Slave station device and communication system
By integrating the pins onto the signal board using an integrated housing and potting sealing technology, the problems of large size and insufficient protection performance of IO-Link slave devices are solved, achieving a miniaturized, highly reliable, and easy-to-install device design.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- BEIJING TEBEIFU ELECTRONIC TECH CO LTD
- Filing Date
- 2025-06-10
- Publication Date
- 2026-05-15
AI Technical Summary
Existing IO-Link slave devices are bulky and lack effective dustproof, waterproof, and shockproof performance.
The device features an integrated housing design, with the pins integrated onto the signal board and secured to the housing using a potting sealant process. The design is further enhanced by a limiting step and an adhesive layer, and the external interfaces are located on the same surface for easy connection.
It significantly reduces equipment size, improves dustproof, waterproof and shockproof performance, simplifies the installation process, and enhances the stability and sealing of the mechanical structure.
Smart Images

Figure CN224249782U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of communication technology, and more specifically, to a slave device and a communication system. Background Technology
[0002] Currently, in IO-Link communication systems, signals from IO-Link devices are amplified by IO-Link slave devices before being transmitted to the IO-Link master device. In related technologies, IO-Link slave devices are relatively large, typically consisting of interconnected upper and lower housings, with the circuit board positioned between them. Utility Model Content
[0003] The present invention aims to at least solve the technical problem of excessively large equipment size in the prior art or related technologies.
[0004] In view of this, an embodiment of the first aspect of the present invention provides a slave device.
[0005] A second aspect of this utility model provides a communication system.
[0006] To achieve the above objectives, an embodiment of this utility model provides a slave device, comprising: a housing, wherein a receiving cavity is provided inside the housing, and a plurality of first interfaces and second interfaces are provided on the first wall surface of the housing; a signal board, disposed in the receiving cavity, wherein a first pin and a second pin extending toward the first wall surface are integrated on the signal board, the first pin being adapted to the first interface, and the second pin being adapted to the second interface; wherein the housing is an integral structure, and the signal board is sealed and assembled with the housing by potting adhesive.
[0007] The slave device proposed in this utility model integrates pins onto the signal board through an integrated housing, significantly reducing the device's size and making it suitable for space-constrained applications. Furthermore, due to the use of potting compound and multiple sealing designs, the device achieves industrial-grade standards in dustproof, waterproof, and shockproof performance.
[0008] Specifically, the slave device includes a housing and a signal board. The housing has a receiving cavity and multiple first and second interfaces on the first wall. The housing is the external protective layer of the device and is fixed to the internal signal board by potting glue, providing robust external protection to avoid damage to the internal circuitry by the external environment (such as dust, moisture, and corrosive media).
[0009] The housing is a unibody structure, which can be made of plastic. This unibody design reduces the weight of the equipment, lowers manufacturing costs, and reduces structural fragility caused by splicing. Furthermore, since the first and second interfaces are located on the same surface, specifically the first wall, external wiring connections are easily facilitated, improving installation efficiency.
[0010] The signal board is housed within the housing cavity and integrates a first pin and a second pin. The signal board is fixed using a potting process and is located at the center of the housing cavity, connected to the corresponding interface on the housing wall. Specifically, the first pin is aligned with the first interface on the housing, and the second pin is aligned with the second interface. The signal board primarily provides data processing and communication functions. The pins are directly soldered to the signal board, avoiding the additional space occupied by traditional connector support structures and reducing the overall size of the device.
[0011] In some technical solutions, optionally, a limiting step is also included, which is located inside the housing, and the signal plate abuts against the limiting step.
[0012] In this technical solution, the limiting step is located inside the housing's receiving cavity and is part of the housing structure. Its position is designed to correspond to the edge of the signal board, serving to support and fix the signal board.
[0013] During equipment assembly, the edge of the signal plate directly contacts the limiting step, allowing for quick positioning during installation without additional adjustments, thus improving assembly efficiency. After the signal plate abuts against the limiting step, a potting process further solidifies the signal plate's position, forming a double fixation and enhancing the stability of the mechanical structure.
[0014] During the glue-filling process, the limiting steps restrict the movement of the signal board and provide a support area for glue filling, ensuring uniform and stable glue filling. At the same time, the limiting steps also provide uniform support for the signal board, preventing bending or deformation caused by uneven stress.
[0015] The limiting step is integrally molded with the shell, which reduces the complexity of the assembly structure and process steps, while maintaining the compactness of the internal structure of the equipment.
[0016] In some technical solutions, the signal board may optionally be parallel to at least a portion of the first wall surface.
[0017] In this technical solution, when the signal board is installed inside the housing, its plane is parallel to at least part of the first wall surface of the housing. The signal board is fixed in the receiving cavity of the housing. The pins (i.e., the first pin and the second pin) are perpendicular to the plane of the signal board and point to the first wall surface, corresponding to the interfaces (i.e., the first interface and the second interface) on the first wall surface.
[0018] Of course, the pins are directly supported by the signal board, reducing the possibility of loosening or breaking of solder joints due to uneven stress. The design of the signal board being parallel to part or all of the first wall surface facilitates positioning during assembly, reduces the need for high assembly precision, simplifies the manufacturing process, and improves production efficiency.
[0019] In some technical solutions, optionally, an adhesive layer is also included, disposed between the limiting step and the signal plate.
[0020] In this technical solution, the adhesive layer is an adhesive material disposed between the signal plate and the limiting step to enhance the fixation effect between the signal plate and the housing. It can be understood that the adhesive layer serves as a preliminary fixation effect before potting and sealing. The adhesive layer provides additional fixing force, which, together with the limiting step, restricts the movement of the signal plate.
[0021] In some technical solutions, optionally, the first interface is provided with a connection terminal, the connection terminal is provided with a first pin hole, and the first pin is located in the first pin hole.
[0022] In this technical solution, the first interface is located on the first wall of the housing and is used to realize the electrical communication interface between the device and the external connected device. It is provided with a connection terminal inside to provide load-bearing and conductive functions for the connection of the pin.
[0023] The connecting terminal is installed inside the first interface for mechanical fixation and electrical signal conduction. A first pin hole is provided on the surface of the connecting terminal to match the first pin, so as to receive the first pin and form a reliable electrical connection.
[0024] The first pin is fixed on the signal board and can extend vertically into the first interface. The end of the pin is inserted into the first pin hole of the connection terminal to ensure the conductivity and mechanical stability between the pin and the pin hole.
[0025] The first interface is mainly used to provide a connection interface between the device and external devices (such as sensors, actuators, etc.), which facilitates quick plugging and unplugging operations. The combination of the housing structure and the connection terminals effectively prevents the pins from being exposed to the external environment, improving the resistance to pollution and interference.
[0026] The pinhole inside the connector precisely positions the first pin, ensuring the accuracy and reliability of the pin connection. The connector can be made of a highly conductive material, enabling efficient transmission of signals or current and reducing signal loss.
[0027] In some technical solutions, optionally, the connecting terminal sleeve is provided with a sealing ring, and the slave device also includes: a connector, which is detachably connected to the first interface, wherein when the connector is connected to the first interface, the connector abuts against the sealing ring.
[0028] In this technical solution, the connecting terminal has a first pinhole for mating with a first pin, and a sealing ring is fitted externally to enhance the sealing performance of the interface. The sealing ring surrounds the connecting terminal and is located in the edge area inside the first interface. The sealing ring can be made of an elastic material (such as silicone or rubber) and has good compressibility and durability. When the connector is connected to the first interface, a sealing effect is formed by compressing the sealing ring.
[0029] In some technical solutions, optionally, the inner wall of the first interface is provided with threads, and the connector is threadedly connected to the first interface.
[0030] In this technical solution, by setting the threads on the inner wall of the first interface and surrounding the entire interface, a threaded connection with the connector can be provided, making the connection more stable and reliable.
[0031] It is understood that the outer wall of the connector is machined with threads corresponding to the inner wall of the first interface. By rotating, the outer thread of the connector and the inner thread of the first interface are gradually tightened to form a stable connection. The connector can be firmly fixed on the first interface, effectively preventing loosening or separation caused by vibration, impact or external force.
[0032] In some technical solutions, optionally, it also includes: an external threaded post, disposed on the first wall surface, and the external threaded post extends in a direction away from the signal board, and the external threaded post is provided with a second interface; wherein, the external threaded post is integrally formed with the housing.
[0033] In this technical solution, an external threaded post is provided on the first wall of the housing. The outer surface of the external threaded post is provided with threads for threaded connection with external connectors. The external threaded post is provided with a second interface for connection with external equipment or wires.
[0034] The second interface serves as a channel for electrical connection between the slave device and the external system, used for data transmission or power supply. By nesting the second interface inside the external threaded column, it is protected from external physical damage, while simplifying the installation of external connectors.
[0035] In some technical solutions, the first pin and the second pin may optionally have different lengths.
[0036] In this technical solution, both the first pin and the second pin are integrated on the signal board and extend toward the first interface and the second interface, respectively.
[0037] By limiting the lengths of the first and second pins to different lengths, a foolproof design can be implemented to reduce the probability of misoperation and effectively prevent pin misalignment or electrical short circuits during insertion. The different lengths ensure sufficient spacing between the two pins, thus avoiding interference when they make physical contact.
[0038] In some technical solutions, optionally, the system also includes: an indicator light, mounted on the signal board, used to display the operating status related to the first and second pins; and a light-transmitting sheet, corresponding to the indicator light, mounted on the housing.
[0039] In this technical solution, the indicator light is mounted on the signal board (circuit board) and is typically associated with the operating status of the first and second pins. A light-transmitting sheet is located on the housing, directly corresponding to the mounting position of the indicator light. The light-transmitting sheet is designed to be transparent or semi-transparent to ensure that the light emitted by the indicator light is clearly visible.
[0040] The indicator light works in conjunction with the light-transmitting sheet through the circuit board, and the light-transmitting sheet conveys the status information of the indicator light.
[0041] In some technical solutions, optionally, it also includes: a potting layer, disposed on the side of the signal board away from the first wall surface, wherein the signal board and the housing are sealed with potting compound to form the potting layer; wherein the potting layer is flush with the side of the housing away from the first wall surface.
[0042] In this technical solution, the potting layer is located on the side of the signal board away from the first wall surface, that is, in the space between the signal board and the housing. The potting layer is flush with the side of the housing away from the first wall surface, forming a sealing and protective layer.
[0043] The potting layer is flush with the side of the housing furthest from the first wall surface, ensuring even coverage of the entire connection area and improving sealing. This design results in a stronger bond between the potting layer and the housing, enhancing the overall structural stability of the equipment.
[0044] The potting layer effectively prevents external environmental factors (such as moisture and dust) from entering the equipment, avoiding contamination of signal boards and circuits, and ensuring the reliability and stability of the equipment in harsh environments.
[0045] An embodiment of the second aspect of this application provides a communication system, including: a master station device; and any of the aforementioned slave station devices, which are communicatively connected to the master station device.
[0046] The communication system provided in this application includes a master station device and slave station devices. The master station device is responsible for communicating with multiple slave station devices, issuing control commands, and receiving feedback data. It typically includes powerful computing capabilities and multiple communication interfaces for managing and scheduling the operations of the slave station devices.
[0047] The master station uses a specific industrial communication protocol for data transmission, ensuring efficient and reliable real-time data exchange. The slave station is the device that performs specific tasks within the communication system; it executes specific operations based on the master station's instructions and feeds back data. Each slave station may contain different types of sensors, actuators, controllers, or other industrial equipment.
[0048] Since the communication system includes any of the aforementioned slave devices, it has the beneficial effects of any of the aforementioned slave devices, which will not be elaborated here.
[0049] Additional aspects and advantages of this invention will become apparent in the description that follows, or may be learned by practice of this invention. Attached Figure Description
[0050] Figure 1 A schematic diagram of the structure of a slave station device according to an embodiment of the present invention is shown;
[0051] Figure 2 A schematic diagram of the structure of a slave station device according to an embodiment of the present invention is shown;
[0052] Figure 3 A schematic diagram of the structure of a signal board according to an embodiment of the present invention is shown;
[0053] Figure 4 A schematic diagram of the structure of a housing according to an embodiment of the present invention is shown;
[0054] Figure 5 A schematic diagram of the structure of a communication system according to an embodiment of the present invention is shown.
[0055] in, Figures 1 to 5 The correspondence between the reference numerals and component names in the attached drawings is as follows:
[0056] 100: Slave device; 102: Housing; 1022: Receiving cavity; 1024: First wall surface; 1026: First interface; 1028: Second interface; 104: Signal board; 1042: First pin; 1044: Second pin; 106: Limiting step; 108: Adhesive layer; 1102: Connecting terminal; 1104: First pinhole; 112: Sealing ring; 114: Connector; 116: External threaded post; 1182: Indicator light; 1184: Light-transmitting sheet; 120: Encapsulation layer; 122: Label plate;
[0057] 200: Communication system; 202: Master station equipment. Detailed Implementation
[0058] To better understand the above-mentioned objectives, features, and advantages of the embodiments of this utility model, the embodiments of this utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.
[0059] Many specific details are set forth in the following description in order to provide a full understanding of this application. However, embodiments of the present invention may also be implemented in other ways different from those described herein. Therefore, the scope of protection of this application is not limited to the specific embodiments disclosed below.
[0060] The following reference Figures 1 to 5 Some embodiments of the present invention are described below.
[0061] like Figure 1 As shown, this embodiment provides a slave device 100, in which pins are integrated onto a signal board 104 via an integrated housing 102, significantly reducing the device size and making it suitable for space-constrained applications. Furthermore, due to the use of potting compound and multiple sealing designs, the device achieves industrial-grade standards in dustproof, waterproof, and shockproof performance.
[0062] Specifically, the slave device 100 includes a housing 102 and a signal board 104. The housing 102 has a receiving cavity 1022, and as shown... Figure 1 and Figure 2 As shown, a plurality of first interfaces 1026 and second interfaces 1028 are provided on the first wall surface 1024. The housing 102 is the external protective layer of the device and is fixed to the internal signal board 104 by potting glue, providing robust external protection to avoid damage to the internal circuitry by the external environment (such as dust, moisture, corrosive media).
[0063] The housing 102 is an integrated structure, which can be made of plastic. The integrated design reduces the weight of the equipment, lowers manufacturing costs, and reduces structural fragility caused by splicing. In addition, since the first interface 1026 and the second interface 1028 are located on the same surface, specifically on the first wall surface 1024, it facilitates external connection wiring and improves installation efficiency.
[0064] The first wall is the outer surface of the shell. The first interface 1026 and the second interface 1028 can be directly set on the outer surface, or the outer surface can be shaped, for example, after grooving and cutting, the first interface 1026 and the second interface 1028 can be set on it.
[0065] The signal board 104 is disposed within the receiving cavity 1022 of the housing 102, integrating a first pin 1042 and a second pin 1044. The signal board 104 is fixed by a potting process and is located at the center of the receiving cavity 1022, connected to the corresponding interface on the wall of the housing 102. Specifically, the first pin 1042 is adapted and aligned with the first interface 1026 on the housing 102, and the second pin 1044 is adapted and aligned with the second interface 1028. The signal board 104 mainly provides data processing and communication functions. The pins are directly soldered to the signal board 104, avoiding the additional space occupied by traditional connector support structures and reducing the overall size of the device.
[0066] It is understandable that potting not only enhances the shock resistance of the signal board 104, but also further improves the sealing performance and environmental adaptability of the equipment.
[0067] Furthermore, the first pin 1042 is integrated on the signal board 104 and is adapted to the first interface 1026 on the housing 102 to connect to the communication signal of the external device. The first pin 1042 extends along the signal board 104 toward the first wall surface 1024 of the housing 102 and is strictly aligned with the first interface 1026, providing a communication interface between the device and the external upstream device. The direct adaptation between the pin and the interface reduces intermediate links and improves the stability and reliability of signal transmission.
[0068] Similarly, the second pin 1044 is integrated on the signal board 104 and is adapted to the second interface 1028 on the housing 102 for connecting to an external power supply or other signal transmission path. The second pin 1044 extends to the other side of the signal board 104 and is aligned with the second interface 1028, providing extended connections for device power input or other signals.
[0069] The signal board 104 is sealed and fixed to the housing 102 by potting glue. The glue completely covers the surface of the signal board 104 and fills the connection gap between the signal board 104 and the housing 102, so that the signal board 104 is firmly embedded in the housing 102, fixing the signal board 104 and preventing displacement or loosening due to vibration or impact. At the same time, it also improves the sealing performance of the equipment and effectively prevents dust, water vapor or corrosive gases from entering the interior.
[0070] Multiple label slots can be provided on the housing 102 to facilitate the insertion of the label plate 122 after targeted writing, so as to distinguish the connection objects and connection purposes of different second interfaces 1028.
[0071] It is understood that through the above structure, this application effectively achieves miniaturization, high integration and high reliability, meeting the needs of modern industrial automation for compact, stable and easy-to-use equipment.
[0072] In some embodiments, optionally, such as Figure 2 As shown, the limiting step 106 is disposed inside the receiving cavity 1022 of the housing 102 and is a part of the structure of the housing 102. Its position is designed to correspond to the edge of the signal plate 104, and is used to support and fix the signal plate 104. Specifically, the limiting step 106 is located inside the housing 102, surrounding or partially distributed in the corresponding area of the edge of the signal plate 104, and the edge of the signal plate 104 directly contacts and abuts against the limiting step 106, forming a supporting function.
[0073] It is understandable that during equipment assembly, the edge of the signal plate 104 directly contacts the limiting step 106, allowing it to be quickly positioned during installation without additional adjustments, thus improving assembly efficiency. After the signal plate 104 abuts against the limiting step 106, the potting process further solidifies the position of the signal plate 104, forming a double fixation and enhancing the stability of the mechanical structure.
[0074] During the glue-filling process, the limiting step 106 restricts the movement of the signal board 104 and provides a support area for glue filling, ensuring uniform and stable glue filling. At the same time, the limiting step 106 also provides uniform support for the signal board 104, preventing bending or deformation of the signal board 104 due to uneven force.
[0075] The limiting step 106 is integrally formed with the housing 102, which reduces the complex assembly structure and process steps, while maintaining the compactness of the internal structure of the equipment.
[0076] In some embodiments, optionally, when the signal board 104 is installed inside the housing 102, its plane remains parallel to at least a portion of the first wall surface 1024 of the housing 102, and the signal board 104 is fixed in the receiving cavity 1022 of the housing 102, with pins (i.e., such as...) Figure 3 The first pin 1042 and the second pin 1044 shown are perpendicular to the plane of the signal board 104 and point towards the first wall 1024, corresponding to the interfaces (i.e., the first interface 1026 and the second interface 1028) on the first wall 1024.
[0077] Of course, the signal board 104 is supported by the limiting step 106 and fixed in the housing 102 by means of potting process, so as to achieve an installation structure parallel to part or all of the first wall surface 1024.
[0078] The signal board 104 is arranged parallel to the first wall surface 1024, which ensures that the pin direction is aligned with the interface while minimizing the size and thickness of the device, making the device more compact and suitable for industrial scenarios with high space requirements.
[0079] It is understood that the pins are perpendicular to the signal board 104 and directly connect to the interface on the first wall surface 1024. The fact that the signal board 104 is parallel to the first wall surface 1024 avoids connection difficulties caused by angular deviations, ensuring the reliability and stability of the connection between the pins and the interface.
[0080] Of course, the pins are directly supported by the signal board 104, reducing the possibility of loosening or breaking of solder joints due to uneven stress. The design of the signal board 104 being parallel to the first wall surface 1024 facilitates positioning during assembly, reduces the high requirements for assembly precision, simplifies the manufacturing process, and improves production efficiency.
[0081] The parallel design creates a natural protective space between the signal board 104 and the first wall surface 1024, avoiding direct impact from the external environment on the signal board 104.
[0082] In some embodiments, optionally, an adhesive layer 108, specifically an adhesive material, is provided between the signal plate 104 and the limiting step 106 to enhance the fixation effect between the signal plate 104 and the housing 102. It is understood that the adhesive layer 108 can serve as a preliminary fixation effect before potting and sealing. The adhesive layer 108 provides additional fixing force, which, together with the limiting step 106, restricts the movement of the signal plate 104.
[0083] The potting process mainly seals and protects the signal board 104 as a whole, while the adhesive layer 108 serves as a local fixing material to ensure that the signal board 104 will not shift before the potting curing, thus improving the potting quality.
[0084] The presence of the adhesive layer 108 stabilizes the position of the signal board 104, ensuring that the pins are always precisely aligned with the first interface 1026 and the second interface 1028, thereby improving the reliability of signal transmission.
[0085] In some embodiments, optionally, the first interface 1026 is located on the first wall 1024 of the housing 102, and is used to realize the electrical communication interface between the device and the external connected device. It is provided with a connection terminal 1102 inside, which provides carrying and conductive functions for the connection of the pin.
[0086] The connecting terminal 1102 is installed inside the first interface 1026 for mechanical fixation and electrical signal conduction. A first pinhole 1104 is provided on the surface of the connecting terminal 1102 to match the first pin 1042, so as to receive the first pin 1042 and form a reliable electrical connection.
[0087] The first pin 1042 is fixed on the signal board 104 and can extend vertically into the first interface 1026. The end of the pin is inserted into the first pin hole 1104 of the connection terminal 1102 to ensure the conductivity and mechanical stability between the pin and the pin hole.
[0088] The first interface 1026 is mainly used to provide a connection interface between the device and external devices (such as sensors, actuators, etc.), which facilitates quick plugging and unplugging operations. The combination of the housing structure and the connection terminal 1102 effectively prevents the pins from being exposed to the external environment, improving the resistance to pollution and interference.
[0089] The pinhole in the connecting terminal 1102 precisely positions the first pin 1042, ensuring the accuracy and reliability of the pin connection. The connecting terminal 1102 can be made of a material with good conductivity, which can efficiently transmit signals or current and reduce signal loss.
[0090] Specifically, the first pinhole 1104 is used to fix the pin and provide a conductive channel. The size of the first pinhole 1104 is precisely matched with the size of the pin to ensure that the pin is not loose when inserted. The inner wall of the pinhole is in close contact with the surface of the pin to provide a low-resistance conductive channel.
[0091] The first pin 1042 serves as a signal bridge between the signal board 104 and external devices. The pin transmits signals from the signal board 104 to the external devices through the connection terminal 1102.
[0092] The connection terminal 1102 is located inside the first interface 1026. It limits the influence of the external environment on the pin through the pin hole, effectively improving the sealing and durability of the device.
[0093] In addition, the mating structure of the first interface 1026 and the connection terminal 1102 supports quick plugging and unplugging of external devices, improving the operational efficiency of industrial automation sites.
[0094] In some embodiments, optionally, the connecting terminal 1102 has a first pin hole 1104 inside for mating with the first pin 1042, and a sealing ring 112 is sleeved on the outside to enhance the sealing performance of the interface. The sealing ring 112 surrounds the outside of the connecting terminal 1102 and is located in the edge region inside the first interface 1026. The sealing ring 112 can be made of an elastic material (such as silicone or rubber) and has good compressibility and durability. When the connector 114 is connected to the first interface 1026, a sealing effect is formed by compressing the sealing ring 112.
[0095] The connector 114 is mateable with the first interface 1026 for a detachable connection. Specifically, the detachable connection includes, but is not limited to, a threaded connection or a snap-fit connection.
[0096] The connector 114 is inserted into the first interface 1026 and abuts against the sealing ring 112. The sealing performance of the interface is ensured by pressing the sealing ring 112.
[0097] The sealing ring 112, through elastic compression, fits tightly against the connector 114 and the interface wall, forming an effective protective barrier to prevent external liquids, gases or dust from entering the equipment.
[0098] The sealing ring 112 provides a certain buffer between the connector 114 and the first interface 1026, absorbing external vibration or impact force and reducing mechanical stress on the signal board 104 and the pins.
[0099] In some embodiments, optionally, threads are provided on the inner wall of the first interface 1026, surrounding the entire interface, to provide a threaded connection with the connector 114, making the connection more secure and reliable.
[0100] It is understood that the outer wall of the connector 114 is machined with threads corresponding to the inner wall of the first interface 1026. By rotating, the external thread of the connector 114 and the internal thread of the first interface 1026 are gradually tightened to form a stable connection. The connector 114 can be firmly fixed on the first interface 1026, effectively preventing loosening or separation caused by vibration, impact or external force.
[0101] In addition, the threaded connection can compress the sealing ring 112 by tightening, making it fit tightly against the connector 114 and the interface wall, thus forming a stronger sealing effect.
[0102] In some embodiments, optionally, such as Figure 4 As shown, an external threaded post 116 is provided on the first wall surface 1024 of the housing 102. The outer surface of the external threaded post 116 is provided with threads for threaded connection with external connectors. The external threaded post 116 is provided with a second interface 1028 for connection with external equipment or wires.
[0103] The second interface 1028 serves as a channel for electrical connection between the slave device 100 and an external system, used for data transmission or power supply. By nesting the second interface 1028 inside the external threaded post 116, it is protected from external physical damage, while simplifying the installation of external connectors.
[0104] The external threaded column 116 and the housing 102 are integrally formed by one-time mold casting or injection molding process, which reduces assembly steps and improves structural strength.
[0105] The external threaded post 116 extends away from the signal board 104, providing a clear and independent connection interface for external devices and avoiding interference with the internal structure. The threads on the external threaded post 116 mate with external connectors (such as connector 114 or threaded joints) to form a stable and detachable mechanical connection.
[0106] The second interface 1028 provides a data communication channel or power transmission path for external devices, supporting efficient interconnection between the slave device 100 and external systems.
[0107] The threaded connection between the external threaded post 116 and the external connector supports quick assembly and disassembly, facilitating on-site installation and maintenance. Due to its compact interface structure, it can adapt to industrial scenarios with limited space.
[0108] In some embodiments, the first pin 1042 and the second pin 1044 are optionally integrated on the signal board 104 and extend toward the first interface 1026 and the second interface 1028, respectively.
[0109] The first pin 1042 is typically shorter, while the second pin 1044 is longer. This difference in length helps to establish a clear docking sequence and orientation during the connection process.
[0110] By limiting the lengths of the first pin 1042 and the second pin 1044 to be different, a foolproof design can be implemented to reduce the probability of misoperation and effectively prevent pin misalignment or electrical short circuits during insertion. The different lengths ensure sufficient spacing between the two pins, thereby avoiding interference when they make physical contact.
[0111] The different lengths of the first pin 1042 and the second pin 1044 also help to physically isolate the paths of different signals, reduce signal interference, and improve the stability and quality of signal transmission.
[0112] In some embodiments, optionally, such as Figure 1 and Figure 4 As shown, indicator light 1182 is mounted on signal board 104 (circuit board) and is typically associated with the operating status of first pin 1042 and second pin 1044. A light-transmitting sheet 1184 is located on housing 102, directly corresponding to the mounting position of indicator light 1182. The light-transmitting sheet 1184 is designed to be transparent or semi-transparent to ensure that the light emitted by indicator light 1182 is clearly visible.
[0113] The indicator light 1182 is configured with the light-transmitting sheet 1184 through the circuit board, and the status information of the indicator light 1182 is transmitted through the light-transmitting sheet 1184.
[0114] The indicator light 1182 typically uses light-emitting diode (LED) beads or other light-emitting elements suitable for industrial environments to intuitively display the operating status, such as whether the equipment is working properly or in a faulty state.
[0115] Furthermore, the indicator light 1182 provides the equipment's operating status through different colors or flashing patterns, such as green for normal operation, red for fault or warning, and yellow for standby or precautions. This design allows operators to quickly understand the equipment's working status and facilitates timely problem handling.
[0116] The indicator light 1182 is closely related to the working status of the first pin 1042 and the second pin 1044, and can reflect whether the signal transmission is normal or whether there is a connection problem. If the pins are not properly connected or malfunction, the indicator light 1182 will remind the operator by illuminating red or flashing.
[0117] In some embodiments, optionally, the potting layer 120 is located on the side of the signal board 104 away from the first wall surface 1024, that is, in the space between the signal board 104 and the housing 102, and the potting layer 120 is flush with the side of the housing 102 away from the first wall surface 1024 to form a sealing protective layer.
[0118] The potting layer 120 can be made of materials such as polyurethane or silicone, possessing sealing, waterproof, dustproof, and shockproof properties, and is used to protect the connection between the signal board 104 and the housing 102. The signal board 104 and the housing 102 form a sealed connection through the potting layer 120. The potting layer 120 fills the gap between the signal board 104 and the housing 102, ensuring a sealed contact between the signal board 104 and the housing 102, preventing external substances (such as water, dust, etc.) from entering the equipment, and protecting the circuit and the signal board 104.
[0119] The potting layer 120 is flush with the side of the housing 102 away from the first wall surface 1024, ensuring that the potting layer 120 can evenly cover the entire connection area while improving sealing. This design makes the potting layer 120 bond more firmly to the housing 102, improving the overall structural stability of the device.
[0120] The potting layer 120 can effectively prevent external environmental factors (such as moisture and dust) from entering the equipment, avoid contaminating the signal board 104 and circuits, and ensure the reliability and stability of the equipment in harsh environments.
[0121] The potting layer 120 helps absorb external vibrations, reducing the impact of vibrations on the signal board 104 and other sensitive components, and improving the equipment's shock resistance. Especially in industrial environments, where equipment often faces significant mechanical shocks and vibrations, the design of the potting layer 120 effectively enhances the equipment's durability.
[0122] Through the sealing design of the potting layer 120, the equipment can effectively improve its IP (Ingress Protection) rating, especially its dustproof and waterproof capabilities. The potting layer 120 ensures the equipment is not damaged when facing harsh environmental conditions.
[0123] like Figure 5 As shown, an embodiment of the second aspect of this application provides a communication system 200, including a master station device 202 and slave station devices 100. The master station device 202 is responsible for communicating with multiple slave station devices 100, issuing control commands, and receiving feedback data. It typically includes powerful computing capabilities and multiple communication interfaces for managing and scheduling the operations of the slave station devices 100.
[0124] The master station device 202 uses a specific industrial communication protocol for data transmission to ensure efficient and reliable real-time data exchange.
[0125] Slave device 100 is a device that performs specific tasks in the communication system. It executes specific operations according to the instructions of master device 202 and feeds back data. Each slave device 100 may contain different types of sensors, actuators, controllers, or other industrial equipment.
[0126] The communication connection between the master station device 202 and the slave station device 100 can be wired (such as industrial Ethernet, cable, etc.) or wireless (such as Wi-Fi, Bluetooth, etc.), depending on the system requirements and environmental conditions.
[0127] Communication between slave device 100 and master device 202 may use standard industry protocols (such as Profinet, Ethernet / IP, IO-Link, etc.) to ensure correct data transmission and real-time performance.
[0128] The master station device 202 connects to the slave station device 100 via a network and performs centralized control and data management of the slave station device 100. The master station device 202 sends commands to the slave station device 100 to control its operation (such as starting, stopping, adjusting parameters, etc.) and collects data feedback from the slave station device 100 (such as sensor measurements, device status, etc.). This connection can be established through different physical layers, such as Ethernet, fiber optics, RS485, Wi-Fi, etc. In industrial automation, dedicated industrial protocols (such as EtherCAT, Profinet, etc.) are often used to ensure high-speed, reliable, and deterministic communication.
[0129] Slave device 100 not only receives control commands from master device 202, but also provides real-time feedback on its operating status or sensor data. For example, if slave device 100 is a temperature sensor, it will send real-time temperature data to master device 202. Master device 202 will make decisions based on this data and may control other slave devices 100 to perform corresponding operations.
[0130] Because equipment in industrial automation requires rapid response, the communication between the master station and the slave station device 100 must have low latency and high bandwidth to ensure the real-time performance and efficiency of the system.
[0131] Since the communication system 200 includes any of the aforementioned slave devices 100, it has the beneficial effects of any of the aforementioned slave devices 100, which will not be elaborated here.
[0132] This application also provides a highly integrated device based on IO-Link communication. The cable connectors (i.e., the first pin 1042 and the second pin 1044) are integrated on the circuit board, and the outer shell (i.e., the housing 102) adopts an integrated design, which greatly reduces the size of the device. The back adopts a double-layer potting form, which provides better protection for the circuit board while sealing it, making this product more outstanding in terms of shock resistance.
[0133] The solution proposed in this application makes the product smaller, more integrated, and provides more advantageous structural space.
[0134] This application integrates the pins of the connector socket directly into the signal processing board (i.e., signal board 104), thus eliminating the bulky support and fixing structure of the original connector socket. This allows the pins to be directly integrated into the circuit board, significantly reducing the size. Simultaneously, the support structure is integrated into the overall housing, making it more stable and greatly improving its sealing performance. This application includes a housing 102, a label plate 122, a sealing ring 112, a sealing plug (i.e., connector 114), sealing potting compound, a signal processing board (i.e., signal board 104), long pins (i.e., second pins 1044), and short pins (i.e., first pins 1042). The housing 102 is integrally cast from plastic, resulting in lower costs. The housing 102 has a sealing ring 112 at the connector connection point, improving the product's sealing effect. At least eight sealing plugs are also provided. During product use, when the number of pre-installed sealing plugs is not used, the remaining interfaces can be sealed with these plugs, further improving the sealing performance of this application during use. Furthermore, the sealing plug also serves to protect this application when stored or unused.
[0135] Long pins and short pins are soldered onto the PCB board respectively, forming an integral component with the signal processing board, which greatly reduces the size of this application.
[0136] The signal processing board is placed inside the housing 102, with pins inserted into corresponding holes in the housing 102 (i.e., the first interface 1026 and the second interface 1028). Adhesive (i.e., adhesive layer 108) is used to initially bond the edges of the signal processing board to the steps of the housing 102 (i.e., the limiting step 106) for positioning. Sealant is applied to the surface of the signal processing board, flush with the housing. After complete curing, a sealing ring is assembled at the bottom of the internal space of the housing's threaded groove. A label plate, used for writing and marking, is installed in the label slot of the housing. A sealing plug is connected to the housing via threads and can be installed for sealing when downstream product wiring is not installed. Indicator lights use different light colors to indicate various states of this application.
[0137] In summary, this embodiment uses all-plastic materials, making it suitable for high-temperature and highly corrosive media. Its overall structure is simple and compact. It is lightweight, easy to install, and convenient to maintain. The integrated design allows for use in confined spaces. Sealing plugs protect unused interfaces, improving the IP protection rating.
[0138] In this utility model, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance; the term "multiple" refers to two or more unless otherwise explicitly defined. The terms "install," "connect," "join," and "fix" should be interpreted broadly. For example, "connect" can be a fixed connection, a detachable connection, or an integral connection; "join" can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0139] In the description of this utility model, it should be understood that the terms "upper", "lower", "left", "right", "front", "rear", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or unit referred to must have a specific orientation or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0140] In the description of this specification, the terms "one embodiment," "some embodiments," "specific embodiment," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.
[0141] The above are merely preferred embodiments of this utility model and are not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.
Claims
1. A slave station device, characterized in that, include: The housing has a receiving cavity inside, and a plurality of first interfaces and second interfaces are provided on the first wall surface of the housing; A signal board is disposed within the receiving cavity, and the signal board is integrated with a first pin and a second pin extending toward the first wall surface. The first pin is adapted to the first interface, and the second pin is adapted to the second interface. The housing is an integrated structure, and the signal board is sealed and assembled with the housing using potting compound.
2. The slave station device according to claim 1, characterized in that, Also includes: A limiting step is provided inside the housing, and the signal plate abuts against the limiting step.
3. The slave station device according to claim 2, characterized in that, The signal board is parallel to at least a portion of the first wall surface.
4. The slave station device according to claim 2, characterized in that, Also includes: An adhesive layer is disposed between the limiting step and the signal plate.
5. The slave station device according to claim 1, characterized in that, The first interface is provided with a connection terminal, and the connection terminal is provided with a first pin hole, and the first pin is located in the first pin hole.
6. The slave station device according to claim 5, characterized in that, The connecting terminal is fitted with a sealing ring, and the slave device further includes: The connector is detachably connected to the first interface, and when the connector is connected to the first interface, the connector abuts against the sealing ring.
7. The slave station device according to claim 6, characterized in that, The inner wall of the first interface is threaded, and the connector is threadedly connected to the first interface.
8. The slave station device according to claim 1, characterized in that, Also includes: An external threaded post is disposed on the first wall surface, and the external threaded post extends in a direction away from the signal board, and the second interface is provided inside the external threaded post; The external threaded post is integrally formed with the housing.
9. The slave station equipment according to any one of claims 1 to 8, characterized in that, The first pin and the second pin have different lengths.
10. The slave station equipment according to any one of claims 1 to 8, characterized in that, Also includes: An indicator light, located on the signal board, is used to display the operating status related to the first pin and the second pin; A light-transmitting sheet is disposed on the housing corresponding to the indicator light.
11. The slave station equipment according to any one of claims 1 to 8, characterized in that, Also includes: An adhesive layer is provided on the side of the signal board away from the first wall surface, and the signal board and the housing are sealed with adhesive to form the adhesive layer; The potting layer is flush with the side of the shell away from the first wall surface.
12. A communication system, characterized in that, include: Main station equipment; The slave device as described in any one of claims 1 to 11 is communicatively connected to the master device.