Stamping part pad with buffer structure

Abstract

The utility model discloses a stamping part pad with a buffer structure, which particularly relates to the technical field of stamping dies, and comprises a base, a buffer component I is arranged on the base, a stamping pad plate is arranged on the buffer component I, a fastening bolt is arranged between the buffer component I and the stamping pad plate, and a die mounting hole is formed in the upper surface of the stamping pad plate. An assembling plate is arranged in the stamping base plate and connected with the first buffering assembly, and a second buffering assembly is arranged on the assembling plate. The first buffer assembly comprises spring shock absorbers, the spring shock absorbers are fixedly connected to the upper surface of the base, a shock absorption frame is fixedly connected to the ends, back to the base, of the spring shock absorbers, a groove is formed in the side face of the stamping base plate, and the shock absorption frame is slidably connected into the groove. One end of the fastening bolt penetrates through the damping frame, and a plurality of screw grooves matched with the fastening bolt are formed in the inner wall of the groove; the utility model solves the technical problem that the current buffer base plate cannot meet the buffer requirement of mold stroke adjustment.

Description

Technical Field

[0001] This utility model relates to the field of stamping die technology, and specifically to a stamping pad with a buffer structure. Background Technology

[0002] Stamping dies are special process equipment used in cold stamping to process materials (metal or non-metal) into parts (or semi-finished products). They are called cold stamping dies (commonly known as cold stamping molds). Stamping is a pressure processing method that uses dies mounted on a press to apply pressure to materials at room temperature, causing them to deform and thus obtaining the desired parts. Currently, to prevent damage to the upper and lower dies during stamping, a stamping pad is often placed at the bottom of the lower die to buffer the stamping pressure.

[0003] For example, patent publication number CN213559534U discloses a cooling and shaping device for an automobile mold, including a mold base, a support frame detachably installed on the top of the mold base, a braking device detachably installed on the top of the support frame, a blower fixedly installed on the top of the support frame, support columns fixedly installed on both sides of the bottom of the blower, a cooling fan detachably installed on the side of the support frame, a blower pipe connected to the top of the cooling fan, a pad fixedly installed on the bottom of the support column, bottom rods fixedly installed on both sides of the bottom of the pad, heat dissipation holes opened at the bottom of the mold base, blower holes opened on the surface of the blower, and a buffer block fixedly installed on the top of the mold base.

[0004] In the existing technology, although the buffer pad set at the bottom of the mold achieves the buffering effect of the stamping force, the entire buffer structure is relatively fixed. When the stamping stroke of the mold changes due to the change of stamping form, the current buffer pad has low compatibility with the mold buffer and cannot quickly meet the buffering requirements of mold stroke adjustment. Utility Model Content

[0005] Therefore, this utility model provides a stamping pad with a buffer structure to solve the technical problem that current buffer pads cannot meet the buffering requirements of mold stroke adjustment.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] A stamping pad with a buffer structure includes a base, a first buffer assembly on the base, a stamping pad on the first buffer assembly, a fastening bolt between the first buffer assembly and the stamping pad, a mold mounting hole on the upper surface of the stamping pad, an assembly plate inside the stamping pad and the assembly plate being connected to the first buffer assembly, and a second buffer assembly on the assembly plate.

[0008] Furthermore, the buffer assembly includes a spring shock absorber, which is fixedly connected to the upper surface of the base. A shock absorber frame is fixedly connected to one end of the spring shock absorber facing away from the base. A groove is provided on the side of the stamping pad, and the shock absorber frame is slidably connected in the groove.

[0009] Furthermore, one end of the fastening bolt passes through the shock absorber frame, and the inner wall of the groove is provided with multiple threaded grooves that are adapted to the fastening bolt.

[0010] Furthermore, the lower surface of the stamping pad is provided with an inner groove, the assembly plate is disposed in the inner groove, a slider is fixedly connected to the periphery of the assembly plate, and a positioning groove for sliding of the slider is provided on the inner wall of the inner groove.

[0011] Furthermore, a clearance groove is provided between the inner groove and the recess, and a fixing block is provided in the clearance groove. The two ends of the fixing block are respectively fixedly connected to the opposite surfaces of the assembly plate and the shock absorber.

[0012] Furthermore, the second buffer assembly includes a rubber composite plate, which is fixedly connected to the bottom of the assembly plate, and a buffer block is fixedly connected to the bottom of the rubber composite plate.

[0013] Furthermore, the rubber composite plate is a composite structure of steel plate and rubber.

[0014] Furthermore, the bottom of the buffer block is coated with a lubricating coating.

[0015] This utility model has the following advantages:

[0016] 1. The stamping pad with a buffer structure, by setting buffer component one and buffer component two, buffer component one can buffer and consume vibration on the periphery of the stamping pad, and buffer component two can absorb impact and residual vibration at the bottom of the stamping pad. In this way, the stamping pad acts on the bottom of the mold to completely realize the buffer protection of the mold stamping and improve the durability of the mold stamping.

[0017] 1. The stamping pad with a buffer structure is connected to the assembly plate by a shock absorber frame. The shock absorber frame is fastened at different height positions on the side of the stamping pad by fastening bolts. Buffer component one and buffer component two ensure effective buffering of impact force. The stamping pad can flexibly adjust the support height to meet the support requirements of the mold stamping height and meet the applicability of mold stamping buffer. Attached Figure Description

[0018] To more clearly illustrate the embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings in the following description are merely exemplary, and those skilled in the art can derive other embodiments based on the provided drawings without creative effort.

[0019] The structures, proportions, sizes, etc. illustrated in this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the implementation conditions of this utility model. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size, without affecting the effects and objectives that this utility model can produce, should still fall within the scope of the technical content disclosed in this utility model.

[0020] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0021] Figure 2 This is a schematic diagram of the structure of the buffer component of this utility model;

[0022] Figure 3 This is a schematic diagram of the structure of the pad of this utility model;

[0023] Figure 4 This is a schematic diagram of the structure of the second buffer component of this utility model;

[0024] Figure 5 This is a structural schematic diagram of the assembly plate and shock absorber frame of this utility model.

[0025] In the diagram: 1. Base; 2. Buffer assembly one; 21. Spring shock absorber; 22. Shock absorber frame; 3. Stamping pad; 31. Mold mounting hole; 4. Fastening bolt; 5. Assembly plate; 6. Buffer assembly two; 61. Rubber composite plate; 62. Buffer block; 7. Groove; 8. Slider; 9. Inner groove; 10. Positioning groove; 11. Fixing block; 12. Clearance groove; 13. Lubricating coating. Detailed Implementation

[0026] The following specific embodiments illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0027] See also Figures 1-5This utility model provides a stamped pad with a buffer structure, including a base 1.

[0028] The base 1 is provided with mounting holes, which can be used with fasteners to connect with the base of the stamping die.

[0029] A buffer assembly 2 is provided on the base 1. The buffer assembly 2 includes a spring shock absorber 21, which is fixedly connected to the upper surface of the base 1. A shock absorber frame 22 is fixedly connected to the end of the spring shock absorber 21 facing away from the base 1.

[0030] The buffer assembly 2 is provided in two sets, and each set of buffer assembly 2 contains at least two spring dampers 21. The spring damper 21 consists of two parts: a spring and a damper. The spring is pre-compressed to store energy, and the damper consumes vibration through damping. Since the spring dampers 21 are all general standard parts or components known to those skilled in the art, their structure and principle can be known to those skilled in the art through technical manuals or conventional experimental methods.

[0031] The buffer assembly 2 is provided with a stamping pad 3, and the upper surface of the stamping pad 3 is provided with a mold mounting hole 31.

[0032] The number of mold mounting holes 31 is multiple, which can be connected to the lower die of the stamping mold with fasteners. In this way, the lower die of the stamping mold can be fixed on the stamping pad 3, which is made of steel.

[0033] The side of the stamping pad 3 has a groove 7, the shock absorber 22 is slidably connected in the groove 7, and a fastening bolt 4 is provided between the buffer assembly 2 and the stamping pad 3. One end of the fastening bolt 4 passes through the shock absorber 22, and the inner wall of the groove 7 has multiple threaded grooves that are compatible with the fastening bolt 4.

[0034] The groove 7 can hide the position of the shock absorber 22 and limit the movement path of the shock absorber 22. In this application, each shock absorber 22 is provided with multiple fastening bolts 4. The shock absorber 22 is connected to the threaded groove at any height position in the groove 7 with the bolts. With the height of the spring shock absorber 21 unchanged, the support height of the stamping pad 3 on the lower die of the stamping die can be adjusted. Under the buffer height limit of the spring shock absorber 21, by adjusting the support height of the stamping pad 3 on the mold on the shock absorber 22, the buffering requirements of stamping can also be met after the stamping stroke of the stamping die is adjusted, so as to solve the technical problem that the current buffer pad cannot meet the buffering requirements of the mold stroke adjustment.

[0035] When the force of the stamping die during the stamping process is applied to the stamping pad 3, the stamping pad 3 can transmit the impact force to the spring damper 21. The spring in the spring damper 21 can buffer the impact force, and the damper in the spring damper 21 can suppress the rebound of the spring. In this way, the spring damper 21 is set on the periphery of the stamping pad 3 to effectively absorb and consume stamping vibration.

[0036] The stamping pad 3 has an assembly plate 5 inside, and a second buffer component 6 is provided on the assembly plate 5. The second buffer component 6 includes a rubber composite plate 61, which is fixedly connected to the bottom of the assembly plate 5. A buffer block 62 is fixedly connected to the bottom of the rubber composite plate 61. The rubber composite plate 61 is a composite structure of steel plate and rubber.

[0037] Assembly plate 5 provides a mounting surface for buffer assembly 6. Buffer block 62 is made of high-elasticity polyurethane material, and rubber composite plate 61 is made of nitrile rubber and steel plate. Assembly plate 5 serves to fix buffer block 62 and rubber composite plate 61. When assembly plate 5 is positioned within stamping pad 3, and the lower die of stamping mold moves simultaneously, stamping pad 3 can use assembly plate 5 to drive rubber composite plate 61 and buffer block 62 towards the base 1 for buffer contact. When the high-elasticity polyurethane buffer block 62 contacts the base 1, it can... To achieve the effect of resisting instantaneous impact, the buffer block 62 can compress the rubber composite plate 61 during this process. While the composite steel plate of the rubber composite plate 61 meets the strength of a certain structure, the nitrile rubber can absorb the residual vibration of the buffer component 2. This allows the bottom position of the stamping pad 3 to have stamping buffer protection. Therefore, by setting the matching buffer component 2 6 and buffer component 1 2 at the bottom of the stamping pad 3, the two can effectively realize the shock resistance and buffering of the stamping of the stamping pad 3, and improve the service life of the stamping die set on the stamping pad 3.

[0038] The assembly plate 5 is connected to the buffer assembly 2. The lower surface of the stamping pad 3 is provided with an inner groove 9. The assembly plate 5 is set in the inner groove 9. A slider 8 is fixedly connected to the periphery of the assembly plate 5. The inner wall of the inner groove 9 is provided with a positioning groove 10 for the slider 8 to slide. An avoidance groove 12 is provided between the inner groove 9 and the groove 7. A fixing block 11 is provided in the avoidance groove 12. The two ends of the fixing block 11 are fixedly connected to the opposite surfaces of the assembly plate 5 and the shock absorber 22, respectively.

[0039] Since the assembly plate 5 and the shock absorber 22 are fixedly connected by the fixing block 11, the clearance groove 12 can constrain the movement path of the fixing block 11. Thus, when it is necessary to adjust the operating height of the stamping pad 3, the stamping pad 3 can be longitudinally slid on the slider 8 of the assembly plate 5 so that the assembly plate 5 and the shock absorber 22 are at the same height, thereby limiting the buffer position of the buffer assembly 1 2 and the buffer assembly 2 6. Since the buffer gap between the buffer assembly 2 6 and the base 1 is in a limited state, and the compression stroke of the spring shock absorber 21 is also in a limited state, when the height of the stamping pad 3 is adjusted on the buffer assembly 1 2 and the buffer assembly 2 6, the buffer assembly 1 2 and the buffer assembly 2 6 can meet the buffering effectiveness of the stamping pad 3 in real time.

[0040] The bottom of the buffer block 62 is coated with a lubricating coating 13.

[0041] The lubricating coating 13 is made of PTFE or a coating containing molybdenum disulfide. Both PTFE and molybdenum disulfide coatings have lubricating properties to reduce the coefficient of friction between the buffer block 62 and the base 1, thereby reducing the lateral force during the stamping process.

[0042] Although the present invention has been described in detail above with general descriptions and specific embodiments, some modifications or improvements can be made to it, which will be obvious to those skilled in the art. Therefore, all such modifications or improvements made without departing from the spirit of the present invention fall within the scope of protection claimed by the present invention.

Claims

1. A stamped pad with a cushioning structure, characterized in that, Includes a base (1), on which a buffer assembly (2) is provided, on which a stamping pad (3) is provided, and a fastening bolt (4) is provided between the buffer assembly (2) and the stamping pad (3). A mold mounting hole (31) is provided on the upper surface of the stamping pad (3). An assembly plate (5) is provided inside the stamping pad (3), and the assembly plate (5) is connected to the buffer assembly (2). A second buffer assembly (6) is provided on the assembly plate (5).

2. The stamped pad with a buffer structure according to claim 1, characterized in that, The buffer assembly (2) includes a spring shock absorber (21), which is fixedly connected to the upper surface of the base (1). A shock absorber frame (22) is fixedly connected to one end of the spring shock absorber (21) facing away from the base (1). A groove (7) is provided on the side of the stamping pad (3), and the shock absorber frame (22) is slidably connected in the groove (7).

3. The stamped pad with a buffer structure according to claim 2, characterized in that, One end of the fastening bolt (4) passes through the shock absorber (22), and the inner wall of the groove (7) is provided with multiple threaded grooves that are compatible with the fastening bolt (4).

4. The stamped pad with a buffer structure according to claim 2, characterized in that, The lower surface of the stamping pad (3) is provided with an inner groove (9), the assembly plate (5) is disposed in the inner groove (9), a slider (8) is fixedly connected to the periphery of the assembly plate (5), and a positioning groove (10) for sliding of the slider (8) is provided on the inner wall of the inner groove (9).

5. The stamped pad with a buffer structure according to claim 4, characterized in that, An avoidance groove (12) is provided between the inner groove (9) and the groove (7). A fixing block (11) is provided in the avoidance groove (12). The two ends of the fixing block (11) are respectively fixedly connected to the opposite surfaces of the assembly plate (5) and the shock absorber (22).

6. The stamped pad with a buffer structure according to claim 1, characterized in that, The second buffer assembly (6) includes a rubber composite plate (61), which is fixedly connected to the bottom of the assembly plate (5), and a buffer block (62) is fixedly connected to the bottom of the rubber composite plate (61).

7. The stamped pad with a buffer structure according to claim 6, characterized in that, The rubber composite plate (61) is a composite structure of steel plate and rubber.

8. The stamped pad with a buffer structure according to claim 6, characterized in that, The bottom of the buffer block (62) is coated with a lubricating coating (13).

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