Vehicle-mounted refrigerator with novel heat dissipation system
By combining cross-arranged cooling fans and computer coolers with semiconductor refrigeration modules, along with a buffer system of high-pressure gas and spring shock absorbers, the problems of low cooling efficiency and poor heat dissipation of vehicle refrigerators are solved, achieving wider temperature control and stable operation.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SUZHOU RUIYAN ELECTRONICS TECH CO LTD
- Filing Date
- 2025-05-16
- Publication Date
- 2026-05-12
AI Technical Summary
Existing vehicle refrigerators have low cooling efficiency, and the cooling temperature is affected by the ambient temperature, making it impossible to reach below zero degrees Celsius. The heat dissipation system is also inefficient.
It adopts a combination of cross-arranged cooling fans and computer coolers with semiconductor refrigeration modules, and adds detachable partitions and shock absorption modules. It utilizes high-pressure gas and spring shock absorbers to buffer impact forces, achieving efficient heat dissipation and stable operation.
It improves the cooling efficiency and controllable temperature range of the car refrigerator from -5 degrees to 20 degrees Celsius, enhances heat dissipation and stability, and adapts to vehicle vibration.
Smart Images
Figure CN224230436U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of vehicle refrigerator technology, specifically to a vehicle refrigerator with a novel heat dissipation system. Background Technology
[0002] A car refrigerator is a portable refrigerated cabinet that connects directly to the vehicle's power supply. It's primarily used for refrigerating, freezing, or keeping warm items such as food, beverages, and medicine while driving. The working principle of a semiconductor car refrigerator is as follows: the core component is a semiconductor cooling chip, composed of two different semiconductor materials (N-type and P-type) connected in series. When power is applied, current flows through the semiconductor material, absorbing heat at one end and releasing heat at the other, achieving temperature difference cooling. By changing the direction of the current, the cooling and heating modes can be switched.
[0003] However, existing car refrigerators have low cooling efficiency, and the cooling temperature is affected by the ambient temperature. They cannot reach below zero degrees Celsius, and the controllable temperature range of car refrigerators is 0 to 20 degrees Celsius, which is a problem of low controllable temperature. In addition, the heat dissipation system of car refrigerators on the market is cooled by a cooling fan, which has poor heat dissipation effect.
[0004] Based on this, the present invention designs a vehicle refrigerator with a novel heat dissipation system to solve the above problems. Utility Model Content
[0005] In view of the above-mentioned shortcomings of the existing technology, the present invention provides a vehicle refrigerator with a novel heat dissipation system.
[0006] To achieve the above objectives, this utility model provides the following technical solution:
[0007] A vehicle-mounted refrigerator with a novel heat dissipation system includes an outer shell, a cooling fan, a computer cooler, a semiconductor refrigeration module, an inner liner, a removable partition, and a shock-absorbing module. The cooling fan, computer cooler, and inner liner are fixedly installed inside the outer shell, with the cooling fan and computer cooler located on the right side of the inner liner, and the cooling fan is fixedly connected to the computer cooler. A removable partition is detachably installed inside the inner liner, and the semiconductor refrigeration module is fixedly installed inside the inner liner and located on the right side of the removable partition. The semiconductor refrigeration module is connected to the computer cooler, and the lower end of the outer shell is connected to the shock-absorbing module.
[0008] Furthermore, multiple cooling fans and computer coolers are provided and arranged in a crisscross pattern.
[0009] Furthermore, the semiconductor refrigeration module includes a semiconductor refrigeration chip, a cooling end, a heating end, and a cooling copper pipe, with the semiconductor refrigeration chip fixedly installed inside the inner liner;
[0010] The thermoelectric cooler includes a cooling end and a heating end. The cooling end is fixedly installed on the left side of the thermoelectric cooler, and the heating end is fixedly installed on the right side of the thermoelectric cooler.
[0011] The heating end is fixedly connected to one end of the cooling copper pipe, and the other end of the cooling copper pipe is fixedly connected to and communicates with the computer cooler.
[0012] Furthermore, the shock absorption module includes a mounting plate, a first slider, an air chamber, a second slider, a base plate, spring shock absorbers, a buffer module, and a connecting module. The mounting plate is fixedly installed at the lower end of the outer shell, and the lower end of the mounting plate is fixedly connected to the first slider. The side wall of the first slider is slidably connected to the upper side wall of the air chamber, and the lower side wall of the air chamber is slidably connected to the second slider. The second slider is fixedly installed at the upper end of the base plate. Multiple spring shock absorbers are provided, and the upper ends of the multiple spring shock absorbers are fixedly connected to the lower end of the outer shell. The buffer module and the connecting module are each provided in two sets and are located on the left and right sides of the air chamber, respectively.
[0013] Furthermore, the buffer module includes a fixed frame, a moving block, and a spring. The interior of the fixed frame is slidably connected to the moving block, one end of the spring is fixedly connected to the moving block, and the other end of the spring is fixedly connected to the inner wall of the fixed frame.
[0014] Furthermore, the two fixed frames are respectively installed on the left and right side walls of the gas chamber.
[0015] Furthermore, the connection module includes a first link and a second link. One end of the first link is rotatably connected to the lower end of the mounting plate, and the other end of the first link is rotatably connected to the moving block. One end of the second link is rotatably connected to the moving block, and the other end of the second link is rotatably connected to the base plate.
[0016] Furthermore, each of the first and second connecting rods is provided in pairs and is located on the front and rear sides of the fixed frame, respectively.
[0017] Compared with the prior art, the advantages of this utility model are as follows: 1. When this utility model is in use, the vehicle power supply provides power to the semiconductor cooling chip. Subsequently, the cooling end of the semiconductor cooling chip absorbs heat from inside the refrigerator, and the refrigerator temperature drops. The semiconductor cooling chip is connected to a cooling copper pipe, and coolant flows through the cooling copper pipe. The heat generated by the semiconductor cooling chip is carried to the computer cooler for circulation through the heating end. The heat generated by the heating end is dissipated by the computer cooler and cooling fan, and the heat is discharged to the external environment. The simultaneous operation of multiple computer coolers and multiple cooling fans improves the heat dissipation efficiency.
[0018] 2. When a computer cooler is added, this utility model can change the temperature controllable range to approximately -5°C to 20°C.
[0019] 3. This utility model absorbs mechanical energy through high-pressure gas compression in the air chamber, buffers impact force with the help of spring shock absorbers, achieves automatic rebound and reset by gas expansion, and limits the rebound speed by using the first slider to drive the connecting rod to squeeze the spring. All components work closely together to effectively cope with vibration on the vehicle and ensure the stable operation of equipment such as refrigerators. Attached Figure Description
[0020] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0021] Figure 1 This utility model relates to a three-dimensional vehicle refrigerator with a novel heat dissipation system. Figure 1 ;
[0022] Figure 2 This is a front view of a vehicle refrigerator with a novel heat dissipation system according to the present invention.
[0023] Figure 3 This utility model relates to a three-dimensional vehicle refrigerator with a novel heat dissipation system. Figure 2 ;
[0024] Figure 4 For along Figure 2 A schematic diagram of the structure with a portion cut off along the AA direction;
[0025] Figure 5 A schematic diagram showing the connection between a computer cooler and a semiconductor refrigeration module;
[0026] Figure 6 This is a structural schematic diagram of the shock absorption module of this utility model.
[0027] The labels in the diagram represent:
[0028] 1. Outer shell; 2. Cooling fan; 3. Computer cooler; 4. Semiconductor refrigeration module; 41. Semiconductor refrigeration chip; 42. Cooling end; 43. Heating end; 44. Cooling copper pipe; 5. Inner liner; 6. Removable partition; 7. Shock absorption module; 71. Mounting plate; 72. First slider; 73. Air chamber; 74. Second slider; 75. Fixed frame; 76. Moving block; 77. First connecting rod; 78. Second connecting rod; 79. Spring; 710. Base plate; 711. Spring shock absorber. Detailed Implementation
[0029] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.
[0030] The terms "left," "right," "front," "back," "up," and "down" used in the following description refer to the orientation from the perspective of the front view.
[0031] In some embodiments, please refer to the accompanying drawings. Figures 1-6 A vehicle-mounted refrigerator with a novel heat dissipation system includes an outer shell 1, a cooling fan 2, a computer cooler 3, a semiconductor refrigeration module 4, an inner liner 5, a removable partition 6, and a shock-absorbing module 7. The cooling fan 2, the computer cooler 3, and the inner liner 5 are fixedly installed inside the outer shell 1. The cooling fan 2 and the computer cooler 3 are located on the right side of the inner liner 5, and the cooling fan 2 is fixedly connected to the computer cooler 3. The removable partition 6 is detachably installed inside the inner liner 5. The semiconductor refrigeration module 4 is fixedly installed inside the inner liner 5 and is located on the right side of the removable partition 6. The semiconductor refrigeration module 4 is connected to the computer cooler 3. The lower end of the outer shell 1 is connected to the shock-absorbing module 7.
[0032] The cooling fans 2 and computer coolers 3 are provided in multiple and arranged in a cross pattern. The semiconductor cooling modules 4 are provided in multiple and are respectively connected to multiple computer coolers 3.
[0033] Both the cooling fan 2 and the computer cooler 3 are existing, mature equipment.
[0034] The cross-arranged cooling fans 2 and the computer cooler 3 together constitute a heat dissipation system, which effectively improves the working efficiency and controllable temperature range of the vehicle refrigerator.
[0035] The semiconductor cooling module 4 includes a semiconductor cooling chip 41, a cooling end 42, a heating end 43, and a cooling copper pipe 44. The semiconductor cooling chip 41 is fixedly installed inside the inner liner 5.
[0036] The thermoelectric cooler 41 includes a cooling end 42 and a heating end 43. The cooling end 42 is fixedly installed on the left side of the thermoelectric cooler 41, and the heating end 43 is fixedly installed on the right side of the thermoelectric cooler 41.
[0037] The heating end 43 is fixedly connected to one end of the cooling copper pipe 44, and the other end of the cooling copper pipe 44 is fixedly connected to and communicates with the computer cooler 3.
[0038] The vehicle power supply provides power to the thermoelectric cooler 41. Subsequently, the cooling end 42 of the thermoelectric cooler 41 absorbs heat from inside the refrigerator, causing the refrigerator temperature to drop. The thermoelectric cooler 41 is connected to the cooling copper pipe 44, through which coolant flows. The heat generated by the thermoelectric cooler 41 is carried to the computer cooler 3 for circulation through the heating end 43. The heat generated by the heating end 43 is dissipated by the computer cooler 3 and the cooling fan 2, expelling the heat to the external environment. The simultaneous operation of multiple computer coolers 3 and multiple cooling fans 2 improves the heat dissipation efficiency.
[0039] This practical semiconductor cooling module 4 has the advantages of being noiseless, highly portable, supporting bidirectional temperature control, and having strong low voltage adaptability, which improves the working efficiency and controllable temperature range of the vehicle refrigerator.
[0040] With the addition of computer cooler 3, this utility model can change the temperature controllable range to approximately -5°C to 20°C.
[0041] The shock absorption module 7 includes a mounting plate 71, a first slider 72, an air chamber 73, a second slider 74, a base plate 710, spring shock absorbers 711, a buffer module, and a connecting module. The mounting plate 71 is fixedly installed at the lower end of the outer shell 1, and the lower end of the mounting plate 71 is fixedly connected to the first slider 72. The side wall of the first slider 72 is slidably connected to the upper side wall of the air chamber 73, and the lower side wall of the air chamber 73 is slidably connected to the second slider 74. The second slider 74 is fixedly installed at the upper end of the base plate 710. Multiple spring shock absorbers 711 are provided, and the upper ends of the multiple spring shock absorbers 711 are fixedly connected to the lower end of the outer shell 1. The buffer module and the connecting module are each provided in two sets and are located on the left and right sides of the air chamber 73, respectively.
[0042] The lower ends of the plurality of spring shock absorbers 711 are each equipped with suction cups for fixing the refrigerator.
[0043] The buffer module includes a fixed frame 75, a moving block 76, and a spring 79. The interior of the fixed frame 75 is slidably connected to the moving block 76, one end of the spring 79 is fixedly connected to the moving block 76, and the other end of the spring 79 is fixedly connected to the inner wall of the fixed frame 75.
[0044] The two fixed frames 75 are respectively installed on the left and right side walls of the air chamber 73.
[0045] The connection module includes a first connecting rod 77 and a second connecting rod 78. One end of the first connecting rod 77 is rotatably connected to the lower end of the mounting plate 71, and the other end of the first connecting rod 77 is rotatably connected to the moving block 76. One end of the second connecting rod 78 is rotatably connected to the moving block 76, and the other end of the second connecting rod 78 is rotatably connected to the base plate 710.
[0046] Two of each of the first connecting rod 77 and the second connecting rod 78 are provided and are located on the front and rear sides of the fixed frame 75, respectively.
[0047] In use, the air chamber 73 is filled with high-pressure gas (usually nitrogen). When the vehicle shakes, the outer shell 1 will squeeze the first slider 72, causing the first slider 72 to squeeze the high-pressure gas and slide in the air chamber 73, thus compressing the gas inside the air chamber 73. Gas is compressible and can absorb a large amount of mechanical energy during the compression process, converting it into the internal energy of the gas, thereby playing a role in buffering the impact force. At the same time, the spring shock absorber 711 also plays a buffering role.
[0048] When the external force disappears, the compressed gas begins to expand, releasing the absorbed energy and pushing the first slider 72 back to its original position, achieving a rebound. During the rebound process, the gas pressure gradually returns to its initial state, while also converting some of the internal energy into mechanical energy. To prevent the first slider 72 from rebounding excessively and causing new vibrations, the first slider 72 drives the first connecting rod 77 to move during the reset process. The first connecting rod 77 drives the moving block 76 to move, and the moving block 76 drives the second connecting rod 78 to move. At the same time, the moving block 76 compresses the spring 79 inward, thereby limiting the rebound speed and ensuring the stability of the refrigerator.
[0049] This invention utilizes the high-pressure gas compression within the air chamber 73 to absorb mechanical energy, and the spring shock absorber 711 to buffer the impact force. It also uses gas expansion to achieve automatic rebound and reset, and the first slider 72 drives the first connecting rod 77 and the second connecting rod 78 to compress the spring 79 to limit the rebound speed. All components work closely together to effectively cope with vibrations on the vehicle and ensure the stable operation of equipment such as refrigerators.
[0050] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions will not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.
Claims
1. A vehicle-mounted refrigerator with a novel heat dissipation system, comprising an outer shell (1), characterized in that, It also includes a cooling fan (2), a computer cooler (3), a semiconductor refrigeration module (4), an inner liner (5), and a removable partition (6). The cooling fan (2), the computer cooler (3), and the inner liner (5) are fixedly installed inside the outer shell (1). The cooling fan (2) and the computer cooler (3) are located on the right side of the inner liner (5), and the cooling fan (2) is fixedly connected to the computer cooler (3). The removable partition (6) is detachably installed inside the inner liner (5). The semiconductor refrigeration module (4) is fixedly installed inside the inner liner (5) and is located on the right side of the removable partition (6). The semiconductor refrigeration module (4) is connected to the computer cooler (3).
2. The vehicle-mounted refrigerator with a novel heat dissipation system according to claim 1, characterized in that, Both the cooling fan (2) and the computer cooler (3) are equipped with multiple units.
3. The vehicle-mounted refrigerator with a novel heat dissipation system according to claim 2, characterized in that, Multiple cooling fans (2) are arranged in a cross pattern with multiple computer coolers (3).
4. The vehicle-mounted refrigerator with a novel heat dissipation system according to claim 1, characterized in that, The semiconductor cooling module (4) includes a semiconductor cooling chip (41) and a cooling copper pipe (44). The semiconductor cooling chip (41) is fixedly installed inside the inner liner (5) and is connected to the cooling copper pipe (44).
5. The vehicle-mounted refrigerator with a novel heat dissipation system according to claim 4, characterized in that, The thermoelectric cooler (41) includes a cooling end (42) and a heating end (43). The cooling end (42) is fixedly installed on the left side of the thermoelectric cooler (41), and the heating end (43) is fixedly installed on the right side of the thermoelectric cooler (41).
6. The vehicle-mounted refrigerator with a novel heat dissipation system according to claim 5, characterized in that, The heating end (43) is fixedly connected to one end of the cooling copper pipe (44), and the other end of the cooling copper pipe (44) is fixedly connected to and communicates with the computer cooler (3).