Chip sorting equipment for wafer processing

Abstract

The utility model discloses chip sorting equipment for wafer processing, which relates to the field of wafer processing and comprises a support frame, a moving frame A and a moving frame B. The moving frame A is slidably mounted on the support frame, one side of the moving frame A is connected with a moving driving mechanism A for driving the moving frame A to move along the length direction of the support frame, the moving frame B is slidably mounted on the moving frame A, and the moving driving mechanism A is connected with a moving driving mechanism B for driving the moving frame B to move along the length direction of the support frame. One side of the B moving frame is connected with a moving driving piece used for driving the B moving frame to move in the height direction of the supporting frame; according to the chip sorting equipment for wafer processing, by arranging the equidistant adjusting mechanism, the distance between the multiple adsorption mechanisms can be flexibly adjusted according to the layout of chips of different specifications, and it is ensured that all the adsorption mechanisms are distributed at equal intervals in the length direction of the supporting frame, so that the chip layout is accurately matched, and the chip sorting efficiency is improved. Therefore, the sorting requirements of chips of different batches and different specifications can be easily met, and the universality and practicability of the equipment are greatly improved.

Description

Technical Field

[0001] This utility model relates to wafer processing technology, specifically to a chip sorting device for wafer processing. Background Technology

[0002] In the wafer fabrication industry, chip sorting is a crucial step, as its efficiency and accuracy directly impact the overall efficiency and quality of chip production. With the continuous development of chip manufacturing technology, chip specifications are becoming increasingly diverse, and different batches of chips exhibit differences in size, layout, and other aspects.

[0003] For example, Chinese utility model patent CN220604621U discloses a chip sorting machine. This machine utilizes a telescopic rod and a limiting plate. When the telescopic rod extends or retracts, it moves the limiting plate. Because the grooves inside the limiting plate form a parallelogram from low to high, when the limiting post moves to the higher part of the groove, the spring is compressed. As the limiting post moves relative to the groove, the spring acts as a buffer. Through the cooperation of the limiting post and the limiting plate, the connecting rod and four sets of vacuum suction cups achieve left-right reciprocating movement. This is achieved by incorporating the telescopic rod... The device allows four sets of vacuum suction cups to move up and down, facilitating the removal of defective chips and placing them in a side box for easy chip sorting. Limiting rods are used to fix and limit the connecting rods. While it can move multiple sets of vacuum suction cups up and down and simultaneously remove multiple chips, in actual production, chips of different specifications and sizes exist. The fixed positions of the multiple suction cups make it difficult to effectively adapt to the sorting environment during the production of different batches and specifications of chips, thus limiting its practicality. Utility Model Content

[0004] The purpose of this invention is to provide a chip sorting device for wafer processing, in order to solve the problem that existing chip sorting devices, due to the fixed positions of multiple sets of suction cups, are difficult to flexibly adapt to the sorting environment of chips of different specifications and sizes, thus affecting sorting accuracy and efficiency and limiting practicality.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a chip sorting device for wafer processing, comprising a support frame, an A-moving frame, and a B-moving frame. The A-moving frame is slidably mounted on the support frame. An A-moving drive mechanism for driving the A-moving frame to move along the length direction of the support frame is connected to one side of the A-moving frame. The B-moving frame is slidably mounted on the A-moving frame. A moving drive component for driving the B-moving frame to move along the height direction of the support frame is connected to one side of the B-moving frame. The device also includes:

[0006] Multiple C-moving frames are installed on B-moving frames, and the multiple C-moving frames are distributed along the length of the support frame;

[0007] Multiple adsorption mechanisms correspond one-to-one with multiple C-moving frames. The adsorption mechanisms are installed on their respective C-moving frames and are used to adsorb chips.

[0008] An equidistant adjustment mechanism is installed on the B-moving frame, and one side of each of the multiple adsorption mechanisms is connected to the equidistant adjustment mechanism. The equidistant adjustment mechanism is used to adjust the distance between two adjacent B-moving frames and to keep the distance between any two adjacent B-moving frames equal.

[0009] Furthermore, there are N+1 C-shaped moving frames, where N is an even number and N≥2. The middle C-shaped moving frame is fixedly connected to the B-shaped moving frame on one side, and the remaining C-shaped moving frames are slidably connected to the B-shaped moving frame. The equidistant adjustment mechanism includes a B telescopic drive component. The moving end of the B telescopic drive component is fixedly connected to the outermost C-shaped moving frame among the multiple C-shaped moving frames, and the fixed end of the B telescopic drive component is fixedly connected to the B-shaped moving frame. V-shaped connecting rods are hinged to the two outermost C-shaped moving frames among the multiple C-shaped moving frames. The V-shaped connecting rods are composed of two A-shaped diagonal rods hinged at their ends. X-shaped connecting rods are hinged to one side of the remaining multiple C-shaped moving frames. The X-shaped connecting rods are composed of two B-shaped diagonal rods hinged in the middle. The two ends of two adjacent X-shaped connecting rods are hinged together, and the two ends of the V-shaped connecting rods are hinged together with the two ends of their adjacent X-shaped connecting rods.

[0010] Furthermore, the adsorption mechanism is a suction cup, which is fixedly installed on its corresponding C-shaped movable frame.

[0011] Furthermore, the adsorption mechanism includes two suction cups, each with a mounting plate fixedly connected to its outer side. Each mounting plate has a sliding rod fixedly connected to one side. The outer walls of the two sliding rods are slidably connected to their corresponding C-moving frames. Each sliding rod has a rack fixedly connected to its top end. The same gear meshes on the side of the two racks that are close to each other. The gear is rotatably mounted on its corresponding C-moving frame via a rotating shaft. Each sliding rod has an elastic element sleeved on its outer side. The two ends of the elastic element are fixedly connected to its corresponding sliding rod and the C-moving frame, respectively.

[0012] Furthermore, the A-moving drive mechanism includes a screw and a rotary drive component. The outer wall of the screw is threadedly connected to the A-moving frame, and the outer walls at both ends of the screw are rotatably connected to the support frame. The output shaft end of the rotary drive component at one end of the screw is fixedly connected, and the rotary drive component is fixedly mounted on the support frame.

[0013] Furthermore, the moving drive component is a telescopic drive component A, the moving end of the telescopic drive component A is fixedly connected to the moving frame B, and the fixed end of the telescopic drive component A is fixedly connected to the moving frame A.

[0014] Compared with the prior art, the chip sorting equipment for wafer processing provided by this utility model can flexibly adjust the distance between multiple adsorption mechanisms according to the layout of chips of different specifications by setting an equidistant adjustment mechanism, ensuring that all adsorption mechanisms are equidistantly distributed in the length direction of the support frame, thereby accurately matching the chip layout. This allows it to easily adapt to the sorting needs of chips of different batches and specifications, greatly improving the versatility and practicality of the equipment.

[0015] The adsorption mechanism employs a dual-suction cup structure to automatically balance chip warping or height differences, ensuring simultaneous adsorption. At the same time, the gear and rack structure forces symmetrical force on both sides of the suction cups, avoiding unilateral overload. The elastic element can also absorb impact energy, reducing mechanical stress on the chip, thereby ensuring the reliability and stability of the adsorption process and effectively protecting the chip from damage. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings.

[0017] Figure 1 This is a first partial three-dimensional structural schematic diagram provided for an embodiment of the present utility model;

[0018] Figure 2 An installation diagram of a chip sorting device for wafer processing is provided for embodiments of this utility model;

[0019] Figure 3 A schematic diagram showing the combination of the B movable frame, C movable frame, adsorption mechanism and B telescopic drive component provided in an embodiment of this utility model;

[0020] Figure 4 This is a schematic diagram of a second partial three-dimensional structure provided for an embodiment of the present utility model;

[0021] Figure 5 Provided for the embodiments of this utility model Figure 4 Enlarged diagram of point A in the diagram.

[0022] Explanation of reference numerals in the attached figures:

[0023] 100. Support frame; 200. A. Moving frame; 210. Screw; 220. Rotary drive component; 300. B. Moving frame; 310. Moving drive component; 400. C. Moving frame; 500. Adsorption mechanism; 510. Suction cup; 520. Mounting plate; 530. Slide rod; 540. Rack; 550. Gear; 560. Elastic component; 600. Equidistant adjustment mechanism; 610. B. Telescopic drive component; 620. V-shaped connecting rod; 621. A. Diagonal rod; 630. X-shaped connecting rod; 631. B. Diagonal rod. Detailed Implementation

[0024] To enable those skilled in the art to better understand the technical solution of this utility model, the present utility model will be further described in detail below with reference to the accompanying drawings.

[0025] Please see Figures 1 to 5 A chip sorting device for wafer processing includes a support frame 100, an A movable frame 200, and a B movable frame 300. The A movable frame 200 is slidably mounted on the support frame 100. An A movable drive mechanism for driving the A movable frame 200 to move along the length direction of the support frame 100 is connected to one side of the A movable frame 200. The B movable frame 300 is slidably mounted on the A movable frame 200. A movable drive member 310 for driving the B movable frame 300 to move along the height direction of the support frame 100 is connected to one side of the B movable frame 300. The device also includes:

[0026] Multiple C-moving frames 400 are installed on B-moving frames 300, and the multiple C-moving frames 400 are distributed along the length of the support frame 100;

[0027] Multiple adsorption mechanisms 500 correspond one-to-one with multiple C-moving frames 400. The multiple adsorption mechanisms 500 are respectively installed on their corresponding C-moving frames 400. The adsorption mechanism 500 is used to adsorb the chip.

[0028] An equidistant adjustment mechanism 600 is installed on the B-moving frame 300, and one side of each of the multiple adsorption mechanisms 500 is connected to the equidistant adjustment mechanism 600. The equidistant adjustment mechanism 600 is used to adjust the distance between two adjacent B-moving frames 300 and to keep the distance between any two adjacent B-moving frames 300 equal.

[0029] Driven by the A-moving drive mechanism, the A-moving frame 200 moves horizontally along the length of the support frame 100, moving the adsorption mechanism 500 to the target wafer area. The B-moving frame 300 is driven by the moving drive component 310 to move up and down along the height of the support frame 100, adjusting the distance between the adsorption mechanism 500 and the chip surface. The equidistant adjustment mechanism 600 simultaneously adjusts the spacing of multiple C-moving frames 400 to ensure that all adsorption mechanisms 500 are equidistantly distributed along the length of the support frame 100, matching the chip layout. Each adsorption mechanism 500 descends synchronously with the C-moving frame 400 to adsorb and grasp the chip. After adsorption is completed, the A-moving frame 200 and the B-moving frame 300 move together to transfer the chip to the designated position and release it.

[0030] In one embodiment of this utility model, N+1 C-moving frames 400 are provided, where N is an even number and N≥2, and in this case, N is 4. One side of the middle C-moving frame 400 is fixedly connected to the B-moving frame 300, i.e., one side of the third C-moving frame is fixedly connected to the B-moving frame 300. The remaining C-moving frames 400 are slidably connected to the B-moving frame 300. The equidistant adjustment mechanism 600 includes a B-telescopic drive member 610, which is a telescopic cylinder or hydraulic cylinder. The moving end of the B-telescopic drive member 610 is fixedly connected to the outermost C-moving frame 400 among the multiple C-moving frames 400, and the fixed end of the B-telescopic drive member 610 is fixedly connected to the B-moving frame 300. The two outermost C-shaped moving frames 400 are each hinged with a V-shaped link 620. The V-shaped link 620 is composed of two A-shaped diagonal bars 621 that are hinged at their ends. The hinge point of the V-shaped link 620 with the C-shaped moving frame 400 is collinear with the axis of the hinge point of the two A-shaped diagonal bars 621 that make up the V-shaped link 620. The remaining C-shaped moving frames 400 are each hinged with an X-shaped link 630 on one side. The X-shaped link 630 is composed of two B-shaped diagonal bars 631 that are hinged in the middle. The hinge point of the X-shaped link 630 with the C-shaped moving frame 400 is collinear with the axis of the hinge point of the two B-shaped diagonal bars 631 that make up the X-shaped link 630. The two ends of two adjacent X-shaped links 630 are hinged together. The two ends of the V-shaped link 620 are hinged together with the two ends of the adjacent X-shaped link 630.

[0031] Specifically, the outermost C-moving frame 400 is moved outward by the B telescopic drive 610. The V-shaped link 620 is linked with the adjacent X-shaped link 630, and the motion is transmitted through the hinge point. The symmetrical hinge structure of the X-shaped link 630 forces all sliding C-moving frames 400 to expand or contract synchronously at equal distances. Through the geometric constraints of the V-shaped link 620 and the X-shaped link 630, the distance between two adjacent C-moving frames 400 is made equal, avoiding manual adjustment errors. The distance between two adjacent adsorption mechanisms 500 can be enlarged or reduced by a single drive input to adapt to the sorting of chips of different specifications.

[0032] In one embodiment of this utility model, the adsorption mechanism 500 is a suction cup 510, which is fixedly installed on the corresponding C-moving frame 400.

[0033] Specifically, a single suction cup 510 is directly fixed on the C-moving frame 400 and connected to an external vacuum pump through a vacuum pipeline to adsorb the chip under negative pressure.

[0034] In one embodiment of this utility model, the adsorption mechanism 500 includes two suction cups 510. Mounting plates 520 are fixedly connected to the outer sides of each suction cup 510. Slide rods 530 are fixedly connected to one side of each mounting plate 520. The outer walls of the two slide rods 530 are slidably connected to their corresponding C-moving frames 400. A rack 540 is fixedly connected to the top of each slide rod 530. The same gear 550 meshes with the adjacent sides of the two racks 540. The gear 550 is rotatably mounted on its corresponding C-moving frame 400 via a rotating shaft. An elastic element 560 is sleeved on the outside of each slide rod 530. The two ends of the elastic element 560 are fixedly connected to its corresponding slide rod 530 and the C-moving frame 400, respectively. The elastic element 560 is a spring.

[0035] Specifically, when the suction cup 510 on one side contacts the chip and is pressed, the slide bar 530 drives the rack 540 to move, and the gear 550 rotates to drive the rack 540 on the other side to move in the opposite direction, so that the other suction cup 510 moves down synchronously. The dual suction cups 510 automatically balance the chip warping or height difference (such as ±2mm range) to ensure simultaneous adsorption. The gear 550 and the two racks 540 force the suction cups 510 on both sides to be symmetrically stressed, avoiding overload on one side. The elastic element 560 absorbs the impact energy and reduces the mechanical stress on the chip.

[0036] In one embodiment of this utility model, the A moving drive mechanism includes a screw 210 and a rotary drive component 220. The outer side wall of the screw 210 is threadedly connected to the A moving frame 200. The outer side walls at both ends of the screw 210 are rotatably connected to the support frame 100. The output shaft end of the rotary drive component 220 at one end of the screw 210 is fixedly connected. The rotary drive component 220 is fixedly installed on the support frame 100. The rotary drive component 220 is a motor or a rotary cylinder.

[0037] Specifically, the screw 210 is rotated by the rotary drive component 220. Since the A moving frame 200 is slidably mounted on the support frame 100, the A moving frame 200 drives the adsorption mechanism 500 to move through the B moving frame 300 and the C moving frame 400 under the drive of the screw 210. The multiple adsorption mechanisms 500 move as a whole, thereby sorting and moving the chips adsorbed by the adsorption mechanism 500.

[0038] In one embodiment of this utility model, the moving drive component 310 is a telescopic drive component A, the moving end of the telescopic drive component A is fixedly connected to the moving frame 300 B, and the fixed end of the telescopic drive component A is fixedly connected to the moving frame 200 A. The telescopic drive component is a telescopic cylinder or a hydraulic cylinder.

[0039] Specifically, when the chip is adsorbed by the adsorption mechanism 500 or the adsorbed chip is placed, the moving end of the A telescopic drive component extends and retracts to move the B moving frame 300. The B moving frame 300 then drives the adsorption mechanism 500 to move up and down through the C moving frame 400.

[0040] In one embodiment of this utility model, a corresponding control unit can be set up for cooperative use. This control unit can be any type of controller connected to the electrical components in this application, thereby controlling the start-up and shutdown of each electrical component. This part is prior art. Here, a microcontroller can be provided as the control unit for demonstration. The microcontroller in this embodiment is a typical embedded microcontroller unit, consisting of an arithmetic logic unit (ALU), a controller, a memory, input / output devices, etc., equivalent to a miniature computer. Compared with the general-purpose microprocessors used in personal computers, it emphasizes self-sufficiency (no external hardware required) and cost savings. Its biggest advantage is its small size, which can be placed inside the instrument, but it has small storage capacity, simple input / output interfaces, and low power consumption.

[0041] The foregoing description only illustrates certain exemplary embodiments of the present invention. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A chip sorting device for wafer processing, comprising a support frame (100), an A movable frame (200), and a B movable frame (300), wherein the A movable frame (200) is slidably mounted on the support frame (100), and an A moving drive mechanism for driving the A movable frame (200) to move along the length direction of the support frame (100) is connected to one side of the A movable frame (200); the B movable frame (300) is slidably mounted on the A movable frame (200), and a moving drive member (310) for driving the B movable frame (300) to move along the height direction of the support frame (100) is connected to one side of the B movable frame (300), characterized in that, Also includes: Multiple C-moving frames (400) are installed on B-moving frames (300), and the multiple C-moving frames (400) are distributed along the length direction of the support frame (100); Multiple adsorption mechanisms (500) correspond one-to-one with multiple C-moving frames (400). The multiple adsorption mechanisms (500) are respectively installed on their corresponding C-moving frames (400). The adsorption mechanism (500) is used to adsorb the chip. An equidistant adjustment mechanism (600) is installed on the B-moving frame (300), and one side of each of the multiple adsorption mechanisms (500) is connected to the equidistant adjustment mechanism (600). The equidistant adjustment mechanism (600) is used to adjust the distance between two adjacent B-moving frames (300) and to keep the distance between any two adjacent B-moving frames (300) equal.

2. The chip sorting equipment for wafer processing according to claim 1, characterized in that, There are N+1 C-moving frames (400), where N is an even number and N≥2. The middle C-moving frame (400) is fixedly connected to the B-moving frame (300) on one side, and the remaining C-moving frames (400) are slidably connected to the B-moving frame (300). The equidistant adjustment mechanism (600) includes a B telescopic drive member (610). The moving end of the B telescopic drive member (610) is fixedly connected to the outermost C-moving frame (400) among the multiple C-moving frames (400), and the fixed end of the B telescopic drive member (610) is fixed to the B-moving frame (300). The two outermost C-moving frames (400) of the multiple C-moving frames (400) are connected by V-shaped connecting rods (620). The V-shaped connecting rods (620) are composed of two A-shaped diagonal rods (621) with their ends hinged together. The remaining multiple C-moving frames (400) are connected by X-shaped connecting rods (630) on one side. The X-shaped connecting rods (630) are composed of two B-shaped diagonal rods (631) with their middle sections hinged together. The two ends of two adjacent X-shaped connecting rods (630) are hinged together. The two ends of the V-shaped connecting rods (620) are hinged together with the two ends of their adjacent X-shaped connecting rods (630).

3. A chip sorting device for wafer processing according to claim 1, characterized in that, The adsorption mechanism (500) is a suction cup (510), which is fixedly installed on the corresponding C movable frame (400).

4. A chip sorting device for wafer processing according to claim 1, characterized in that, The adsorption mechanism (500) includes two suction cups (510), each with a mounting plate (520) fixedly connected to its outer side. Each mounting plate (520) has a slide rod (530) fixedly connected to one side. The outer walls of the two slide rods (530) are slidably connected to their corresponding C-moving frames (400). Each slide rod (530) has a rack (540) fixedly connected to its top end. The racks (540) have the same gear (550) meshing on their adjacent sides. The gear (550) is rotatably mounted on its corresponding C-moving frame (400) via a rotating shaft. Each slide rod (530) has an elastic element (560) sleeved on its outer side. The two ends of the elastic element (560) are fixedly connected to their corresponding slide rods (530) and C-moving frames (400) respectively.

5. A chip sorting device for wafer processing according to claim 1, characterized in that, A moving drive mechanism includes a screw (210) and a rotary drive component (220). The outer side wall of the screw (210) is threadedly connected to the A moving frame (200). The outer side walls at both ends of the screw (210) are rotatably connected to the support frame (100). The output shaft end of the rotary drive component (220) at one end of the screw (210) is fixedly connected. The rotary drive component (220) is fixedly installed on the support frame (100).

6. A chip sorting device for wafer processing according to claim 1, characterized in that, The moving drive (310) is a telescopic drive A. The moving end of the telescopic drive A is fixedly connected to the moving frame B (300), and the fixed end of the telescopic drive A is fixedly connected to the moving frame A (200).

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