A substrate drying apparatus

Abstract

A substrate drying apparatus relates to the field of semiconductor device fabrication. The apparatus includes a housing, a stage disposed within the housing, a pressure control unit, and a temperature control system. The stage has a top surface for supporting the substrate to be dried. The pressure control unit is used to pressurize or depressurize the housing. The housing has a liquid working fluid inlet for connecting to a liquid gas supply source. The liquid gas enters the housing through the inlet and is miscible with an isopropanol solution on the surface of the substrate to be dried. The temperature control system regulates the temperature at the top surface of the stage. When the pressure control unit pressurizes the housing, it lowers the temperature at the top surface of the stage to solidify the liquid gas. When the pressure control unit depressurizes the housing, it raises the temperature at the top surface of the stage to sublimate the solidified liquid gas. This apparatus can improve the drying quality of substrates, especially high aspect ratio substrate structures, ensuring structural stability while achieving substrate drying.

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