Rapid cooling mechanism for 3D printing forming of electromagnetic wave absorber

By combining the enclosure component, the air-cooling component, and the lifting device, the problem of excessive temperature in 3D printed electromagnetic wave absorbers was solved, achieving rapid and uniform cooling and improving the printing quality and efficiency of electromagnetic wave absorbers.

CN224197333UActive Publication Date: 2026-05-05赣州市睿驰智能科技有限公司 +1
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
赣州市睿驰智能科技有限公司
Filing Date
2025-05-19
Publication Date
2026-05-05

AI Technical Summary

Technical Problem

During the 3D printing of electromagnetic wave absorbers, the temperature of the formed electromagnetic wave absorber is high, which leads to material damage. Existing technologies make it difficult to achieve efficient and rapid cooling.

Method used

It employs enclosed components, air-cooled components, and closed components in conjunction with a lifting device. Air cooling is achieved through a radiator, the enclosed components form a closed heat dissipation space, and the lifting device adjusts in real time according to the printed data to achieve rapid and uniform cooling.

Benefits of technology

This technology enables rapid and uniform cooling of the electromagnetic absorber, improving print quality and efficiency while reducing the impact of temperature fluctuations on print quality.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of 3D printing cooling, in particular to an electromagnetic wave absorber 3D printing forming rapid cooling mechanism which comprises a mounting plate, a cooling device and a cooling device. The cooling device comprises an enclosing assembly, an air cooling assembly and a sealing assembly; the lifting device is used for driving the cooling device to ascend and descend; the radiator, the enclosing assembly and the lifting device are used in cooperation, heat dissipation can be conducted on the printing position in real time according to 3D printing data, the temperature of the printed and formed electromagnetic wave absorbing body can be rapidly and evenly reduced, the quality and production efficiency of the electromagnetic wave absorbing body are improved, and the production cost is reduced. A relatively closed heat dissipation space can be formed around the printing area through the arrangement of the enclosure assembly, so that heat dissipation management is more concentrated and efficient, the temperature gradient in the printing area is favorably controlled, and the influence of temperature fluctuation on the printing quality is reduced.
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Description

Technical Field

[0001] This utility model relates to the field of 3D printing cooling technology, specifically to a rapid cooling mechanism for 3D printing of an electromagnetic wave absorber. Background Technology

[0002] 3D printing technology, as a rapid prototyping technology, has been widely used in many fields. Electromagnetic absorbers, as a special material, play an important role in military and communications fields. However, during the 3D printing of electromagnetic absorbers, due to limitations in material properties and printing speed, the printed electromagnetic absorbers often have high temperatures. Failure to cool them down in time may lead to damage. Therefore, developing an efficient and rapid cooling mechanism is of great significance for improving the quality and efficiency of 3D printing electromagnetic absorbers. Utility Model Content

[0003] The purpose of this invention is to provide a rapid cooling mechanism for 3D printing of electromagnetic wave absorbers to solve the problems mentioned in the background art.

[0004] To achieve the above objectives, this utility model provides the following technical solution:

[0005] A rapid cooling mechanism for 3D-printed electromagnetic wave absorbers includes:

[0006] Mounting plate, which is disposed inside the printing cavity of the 3D printer;

[0007] A cooling device, comprising an enclosure component, an air-cooling component, and a sealing component, wherein the enclosure component is used to enclose the printing position, the air-cooling component is used to air-cool the 3D printing position, and the sealing component is used to seal the perimeter of the enclosed position to enhance the heat dissipation effect on the printing position.

[0008] A lifting device is used to drive the cooling device to move up and down.

[0009] Preferably, the enclosure component includes a connecting pipe, symmetrically arranged X-direction enclosure plates and symmetrically arranged Y-direction enclosure plates. The symmetrically arranged X-direction enclosure plates are connected to each other by connecting pipes, and the symmetrically arranged Y-direction enclosure plates are also connected to each other by connecting pipes. The X-direction enclosure plates and the Y-direction enclosure plates are arranged perpendicular to each other.

[0010] Preferably, the air-cooling component includes a heat sink, and several heat sinks are provided. The several heat sinks are respectively provided on the X-direction enclosure plate and the Y-direction enclosure plate. The connecting pipe has several air outlets, and the output end of the heat sink and the air outlets are interconnected.

[0011] Preferably, the closure assembly includes a snap-fit ​​block, rollers, mounting rods, torsion springs, sleeves, and a sealing film. The snap-fit ​​block is disposed at the connection between the X-direction enclosure plate and the Y-direction enclosure plate. The snap-fit ​​block is connected to rollers, and the rollers disposed on different sidewalls of the snap-fit ​​block are fitted against the X-direction enclosure plate or the Y-direction enclosure plate. The mounting rod is disposed on the snap-fit ​​block. The torsion spring is sleeved on the mounting rod, and both ends of the torsion spring are fixedly connected to the mounting rod and the sleeve. Both ends of the sealing film are respectively fixedly connected to the sleeves disposed on different snap-fit ​​blocks.

[0012] Preferably, the enclosure assembly further includes a drive push rod and a connecting plate. The drive push rod is used to push the X-direction enclosure plate or the Y-direction enclosure plate on the same side to move closer or further apart from each other. The X-direction enclosure plates on the same side are connected to each other through the connecting plate, and the Y-direction enclosure plates on the same side are also connected to each other through the connecting plate. Both the X-direction enclosure plate and the Y-direction enclosure plate are slidably connected to the corresponding connecting plate.

[0013] Preferably, the lifting device includes a lifting push rod, with both ends of the lifting push rod connected to the printing cavity and the connecting plate, respectively.

[0014] Compared with the prior art, the beneficial effects of this utility model are as follows: This utility model uses a heat sink, an enclosure component, and a lifting device in combination to dissipate heat at the printing position in real time according to 3D printing data. This can quickly and evenly reduce the temperature of the electromagnetic wave absorber after printing, thereby improving the quality and production efficiency of the electromagnetic wave absorber. The enclosure component can form a relatively closed heat dissipation space around the printing area, making heat dissipation management more centralized and efficient. This helps to control the temperature gradient in the printing area and reduce the impact of temperature fluctuations on printing quality. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the axial view structure of the present invention. Figure 1 ;

[0016] Figure 2 This is a schematic diagram of the axial view structure of the present invention. Figure 2 ;

[0017] Figure 3 This is a schematic diagram of the position and structure of the snap-fit ​​block and sleeve of this utility model;

[0018] Figure 4 This is a schematic diagram of the connection structure of the snap-fit ​​block, mounting rod, and torsion spring of this utility model.

[0019] In the figure: 1 mounting plate, 2 connecting pipe, 3 X-direction enclosing plate, 4 Y-direction enclosing plate, 5 radiator, 6 clamping block, 7 roller, 8 mounting rod, 9 torsion spring, 10 sleeve, 11 sealing film, 12 driving push rod, 13 connecting plate, 14 lifting push rod. Detailed implementation mode

[0020] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0021] Please refer to Figure 1-4 , the present invention provides a technical solution:

[0022] A rapid cooling mechanism for electromagnetic wave absorber 3D printing and forming, as shown in the attached Figure 1 drawing of the specification, includes:

[0023] Mounting plate 1, the mounting plate 1 is arranged in the printing cavity of the 3D printer, and the mounting plate 1 has a "return" - shaped structure;

[0024] Cooling device, the cooling device includes an enclosing component, an air cooling component and a sealing component. The enclosing component is used to enclose the printing position, the air cooling component is used to air - cool the 3D printing position, and the sealing component is used to seal the periphery of the enclosing position to enhance the heat dissipation effect of the printing position;

[0025] Lifting device, the lifting device is used to drive the cooling device to lift.

[0026] The enclosing component includes a connecting pipe 2, symmetrically arranged X - direction enclosing plates 3 and symmetrically arranged Y - direction enclosing plates 4. The X - direction enclosing plates 3 and Y - direction enclosing plates 4 are used to install radiators 5. The symmetrically arranged X - direction enclosing plates 3 are connected to each other through the connecting pipe 2, and the symmetrically arranged Y - direction enclosing plates 4 are also connected to each other through the connecting pipe 2. The X - direction enclosing plates 3 and Y - direction enclosing plates 4 are arranged perpendicular to each other.

[0027] The air cooling component includes radiators 5. The radiators 5 are air - cooled radiators. The specific model of the air - cooled radiator 5 can be reasonably selected according to the 3D - printed parts. There are several radiators 5, and several radiators 5 are respectively arranged on the X - direction enclosing plates 3 and Y - direction enclosing plates 4. The connecting pipe 2 is provided with several air outlets, and the output ends of the radiators 5 and the air outlets are interconnected.

[0028] The closure assembly includes a snap-fit ​​block 6, rollers 7, mounting rods 8, torsion springs 9, sleeves 10, and sealing membranes 11. The snap-fit ​​block 6 has a cross-shaped structure and a hollow interior. In use, the snap-fit ​​block 6 is positioned at the connection between the X-direction enclosure plate 3 and the Y-direction enclosure plate 4. The snap-fit ​​block 6 is connected to rollers 7, which are located on different side walls of the snap-fit ​​block 6 and fit against either the X-direction enclosure plate 3 or the Y-direction enclosure plate 4. The rollers 7 ensure that the snap-fit ​​block 6 does not impede the movement of the X-direction enclosure plate 3 and the Y-direction enclosure plate 4. The mounting rod 8 is fixedly connected to the snap-fit ​​block. 6. Mounting rod 8 is used to mount torsion spring 9 and sleeve 10. Torsion spring 9 is sleeved on mounting rod 8, and both ends of torsion spring 9 are fixedly connected to mounting rod 8 and sleeve 10. Torsion spring 9 drives sleeve 10 to move, thereby keeping sealing membrane 11 taut. As shown in the attached diagram of the instruction manual, both ends of sealing membrane 11 are fixedly connected to sleeve 10 set on different snap-fit ​​blocks 6. The sealing membrane 11 set around the perimeter seals the area between X-direction enclosure plate 3 and Y-direction enclosure plate 4, thereby making heat dissipation management more concentrated and efficient.

[0029] The enclosure assembly also includes a drive push rod 12 and a connecting plate 13. The drive push rod 12 is a DC electric push rod. The drive push rod 12 is used to push the X-direction enclosure plate 3 or the Y-direction enclosure plate 4 on the same side to move closer or further apart. The drive push rod 12 is symmetrically arranged on the connecting plate 13. The X-direction enclosure plates 3 on the same side are connected to each other through the connecting plate 13. The Y-direction enclosure plates 4 on the same side are also connected to each other through the connecting plate 13. The X-direction enclosure plates 3 and the Y-direction enclosure plates 4 are slidably connected to their corresponding connecting plates 13.

[0030] The lifting device includes a lifting push rod 14, which is a DC electric push rod. The two ends of the lifting push rod 14 are connected to the printing cavity and the connecting plate 13, respectively. The lifting push rod 14 is used to drive the printing connecting plate 13 to be raised and lowered in real time according to the 3D printing data.

[0031] Working principle: When printing the electromagnetic absorber, the lifting push rod 14 will adjust the height of the connecting plate 13 in real time according to the 3D printing data. Then, according to the printing position, the drive push rod 12 will drive the X-direction enclosure plate 3 and the Y-direction enclosure plate 4 to enclose the printing position. At the same time, the heat sink 5 will be activated to blow air to the printing position through the connecting pipe 2 at close range, so as to achieve efficient heat dissipation.

[0032] When the X-direction enclosure plate 3 or the Y-direction enclosure plate 4 moves away from each other, the sealing film 11 will be pulled, the sleeve 10 will rotate, and the torsion spring 9 will be deformed by force. When the X-direction enclosure plate 3 or the Y-direction enclosure plate 4 moves closer to each other, the torsion spring 9 will reset, thereby driving the sleeve 10 to move, so that the sealing film 11 is re-stored on the sleeve 10.

[0033] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A rapid cooling mechanism for 3D-printed electromagnetic wave absorbers, characterized in that, include: Mounting plate, which is disposed inside the printing cavity of the 3D printer; A cooling device, comprising an enclosure component, an air-cooling component, and a sealing component, wherein the enclosure component is used to enclose the printing position, the air-cooling component is used to air-cool the 3D printing position, and the sealing component is used to seal the perimeter of the enclosed position to enhance the heat dissipation effect on the printing position. A lifting device is used to drive the cooling device to move up and down.

2. The rapid cooling mechanism for 3D printing of an electromagnetic wave absorber according to claim 1, characterized in that: The enclosure component includes a connecting pipe, symmetrically arranged X-direction enclosure plates and symmetrically arranged Y-direction enclosure plates. The symmetrically arranged X-direction enclosure plates are connected to each other by connecting pipes, and the symmetrically arranged Y-direction enclosure plates are also connected to each other by connecting pipes. The X-direction enclosure plates and the Y-direction enclosure plates are arranged perpendicular to each other.

3. The rapid cooling mechanism for 3D printing of an electromagnetic wave absorber according to claim 2, characterized in that: The air-cooling component includes a heat sink, and several heat sinks are provided. The several heat sinks are respectively provided on the X-direction enclosure plate and the Y-direction enclosure plate. The connecting pipe has several air outlets, and the output end of the heat sink and the air outlets are interconnected.

4. The rapid cooling mechanism for 3D printing of an electromagnetic wave absorber according to claim 3, characterized in that: The sealing assembly includes a snap-fit ​​block, rollers, mounting rods, torsion springs, sleeves, and a sealing membrane. The snap-fit ​​block is disposed at the connection between the X-direction enclosure plate and the Y-direction enclosure plate. The snap-fit ​​block is connected to rollers, and the rollers disposed on different side walls of the snap-fit ​​block are fitted against the X-direction enclosure plate or the Y-direction enclosure plate. The mounting rod is disposed on the snap-fit ​​block. The torsion spring is sleeved on the mounting rod, and both ends of the torsion spring are fixedly connected to the mounting rod and the sleeve. Both ends of the sealing membrane are respectively fixedly connected to the sleeves disposed on different snap-fit ​​blocks.

5. The rapid cooling mechanism for 3D printing of an electromagnetic wave absorber according to claim 4, characterized in that: The enclosure assembly also includes a drive push rod and a connecting plate. The drive push rod is used to push the X-direction enclosure plate or the Y-direction enclosure plate on the same side to move closer or further apart from each other. The X-direction enclosure plates on the same side are connected to each other through the connecting plate, and the Y-direction enclosure plates on the same side are also connected to each other through the connecting plate. Both the X-direction enclosure plate and the Y-direction enclosure plate are slidably connected to the corresponding connecting plate.

6. The rapid cooling mechanism for 3D printing of an electromagnetic wave absorber according to claim 5, characterized in that: The lifting device includes a lifting push rod, with its two ends connected to the printing cavity and the connecting plate, respectively.