Cold and hot temperature control device capable of passive uniform heat transfer
By combining semiconductor cooling chips and passive heat spreaders, the problems of uneven temperature during heating and large size and high energy consumption during heat dissipation in household heat conduction devices are solved, achieving miniaturized, integrated, and highly efficient temperature control.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- WUXI RUYI CREATIVE DESIGN CO LTD
- Filing Date
- 2025-04-14
- Publication Date
- 2026-05-12
AI Technical Summary
Existing household heat conduction devices suffer from uneven surface temperature and excessive local temperature differences during heating, and are bulky, energy-intensive, and slow in cooling, failing to meet the requirements for miniaturization and integration.
It adopts semiconductor cooling chips and passive heat spreaders, combined with temperature control components and cooling and heating components, to achieve passive uniform heat transfer. The components are small in size and have a compact structure, enabling rapid and stable switching between cooling and heating modes in a limited space.
It achieves efficient temperature control within a limited space, with small component size, compact structure, flexible and convenient switching between hot and cold, and precise temperature control, making it suitable for personal and family consumption scenarios as well as medical and health care scenarios.
Smart Images
Figure CN224230372U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to semiconductor refrigeration and thermal technology, specifically a cold and hot temperature control device capable of passive and uniform heat transfer. Background Technology
[0002] With the increasing demand for heat conduction devices in heating and heat dissipation scenarios such as home use, pets, and medical and health care, more and more heat conduction devices are appearing on the market.
[0003] However, existing household heat dissipation devices mainly use traditional heat dissipation plates such as aluminum plates, channel plates, and copper plates for heating. However, traditional heat dissipation plates cannot fully transfer heat, resulting in uneven surface temperature, excessive local temperature differences, and problems such as condensation. Moreover, for heat dissipation and cooling, they mainly use traditional refrigeration and heating technologies, such as compressor refrigeration, liquid circulation heat dissipation, and thermal conductive gel. These technologies have disadvantages such as large size, high energy consumption, and slow response speed, which cannot meet the development of miniaturization and integration. As a result, existing household heat dissipation devices cannot meet the needs of achieving efficient temperature control in limited spaces. Utility Model Content
[0004] To address the shortcomings of the existing technology, this utility model provides a passive and uniform heat transfer temperature control device. The device is small in size and compact in structure, and the switching between cooling and heating is flexible and convenient. The generated temperature can be precisely controlled to meet the needs of cooling and heating. It can achieve rapid and stable switching between cooling and heating modes in a limited space and uniformly transfer heat to the contact surface.
[0005] To achieve the above technical objectives, the present invention adopts the following technical solution: a cold and hot temperature control device capable of passive and uniform heat transfer, comprising a bottom shell and a passive heat spreader plate, wherein the passive heat spreader plate is disposed on the bottom shell, and the bottom shell is provided with a cooling and heating component and a temperature control component, wherein the temperature control component is used to monitor the temperature of the passive heat spreader plate.
[0006] The cooling and heating assembly includes a thermoelectric cooler, a cooling fan, and a heat sink. The top surface of the thermoelectric cooler is attached to a passive heat spreader, and the heat sink is attached to the bottom surface of the thermoelectric cooler. Thermal insulation cotton is provided around the thermoelectric cooler to separate the passive heat spreader and the heat sink. The heat sink is equipped with a cooling fan.
[0007] Preferably, a power adapter is provided on one side of the bottom shell, and the power adapter is connected to the cooling and heating components and the temperature control components.
[0008] Preferably, the bottom shell sidewall is provided with a USB interface and a DC power interface, and the DC power interface is connected to a power adapter.
[0009] Preferably, the bottom shell sidewall is provided with a button assembly.
[0010] Preferably, the USB interface is connected to a USB-SUB cable, which connects the USB interface to an external temperature control switch.
[0011] Preferably, the temperature control component includes a PCB board and several temperature sensors, which are evenly distributed on the back of the passive heat spreader. The PCB board is fixed to the bottom shell and connected to the temperature sensors and the thermoelectric cooling chip.
[0012] Preferably, the bottom shell and the passive heat spreader are connected by screws.
[0013] Preferably, both the top and bottom surfaces of the semiconductor cooling chip are coated with thermally conductive silicone grease.
[0014] Preferably, the bottom shell has a heat dissipation vent on its side, and the heat dissipation vent has a heat dissipation grille.
[0015] Preferably, a remote control switch is also included.
[0016] In summary, this utility model achieves the following technical effects:
[0017] This utility model discloses a passive and uniform heat transfer temperature control device. It uses a semiconductor cooling chip in conjunction with a passive heat spreader as the cold and heat sources. The components are small in size and compact in structure, and uniformly transfer heat to the top surface of the passive heat spreader. Moreover, the temperature control component can monitor the temperature of the passive heat spreader in real time. In conjunction with the cooling and heating components, the switching between cooling and heating is flexible and convenient, and the generated temperature can be precisely controlled to meet the needs of cooling and heating. It can achieve rapid and stable switching between cooling and heating modes in a limited space. It can be widely used in personal and family consumer scenarios such as pet constant temperature seat cushions / beds, smart mouse pads / desk mats, constant temperature office desks, cold and hot temperature control seat cushions, constant temperature seats / sofas, constant temperature cup mats, and car temperature control seat cushions. It can also be used in medical and health care scenarios such as physiotherapy patches and insulin refrigeration pen cases. Attached Figure Description
[0018] Figure 1 This is a three-dimensional structural diagram of the cold and hot temperature control device of this utility model that is capable of passive and uniform heat transfer.
[0019] Figure 2 This is an exploded schematic diagram of the cold and hot temperature control device of this utility model, which is capable of passive and uniform heat transfer.
[0020] Figure 3 This is a schematic diagram of the internal structure of the cold and hot temperature control device of this utility model, which is capable of passive and uniform heat transfer.
[0021] Figure 4 This is a schematic diagram of the cooling and heating component of the cold and heat temperature control device of this utility model, which is capable of passive and uniform heat transfer.
[0022] Figure 5 This is a schematic diagram of the temperature control component of the cold and hot temperature control device of this utility model, which is capable of passive and uniform heat transfer.
[0023] Figure 6 This is a schematic diagram of the PCB board structure of the cold and hot temperature control device of this utility model, which is capable of passive and uniform heat transfer.
[0024] Explanation of reference numerals in the instruction manual's attached diagrams: 1. Bottom shell; 2. Passive heat spreader; 3. Cooling and heating components; 31. Semiconductor cooling chip; 32. Insulation cotton; 33. Cooling fan; 34. Heat sink; 4. Power adapter; 5. PCB board; 6. Temperature sensor; 7. USB interface; 8. DC power interface; 9. Cooling button; 10. Main switch button; 11. Heating button; 12. Remote control switch; 13. USB-SUB cable; 14. External temperature control switch; 15. Temperature control PCB module; 16. Electrode positive and negative control module; 17. Current control module. Detailed Implementation
[0025] The present invention will be further described in detail below with reference to the accompanying drawings.
[0026] This specific embodiment is merely an explanation of the present utility model and is not intended to limit the present utility model. After reading this specification, those skilled in the art can make modifications to this embodiment without contributing any inventive step, but as long as they are within the scope of the claims of the present utility model, they are protected by patent law.
[0027] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.
[0028] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.
[0029] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0030] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.
[0031] Example 1:
[0032] like Figure 1 As shown in Figure 3, a cooling and heating integrated device based on a semiconductor cooling chip 31 includes a bottom shell 1 and a passive heat spreader 2. The passive heat spreader 2 is covered on the bottom shell 1. The bottom shell 1 is provided with two cooling and heating components 3 and a temperature control component. The temperature control component is used to monitor the temperature of the passive heat spreader 2. The two cooling and heating components 3 are located at both ends of the passive heat spreader 2.
[0033] The passive heat spreader 2 can evenly and quickly transfer the heat generated by the semiconductor cooling chip 31 to the entire surface, eliminating the generation of condensation at the source. Passive uniform heat transfer is a technology that achieves efficient heat transfer and uniform distribution without external energy input, through the inherent characteristics of materials and internal metric. The material of the passive heat spreader 2 can be adjusted according to the application scenario, such as VC plate, resonant heat transfer plate, flat heat pipe, etc. The bottom shell 1 is connected to the passive heat spreader 2 by screws. The bottom shell 1 is used to support the passive heat spreader 2. The material can be adjusted according to the actual application scenario and needs to have a certain load-bearing capacity, such as rigid foam material, plastic, aluminum alloy, etc.
[0034] This embodiment of the integrated cooling and heating device based on the semiconductor cooling chip 31 uses the semiconductor cooling chip 31 as both a cold source and a heat source. The components are small in size and compact in structure. Moreover, the temperature control component can monitor the temperature of the passive heat spreader 2 in real time. In conjunction with the cooling and heating component 3, the switching between cooling and heating is flexible and convenient, and the resulting temperature can be precisely controlled to meet the needs of cooling and heating. It can achieve rapid and stable switching between cooling and heating modes in a limited space, and evenly transfer heat to the top surface of the passive heat spreader 2. It can be widely used in personal and family consumer scenarios such as pet constant temperature seat cushions / beds, smart mouse pads / desk mats, constant temperature office desks, cold and hot temperature control seat cushions, constant temperature seats / sofas, constant temperature cup mats, and car temperature control seat cushions. It can also be used in medical and health care scenarios such as physiotherapy patches and insulin refrigeration pen cases.
[0035] The bottom shell 1 has a USB interface 7 and a DC power interface 8 on its side wall. The DC power interface 8 is connected to the power adapter 4. The USB interface 7 provides an external wiring control connector for the temperature control component. It is installed on the outer edge of the bottom shell 1 through a plastic spring. The DC power connector inputs 220V voltage to the power adapter 4 to provide power support for the entire device. It is screwed to the outer edge of the bottom shell 1 through a thread and nut.
[0036] A power adapter 4 is provided on one side of the bottom shell 1. The power adapter 4 is connected to the cooling and heating component 3 and the temperature control component. The function of the power adapter 4 is to convert the 220V input voltage from the DC power connector to 12V to adapt to the power supply of the whole set of devices. It is screwed to the top passive heat spreader 2.
[0037] The bottom shell 1 has a button group on its side wall, which includes a cooling button 9, a main switch button 10, and a heating button 11. The cooling button 9 is used to control the temperature drop on the device body and is installed on the outer edge of the bottom shell 1. The main switch button 10 is used to control the operation of the entire device and the switching of cooling and heating modes on the device body and is installed on the outer edge of the bottom shell 1. The heating button 11 is used to control the temperature rise on the device body and is installed on the outer edge of the bottom shell 1.
[0038] like Figure 4 As shown, the cooling and heating assembly 3 includes a semiconductor cooling chip 31, a cooling fan 33, and a heat sink 34. The top surface of the semiconductor cooling chip 31 is attached to the passive heat spreader 2, and the heat sink 34 is attached to the bottom surface of the semiconductor cooling chip 31. Thermal insulation cotton 32 is provided around the semiconductor cooling chip 31. The thermal insulation cotton 32 is used to separate the passive heat spreader 2 and the heat sink 34. The heat sink 34 is equipped with a cooling fan 33. The top and bottom surfaces of the semiconductor cooling chip 31 are coated with thermally conductive silicone grease.
[0039] The thermoelectric cooler 31 serves as both a cooling and heating source. It is evenly coated on both sides with thermally conductive silicone grease and tightly attached between the passive heat spreader 2 and the heat sink 34. Thermal insulation cotton 32 is attached around it, and it is secured with four screws to achieve efficient heat transfer. The thermoelectric cooler 31 used is from the Seebeck flagship store. The thermal insulation cotton 32 isolates the thermoelectric cooler 31 from the external environment and is tightly installed around the semiconductor, glued to the heat sink 34. The cooling fan 33 continuously or intermittently blows air onto the heat sink 34 in cooling scenarios to dissipate heat from the hot end of the thermoelectric cooler 31. It is screwed into the heat sink 34 and is a silent fan from Beijing Deepcool Technology Co., Ltd. The heat sink 34 is a channel-type aluminum profile heat sink 34, used in cooling mode in conjunction with the bottom cooling fan 33 to dissipate heat from the hot end of the thermoelectric cooler 31, achieving continuous cooling. In heating mode, it can increase the heat capacity of the cold end of the thermoelectric cooler 31 to achieve continuous heating.
[0040] like Figure 5 As shown in Figure 6, the temperature control component includes a PCB board 5 and several temperature sensors 6. The temperature sensors 6 are evenly distributed on the back of the passive heat spreader 2. The PCB board 5 is fixed to the bottom shell 1 and connected to the temperature sensors 6 and the semiconductor cooling chip 31. The PCB board 5 is provided with a temperature control PCB module 15, an electrode positive and negative control module 16 and a current control module 17.
[0041] Temperature sensor 6 can be used to monitor the surface temperature of the high-efficiency passive heat spreader 2 in real time after the device is powered on and running. The information is transmitted to the temperature control PCB module 15 for subsequent temperature adjustment. During installation, thermal grease is filled in the loose areas and the surface is sealed with glue for fixation. The model selected is NTC thermistor temperature sensor 6 from Shenzhen Boye Chuangzhan Electronics Co., Ltd.
[0042] The temperature control PCB module 15 is used to receive the monitoring information from the temperature sensor 6 and feed it back to an external display device, such as a display screen or remote control display. The electrode positive and negative control module 16 is used to control the positive and negative of the electrodes, thereby controlling the switching of the cooling and heating modes of the semiconductor refrigeration chip 31. After receiving the information transmitted by the temperature control component, the current control module 17 controls the working temperature of the semiconductor refrigeration chip 31 by controlling the total current, thereby achieving the purpose of cooling and heating temperature control.
[0043] The temperature control PCB module 15 integrates a receiver and a Bluetooth module. The receiver can work with the external remote control switch 12 to remotely control the operation of the entire device and switch between cooling and heating modes. The Bluetooth module can connect with an external mobile terminal via Bluetooth to remotely control the operation of the entire device and switch between cooling and heating modes.
[0044] The USB interface 7 is connected to a USB-SUB cable 13, which connects the USB interface 7 to an external temperature control switch 14. The external temperature control switch 14 is fixed to an external product by means of embedding, screw connection, or other installation methods to achieve the function of controlling the device.
[0045] The electrode positive and negative control module 16 is connected to the main switch button 10, and the heating button 11 and the cooling button 9 are connected to the current control module 17.
[0046] The bottom shell 1 has a heat dissipation vent on its side, and the heat dissipation vent is equipped with a heat dissipation grille.
[0047] The cooling and heating process of this utility model is as follows: power supply connection → cold source operation → passive heat spreader 2 uniformly transfers heat to achieve cooling → electrodes reverse direction → heat source operation → passive heat spreader 2 rapidly transfers heat to achieve heating. Specifically, the power supply is connected to the DC power interface 8, and a 12V current is output to the PCB board 5 and the cooling and heating component 3 through the power adapter 4. After receiving the power, the cooling and heating component 3 starts to work, and the generated heat is transferred to the entire surface through the passive heat spreader 2. When temperature adjustment is required, the temperature sensor 6 monitors the surface temperature and displays the temperature information on an external display via the temperature control PCB module 15. The user transmits the signal to the PCB board 5 via Bluetooth, remote control, or external wiring, and controls the current magnitude via the current control module 17 to achieve temperature control. When switching between cooling and heating modes, the signal is transmitted to the PCB board 5 via Bluetooth, remote control, or external wiring, and the electrode positive and negative control module 16 reverses the electrode polarity, thus switching the mode of the cooling / heating component 3. In cooling mode, the heat generated at the hot end of the cold source is dissipated by the heat sink 34 at the bottom of the cooling / heating component 3 in conjunction with the cooling fan 33. In heating mode, the heat generated at the cold end of the hot source is absorbed by the heat sink 34 at the bottom of the cooling / heating component 3.
[0048] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present utility model shall fall within the scope of the technical solution of the present utility model.
Claims
1. A temperature control device capable of passive and uniform heat transfer, characterized in that, It includes a bottom shell and a passive heat spreader plate, the passive heat spreader plate being covered on the bottom shell, the bottom shell being provided with a cooling and heating component and a temperature control component, the temperature control component being used to monitor the temperature of the passive heat spreader plate; The cooling and heating assembly includes a semiconductor cooling chip, a cooling fan, and a heat sink. The top surface of the semiconductor cooling chip is attached to a passive heat spreader, and the heat sink is attached to the bottom surface of the semiconductor cooling chip. Thermal insulation cotton is provided around the semiconductor cooling chip to separate the passive heat spreader and the heat sink. The heat sink is equipped with a cooling fan. The temperature control component includes a PCB board and several temperature sensors. The temperature sensors are evenly distributed on the back of the passive heat spreader. The PCB board is fixed to the bottom shell and connected to the temperature sensors and the semiconductor cooling chip.
2. The cold and hot temperature control device capable of passive and uniform heat transfer according to claim 1, characterized in that, A power adapter is provided on one side of the bottom shell, and the power adapter is connected to the cooling and heating components and the temperature control components.
3. A temperature control device capable of passive and uniform heat transfer according to claim 2, characterized in that, The bottom shell sidewall is provided with a USB interface and a DC power interface, and the DC power interface is connected to a power adapter.
4. A temperature control device for passive and uniform heat transfer according to claim 1, characterized in that, The bottom shell sidewall is equipped with a button assembly.
5. A temperature control device for passive and uniform heat transfer according to claim 3, characterized in that, The USB interface is connected to a USB-SUB cable, which connects the USB interface to an external temperature control switch.
6. A temperature control device capable of passive and uniform heat transfer according to claim 1, characterized in that, The bottom shell and the passive heat dissipation plate are connected by screws.
7. A temperature control device capable of passive and uniform heat transfer according to claim 1, characterized in that, The top and bottom surfaces of the semiconductor cooling chip are coated with thermally conductive silicone grease.
8. A temperature control device capable of passive and uniform heat transfer according to claim 1, characterized in that, The bottom shell has a heat dissipation vent on its side, and the heat dissipation vent is equipped with a heat dissipation grille.
9. A temperature control device capable of passive and uniform heat transfer according to claim 1, characterized in that, It also includes a remote control switch.