Circuit board curing oven

Abstract

This utility model discloses a circuit board curing oven, relating to the field of circuit board processing equipment. The key technical features are: an oven body and two conveyor belts, one forward and one reverse. A buffer platform is provided at one end of the forward conveyor belt, and a flipping plate is mounted on the buffer platform. The flipping plate has a receiving groove on its side facing the forward conveyor belt, allowing it to flip towards the reverse conveyor belt and place the circuit board on it. By using the forward and reverse conveyor belts and the flipping plate, after the circuit board is cured on the front side, it can be directly reversed via the flipping plate and conveyed along the reverse conveyor belt for curing on the reverse side. This method ensures that the front and back of the circuit board are not mixed up, and curing of both sides can be completed in one pass, guaranteeing high curing efficiency.

Description

Technical Field

[0001] This utility model relates to the field of circuit board processing equipment, and more specifically, it relates to a circuit board curing oven. Background Technology

[0002] A circuit board curing oven is a device specifically designed for curing, drying, and heating coatings, inks, solder pastes, or other chemical materials during the production of printed circuit boards. Its main function is to cause the coating materials on the circuit board to undergo chemical reactions or physical changes at high temperatures through heating or radiation, thereby achieving the effects of drying, curing, or hardening.

[0003] Existing curing ovens consist of an oven body and a conveyor belt. Circuit boards are placed on the conveyor belt, which transports them into the oven body, which is equipped with ultraviolet (UV) irradiation lamps. During the assembly of circuit boards, UV adhesive is often used to bond and fix components. When exposed to ultraviolet light, UV adhesive undergoes a rapid chemical reaction, hardens into a solid, and provides strong adhesion.

[0004] In the production process of double-sided circuit boards, both sides of the circuit board need to be cured. Currently, it is generally done in batches. First, the front side of a batch of circuit boards is cured, and then the back side of the same batch of circuit boards is cured. However, currently, the circuit boards are usually placed on a conveyor belt manually. When placing the circuit boards, people need to pay attention to the front and back sides of the circuit boards. Once an operational error occurs, the same side of the circuit board may be cured twice.

[0005] Therefore, a new solution is needed to address this problem. Utility Model Content

[0006] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide a circuit board curing oven.

[0007] The above-mentioned technical objective of this utility model is achieved through the following technical solution: a circuit board curing oven, including an oven body and a conveyor belt, wherein there are two conveyor belts arranged side by side, both conveyor belts pass through the oven body, the two conveyor belts are a forward conveyor belt and a reverse conveyor belt, a buffer platform is provided at one end of the forward conveyor belt, a flipping plate is provided on the buffer platform, the flipping plate has a receiving groove for accommodating circuit boards on the side facing the forward conveyor belt, the flipping plate can be flipped towards the reverse conveyor belt and place the circuit board on the reverse conveyor belt.

[0008] The present invention is further configured such that: the reverse conveyor belt is lower than the buffer platform; a through groove communicating with the receiving groove is provided on one side of the flip plate; a protrusion is provided on the reverse conveyor belt; the top surface of the protrusion is higher than the buffer platform; the width of the protrusion is smaller than the width of the through groove; and the protrusion contacts the circuit board by being embedded in the through groove.

[0009] The present invention is further configured such that: a support platform is provided next to the reverse conveyor belt, the support platform is located on the side of the reverse conveyor belt away from the buffer platform, the top surface of the support platform is flush with the top surface of the buffer platform, and one end of the flip plate can abut against the top surface of the support platform.

[0010] The present invention is further configured such that: two marker lines one and two marker lines two are provided on the forward conveyor belt, the two marker lines one are located between the two marker lines two, and when the flip plate is in contact with the buffer platform, the two marker lines one are flush with the two opposite inner side walls of the through groove, and the two marker lines two are flush with the two opposite inner side walls of the receiving groove.

[0011] The present invention is further configured such that: a rotating shaft is provided above the buffer platform, the rotating shaft is electrically driven to rotate in both directions, and one end of the flip plate is fixedly connected to the rotating shaft.

[0012] The present invention is further configured such that a sensor is provided inside the receiving groove.

[0013] In summary, this utility model has the following beneficial effects:

[0014] By setting up a forward conveyor belt, a reverse conveyor belt, and a flip plate, the circuit board can be directly flipped after the front side is cured, and then conveyed along the reverse conveyor belt to achieve the reverse side curing. This method ensures that the front and back of the circuit board are not mixed up, and the curing of both sides can be completed in one go, thus ensuring the curing efficiency of the circuit board. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of this utility model;

[0016] Figure 2 for Figure 1 Enlarged schematic diagram of part A in the middle.

[0017] In the diagram: 1. Furnace body; 2. Forward conveyor belt; 3. Reverse conveyor belt; 4. Buffer platform; 5. Tilting plate; 6. Receiving tank; 7. Through slot; 8. Protrusion; 9. Support platform; 10. Marker line one; 11. Marker line two. Detailed Implementation

[0018] The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0019] Circuit board curing oven, such as Figure 1 and Figure 2 As shown, the system includes a furnace body 1 and two conveyor belts arranged side-by-side. Both conveyor belts pass through the furnace body 1. The two conveyor belts are a forward conveyor belt 2 and a reverse conveyor belt 3, with opposite conveying directions. One end of the forward conveyor belt 2 is equipped with a buffer platform 4, on which a flipping plate 5 is installed. The flipping plate 5 has a receiving slot 6 for accommodating circuit boards on the side facing the forward conveyor belt 2. The flipping plate 5 can flip towards the reverse conveyor belt 3 and place the circuit boards on the reverse conveyor belt 3. The horizontal length of the reverse conveyor belt 3 is greater than its horizontal length. After the circuit board is placed on the forward conveyor belt 2, it is conveyed along with the forward conveyor belt 2. After passing through the furnace body 1, the front side of the circuit board is cured. At this time, the circuit board is conveyed by the forward conveyor belt 2 into the receiving groove 6 on the flip plate 5. After the circuit board enters the receiving groove 6, the flip plate 5 will flip towards the reverse conveyor belt 3, and the front side of the circuit board will come into contact with the reverse conveyor belt 3. At this time, the circuit board will be conveyed along the reverse conveyor belt 3 and pass through the furnace body 1 to complete the curing of the reverse side. In this way, the front and back of the circuit board will not be confused, and the curing of the front and back sides can be completed in one go, ensuring the curing efficiency of the circuit board.

[0020] like Figure 1 and Figure 2 As shown, the reverse conveyor belt 3 is lower than the buffer platform 4. A through groove 7 communicating with the receiving groove 6 is provided on one side of the flipping plate 5. The width of the through groove 7 is less than the width of the receiving groove 6. A protrusion 8 is provided on the reverse conveyor belt 3. The top surface of the protrusion 8 is higher than the buffer platform 4, and the width of the protrusion 8 is less than the width of the through groove 7. The protrusion 8 contacts the circuit board by embedding itself in the through groove 7. The length of the receiving groove 6 along the thickness direction of the flipping plate 5 is greater than the thickness of the circuit board. The lower inner wall of the receiving groove 6 is not higher than the forward conveyor belt 2. When the forward conveyor belt 2 conveys the circuit board into the receiving groove 6 on the flipping plate 5, the flipping plate 5 will flip. When the flipping plate 5 flips to a certain angle, the protrusion 8 will embed itself in the through groove 7 and contact the circuit board. Upon contact, the circuit board is conveyed along the reverse conveyor belt 3 under the action of the protrusion 8, thereby curing the reverse side of the circuit board. A support platform 9 is provided next to the reverse conveyor belt 3. The support platform 9 is located on the side of the reverse conveyor belt 3 away from the buffer platform 4. The top surface of the support platform 9 is flush with the top surface of the buffer platform 4. One end of the flip plate 5 can abut against the top surface of the support platform 9. When the flip plate 5 flips to contact the support platform 9 at one end, the protrusion 8 will be embedded in the through groove 7. Because the thickness of the receiving groove 6 is greater than the thickness of the circuit board, the protrusion 8 will lift the circuit board, thereby driving the circuit board to be conveyed. The support platform 9 provides a limit to the rotation of the flip plate 5 and can cooperate with the buffer platform 4 to provide support for the flip plate 5.

[0021] like Figure 2 As shown, the forward conveyor belt 2 is equipped with two marker lines 10 and two marker lines 11. The two marker lines 10 are located between the two marker lines 11, and the adjacent marker lines 10 and 11 form an alignment zone. When the flipping plate 5 is in contact with the buffer table 4, the two marker lines 10 are flush with the two opposite inner walls of the through groove 7, and the two marker lines 11 are flush with the two opposite inner walls of the receiving groove 6. During the process of placing the circuit board, it is ensured that both ends of the circuit board are located in the two alignment zones, thereby ensuring that the circuit board can smoothly enter the flipping plate 5 during subsequent conveying. A rotating shaft is set above the buffer table 4. The rotating shaft is electrically driven to rotate in both directions. One end of the flipping plate 5 is fixedly connected to the rotating shaft. The rotation of the flipping plate 5 is electrically controlled, making the flipping process more automated. A sensor is installed in the receiving groove 6 to detect whether the circuit board is in place in the receiving groove 6. When the sensor detects that the circuit board is in place, it drives the rotating shaft to rotate.

[0022] The above description is merely a preferred embodiment of this utility model. The protection scope of this utility model is not limited to the above embodiments. All technical solutions falling within the scope of this utility model's concept are protected. It should be noted that for those skilled in the art, any improvements and modifications made without departing from the principle of this utility model should also be considered within the protection scope of this utility model.

Claims

1. A circuit board curing oven, comprising an oven body (1) and a conveyor belt, characterized in that: The number of conveyor belts is two and the two conveyor belts are arranged side by side. Both conveyor belts pass through the furnace body (1). The two conveyor belts are a forward conveyor belt (2) and a reverse conveyor belt (3). One end of the forward conveyor belt (2) is provided with a buffer platform (4). A flipping plate (5) is provided on the buffer platform (4). The flipping plate (5) has a receiving groove (6) for accommodating circuit boards on the side facing the forward conveyor belt (2). The flipping plate (5) can flip towards the reverse conveyor belt (3) and place the circuit boards on the reverse conveyor belt (3).

2. The circuit board curing oven according to claim 1, characterized in that: The reverse conveyor belt (3) is lower than the buffer platform (4). A through groove (7) communicating with the receiving groove (6) is provided on one side of the flip plate (5). A protrusion (8) is provided on the reverse conveyor belt (3). The top surface of the protrusion (8) is higher than the buffer platform (4). The width of the protrusion (8) is smaller than the width of the through groove (7). The protrusion (8) contacts the circuit board by being embedded in the through groove (7).

3. The circuit board curing oven according to claim 2, characterized in that: A support platform (9) is provided next to the reverse conveyor belt (3). The support platform (9) is located on the side of the reverse conveyor belt (3) facing away from the buffer platform (4). The top surface of the support platform (9) is flush with the top surface of the buffer platform (4). One end of the flip plate (5) can abut against the top surface of the support platform (9).

4. The circuit board curing oven according to claim 2, characterized in that: The forward conveyor belt (2) is provided with two marker lines one (10) and two marker lines two (11). The two marker lines one (10) are located between the two marker lines two (11). When the flip plate (5) is in contact with the buffer table (4), the two marker lines one (10) are flush with the two inner walls of the through groove (7) respectively, and the two marker lines two (11) are flush with the two inner walls of the receiving groove (6) respectively.

5. The circuit board curing oven according to claim 4, characterized in that: A rotating shaft is provided above the buffer platform (4). The rotating shaft is electrically driven to rotate in both directions. One end of the flip plate (5) is fixedly connected to the rotating shaft.

6. The circuit board curing oven according to claim 5, characterized in that: The receiving slot (6) is equipped with a sensor.

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