Batch feeding tool for semiconductor chips

Abstract

A semiconductor chip batch feeding tool comprises a pair of guide rails arranged in the length direction of a support in a spaced mode, a material preparing area and a feeding area are sequentially arranged between the guide rails, and the guide rails are each provided with a moving block in a sliding fit mode; the seat plate is installed on the moving block, a plurality of placing areas are arrayed on the seat plate and used for placing the material boxes, first through holes are formed in the placing areas in a penetrating mode, and a plurality of limiting columns are arranged on the periphery of each first through hole and used for limiting the material boxes; the jacking mechanism is located below the feeding area and installed on the support, second through holes are formed in the feeding area in an array mode, and the jacking mechanism corresponds to each second through hole and is used for jacking the semiconductor chips in the material box when the base plate moves to the feeding area and the first through holes correspond to the second through holes one to one. The jacking mechanism comprises a horizontal top plate which is movably arranged in the vertical direction. According to the tool, the semiconductor chips can be conveniently prepared in batches, and the semiconductor chips of the multiple material boxes are jacked up, so that the semiconductor chips on the top layer can be conveniently fed in batches.

Description

Technical Field

[0001] This application belongs to the field of semiconductor chip packaging and testing technology, specifically relating to a semiconductor chip batch loading fixture. Background Technology

[0002] In the semiconductor chip packaging and testing process, for devices that have completed processes such as die mounting, wire bonding / bonding, and molding, depending on the product model, the molded semi-finished products need to be processed. This includes removing burrs from the molding process and removing excess adhesive from the molding. These semi-finished products are typically stacked in a frame cassette, which restricts their perimeter. For the next processing step, they are removed sequentially from the bottom or top of the cassette, depending on the specific needs. To improve the efficiency of the next processing step, batch transfer operations are required. This necessitates a loading fixture that can handle the batch transfer of semi-finished products from multiple cassettes. Utility Model Content

[0003] To address the shortcomings of the aforementioned prior art, this application provides a semiconductor chip batch loading fixture, which facilitates the batch preparation of semiconductor chips and enables the batch loading of the top-layer semiconductor chip by lifting the semiconductor chips in multiple hoppers.

[0004] To achieve the above objectives, the present invention employs the following technology:

[0005] A semiconductor chip batch loading fixture includes:

[0006] support;

[0007] A pair of guide rails are spaced apart along the length of the support, with a material preparation area and a material feeding area between the guide rails, and a moving block is slidably fitted on each guide rail.

[0008] A base plate is mounted on a movable block and has multiple placement areas arranged on it for placing material boxes. Each placement area is provided with a first through hole, and multiple limiting posts are provided on the outer periphery of each first through hole to limit the material box.

[0009] The lifting mechanism is located below the loading area and installed on the bracket. The loading area array has a second through hole. The lifting mechanism is set for each second through hole. It is used to lift the semiconductor chip in the material box when the base plate moves to the loading area and the first through hole corresponds to the second through hole.

[0010] Furthermore, the material box has a frame structure that runs vertically through the box. A pair of limiting platforms are provided at the bottom of its inner wall, and a carrier plate is placed on the limiting platforms. When semiconductor chips are stacked in the material box, the semiconductor chips are supported on the carrier plate.

[0011] Furthermore, the lifting mechanism includes a horizontal top plate that moves vertically, the size of which is smaller than the sizes of the first and second through holes. At least one vertical guide rod is connected to the bottom of the horizontal top plate, the vertical guide rod passes through a guide block, and the bottom of the horizontal top plate is also connected to the drive end of the lifting assembly. The lifting assembly and the guide block are mounted on a bracket.

[0012] Furthermore, it also includes multiple vertically movable pneumatic suction cups, which are positioned above each material box when the material is in the loading area, and are used to pick up the semiconductor chip at the top layer that is lifted from the corresponding material box.

[0013] The beneficial effects of this utility model are as follows:

[0014] 1. Applied to batch feeding, it facilitates the placement of material boxes and stacking of semiconductor chips in the preparation area, and in the feeding area, the semiconductor chips in multiple material boxes are lifted to facilitate the batch feeding of the top semiconductor chip, thereby facilitating the batch processing of the batch-fed semiconductor chips in the next process and improving process efficiency.

[0015] 2. The contents of the material box are designed with a limiting platform and a carrier plate to facilitate the stacking of semiconductor chips and to facilitate the vertical movement of semiconductor chips in conjunction with the lifting mechanism. When the top semiconductor chip is exposed in the material box, it can be used for gripping mechanisms such as suction cups to grab semiconductor chips from the top of the material box array in batches.

[0016] 3. The lifting mechanism is preferably constructed using a horizontal top plate, vertical guide rods and guide blocks, racks and gears, and worm gears. The self-locking function of the worm gears ensures the stability of the lifting process. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of an embodiment of this application.

[0018] Figure 2 This is a schematic diagram of the base plate structure according to an embodiment of this application.

[0019] Figure 3 This is a schematic diagram of the material box structure according to an embodiment of this application.

[0020] Figure 4 This is a schematic diagram of the lifting mechanism structure according to an embodiment of this application. Detailed Implementation

[0021] To make the objectives, technical solutions and advantages of the present utility model clearer, the implementation methods of the present utility model will be described in detail below with reference to the accompanying drawings. However, the embodiments described in the present utility model are only some embodiments of the present utility model, and not all embodiments.

[0022] This application provides a semiconductor chip batch loading fixture, such as... Figures 1-4 As shown, the assembly includes a bracket 1, a guide rail 2, a base plate 3, a material box 4, and a lifting mechanism 5, etc., used for batch loading of semiconductor chips 6. In this example, the semiconductor chip 6 refers to a semi-finished product that is still connected to the lead frame after molding.

[0023] A pair of guide rails 2 are spaced apart along the length of the bracket 1. Between the guide rails 2 are a material preparation area 11 and a material loading area 12. The material preparation area 11 is used to stack semiconductor chips 6, and the material loading area 12 is used to lift the stacked semiconductor chips 6 for gripping by a suction mechanism. Each guide rail 2 has a sliding block 21. The base plate 3 is mounted on the sliding block 21 and has multiple placement areas arrayed on it for placing material boxes 4. Each placement area has a through hole 32, and each through hole 32 has multiple limiting posts 31 on its outer periphery to limit the material box 4.

[0024] Specifically, the material box 4 has a frame structure that runs vertically through the inside. A pair of limiting platforms 41 are provided at the bottom of its inner wall. A carrier plate 42 is placed on the limiting platform 41. When the semiconductor chip 6 is stacked in the material box 4, the semiconductor chip 6 is supported on the carrier plate 42.

[0025] The lifting mechanism 5 is located below the loading area 12 and installed on the bracket 1. The loading area 12 has arrayed second through holes 13 penetrating the bracket 1. The lifting mechanism 5 is provided for each second through hole 13. The lifting mechanism 5 includes a horizontal top plate 50 that moves vertically. The size of the horizontal top plate 50 is smaller than the size of the first through hole 32 and the second through hole 13. The horizontal top plate 50 is used to lift the semiconductor chip 6 in the material box 4 when the base plate 3 moves to the loading area 12 and the first through hole 32 and the second through hole 13 correspond one-to-one.

[0026] To facilitate the transfer, a gripping assembly formed by pneumatic suction cups 7 is typically used. This assembly is positioned above the loading area 12 and corresponds to the position of the material box 4 when the first through hole 32 and the second through hole 13 are aligned. Specifically, the pneumatic suction cups 7 are arranged in an array and connected to the vertical moving mechanism, which in turn is connected to an air pump. Furthermore, depending on the specific application scenario, other stroke mechanisms, such as linear or rotary stroke mechanisms, can be configured on top of the vertical moving mechanism to facilitate the transfer of the material to the desired workstation after suction.

[0027] In application, the carrier plate 42 is first placed into the material box 4 and supported on the limiting stage 41. Then, the semiconductor chip 6 is stacked on the carrier plate 42. The base plate 3 is moved to the preparation area 11, and the material boxes 4 containing the semiconductor chip 6 are placed in each placement area. The placed material boxes 4 are limited by the limiting post 31. Then, the base plate 3 is moved along the guide rail 2 so that it moves from the preparation area 11 to the predetermined position of the loading area 12. After reaching the predetermined position, the first through hole 32 and the second through hole 13 correspond one by one.

[0028] Then, depending on the current state of the semiconductor chips 6 contained in the material box 4, the material box 4 is filled with semiconductor chips 6 of the same type. If the material box 4 is fully loaded with semiconductor chips 6 of the same type, and when fully loaded, the top semiconductor chip 6 is at a predetermined distance from the top opening of the material box 4, then this state can be used for filling the top semiconductor chip 6. After the first layer of semiconductor chips 6 is filled, or if the semiconductor chips 6 contained in the material box 4 are at a long distance / height difference from the top opening of the material box 4, then the horizontal top plate 50 of the lifting mechanism 5 is used to push the semiconductor chips 6 in the material box 4 upward as a whole, so that the top semiconductor chip 6 in the current state reaches the position where it can be attracted.

[0029] Then, the pneumatic suction cup 7 is used to vertically downwards to contact the top semiconductor chip 6 and adsorb it in batches. Then, the pneumatic suction cup 7 is raised, and then based on other strokes of the pneumatic suction cup 7, such as moving in a straight line in a horizontal direction or rotating around a certain axis, the material is loaded to the processing station.

[0030] Specifically, to improve the stability of the horizontal top rod 50 when it moves upward, at least one vertical guide rod 51 is connected to the bottom of the horizontal top plate 50. The vertical guide rod 51 passes through the guide block 53. The bottom of the horizontal top plate 50 is also connected to the drive end of the lifting assembly. The lifting assembly and the guide block 53 are mounted on the bracket 1. The horizontal top plate 50 is driven to move up and down by the lifting assembly. During the movement, the cooperation of the vertical guide rod 51 and the guide block 53 can guide and limit the movement.

[0031] As an alternative to the lifting assembly, the lifting assembly includes a vertically arranged cylinder, the drive end of which is arranged upward and connected to a horizontal top plate 50. The cylinder is mounted on a bracket 1. By moving a certain distance with each stroke of the cylinder, the next semiconductor chip 6 to be loaded is continuously moved upward to a position where it can be attracted.

[0032] As an alternative to the lifting assembly, the lifting assembly includes a rack 52 vertically arranged and connected to a horizontal top plate 50. The rack 52 meshes with a rotatably arranged drive gear 59, which is driven to rotate by a rotary motor mounted on the bracket 1. By driving the gear 59 to rotate stepwise through the rotary motor, the rack 52 continuously rises, thereby continuously moving the next semiconductor chip 6 to be loaded upwards to a position where it can be attracted. To improve stability, a servo motor can be selected as the rotary motor.

[0033] As another preferred option for lifting components, such as Figure 4The lifting assembly shown includes a rack 52 vertically arranged and connected to a horizontal top plate 50, a drive gear 59 meshing with the rack 52, a rotating shaft 57 coaxially connected to the drive gear 59 and rotatably mounted on a crossbeam 54, a worm gear 58 coaxially connected to the rotating shaft 57, a worm 56 cooperating with the worm gear 58, and a drive motor 55 with an output shaft coaxially connected to the worm 56 and mounted on the crossbeam 54. A guide block 53 is connected to the crossbeam 54, and the crossbeam 54 is mounted on a bracket 1. The drive motor 55 drives the worm 56 to rotate, causing the worm gear 58 to rotate, which in turn causes the drive gear 59 to drive the rack 52 to move. During this process, due to the combined effect of the worm gear 58 and the worm 56, a self-locking function is achieved, improving the stability of the lifting and lowering operation of the horizontal top plate 50.

[0034] The above description is only a preferred embodiment of this application and is not intended to limit this application. Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application.

Claims

1. A semiconductor chip batch loading fixture, characterized in that, include: Support (1); A pair of guide rails (2) are spaced apart along the length of the support (1). Between the guide rails (2) are a material preparation area (11) and a material feeding area (12). Each guide rail (2) is slidably fitted with a moving block (21). The base plate (3) is installed on the movable block (21) and has multiple placement areas arranged on it for placing the material box (4). Each placement area is provided with a first through hole (32), and each first through hole (32) is provided with multiple limiting posts (31) on its outer periphery for limiting the material box (4). The lifting mechanism (5) is located below the loading area (12) and installed on the bracket (1). The loading area (12) has a second through hole (13). The lifting mechanism (5) is set up for each second through hole (13) to lift the semiconductor chip (6) in the material box (4) when the base plate (3) moves to the loading area (12) and the first through hole (32) corresponds to the second through hole (13).

2. The semiconductor chip batch loading fixture according to claim 1, characterized in that, The material box (4) has a frame structure that runs through the top and bottom. A pair of limiting platforms (41) are provided at the bottom of its inner wall. A carrier plate (42) is placed on the limiting platform (41). When the semiconductor chip (6) is stacked in the material box (4), the semiconductor chip (6) is supported on the carrier plate (42).

3. The semiconductor chip batch loading fixture according to claim 1, characterized in that, The lifting mechanism (5) includes a horizontal top plate (50) that moves vertically, and the size of the horizontal top plate (50) is smaller than the size of the first through hole (32) and the second through hole (13).

4. The semiconductor chip batch loading fixture according to claim 3, characterized in that, At least one vertical guide rod (51) is connected to the bottom of the horizontal top plate (50). The vertical guide rod (51) passes through the guide block (53). The bottom of the horizontal top plate (50) is also connected to the drive end of the lifting assembly. The lifting assembly and the guide block (53) are mounted on the bracket (1).

5. The semiconductor chip batch loading fixture according to claim 4, characterized in that, The lifting assembly includes a vertically arranged cylinder with its drive end arranged upward and connected to a horizontal top plate (50), and the cylinder is mounted on a bracket (1).

6. The semiconductor chip batch loading fixture according to claim 4, characterized in that, The lifting assembly includes a rack (52) that is vertically arranged and connected to a horizontal top plate (50). The rack (52) is engaged with a rotatable drive gear (59), which is driven to rotate by a rotating motor mounted on a bracket (1).

7. The semiconductor chip batch loading fixture according to claim 4, characterized in that, The lifting assembly includes a rack (52) vertically arranged and connected to a horizontal top plate (50), a drive gear (59) meshing with the rack (52), a rotating shaft (57) coaxially connected to the drive gear (59) and rotatably mounted on the cross frame (54), a worm gear (58) coaxially connected to the rotating shaft (57), a worm (56) cooperating with the worm gear (58), and a drive motor (55) with an output shaft coaxially connected to the worm (56) and mounted on the cross frame (54). A guide block (53) is connected to the cross frame (54), and the cross frame (54) is mounted on a bracket (1).

8. The semiconductor chip batch loading fixture according to any one of claims 1-7, characterized in that, It also includes multiple pneumatic suction cups that are vertically movable and located above each material box (4) when it is in the loading area (12), respectively used to pick up the semiconductor chip (6) that is pushed up from the corresponding material box (4) and is located at the top layer.

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