Circuit board packaging potting machine

Abstract

The utility model discloses a circuit board packaging glue pouring machine which comprises a control box, a first groove is formed in the top of the control box, a first motor is installed on the front surface of the control box, and an output shaft of the first motor extends into the first groove and is connected with a first lead screw; the moving plate is in threaded connection with the first lead screw; a clamping device; the circuit board clamping device has the advantages that flexible adjustment can be carried out according to different sizes of circuit boards through the designed clamping device, and the universality of equipment is greatly improved; compared with a traditional spring clamping mode, the circuit board glue pouring device can be suitable for glue pouring operation of circuit boards of various sizes and specifications, the production cost and the production difficulty are reduced, the pressure sensor installed on the top of the vertical plate can directly measure actual clamping pressure, real-time monitoring and accurate adjustment of the clamping force are achieved, and the production efficiency is improved. The circuit board is prevented from being damaged due to too tight clamping, and meanwhile it is ensured that the circuit board cannot move in the glue pouring process.

Description

Technical Field

[0001] This utility model belongs to the field of circuit board potting technology, specifically relating to a circuit board encapsulation potting machine. Background Technology

[0002] In the manufacturing process of electronic devices, circuit boards, as an important carrier of electronic components, are crucial in terms of performance and stability. The glue dispensing machine covers the surface of the circuit board with a layer of glue to form a sealing layer, which effectively prevents moisture, dust and other external substances from corroding electronic components and improves the circuit board's moisture-proof and dust-proof capabilities.

[0003] However, existing PCB dispensing machines still have some problems in practical use. For example, a PCB dispensing machine with patent publication number CN218282418U, although it has certain dispensing functions, relies on springs to clamp and fix the PCB. This method is not conducive to flexible adjustment according to different PCB sizes, which greatly reduces the equipment's versatility. In actual production, PCBs come in various sizes and specifications, and the fixed clamping method is difficult to meet production needs, increasing production costs and difficulty. Utility Model Content

[0004] The purpose of this invention is to provide a circuit board encapsulation and dispensing machine that can flexibly clamp circuit boards according to their different sizes.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a circuit board encapsulation and dispensing machine, comprising...

[0006] A control box, the top of which has a first groove, a first motor is mounted on the front surface of the control box, and the output shaft of the first motor extends into the interior of the first groove and is connected to a first lead screw;

[0007] A movable plate threadedly connected to the first lead screw;

[0008] The clamping device includes a vertical plate symmetrically mounted on the top of the movable plate, a second cylinder mounted on the side surface of the vertical plate, the output end of the second cylinder passing through the vertical plate and connected to a clamping plate, a rubber pad mounted on the side surface of the clamping plate, and a pressure sensor mounted on the top of the vertical plate.

[0009] Preferably, it also includes fixing ears symmetrically arranged on the outer wall of the pressure sensor, and the fixing ears are installed on the top of the upright plate.

[0010] Preferably, the top of the control box is equipped with symmetrically distributed vertical plates, the top of two vertical plates are equipped with horizontal frames, one of the vertical plates is provided with a pipe through-hole, and the inner wall of the pipe through-hole is equipped with multiple connecting pieces, and any one of the connecting pieces is provided with a universal ball.

[0011] Preferably, a second motor is mounted on the side surface of the horizontal frame, and the output shaft of the second motor extends into the interior of the horizontal frame and is connected to a second lead screw.

[0012] Preferably, it also includes a threaded seat that is threadedly connected to the second lead screw, a first cylinder disposed at the bottom of the threaded seat, and a rubber bucket disposed at the output end of the first cylinder.

[0013] Preferably, it also includes a support frame disposed on the side surface of the control box, a support platform mounted on the top of the support frame, and a glue container mounted on the top of the support platform.

[0014] Preferably, a third motor is installed on the top of the glue tank, and the output shaft of the third motor is connected to a stirring rod extending into the inside of the glue tank. A metering pump is installed on the top of the glue tank, and the metering pump is equipped with a suction pipe and a delivery pipe. The suction pipe extends into the inside of the glue tank, and the delivery pipe is connected to the glue container.

[0015] Compared with the prior art, the beneficial effects of this utility model are:

[0016] The designed clamping device can be flexibly adjusted according to different circuit board sizes, greatly improving the equipment's versatility. Compared with the traditional spring-clamping method, it is applicable to the potting of circuit boards of various sizes, reducing production costs and difficulties. The pressure sensor installed on the top of the stand can directly measure the actual clamping pressure, enabling real-time monitoring and precise adjustment of the clamping force. This avoids damage to the circuit board due to excessive clamping and ensures that the circuit board does not shift during the potting process, effectively guaranteeing the potting accuracy and improving the potting quality and performance of the circuit board. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of this utility model;

[0018] Figure 2 For the present utility model Figure 1 A schematic diagram of the enlarged structure of region F in the diagram;

[0019] Figure 3 This is a top view of the horizontal seat structure of this utility model;

[0020] Figure 4 This is a side view of the vertical plate structure of this utility model;

[0021] Figure 5 For the present utility model Figure 4 A magnified structural diagram of region B in the diagram;

[0022] In the diagram: 1. Control box; 11. First groove; 12. First motor; 120. First lead screw; 2. Support frame; 21. Support platform; 3. Glue tank; 31. Third motor; 32. Metering pump; 320. Delivery pipe; 4. Vertical plate; 41. Pipe opening; 5. Horizontal frame; 51. Second motor; 510. Second lead screw; 6. Threaded seat; 61. First cylinder; 610. Glue tank; 7. Moving plate; 71. Vertical plate; 710. Second cylinder; 711. Pressure sensor; 7110. Fixing lug; 8. Clamping plate; 81. Rubber pad; 9. Connecting piece; 91. Universal ball. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model. Example

[0024] Please see Figures 1-3 This is the first embodiment of the present invention, which provides a circuit board encapsulation and potting machine, including...

[0025] The control box 1 has a first groove 11 on its top. The first motor 12 is installed on the front surface of the control box 1 by screws, so that the first motor 12 is installed firmly. The output shaft of the first motor 12 extends into the interior of the first groove 11 and is connected to the first lead screw 120. The first motor 12 is started to drive the first lead screw 120 to rotate.

[0026] The movable plate 7 is threadedly connected to the first lead screw 120. When the first lead screw 120 rotates, the movable plate 7 can move back and forth.

[0027] The clamping device includes a vertical plate 71 symmetrically mounted on the top of the movable plate 7, which adds the vertical plate 71. A second cylinder 710 is mounted on the side surface of the vertical plate 71, which adds the second cylinder 710. The output end of the second cylinder 710 passes through the vertical plate 71 and is connected to a clamping plate 8. Activating the second cylinder 710 causes the clamping plate 8 to move left and right. A rubber pad 81 is mounted on the side surface of the clamping plate 8. The left and right movement of the clamping plate 8 causes the rubber pad 81 to move left and right, so that the two rubber pads 81 clamp the side surface of the circuit board. The second cylinder 710 drives the clamping plate 8 and the rubber pad 81 to move. It can be flexibly adjusted according to different circuit board sizes, greatly improving the equipment's versatility. Compared with the traditional spring-clamping method, it is no longer limited to a fixed clamping range and can be applied to the potting of circuit boards of various sizes and specifications, reducing production costs and difficulties. The pressure sensor 711 installed on the top of the upright plate 71 can directly measure the actual clamping pressure, realize real-time monitoring and precise adjustment of the clamping force, avoid damage to the circuit board due to excessive clamping, and ensure that the circuit board does not shift during the potting process, effectively guaranteeing the potting accuracy and improving the potting quality and performance of the circuit board.

[0028] In this embodiment, preferably, it also includes fixing ears 7110 symmetrically arranged on the outer wall of the pressure sensor 711, which realizes the addition of fixing ears 7110. The fixing ears 7110 are installed on the top of the upright plate 71 by screws, so that the fixing ears 7110 are installed firmly, thereby realizing the stable installation of the pressure sensor 711.

[0029] In this embodiment, preferably, a support frame 2 is also provided on the side surface of the control box 1, which realizes the addition of the support frame 2. A support platform 21 is installed on the top of the support frame 2, which increases the support of the support frame 2 to the support platform 21. A glue tank 3 is installed on the top of the support platform 21, which increases the support of the glue tank 3 to the support platform 21.

[0030] In this embodiment, preferably, a third motor 31 is installed on the top of the glue tank 3, and the output shaft of the third motor 31 is connected to a stirring rod extending into the interior of the glue tank 3. The third motor 31 drives the stirring rod to stir the glue, thereby achieving uniform mixing of the glue. A metering pump 32 is installed on the top of the glue tank 3, and the metering pump 32 is equipped with a suction pipe and a delivery pipe 320. The suction pipe extends into the interior of the glue tank 3, and the delivery pipe 320 is connected to the glue bucket 610. Through the action of the metering pump 32, the glue in the glue tank 3 is delivered to the glue bucket 610 via the delivery pipe 320.

[0031] In this embodiment, preferably, the top of the control box 1 is equipped with symmetrically distributed vertical plates 4, which realizes the addition of vertical plates 4. The top of the two vertical plates 4 is equipped with a horizontal frame 5, which increases the support for the horizontal frame 5 through the vertical plates 4.

[0032] In this embodiment, preferably, the second motor 51 is installed on the side surface of the horizontal frame 5 by screws, so that the second motor 51 is installed firmly, and the output shaft of the second motor 51 extends into the interior of the horizontal frame 5 and is connected to the second lead screw 510. The second motor 51 is started to drive the second lead screw 510 to rotate.

[0033] In this embodiment, preferably, it also includes a threaded seat 6 threadedly connected to the second lead screw 510. The rotation of the second lead screw 510 realizes the left and right movement of the threaded seat 6. A first cylinder 61 is set at the bottom of the threaded seat 6. The left and right movement of the threaded seat 6 drives the first cylinder 61 to move left and right. A glue bucket 610 is set at the output end of the first cylinder 61. The first cylinder 61 can drive the glue bucket 610 to rise and fall. The glue in the glue bucket 610 flows into the glue dispensing head, and the glue dispensing head dispenses glue to the circuit board. Example

[0034] Please see Figures 1-5 This is the second embodiment of the present invention, which is based on the previous embodiment, but differs in that:

[0035] A vertical plate 4 has a through-hole 41, which realizes the opening of the through-hole 41. The inner wall of the through-hole 41 is equipped with multiple connecting pieces 9 by screws, so that the connecting pieces 9 are installed firmly. Each connecting piece 9 is equipped with a universal ball 91, which realizes the addition of the universal ball 91. The conveying pipe 320 passes through the through-hole 41, and the universal ball 91 increases the convenience of the conveying pipe 320 passing through and moving.

[0036] The working principle and usage process of this utility model: Start the first motor 12, the first motor 12 drives the first lead screw 120 to rotate, so that the moving plate 7 moves to a suitable position, and the circuit board to be potted is placed on the moving plate 7, located between the two clamping plates 8.

[0037] The second cylinder 710 is activated, which drives the clamping plate 8 to move left and right, so that the rubber pad 81 gradually approaches the circuit board and clamps the circuit board. During this process, the pressure sensor 711 monitors the clamping pressure in real time and feeds back the data. If the pressure is abnormal, the extension and retraction of the second cylinder 710 is adjusted in time to ensure that the circuit board is firmly clamped without being damaged due to excessive clamping.

[0038] Based on the position of the circuit board, the second motor 51 is started, which drives the second lead screw 510 to rotate, causing the threaded seat 6 to move left and right, which in turn drives the first cylinder 61 and the glue tank 610 to move left and right, achieving the initial adjustment of the horizontal position of the glue dispensing head; then the first cylinder 61 is started, which drives the glue tank 610 to rise and fall, adjusting the vertical position of the glue dispensing head so that the glue dispensing head is aligned with the glue dispensing area of ​​the circuit board.

[0039] Start the third motor 31. The third motor 31 drives the stirring rod to stir the glue in the glue tank 3, so that the glue is evenly mixed and the glue dispensing quality is ensured.

[0040] When the metering pump 32 is started, the glue in the glue tank 3 is sucked into the metering pump 32 through the suction pipe, and then transported to the glue bucket 610 through the delivery pipe 320; the glue in the glue bucket 610 flows into the dispensing head to dispense glue onto the circuit board.

[0041] Although embodiments of the present invention have been shown and described in detail above, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A circuit board encapsulation and potting machine, characterized in that: include The control box (1) has a first groove (11) on its top and a first motor (12) installed on the front surface of the control box (1). The output shaft of the first motor (12) extends into the interior of the first groove (11) and is connected to a first lead screw (120). The movable plate (7) is threadedly connected to the first lead screw (120); The clamping device includes a vertical plate (71) symmetrically mounted on the top of the movable plate (7), a second cylinder (710) mounted on the side surface of the vertical plate (71), and the output end of the second cylinder (710) passes through the vertical plate (71) and is connected to a clamping plate (8), a rubber pad (81) mounted on the side surface of the clamping plate (8), and a pressure sensor (711) mounted on the top of the vertical plate (71).

2. The circuit board encapsulation and potting machine according to claim 1, characterized in that: It also includes a fixing ear (7110) symmetrically arranged on the outer wall of the pressure sensor (711), and the fixing ear (7110) is installed on the top of the upright plate (71).

3. The circuit board encapsulation and potting machine according to claim 1, characterized in that: The top of the control box (1) is equipped with symmetrically distributed vertical plates (4), and the top of the two vertical plates (4) is equipped with horizontal frames (5). One of the vertical plates (4) is provided with a through-hole (41), and the inner wall of the through-hole (41) is equipped with multiple connecting pieces (9). Each connecting piece (9) is provided with a universal ball (91).

4. The circuit board encapsulation and potting machine according to claim 3, characterized in that: The second motor (51) is mounted on the side surface of the horizontal frame (5), and the output shaft of the second motor (51) extends into the interior of the horizontal frame (5) and is connected to the second lead screw (510).

5. A circuit board encapsulation and potting machine according to claim 4, characterized in that: It also includes a threaded seat (6) that is threadedly connected to the second lead screw (510), a first cylinder (61) located at the bottom of the threaded seat (6), and a rubber bucket (610) located at the output end of the first cylinder (61).

6. A circuit board encapsulation and potting machine according to claim 5, characterized in that: It also includes a support frame (2) set on the side surface of the control box (1), a support platform (21) installed on the top of the support frame (2), and a glue tank (3) installed on the top of the support platform (21).

7. A circuit board encapsulation and potting machine according to claim 6, characterized in that: A third motor (31) is installed on the top of the glue tank (3), and the output shaft of the third motor (31) is connected to a stirring rod extending into the glue tank (3). A metering pump (32) is installed on the top of the glue tank (3), and a suction pipe and a delivery pipe (320) are provided on the metering pump (32). The suction pipe extends into the interior of the glue tank (3), and the delivery pipe (320) is connected to the glue bucket (610).

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