Testing device applied to high-density pin chip

Abstract

The utility model discloses a testing device applied to a high-density pin chip, which comprises a base, a movable support, a sliding chute plate support, a group of adapter plates and an equidistant sliding chute plate, the base comprises a base substrate, a connecting piece is arranged on the base substrate, the movable support comprises a movable support body, the movable support body is connected with the connecting piece through a screw rod I, and the screw rod II is connected with the sliding chute plate support. The movable support body is symmetrically provided with two connecting plates, the sliding groove plate support is connected with the two connecting plates through second screw rods and fixed through the sliding rods, an equidistant sliding groove plate is installed below the sliding groove plate support, and the equidistant sliding groove plate is connected with the sliding groove plate support through third screw rods and connected with an equidistant sliding groove plate bottom plate through a sliding rod assembly. A first sliding block assembly and a second sliding block assembly are installed on the front side and the rear side of the equidistant sliding groove plate respectively, adapter plates are installed on the front side and the rear side of the sliding groove plate support, the distance between the spring probes can be adjusted from 0.38 mm to 1.2 mm, and the testing range of the device is greatly expanded.

Description

Technical Field

[0001] This utility model relates to the field of chip testing technology, and specifically to a testing device for high-density pin chips. Background Technology

[0002] In modern electronic systems, Quad Flat Package (QFP) and Small Outline Package (SOP) have become common packaging solutions due to their high pin density (QFP pin count can exceed 240, with a typical pin pitch of 0.4-0.8 mm). Figure 1 (As shown). However, in live debugging scenarios, these two types of packages can cause the following operational challenges: First, mechanical safety risks: when manually operating oscilloscope or logic analyzer probes, adjacent pins are prone to short circuits due to probe slippage; Second, limitations in parallel testing: traditional probes are limited by physical size, making it difficult to achieve synchronous measurement of multiple target contacts in dense pin areas.

[0003] Therefore, this utility model proposes an efficient and convenient testing device for high-density pin chips. Utility Model Content

[0004] In view of the problems existing in the prior art, the purpose of this utility model is to provide a test device for high-density pin chips, which realizes the reorganization of pins in three-dimensional space through the adapter module and expands the dense pins into test points with larger spacing by adopting a vertical adapter structure.

[0005] To achieve the above objectives, the technical solution of this utility model is as follows:

[0006] A testing device for high-density pin chips includes a base, a movable support, a slide plate support, a set of adapter plates, and equidistant slide plates. The base includes a base base with a connector for adjusting the height of the movable support. The movable support includes a movable support body, which is connected to the connector via a screw and fixed by a set of slide rods. Two connecting plates are symmetrically arranged on the movable support body. The slide plate support is connected to the two connecting plates via a screw and fixed by a set of slide rods. Equidistant slide plates are installed inside the slide plate support and positioned inside the slide plate support by slide rod assemblies. A screw contacts the top of the equidistant slide plates through the top of the slide plate support. Several slider assemblies and several slider assemblies are installed on the front and rear sides of the equidistant slide plates, respectively. Adapter plates are installed on both the front and rear sides of the slide plate support, and several test pins are installed on the top of each adapter plate.

[0007] Furthermore, the front and rear surfaces of the equidistant slide plate are respectively provided with a plurality of slide grooves one and slide groove two, and two through holes one are symmetrically provided on the upper surface of the equidistant slide plate.

[0008] Furthermore, the slider assembly includes a slider, a spring probe is installed at the bottom of the slider, an adapter probe is installed on the front surface of the slider, and a circular protrusion matching the size of the groove is provided on its back surface. The slider is slidably connected to the groove on the front surface of the equidistant groove plate through the circular protrusion.

[0009] Furthermore, the slider assembly includes a second slider, a spring probe is installed at the bottom of the second slider, an adapter probe is installed on the surface of the second slider away from the equidistant slide plate, and a circular protrusion two matching the size of the slide groove two is provided on the surface of the second slider facing the equidistant slide plate. The second slider is slidably connected to the slide groove two on the rear surface of the equidistant slide plate through the circular protrusion two.

[0010] Furthermore, the slide plate support includes a slide plate support top plate, and two slide plate support side plates are symmetrically arranged at the two downward-facing ends of the slide plate support top plate. The two slide plate support side plates are respectively provided with folded plates facing inward. A threaded hole II is opened at the center of the slide plate support top plate, and through holes II matching the size of through hole I are opened on the surfaces of its top two ends. Through holes III matching the size of through hole I are opened on both folded plates. Threaded holes III matching the size of screw III are opened on both slide plate support side plates, and through holes IV and V are opened on their surfaces. Four threaded holes IX are respectively provided on the front and rear surfaces of the two slide plate support side plates.

[0011] Furthermore, the slide rod assembly includes a slide rod and a set of springs. The screw rod three contacts the top of the equidistant slide plate through the threaded hole two at the top of the slide plate bracket, and is fixed by the slide rod passing through through holes one, two and three. The lower part of the slide rod passing through through holes one and two is fitted with springs.

[0012] Furthermore, the two connecting plates of the movable support body are provided with threaded holes four that match the size of threaded hole three, and the two connecting plates are provided with through holes six that match the size of through hole four; the center of the movable support body is provided with threaded hole six that matches the size of screw one, and its surface is provided with several through holes seven that match the size of slide rod.

[0013] Furthermore, the connector includes an arc-shaped connecting block, and two adjusting plates are symmetrically arranged at the end of the arc-shaped connecting block along its height direction. The center of the two adjusting plates is provided with a threaded hole seven that matches the size of the threaded hole six, and a set of through holes eight that match the size of the slide rod are provided on its surface. The movable bracket and the connector are connected by a screw passing through the threaded hole seven and the threaded hole six, and are fixed by the slide rod passing through the through holes eight and the through holes seven.

[0014] Furthermore, the arc-shaped connecting block is provided with a threaded hole eight, and two slide rails are symmetrically provided on the base base. A tray is slidably connected to the slide rail, and a long strip protrusion is provided at the mating point between the tray and the slide rail. A tray baffle is installed at the end of the tray facing the arc-shaped connecting block.

[0015] Furthermore, the screw four passes through the threaded hole eight and contacts the surface of the tray baffle near the arc-shaped connecting block.

[0016] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0017] 1) The position of slider one and slider two is adjusted by using the device of this utility model. The front and rear sets of pins are placed in a staggered manner to avoid the problem of poor strength caused by the probe slider tip being too thin.

[0018] 2) This utility model device enables simultaneous conversion of 17 channels of pins, and the pin pitch after conversion is greater than 2.8mm, which facilitates online testing of high-density pin chips;

[0019] 3) The slider of this utility model uses an adapter plate and an adapter probe to isolate the slider and the test pin, preventing direct contact with the slider from causing slider displacement and thus affecting the test;

[0020] 4) This utility model enables the spring probe spacing to be adjustable from 0.38mm to 1.2mm, which greatly expands the testing range of the device. Attached Figure Description

[0021] Figure 1 Diagram of an LQFP packaged chip;

[0022] Figure 2 This is a schematic diagram of the base structure of this utility model;

[0023] Figure 3 This is a schematic diagram of the mobile support structure of this utility model;

[0024] Figure 4 This is a schematic diagram of the slide plate support structure of this utility model. Figure 1 ;

[0025] Figure 5 This is a schematic diagram of the slide plate support structure of this utility model. Figure 2 ;

[0026] Figure 6 This is a schematic diagram of the adapter plate structure of this utility model. Figure 1 ;

[0027] Figure 7 This is a schematic diagram of the internal structure of the adapter plate of this utility model;

[0028] Figure 8 This is a schematic diagram of the equidistant sliding groove plate structure of this utility model. Figure 1 ;

[0029] Figure 9 This is a schematic diagram of the equidistant sliding groove plate structure of this utility model. Figure 2 ;

[0030] Figure 10 This is a cross-sectional view of the equidistant chute plate of this utility model;

[0031] Figure 11 This is a schematic diagram of the slider assembly structure of this utility model. Figure 1 ;

[0032] Figure 12 This is a schematic diagram of the slider assembly structure of this utility model. Figure 2 ;

[0033] Figure 13 This is a schematic diagram of the two-component slider structure of this utility model. Figure 1 ;

[0034] Figure 14 This is a schematic diagram of the two-component slider structure of this utility model. Figure 2 ;

[0035] Figure 15 This is a schematic diagram of the cooperation between the equidistant sliding groove plate and the sliding rod assembly of this utility model;

[0036] Figure 16 This is a schematic diagram of the overall structure of the device of this utility model;

[0037] Figure 17 This is a schematic diagram of the device of this utility model without the adapter plate installed;

[0038] Figure 18 This is a schematic diagram showing the convergence of a slider assembly of this utility model;

[0039] Figure 19 for Figure 18 A schematic diagram at point A in the middle;

[0040] Figure 20 for Figure 18 A schematic diagram at point B in the middle;

[0041] Figure 21 This is a schematic diagram of the unfolded slider assembly of this utility model;

[0042] Figure 22 for Figure 21 A schematic diagram at point A in the middle;

[0043] Figure 23 for Figure 21 A schematic diagram at point B in the middle;

[0044] Figure 24 This is a schematic diagram of the equidistant sliding groove plate structure of this utility model. Figure 3 ;

[0045] Figure 25 This is a schematic diagram of the adapter plate structure of this utility model. Figure 2 .

[0046] In the diagram: 1. Base; 101. Base base; 1011. Slide rail; 102. Connector; 1021. Arc-shaped connecting block; 10211. Threaded hole eight; 1022. Adjusting plate; 10221. Threaded hole seven; 10222. Through hole eight; 2. Moving bracket; 201. Moving bracket body; 2011. Threaded hole six; 2012. Through hole seven; 202. Connecting plate; 2021. Threaded hole four; 2022. Through hole six; 3. Slide plate bracket; 301. Top plate of slide plate bracket; 3011. Threaded hole two; 3012. Through hole two; 302. Side plate of slide plate bracket; 3021. Threaded hole three; 3022. Through hole four; 3023. Through hole five; 3024, Threaded Hole Nine; 303, Folding Plate; 3031, Through Hole Three; 4, Adapter Plate; 401, Test Pin; 402, Threaded Hole Ten; 403, Circuit; 5, Equidistant Slide Plate; 501, Slide One; 502, Slide Two; 503, Through Hole One; 6, Screw One; 7, Slide Rod; 8, Screw Two; 9, Screw Three; 10, Test Pin; 11, Slider One; 1101, Circular Protrusion One; 12, Spring Probe; 13, Adapter Probe; 14, Slider Two; 1401, Circular Protrusion Two; 15, Spring; 16, Tray; 1601, Long Strip Protrusion; 1602, Tray Baffle; 16021, Threaded Hole Nine; 17, Screw Four; 18, Screw Five. Detailed Implementation

[0047] The present invention will be further described below with reference to the accompanying drawings, but the scope of protection of the present invention is not limited to the scope described herein.

[0048] Please refer to Figure 16 and 17A testing device for high-density pin chips includes a base 1, a movable support 2, a slide plate support 3, a set of adapter plates 4, and equidistant slide plates 5. The base 1 includes a base base 101, on which a connector 102 for adjusting the height of the movable support 2 is provided. The movable support 2 includes a movable support body 201, which is connected to the connector 102 by a screw 6 and fixed by a set of slide rods 7. Two connecting plates 202 are symmetrically arranged on the movable support body 201. The bracket 3 is connected to the two connecting plates 202 by screw 8 and fixed by a set of slide rods 7. The slide plate bracket 3 is equipped with equidistant slide plates 5. The equidistant slide plates 5 are positioned inside the slide plate bracket 3 by slide rod assembly. Screw 9 contacts the top of the equidistant slide plates 5 through the top of the slide plate bracket. Several slider 1 assemblies and several slider 2 assemblies are installed on the front and rear sides of the equidistant slide plates 5, respectively. Adapter plates 4 are installed on the front and rear sides of the slide plate bracket 3. Several test pins 10 are installed on the top of each adapter plate.

[0049] Please refer to Figure 3 The movable support body 201 has a threaded hole 2011 at its center that matches the size of the screw 6, and several through holes 2012 on its surface that match the size of the slide rod 7. The arc-shaped connecting block 1021 has a threaded hole 10211. Two slide rails 1011 are symmetrically provided on the base 101. A tray 16 is slidably connected to the slide rail 1011. A long protrusion 1601 is provided at the mating point between the tray 16 and the slide rail 1011. A tray baffle 1602 is installed at the end of the tray 16 facing the arc-shaped connecting block 1021.

[0050] The screw 17 passes through the threaded hole 10211 and makes contact with the surface of the tray baffle 1602 near the arc-shaped connecting block 1021.

[0051] The two slide rails 1011 on the base 1 are used to allow the tray 16 placed on it to move linearly back and forth. The threaded hole 8 10211 on the back side is used to engage the screw 4 17 to push the tray 16 to move.

[0052] Please refer to Figure 2 The connector 102 includes an arc-shaped connecting block 1021. Two adjusting plates 1022 are symmetrically arranged at the ends of the arc-shaped connecting block 1021 along its height direction. The center of the two adjusting plates 1022 is provided with a threaded hole 10221 that matches the size of the threaded hole 6 2011. A set of through holes 8 10222 that matches the size of the slide rod 7 is provided on its surface. The movable bracket 2 is connected to the connector 102 by a screw 1 6 passing through the threaded hole 7 10221 and the threaded hole 6 2011, and is fixed by the slide rod 7 passing through the through holes 8 10222 and the through holes 7 2012.

[0053] Rotating screw 6 adjusts the vertical movement of the movable bracket 2; in this embodiment, the vertical displacement is 20mm. After adjusting the position of the movable bracket 2, it is fixed by eight sliding rods, which can be secured by screws, welding, or adhesive.

[0054] Please refer to Figure 8-10 The front and rear surfaces of the equidistant slide plate 5 are provided with several slide grooves 501 and 502 respectively, and two through holes 503 are symmetrically provided on the upper surface of the equidistant slide plate 5.

[0055] In this embodiment, there are 9 slides 501 and 8 slides 502.

[0056] Please refer to Figure 11-12 The slider assembly includes a slider 11, a spring probe 12 is installed at the bottom of the slider 11, an adapter probe 13 is installed on the front surface of the slider 11, and a circular protrusion 1101 matching the size of the groove 501 is provided on its back surface. The slider 11 is slidably connected to the groove 501 on the front surface of the equidistant groove plate 5 through the circular protrusion 1101.

[0057] Please refer to Figure 13-14 The second slider assembly includes a second slider 14. A spring probe 12 is installed at the bottom of the second slider 14. An adapter probe 13 is installed on the surface of the second slider 14 away from the equidistant slide plate 5. A circular protrusion 1401 matching the size of the slide groove 502 is provided on the surface of the second slider 14 facing the equidistant slide plate 5. The second slider 14 is slidably connected to the slide groove 502 on the rear surface of the equidistant slide plate 5 through the circular protrusion 1401.

[0058] The signal from the spring probe 12 at the bottom is transmitted to the adapter probe 13 via a thin wire or a pre-embedded wire.

[0059] Please refer to Figure 4-5 The slide plate support 3 includes a slide plate support top plate 301, and two slide plate support side plates 302 are symmetrically provided at the two downward ends of the slide plate support top plate 301. The two slide plate support side plates 302 are respectively provided with folding plates 303 facing inward.

[0060] A threaded hole 3011 is provided at the center of the top plate 301 of the slide plate support, and through holes 3012 matching the size of through hole 503 are provided on the surfaces of both ends of the top plate.

[0061] Both folding plates 303 are provided with through holes 3031 that match the size of through hole 503;

[0062] Both slide plate support side plates 302 are provided with threaded holes 3021 that match the size of screw 39, and through holes 3022 and 3023 are provided on their surfaces; the front and rear surfaces of the two slide plate support side plates 302 are provided with four threaded holes 3024 respectively. The two transverse M6 threaded holes 3021 on the left and right sides cooperate with screw 39 to realize the left and right movement of slide plate support 3.

[0063] Please refer to Figure 15 The slide rod assembly includes a slide rod 7 and a set of springs 15. The screw 9 contacts the top of the equidistant slide plate 5 through the threaded hole 3011 at the top of the slide plate bracket 3, and is fixed by the slide rod 7 passing through the through hole 503, the through hole 3012 and the through hole 3031. The lower part of the slide rod 7 passing through the through hole 503 and the through hole 3012 is fitted with springs 15.

[0064] Please refer to Figure 3 The two connecting plates 202 of the movable bracket body 201 are provided with threaded holes 2021 that match the size of threaded hole 3021, and the two connecting plates 202 are provided with through holes 2022 that match the size of through hole 4022.

[0065] The movable bracket 2 and the slide plate bracket 3 are fixed by screw 2 8 passing through threaded hole 3021 and threaded hole 4 2021, and by four slide rods 7 passing through through hole 5 3023 and through hole 6 2022.

[0066] The slide plate bracket 3 has adapter plates 4 installed on both the front and rear sides.

[0067] Please refer to Figure 6-7 The adapter plate 4 includes an adapter plate body, wherein the top of the adapter plate body is provided with several test pins 401, and its side plate is provided with a threaded hole 402 that matches the size of the threaded hole 3024. Furthermore, the adapter plate 4 and the two slide plate bracket side plates 302 are connected by four screws 18 passing through the threaded hole 402 and the threaded hole 3024.

[0068] The adapter board 4 has a pre-embedded circuit 403 for transmitting the signal from the adapter probe 13 to the pin under test 10.

[0069] The method of using this device includes the following steps:

[0070] 1) Align one side of the circuit board to be tested with the side of the tray baffle 1602 away from the arc-shaped connecting block 1021, so that the four sides of the circuit board to be tested are parallel to the four sides of the tray 16 respectively.

[0071] 2) Rotate screw 17 so that the test pin 10 of the chip under test is approximately below the spring probe 12;

[0072] 3) Rotate screw 6 to bring spring probe 12 close to the test pin 10 of the chip, but do not make contact;

[0073] 4) Rotate screw 8 to adjust the spacing of spring probe 12 so that the spacing of spring probe 12 is the same as the spacing of test pin 10 of the chip;

[0074] 5) Turn to the right and observe the distance between the spring probe 12 and the chip pin;

[0075] 6) Rotate screw 4 17 so that spring probe 12 is directly above the chip pin;

[0076] 7) Turn the view to the front and observe whether the spring probe 12 is aligned with the pin to be tested;

[0077] 8) Rotate screw 8 to align the spring probe with the pin to be tested;

[0078] 9) Rotate screw 6 to make the spring probe contact the chip pin;

[0079] 10) Confirm that the spring probe is in contact with the chip pin before testing;

[0080] 11) After the test is completed, before taking out the circuit board, you need to move the spring probe to a suitable position so that the spring probe is away from the chip pin.

[0081] Regarding the calculation of slider dimensions:

[0082] The spring probes are arranged in an alternating pattern using two slider assemblies, with the spacing between the spring probes in each slider assembly being twice the spacing between the spring probes. If the minimum chip pin pitch is d, this requires the spring probe spacing to also be d. Figure 18-20 This shows the situation when the slider assembly is brought together. The diagram shows the distance between the lower ends of the two sliders in the slider assembly.

[0083] d0=2d

[0084] The width of the bottom edge of a single slider is l0, and the distance between the bottom edges of two sliders is g0. By using the setting where the top edge is larger than the bottom edge, the width l0 of the bottom edge of a single slider is increased by n times to the width l1 of the top edge of a single slider.

[0085] l1=n×l0

[0086] The distance g1 between the tops of the two sliders is equal to the distance g0 between the bottoms of the two sliders.

[0087] g1 = g0

[0088] Based on geometric relationships, the distance between the tops of the two sliders

[0089]

[0090] When the slider assembly separates to accommodate the maximum chip pin pitch d′ of the design, as Figure 21-23 As shown, the distance between the lower ends of the two sliders

[0091] d′0=2d′

[0092] The width of the lower end of a single slider remains unchanged, that is

[0093] l0′=l0

[0094] The distance between the lower ends of the two sliders becomes

[0095]

[0096] The width of the top of a single slider remains unchanged.

[0097] l′1=l1=n×l0

[0098] The distance g′1 between the tops of the two sliders is equal to the distance g′0 between the bottoms of the two sliders.

[0099] g′1=g′0=2d′-l′0

[0100] The distance between the tops of the two sliders can be obtained.

[0101]

[0102] Dimension calculation of equidistant chute plates:

[0103] Based on the above calculations, the grooves on the equidistant groove plate can be drawn. For example... Figure 24 As shown, the circular protrusion of the slider assembly moves in the groove. When the circular protrusion moves to the lower end of the groove, the slider assembly converges to the minimum distance d. c When the circular protrusion moves to the top of the groove, the slider assembly expands to its maximum spacing d. f When drawing the slideway, the array spacing at the lower end of the slideway is...

[0104] d c =d1=n×l0+g0

[0105] The array spacing at the upper end of the chute is

[0106] d f =d′1=n×l0+2d′-l′0

[0107] The spacing of the groove array on the other side of the equidistant groove plate is also d. c and d f However, the lower array needs to be moved to the left or right. The distance; the upper array needs to be moved left or right. The distances are arranged alternately on the current side.

[0108] Adapter plate size calculation:

[0109] like Figure 25 As shown, the embedded circuit on the adapter plate needs to maintain contact with the adapter probe at all times when the slider spacing changes. Therefore, when the sliders converge to the minimum spacing d1, the starting position of the i-th embedded circuit is...

[0110] x i =i×d1

[0111] The termination position of the i-th pre-embedded circuit when the slider is extended to the maximum spacing d′1.

[0112] x′ i =i×d′1

[0113] To prevent overlapping of the embedded circuits, the i-th embedded circuit needs to be moved upwards by y. i y i The width of the pre-embedded circuit should be large enough.

[0114] The calculation method for the size of the embedded circuit on the other side of the adapter board is similar, but it is also important to note that it should be arranged in an alternating manner with the circuit on this side.

Claims

1. A testing device for high-density pin chips, characterized in that... The system includes a base (1), a movable support (2), a slide plate support (3), a set of adapter plates (4), and equidistant slide plates (5). The base (1) includes a base base (101), on which a connector (102) for adjusting the height of the movable support (2) is provided. The movable support (2) includes a movable support body (201), which is connected to the connector (102) by a screw (6) and fixed by a set of slide rods (7). Two connecting plates (202) are symmetrically provided on the movable support body (201). The slide plate support (3) and the two connecting plates (5) are connected to the slide plate support (4). A connecting plate (202) is connected by a screw (8) and fixed by a set of slide rods (7). An equidistant slide plate (5) is installed inside the slide plate bracket (3). The equidistant slide plate (5) is positioned inside the slide plate bracket (3) by a slide rod assembly. A screw (9) contacts the top of the equidistant slide plate (5) through the top of the slide plate bracket (3). Several slider assemblies 1 and several slider assemblies 2 are installed on the front and rear sides of the equidistant slide plate (5), respectively. A transition plate (4) is installed on both the front and rear sides of the slide plate bracket (3). Several test pins (10) are installed on the top of each transition plate (4).

2. The testing device for high-density pin chips according to claim 1, characterized in that... The front and rear surfaces of the equidistant slide plate (5) are provided with a number of slide grooves 1 (501) and slide groove 2 (502), and two through holes 1 (503) are symmetrically provided on the upper surface of the equidistant slide plate (5).

3. The testing device for high-density pin chips according to claim 2, characterized in that... The slider assembly includes a slider (11), a spring probe (12) is installed at the bottom of the slider (11), an adapter probe (13) is installed on the front surface of the slider (11), and a circular protrusion (1101) matching the size of the groove (501) is provided on its back surface. The slider (11) is slidably connected to the groove (501) on the front surface of the equidistant groove plate (5) through the circular protrusion (1101).

4. The testing device for high-density pin chips according to claim 2, characterized in that... The slider assembly includes a second slider (14), a spring probe (12) is installed at the bottom of the second slider (14), and an adapter probe (13) is installed on the surface of the second slider (14) away from the equidistant slide plate (5). The surface of the second slider (14) facing the equidistant slide plate (5) is provided with a circular protrusion (1401) that matches the size of the slide groove (502). The second slider (14) is slidably connected to the slide groove (502) on the rear surface of the equidistant slide plate (5) through the circular protrusion (1401).

5. A testing device for high-density pin chips according to claim 4, characterized in that... The slide plate bracket (3) includes a slide plate bracket top plate (301), and two slide plate bracket side plates (302) are symmetrically provided at the two downward ends of the slide plate bracket top plate (301). The two slide plate bracket side plates (302) are respectively provided with folded plates (303) facing inward. A threaded hole 2 (3011) is provided at the center of the slide plate bracket top plate (301), and through holes 2 (3012) matching the size of through hole 1 (503) are provided on the surfaces of its top two ends. Through holes 3 (3031) matching the size of through hole 1 (503) are provided on both folded plates (303). Threaded holes 3 (3021) matching the size of screw 3 (9) are provided on both slide plate bracket side plates (302), and through holes 4 (3022) and through holes 5 (3023) are provided on their surfaces. Four threaded holes 9 (3024) are provided on the front and rear surfaces of the two slide plate bracket side plates (302).

6. The testing device for high-density pin chips according to claim 4, characterized in that... The slide rod assembly includes a slide rod (7) and a set of springs (15). The screw three (9) contacts the top of the equidistant slide plate (5) through the threaded hole two (3011) at the top of the slide plate bracket (3), and is fixed by the slide rod (7) passing through the through hole one (503), through hole two (3012) and through hole three (3031). The slide rod (7) passing through the through hole one (503) and through hole two (3012) is fitted with a spring (15) on its lower part.

7. A testing device for high-density pin chips according to claim 6, characterized in that... The movable support body (201) has two connecting plates (202) with threaded holes four (2021) matching the size of threaded hole three (3021) and two connecting plates (202) with through holes six (2022) matching the size of through hole four (3022); the movable support body (201) has a threaded hole six (2011) matching the size of screw one (6) at its center, and several through holes seven (2012) matching the size of slide rod (7) on its surface.

8. A testing device for high-density pin chips according to claim 7, characterized in that... The connector (102) includes an arc-shaped connecting block (1021). The ends of the arc-shaped connecting block (1021) are symmetrically provided with two adjusting plates (1022) along its height direction. The center of the two adjusting plates (1022) is provided with a threaded hole seven (10221) that matches the size of the threaded hole six (2011). A set of through holes eight (10222) that matches the size of the slide rod (7) is provided on its surface. The movable bracket (2) and the connector (102) are connected by a screw one (6) passing through the threaded hole seven (10221) and the threaded hole six (2011), and are fixed by the slide rod (7) passing through the through holes eight (10222) and the through holes seven (2012).

9. A testing device for high-density pin chips according to claim 8, characterized in that... The arc-shaped connecting block (1021) has a threaded hole (10211). Two slide rails (1011) are symmetrically provided on the base base (101). A tray (16) is slidably connected to the slide rail (1011). A long protrusion (1601) is provided at the mating point between the tray (16) and the slide rail (1011). A tray baffle (1602) is installed at the end of the tray (16) facing the arc-shaped connecting block (1021).

10. A testing device for high-density pin chips according to claim 9, characterized in that... The screw four (17) passes through the threaded hole eight (10211) and makes contact with the surface of the tray baffle (1602) near the arc-shaped connecting block (1021).

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