Optical integrated packaging devices

Abstract

This application relates to an optical integrated packaging device. The optical integrated packaging device includes a substrate, a light-emitting chip, a light-blocking component, and an external lens. The light-emitting chip is disposed on the substrate. The light-blocking component is disposed on the substrate and surrounds the light-emitting chip. A light-passing hole is formed on the light-blocking component, and the light-passing hole has a light-passing aperture that limits the amount of light passing through. The light-passing aperture corresponds to the light-emitting chip. The external lens is disposed on the light-blocking component and corresponds to the light-passing hole. This optical integrated packaging device, by placing a light-blocking component between the substrate and the external lens, can not only block unwanted light emission and adjust the edge and shape of the light spot through its light-passing aperture, but also support the external lens. It eliminates the need for an additional support frame to support the light-blocking component and lens of a traditional light-emitting device, thus reducing the number of components, greatly simplifying the structure, and significantly reducing costs.

Description

Technical Field

[0001] This application relates to the field of semiconductor light-emitting technology, and in particular to an optical integrated packaging device. Background Technology

[0002] To capture the ideal light spot, traditional light-emitting devices typically include a light-shielding component on the light-emitting side. This component has a window through which the size and shape of the light spot's edge are adjusted. Moving inward from the window, a lens, a support frame, and an LED light source are arranged sequentially. The lens is positioned in front of the LED light source via the support frame. The LED light source consists of a light-emitting chip and a light-transmitting adhesive, which seals the chip. The lens regulates the light emission from the chip, and the light-shielding component, also located on the support frame, blocks unwanted light emission. Clearly, this light-emitting device uses numerous components and has a complex structure. Summary of the Invention

[0003] Therefore, it is necessary to provide an optical integrated packaging device to address the problem of numerous components and complex structures in traditional light-emitting devices.

[0004] An optical integrated packaging device, comprising:

[0005] substrate;

[0006] A light-emitting chip, wherein the light-emitting chip is disposed on the substrate;

[0007] A light-blocking member is disposed on the substrate and surrounds the light-emitting chip. The light-blocking member has a light-passing hole with a light-passing opening that limits the amount of light passing through it. The light-passing opening corresponds to the light-emitting chip.

[0008] An outer lens is disposed on the light-blocking member and is configured corresponding to the light-passing hole.

[0009] In one embodiment, the light-blocking component is an integral structure and includes a support portion and a light-blocking portion. The support portion is supported between the substrate and the light-blocking portion, the light-blocking portion is located above the light-emitting chip, the light-passing hole is formed on the light-blocking portion, and the outer lens is disposed on the light-blocking portion.

[0010] In one embodiment, the size of the light inlet of the light-passing aperture is larger than the size of the light outlet of the light-passing aperture, and the light outlet is the light outlet; or the size of the light inlet of the light-passing aperture is equal to the size of the light outlet of the light-passing aperture, and the light outlet is located between the light inlet and the light outlet.

[0011] In one embodiment, the center line of the light-passing aperture is offset relative to the optical axis of the light-emitting chip, or the center line of the light-passing aperture intersects with the optical axis of the light-emitting chip.

[0012] In one embodiment, the light-emitting chip is located inside the light-passing hole, and the hole wall is in contact with all sides of the light-emitting chip.

[0013] In one embodiment, the optical integrated packaging device further includes a light-transmitting adhesive layer disposed on the light-emitting chip and located within the light-passing aperture.

[0014] In one embodiment, the optical integrated packaging device further includes an inner lens disposed on the light-transmitting adhesive layer.

[0015] In one embodiment, the edge of the light outlet of the light-passing aperture is chamfered or rounded, the chamfer or rounding extends to the light-transmitting adhesive layer, and the side of the inner lens is formed by the chamfer or rounding.

[0016] In one embodiment, the light-blocking element is a light-absorbing resin filled with heat-dissipating particles.

[0017] In one embodiment, at least one of the side surface of the light-blocking member and the side surface of the outer lens is coplanar with the side surface of the substrate.

[0018] The aforementioned optical integrated packaging device, by placing a light-blocking component between the substrate and the outer lens, serves to support the outer lens and block part of the light emitted by the LED chip. Simultaneously, the light-blocking component's aperture allows the remaining light emitted by the LED chip to pass through and be projected as a clean, stray-free light spot through the outer lens. Therefore, the light-blocking component not only blocks unwanted light emission and adjusts the edge and shape of the light spot through its aperture, but also supports the outer lens. This eliminates the need for an additional support frame to support the light-blocking component and lens of traditional light-emitting devices, reducing the number of components, greatly simplifying the structure, and significantly lowering costs. Furthermore, compared to traditional light-emitting devices using LED light sources, the optical integrated packaging device is based on the LED chip for packaging, achieving chip-level optical packaging. Its small size enables device miniaturization. Attached Figure Description

[0019] Figure 1 This is a cross-sectional view of the optical integrated packaging device in the first embodiment of this application.

[0020] Figure 2 for Figure 1 A top view of a centrally integrated optical packaged device.

[0021] Figure 3 This is a cross-sectional view of the optical integrated packaging device in the second embodiment of this application.

[0022] Figure 4This is a cross-sectional view of the optical integrated packaging device in the third embodiment of this application.

[0023] Figure 5 This is a cross-sectional view of the optical integrated packaging device in the fourth embodiment of this application.

[0024] Figure 6 This is a cross-sectional view of the optical integrated packaging device in the fifth embodiment of this application.

[0025] Figure 7 for Figure 6 A top view of a centrally integrated optical packaged device.

[0026] Figure 8 This is a cross-sectional view of the optical integrated packaging device in the sixth embodiment of this application.

[0027] Explanation of reference numerals in the attached figures:

[0028] 100 - Optical integrated packaging device; 110 - Substrate; 120 - Light-emitting chip; 130 - Light-blocking component; 131 - Light-passing hole; 132 - Light-passing port; 133 - Support part; 134 - Light-blocking part; 135 - Chamfer; 140 - Outer lens; 142 - Support structure; 144 - Lens structure; 150 - Light-transmitting adhesive layer; 160 - Inner lens. Detailed Implementation

[0029] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0030] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0031] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0032] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0033] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0034] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0035] Please see Figure 1 and Figure 2 , Figure 1 A cross-sectional view of the optical integrated packaging device according to the first embodiment of this application is shown. Figure 2 It shows Figure 1A top view of an optical integrated packaging device. The first embodiment of this application provides an optical integrated packaging device 100, including a substrate 110, a light-emitting chip 120, a light-blocking member 130, and an outer lens 140. The light-emitting chip 120 is disposed on the substrate 110. The light-blocking member 130 is disposed on the substrate 110 and surrounds the light-emitting chip 120. The light-blocking member 130 has a light-passing hole 131, and the light-passing hole 131 has a light-passing opening 132 that limits the amount of light passing through. The light-passing opening 132 is disposed corresponding to the light-emitting chip 120. The outer lens 140 is disposed on the light-blocking member 130 and is disposed corresponding to the light-passing hole 131.

[0036] By providing a light-blocking component 130 between the substrate 110 and the outer lens 140, the light-blocking component 130 can support the outer lens 140 and block part of the light emitted by the light-emitting chip 120. At the same time, the light-passing hole 131 on the light-blocking component 130 allows the remaining light emitted by the light-emitting chip 120 to pass through and be projected as a pure, stray light spot through the outer lens 140. Therefore, the light-blocking component 130 can not only block unwanted light emission and adjust the edge and shape of the light spot through its light-passing hole 132, but also support the outer lens 140. There is no need to set up an additional support frame to support the light-blocking component and lens of the traditional light-emitting device, thus reducing the number of parts, greatly simplifying the structure, and significantly reducing costs. Moreover, compared with traditional light-emitting devices that use LED light sources, the optical integrated packaging device 100 is based on the packaging of the light-emitting chip 120, achieving chip-level optical packaging. Its small size realizes the miniaturization of the device. In addition, the light aperture 131 is built-in, which serves to protect the light aperture 131. Compared with the traditional external window, it cannot be directly observed and has a low probability of being damaged.

[0037] The side surface of the light-blocking member 130 is coplanar with the side surface of the substrate 110, and the side surface of the outer lens 140 is coplanar with the side surface of the light-blocking member 130. Figure 1 In the optical axis cross-section, the cross-sectional line of the side of the light-blocking member 130 is on the same straight line as the cross-sectional line of the side of the substrate 110, and the cross-sectional line of the side of the outer lens 140 is on the same straight line as the cross-sectional line of the side of the light-blocking member 130. During mass production of devices, modules containing arrayed device units can be fabricated first, and then the modules can be laser-cut or metal-cut to separate the device units, batch-cutting individual devices, thus improving production efficiency and reducing production costs. In other embodiments, the side of the substrate 110 can be extended and not coplanar with the side of the light-blocking member 130 and the side of the outer lens 140; alternatively, the side of the light-blocking member 130 can be recessed and not coplanar with the side of the substrate 110 and the side of the outer lens 140.

[0038] Please combine Figure 2The optical integrated packaging device 100 is generally square in shape. Because the sides of all the different components of the device are flush, it facilitates splicing between different components and can reduce or eliminate seams. Specifically, the substrate 110 and the light-blocking member 130 are both square, and the outer lens 140 is also generally square, but the orthographic projection of its light-emitting surface is circular. In other embodiments, the optical integrated packaging device 100 may be generally circular or have other suitable shapes.

[0039] The substrate 110 can be a plate with circuitry (not shown), which not only supports the light-emitting chip 120 but also electrically connects the light-emitting chip 120 to external devices through the circuitry. The material of the plate can be, but is not limited to, glass, resin, or ceramic. The substrate 110 can also be a metal substrate 110, which is divided into a positive electrode portion and a negative electrode portion by separators. The light-emitting chip 120 is die-bonded to the positive electrode portion and electrically connected to the negative electrode portion through bonding wires.

[0040] The light-emitting chip 120 can be, but is not limited to, an LED chip or a semiconductor laser chip, and its number can be set according to actual needs. Furthermore, the light-emitting chip 120 is not limited to a standard-mount chip; a flip-chip can also be used. In this embodiment, only one LED chip is provided on the substrate 110. The fewer the number of chips, the lower the cost. The light-blocking component 130 and the outer lens 140 are adapted to the light-emitting chip 120; the fewer the number of chips, the smaller the size of the light-blocking component 130 and the outer lens 140, further reducing the overall size of the device. In an alternative embodiment, multiple LED chips can be provided on the substrate 110, such as two chips side-by-side to increase the light output brightness; or three chips of different emitting colors to mix light and achieve white light emission.

[0041] The size of the light-emitting chip 120 is not limited here. Obviously, the smaller the size of the light-emitting chip 120, the smaller the overall device size, which is beneficial for device miniaturization. For example, the size of the light-emitting chip 120 can be, but is not limited to, 20μm~200μm. The size of the light-emitting chip 120 can be further limited to 50μm~100μm, reaching the mini-LED level, balancing small size and manufacturing difficulty. Of course, to achieve device miniaturization, the light-emitting chip 120 can also be a micro-LED level chip.

[0042] The light-blocking component 130 is an integral structure, comprising a support portion 133 and a light-blocking portion 134. The support portion 133 is supported between the substrate 110 and the light-blocking portion 134, and the light-blocking portion 134 is located above the light-emitting chip 120. A light-passing hole 131 is formed on the light-blocking portion 134. An external lens 140 is disposed on the light-blocking portion 134. The light-blocking component 130 is mounted on the substrate 110 through its support portion 133, eliminating the need for a support structure. Simultaneously, its light-blocking portion 134 also serves to support the external lens 140, thus combining self-support and external structural support. Clearly, the light-blocking component 130 integrates support and light-blocking functions, replacing at least two or more components, simplifying the structure and reducing costs. The light-blocking component 130 can be integrally molded using a mold and then fixed to the substrate 110, simplifying the processing and assembly of the light-blocking component 130.

[0043] To achieve the airtightness of the device, the support part 133 can be glued to the substrate 110 to achieve a sealed connection between the two. Similarly, the outer lens 140 can be sealed to the top surface of the light-blocking part 134 with glue. Thus, the light-emitting chip 120 is sealed and encapsulated inside the device, avoiding the influence of the external environment on the light-emitting chip 120 and improving the service life of the light-emitting chip 120.

[0044] The centerline L2 of the light-passing aperture 131 is on the same straight line as the optical axis L1 of the light-emitting chip 120, and the size of the light-passing aperture 132 is adapted to the size of the light-emitting chip 120. Light emitted from the top surface of the light-emitting chip 120 parallel to the optical axis can all be emitted from the light-passing aperture 132, resulting in a bright and uniform light spot projected by the device. In an alternative embodiment, the size of the light-passing aperture 132 can be larger than the size of the light-emitting chip 120, thereby increasing the emission angle of the output beam; or, the size of the light-passing aperture 132 can be smaller than the size of the light-emitting chip 120, thereby achieving small-angle light emission, such as outputting a laser beam.

[0045] The light inlet of the light-blocking part 134 is larger than the light outlet of the light-passing hole 131, and the light outlet 132 is the light outlet of the light-passing hole 131. Since the light inlet is larger than the light outlet, some of the light entering from the light inlet will be blocked by the hole wall, and the rest will be emitted from the light outlet and projected as a purer light spot after passing through the outer lens 140.

[0046] Furthermore, the light-passing aperture 131 is tapered in the light-emitting direction along the optical axis. Specifically, the light-passing aperture 131 is shaped like a frustum, with both its light-inlet and light-outlet being square. The projected area of ​​the light-outlet is equal to the area of ​​the top surface of the light-emitting chip 120. In other embodiments, the light-passing aperture 131 may be shaped like a frustum of a cone, a frustum of a cone, or other polygonal frustums, and the projected area of ​​the light-outlet may be equal to or greater than the area of ​​the top surface of the light-emitting chip 120.

[0047] The light-blocking element 130 can be made of, but is not limited to, a light-absorbing material. The light-absorbing material can be black resin, specifically, but not limited to, a resin material filled with carbon black. The light emitted by the light-emitting chip 120 is absorbed by the inner surface of the light-blocking element 130 and the wall of the light-passing aperture 131, and can only be emitted from the light-passing port 132. Since most of the light-emitting chip 120 emits light laterally, it essentially retains its parallel-optical-axis emission, resulting in a pure, bright light spot projected by the device with no stray light. Simultaneously, the outer surface of the light-blocking element 130 is black, which can improve the contrast of the device's light emission. In an alternative embodiment, the light-blocking element 130 can be made of a highly reflective material, such as white resin or resin filled with highly reflective particles, which can reflect the light incident upon it, preventing light from passing through the light-blocking element 130.

[0048] The outer lens 140 is disposed on the top surface of the light-blocking part 134 and can be fixed to the top surface of the light-blocking part 134 by adhesive bonding. The outer lens 140 can shape the light emitted from the light-passing aperture 131, thereby improving the light control capability of the device. The outer lens 140 can serve to focus, collimate, or diffuse light, depending on the actual needs.

[0049] The outer lens 140 is a convex lens, which acts as a light-focusing lens to improve the brightness of the light spot projected by the device. Specifically, the outer lens 140 is a plano-convex lens, and its light-emitting surface is a convex curved surface. The focal point of the outer lens 140 is located on the top surface of the light-emitting chip 120. However, in other embodiments, the plano-convex lens can be replaced by a biconvex lens or the outer lens 140 can also be a Fresnel lens.

[0050] Please see Figure 3 , Figure 3 A cross-sectional view of the optical integrated packaging device in the second embodiment of this application is shown. Compared with the optical integrated packaging device 100 in the first embodiment, in this embodiment, the light inlet of the light-passing aperture 131 of the optical integrated packaging device 100 is equal to the light outlet of the light-passing aperture 131, and the light outlet 132 is disposed between the light inlet and the light outlet. As the light outlet 132 limits the amount of light passing through, it is necessarily smaller than the light inlet and the light outlet. The aperture wall between the light inlet and the light outlet 132 can block part of the incoming light. The space between the light outlet 132 and the light outlet gradually increases, thereby increasing the light emission angle range and serving the functions of blocking light and expanding the light emission angle range. The light outlet 132 can be disposed in the middle of the light-passing aperture 131, or it can be disposed close to the light inlet or the light outlet.

[0051] The projected area of ​​the light port 132 is larger than the area of ​​the top surface of the light-emitting chip 120, thereby increasing the angular range of the light-emitting beam of the device to meet the requirements of large light spot application scenarios.

[0052] The optical integrated packaging device 100 also includes a light-transmitting adhesive layer 150, which is disposed on the top surface of the light-emitting chip 120. The side surface of the light-transmitting adhesive layer 150 is gradually widened in the direction away from the optical axis, which can reflect the large-angle lateral light emission of the light-emitting chip 120 upwards, reducing lateral light emission loss and improving brightness. The top surface of the light-transmitting adhesive layer 150 is a convex curved surface, which can act as a light-focusing surface. Correspondingly, the focal point of the outer lens 140 is located on the light-emitting surface of the light-transmitting adhesive layer 150.

[0053] As for the other aspects of the optical integrated packaging device 100 in this embodiment, they are basically the same as the other aspects of the optical integrated packaging device 100 in the first embodiment above. The specific content can be referred to the description of the first embodiment above, and will not be repeated here.

[0054] Please see Figure 4 , Figure 4 A cross-sectional view of the optical integrated packaging device in the third embodiment of this application is shown. Compared with the optical integrated packaging device 100 in the first embodiment, in this embodiment, the center line L2 of the light-passing aperture 131 of the optical integrated packaging device 100 is offset relative to the optical axis L1 of the light-emitting chip 120, thereby projecting a biased light beam to meet different application requirements. The optical axis L1 of the light-emitting chip 120 passes through the light-passing aperture 131, and the center line L2 of the light-passing aperture 131 is located on one side of the optical axis L1 of the light-emitting chip 120. In other embodiments, an asymmetrical lens can be used instead of the biased center line L2 of the light-passing aperture 131 to achieve biased light output; or, the optical axis L1 of the light-emitting chip 120 does not pass through the light-passing aperture 131, and the number of light-passing apertures 131 is not limited to one.

[0055] The optical integrated packaging device 100 also includes a light-transmitting adhesive layer 150, which is disposed on the top surface of the light-emitting chip 120 to reduce the Fresnel loss of the light-emitting chip 120. At the same time, the top surface of the light-transmitting adhesive layer 150 is a convex curved surface, which can play a light-concentrating role.

[0056] As for the other aspects of the optical integrated packaging device 100 in this embodiment, they are basically the same as the other aspects of the optical integrated packaging device 100 in the first embodiment above. The specific content can be referred to the description of the first embodiment above, and will not be repeated here.

[0057] Please see Figure 5 , Figure 5A cross-sectional view of the optical integrated packaging device in the fourth embodiment of this application is shown. Compared with the optical integrated packaging device 100 in the first embodiment, in this embodiment, the center line L1 of the light-passing aperture 131 of the optical integrated packaging device 100 intersects with the optical axis L2 of the light-emitting chip 120, thus projecting a biased light beam to meet different application requirements. The intersection point of the center line L1 of the light-passing aperture 131 and the optical axis L1 of the light-emitting chip 120 is located within the light-passing aperture 131, and the number of light-passing apertures 131 is not limited to one.

[0058] The material of the light-blocking component 130 can be, but is not limited to, a high-reflectivity material, such as white resin. Its inner surface and the hole wall of the light-passing hole 131 are both reflective surfaces. The light entering the light-passing hole 131 undergoes multiple reflections, thus fully mixing the light and improving the uniformity and brightness of the emitted light.

[0059] The optical integrated packaging device 100 also includes a light-transmitting adhesive layer 150, which is disposed on the top surface of the light-emitting chip 120 to reduce the Fresnel loss of the light-emitting chip 120. When molding the light-transmitting adhesive layer 150, an appropriate amount of adhesive can be directly applied, coated, or printed onto the top surface of the light-emitting chip 120 and allowed to cure. In other embodiments, the light-transmitting adhesive layer 150 can cover the top and sides of the light-emitting chip 120, sealing the entire chip 120 and further improving its sealing performance.

[0060] Furthermore, the light-transmitting adhesive layer 150 is an adhesive layer filled with phosphor, which performs color conversion on the light emission of the light-emitting chip 120. The light-emitting chip 120 can be, but is not limited to, a blue LED chip, whose light emission is changed from blue to white by the phosphor.

[0061] As for the other aspects of the optical integrated packaging device 100 in this embodiment, they are basically the same as the other aspects of the optical integrated packaging device 100 in the first embodiment above. The specific content can be referred to the description of the first embodiment above, and will not be repeated here.

[0062] Please see Figure 6 and Figure 7 , Figure 6 A cross-sectional view of the optical integrated packaging device according to the fifth embodiment of this application is shown. Figure 7 It shows Figure 6The top view of the optical integrated package device in this embodiment shows that, compared to the optical integrated package device 100 in the first embodiment, the light-emitting chip 120 of the optical integrated package device 100 is located within the light-passing aperture 131, thus eliminating the need for a support portion 133 in the light-blocking member 130, resulting in a simpler structure. The aperture wall of the light-passing aperture 131 is fitted to all sides of the light-emitting chip 120, meaning the light-passing aperture 131 is adapted to the size of the light-emitting chip 120. This allows the dimensions on both sides of the light-blocking member 130 to be smaller, thereby significantly reducing the overall volume of the light-blocking member 130 and further reducing the size of the device.

[0063] The optical integrated packaging device 100 also includes a light-transmitting adhesive layer 150, which is disposed on the light-emitting chip 120 and located within the light-passing aperture 131, thereby reducing the Fresnel loss of the light-emitting chip 120. The light-transmitting adhesive layer 150 seals the top surface of the light-emitting chip 120, and the light-blocking component 130 seals the side surface of the light-emitting chip 120. Essentially, the light-blocking component 130 and the light-transmitting adhesive layer 150 work together to completely cover the light-emitting chip 120, resulting in a better sealing effect.

[0064] The light-blocking component 130 is directly molded onto the substrate 110 using a mold. Specifically, when molding the light-transmitting adhesive layer 150 and the light-blocking component 130, the light-transmitting adhesive layer 150 can first be molded on the top surface of the light-emitting chip 120 using a mold. Then, molten light-absorbing resin is injected from the side into the cavity formed between the substrate 110 and the mold. After the light-absorbing resin cures, the mold is removed, and the light-blocking component 130 can be directly molded onto the substrate 110. Obviously, the above process uses the same mold to mold two structural components, requiring only one demolding, eliminating the need for multiple demoldings and the installation of the light-blocking component 130, thus greatly simplifying the production process, improving production efficiency, and ensuring excellent sealing between the light-blocking component 130 and the substrate 110. In other embodiments, the light-blocking component 130 can be molded first and then bonded to the substrate 110 with adhesive, wherein the light-emitting chip 120 is a flip chip.

[0065] The light-blocking component 130 is a light-absorbing resin filled with heat-dissipating particles. Since the light-blocking component 130 is in contact with the side of the light-emitting chip 120, the heat from the light-emitting chip 120 is directly conducted to the light-blocking component 130. The exposed side of the light-blocking component 130 conducts heat away from the device, significantly improving the heat dissipation efficiency of the light-emitting chip 120. In other embodiments, a high-reflectivity resin can be used instead of the light-absorbing resin.

[0066] The outer lens 140 includes a support structure 142 and a lens structure 144. The lens structure 144 is disposed on the support structure 142, and the support structure 142 is supported between the light-blocking member 130 and the lens structure 144.

[0067] Furthermore, the outer lens 140 is a one-piece structure, and the support structure 142 and the lens structure 144 can be integrally injection molded, thus simplifying assembly. In other embodiments, the outer lens 140 can be a separate structure, and the two can be fixedly connected by means of adhesive connection, threaded connection or snap-fit ​​connection.

[0068] The lens structure 144 may be, but is not limited to, a convex lens, wherein the focal point of the lens structure 144 is located on the light-emitting surface of the light-transmitting adhesive layer 150.

[0069] As for the other aspects of the optical integrated packaging device 100 in this embodiment, they are basically the same as the other aspects of the optical integrated packaging device 100 in the first embodiment above. The specific content can be referred to the description of the first embodiment above, and will not be repeated here.

[0070] Please see Figure 8 , Figure 8 A cross-sectional view of the optical integrated packaging device in the sixth embodiment of this application is shown. Based on the optical integrated packaging device 100 in the fifth embodiment described above, this embodiment further includes an inner lens 160, which is disposed on the light-transmitting adhesive layer 150 to shape the light emitted by the light-emitting chip 120, further improving the device's light control capability. In other embodiments, the inner lens 160 can be directly disposed on the top surface of the light-emitting chip 120.

[0071] The edge of the light exit of the light-passing aperture 131 is chamfered 135, extending to the light-transmitting adhesive layer 150. The side of the inner lens 160 is formed by the chamfer 135. The chamfer 135 also reduces the difficulty of demolding the mold used to directly form the light-blocking component 130 on the substrate 110, making it easier to separate the mold from the formed light-blocking component 130. When forming the inner lens 160, adhesive can be poured directly into the light-passing aperture 131 until it is completely filled, thus directly forming the inner lens 160 on the light-transmitting adhesive layer 150. This integrates the forming and assembly functions of the inner lens 160, eliminating the need to first form the inner lens 160 with a mold and then bond it to the light-transmitting adhesive layer 150. Furthermore, the side of the inner lens 160 can allow for large-angle incident light towards the outer lens 140 through total internal reflection. In other embodiments, the chamfer 135 can be replaced by a rounding; obviously, rounding can achieve the same technical effect.

[0072] The top surface of the inner lens 160 is convex, which acts as a light-focusing surface and can further improve the brightness of the light spot projected by the device. The focal point of the outer lens 140 is located on the light-emitting surface of the inner lens 160.

[0073] As for the other aspects of the optical integrated packaging device 100 in this embodiment, they are basically the same as the other aspects of the optical integrated packaging device 100 in the fifth embodiment above. The specific content can be referred to the description of the fifth embodiment above, and will not be repeated here.

[0074] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0075] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. An optical integrated packaging device, characterized in that, include: substrate(110); A light-emitting chip (120) is disposed on the substrate (110); A light-blocking member (130) is disposed on the substrate (110) and surrounding the light-emitting chip (120). The light-blocking member (130) has a light-passing hole (131) with a light-passing opening (132) that limits the amount of light passing through. The light-passing opening (132) corresponds to the light-emitting chip (120). An outer lens (140) is disposed on the light-blocking member (130) and is disposed corresponding to the light-passing hole (131).

2. The optical integrated packaging device according to claim 1, characterized in that, The light-blocking component (130) is an integral structure and includes a support portion (133) and a light-blocking portion (134). The support portion (133) is supported between the substrate (110) and the light-blocking portion (134). The light-blocking portion (134) is located above the light-emitting chip (120). The light-passing hole (131) is opened on the light-blocking portion (134). The outer lens (140) is disposed on the light-blocking part (134).

3. The optical integrated packaging device according to claim 1, characterized in that, The size of the light inlet of the light-passing aperture (131) is larger than the size of the light outlet of the light-passing aperture (131), and the light outlet (132) is the light outlet; or The size of the light inlet of the light-passing aperture (131) is equal to the size of the light outlet of the light-passing aperture (131), and the light outlet (132) is located between the light inlet and the light outlet.

4. The optical integrated packaging device according to claim 1, characterized in that, The center line of the light-passing aperture (131) is offset relative to the optical axis of the light-emitting chip (120), or the center line of the light-passing aperture (131) intersects with the optical axis of the light-emitting chip (120).

5. The optical integrated packaging device according to claim 1, characterized in that, The light-emitting chip (120) is located inside the light-passing hole (131), and the hole wall of the light-passing hole (131) is in contact with all sides of the light-emitting chip (120).

6. The optical integrated packaging device according to claim 5, characterized in that, Also includes: A light-transmitting adhesive layer (150) is disposed on the light-emitting chip (120) and located within the light-passing hole (131).

7. The optical integrated packaging device according to claim 6, characterized in that, Also includes: An inner lens (160) is disposed on the light-transmitting adhesive layer (150).

8. The optical integrated packaging device according to claim 7, characterized in that, The edge of the light outlet of the light-passing hole (131) is provided with a chamfer (135) or a rounding, the chamfer (135) or the rounding extends to the light-transmitting adhesive layer (150), and the side of the inner lens (160) is formed by the chamfer (135) or the rounding.

9. The optical integrated packaging device according to any one of claims 1 to 8, characterized in that, The light-blocking component (130) is a light-absorbing resin filled with heat-dissipating particles.

10. The optical integrated packaging device according to any one of claims 1 to 8, characterized in that, At least one of the side surface of the light-blocking member (130) and the side surface of the outer lens (140) is coplanar with the side surface of the substrate (110).

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