Contacting structure and electronic device

Abstract

This application provides a contact conduction structure and an electronic device. The contact conduction structure includes: a spring piece welded and fixed to a circuit board, the spring piece having a grounding contact movable relative to the circuit board; the grounding contact and a housing can form an elastic contact, thereby creating a grounding path between the circuit board and the housing; the spring piece has a preset elastic deformation range, and there is a variable assembly gap between the surface of the housing used to abut the grounding contact and the surface of the circuit board used to weld and fix the spring piece; the assembly gap does not exceed the elastic deformation range, so that the grounding contact can abut against the housing even as the assembly gap changes. This contact conduction structure, using a spring piece design, enables a sufficiently effective ground between the circuit board and the housing, thereby eliminating high-frequency noise and electrostatic interference in the circuit board through grounding. This not only reduces the risk of damage to the circuit board due to electrostatic discharge but also improves the reliability of the electronic device.

Description

Technical Field

[0001] This utility model relates to the field of electronic equipment technology, and in particular to a spring-type contact conduction structure and an electronic device including the contact conduction structure. Background Technology

[0002] Currently, the main grounding method for circuit boards in electronic devices (such as model ESC devices) on the market is to connect the exposed copper contact points (or preset exposed copper areas, which can be used to release static electricity) on the circuit board to the casing of the electronic device through a traditional contact conduction structure, thereby conducting the static electricity on the circuit board to the casing, thereby reducing electromagnetic interference, electrostatic interference and preventing damage to the circuit board.

[0003] However, due to the processing tolerances, assembly gaps, and usage scenarios (such as vibration and drop) of components such as circuit boards and housings in electronic devices, the exposed copper contact positions (i.e., the positions for releasing static electricity) reserved on the circuit board may not be effectively connected to the housing through traditional contact conduction structures, thus making the circuit board have a greater risk of conductive failure or grounding failure.

[0004] Furthermore, electrical or grounding failures can cause electrostatic discharge damage to components on the circuit board, further increasing the risk of electronic device failure.

[0005] In summary, traditional contact conduction structures cannot solve the problems of conductivity failure or grounding failure caused by factors such as machining tolerances, assembly gaps, and usage scenarios. Utility Model Content

[0006] The contact conduction structure and electronic device provided by this utility model aim to solve at least one defect of existing contact conduction structures applicable to electronic devices.

[0007] In a first aspect, this utility model provides a contact conduction structure. The contact conduction structure is used in electronic devices having a housing and a circuit board, and the contact conduction structure includes:

[0008] A spring clip, which is welded and fixed to the circuit board, and has a grounding contact that is movable relative to the circuit board;

[0009] The grounding contact can form an elastic contact with the housing, so as to form a grounding path between the circuit board and the housing;

[0010] The spring has a preset elastic deformation range, and there is a variable assembly gap between the surface of the housing that abuts the grounding contact and the surface of the circuit board that is used to weld and fix the spring.

[0011] The assembly spacing does not exceed the elastic deformation range, so that the grounding contact can abut against the outer casing during the change of the assembly spacing.

[0012] In some embodiments, the spring has an elastic force that limits the tendency for the grounding contact and the circuit board to close together;

[0013] When the spring provides the elastic force, the grounding contact can be pressed tightly against the housing to form the grounding path.

[0014] In some embodiments, the spring includes:

[0015] The assembly includes a welding section, a first bending section, a first elastic arm, a second bending section, a second elastic arm, and a contact section, with the grounding contact disposed on the contact section.

[0016] The welding part is welded and fixed to the circuit board, and one end of the first bent part is connected to the welding part;

[0017] The other end of the first bend is connected to one end of the first elastic arm, and the other end of the first elastic arm is connected to one end of the second bend.

[0018] The other end of the second bend is connected to one end of the second elastic arm, and the other end of the second elastic arm is connected to the contact portion.

[0019] In some embodiments, the welding portion, the first bending portion, the first elastic arm, the second bending portion, the second elastic arm, and the contact portion are integrally formed.

[0020] In some embodiments, the welded portion includes:

[0021] The substrate and the arched protrusion, wherein the arched protrusion is formed by stamping at least a portion of the substrate and the arched protrusion is an integral structure with the substrate.

[0022] In some embodiments, the substrate, the first elastic arm, and the second elastic arm are all straight, the first bend and the second bend are both arc-shaped bends, and the contact portion is an arc-shaped hook.

[0023] In some embodiments, the substrate has opposing first and second surfaces, and the first surface abuts against the surface of the circuit board;

[0024] The arched protrusion has opposing inner arch surfaces and outer arch surfaces, the first bent portion has opposing first inner arc surfaces and first outer arc surfaces, the second bent portion has opposing second inner arc surfaces and second outer arc surfaces, and the contact portion has opposing contact arc surfaces and non-contact arc surfaces.

[0025] The first surface, the inner arched surface, the first outer arc surface, the second inner arc surface, and the contact arc surface are located on the same side, and the second surface, the outer arched surface, the first inner arc surface, the second outer arc surface, and the non-contact arc surface are located on the same side.

[0026] In some embodiments, the contact arc surface abuts against the housing, the first surface abuts against the circuit board, the grounding contact is exposed on the contact arc surface, and conductive material is exposed on the first surface, so that the grounding path is in a conductive state.

[0027] In some embodiments, the inner arch has a first radial dimension, the outer arch has a second radial dimension, and the first radial dimension is smaller than the second radial dimension;

[0028] The first inner arc surface has a third radial dimension, the first outer arc surface has a fourth radial dimension, and the third radial dimension is smaller than the fourth radial dimension;

[0029] The second inner arc surface has a fifth radial dimension, and the second outer arc surface has a sixth radial dimension, wherein the fifth radial dimension is greater than the sixth radial dimension;

[0030] The contact arc surface has a seventh radial dimension, the non-contact arc surface has an eighth radial dimension, and the seventh radial dimension is greater than the eighth radial dimension.

[0031] Secondly, this utility model provides an electronic device. The electronic device includes:

[0032] The device body, circuit board, housing, and the aforementioned contact and conductive structure are provided. The device body and the circuit board are both located inside the housing, and the circuit board has a preset exposed copper area.

[0033] The conductive material exposed on the first surface of the substrate of the contact conduction structure can form an electrical connection with the exposed copper area, and the grounding contact exposed on the contact arc surface of the contact conduction structure can form an electrical connection with the outer shell, so that the static electricity on the circuit board can be conducted to the outer shell through the contact spring.

[0034] At least one beneficial effect of the contact conduction structure and electronic device provided by this utility model embodiment is: A novel contact conduction structure is proposed, which adopts a spring-loaded design and has a preset elastic deformation range; in the electronic device, the spring-loaded contact is soldered and fixed to the circuit board of the electronic device, and the outer casing of the electronic device abuts against the grounding contact on the spring-loaded contact, so that a grounding path is formed between the circuit board and the outer casing. This grounding path, in a conductive state, can conduct static electricity from the circuit board to the outer casing, thereby preventing damage to the circuit board caused by static electricity failure or grounding inability to ground; wherein, the spring-loaded contact can generate a suitable shape within its elastic deformation range according to the processing tolerances and assembly gaps of the outer casing and the circuit board. The spring-loaded contact deforms to ensure that its grounding contact remains in contact with the housing at all times. Furthermore, in scenarios involving vibration or drops, relative movement occurs between the circuit board and the housing. The spring-loaded contact deforms synchronously with this relative movement, further ensuring that its grounding contact remains in contact with the housing. In summary, due to its spring-loaded design, this contact conduction structure provides a sufficiently effective ground between the circuit board and the housing. This allows high-frequency noise and electrostatic interference on the circuit board to be effectively eliminated through grounding, reducing the risk of damage to the circuit board due to electrostatic discharge, improving the reliability of the electronic equipment, and meeting safety regulations. Attached Figure Description

[0035] One or more embodiments are illustrated by way of example with reference to the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements having the same reference numerals in the drawings are designated as the same elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0036] Figure 1 An exploded view of the electronic device provided in an embodiment of this utility model;

[0037] Figure 2 A cross-sectional schematic diagram of the electronic device provided in an embodiment of this utility model;

[0038] Figure 3 Provided for the embodiments of this utility model Figure 2 A magnified view of a portion at point A;

[0039] Figure 4 This is a schematic diagram of the contact conduction structure provided in an embodiment of the present utility model.

[0040] Figure label:

[0041] 100. Contact conductive structure (spring); 1. Welding part; 11. Substrate; 12. Arched protrusion; 111. First surface; 112. Second surface; 121. Inner arched surface; 122. Outer arched surface; 2. First bending part; 201. First inner arc surface; 202. First outer arc surface; 3. First elastic arm; 4. Second bending part; 401. Second inner arc surface; 402. Second outer arc surface; 5. Second elastic arm; 6. Contact part; 601. Contact arc surface; 602. Non-contact arc surface;

[0042] 1000, Electronic equipment; 200, Housing; 300, Circuit board; 400, Main body of equipment. Detailed Implementation

[0043] The present invention will now be described in detail with reference to specific embodiments. It should be emphasized that the following description is merely exemplary and is not intended to limit the scope and application of the present invention.

[0044] It should be noted that, unless otherwise expressly specified and limited, the terms "radial," "same side," etc., used in this specification indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. The terms "installation," "fitting," "connection," and "fixing" should be interpreted broadly. For example, "connection" can be a fixed connection or a detachable connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. "Fixing" can be bolt fixing, snap-fit ​​fixing, or glue fixing. The terms "first," "second," "third," "fourth," "fifth," "sixth," "seventh," and "eighth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first," "second," "third," "fourth," "fifth," "sixth," "seventh," and "eighth" may explicitly or implicitly include one or more of that feature. "A plurality" or "several" means two or more. In addition, "and / or" includes any and all combinations of one or more related listed items. For those skilled in the art, the specific meaning of the above terms in this utility model can be understood according to the specific circumstances.

[0045] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0046] In this embodiment, the specific shape, structure and size of the "contact conduction structure and electronic device" are not limited. Those skilled in the art can selectively use any suitable implementation method according to actual needs.

[0047] For ease of explanation, the "contact conduction structure" and "spring" in the embodiments of this utility model are described using the same reference numeral, that is, the reference numeral "100" can represent "contact conduction structure" and also "spring".

[0048] Figure 1 An exploded view of the electronic device provided in an embodiment of this utility model. Figure 2 This is a cross-sectional schematic diagram of an electronic device provided in an embodiment of the present utility model. Figure 3 Provided for the embodiments of this utility model Figure 2 A magnified view of a portion at point A. Figure 4 This is a schematic diagram of the contact conduction structure provided in an embodiment of the present utility model.

[0049] Please see Figures 1-4 The contact conduction structure 100 is used in an electronic device 1000 having a housing 200 and a circuit board 300.

[0050] In this embodiment of the application, the contact conduction structure 100 described above includes: a spring 100.

[0051] It should be noted that the contact conduction structure 100 is a grounding structure used in electronic device 1000 to achieve effective grounding of circuit board 300.

[0052] It is understandable that, in order to ensure that the circuit board 300 can still maintain an effective grounding function under usage scenarios such as vibration and drop, the contact conduction structure 100 can adopt an elastic connection method or a flexible connection method to ensure an effective connection between the circuit board 300 and the housing 200. Specifically, the elastic connection method can use a spring, spring sheet or spring plate with good elastic deformation capability, while the flexible connection method can use FPC (Flexible Printed Circuit).

[0053] However, FPC-type flexible connections require the use of corresponding electrical connectors (i.e., sockets need to be pre-installed on the circuit board and the housing, and then the FPC needs to be inserted into the socket to achieve conductivity between the circuit board and the housing), while spring contacts can be directly soldered onto the circuit board and maintain an effective connection with the housing through their elastic deformation capability; therefore, compared with FPC-type flexible connections, spring contact elastic connections have a simpler assembly process and lower assembly costs; in addition, compared with spring contact elastic connections, FPC-type flexible connections have lower processing costs.

[0054] To further clarify, all other implementations that are the same as or similar to the embodiments of this application in terms of basic principles and basic structure are within the protection scope of this application.

[0055] The spring 100 is soldered and fixed to the circuit board 300, and the spring 100 has a grounding contact that can move relative to the circuit board 300.

[0056] In addition, the spring 100 can be made of a conductive material with an insulating coating on its surface, and the grounding contact can be understood as the conductive material exposed after the insulating coating is scraped off on the contact arc surface 601 of the contact portion 6. The grounding contact can also be understood as a conductive structure provided on the contact arc surface 601 of the contact portion 6.

[0057] In addition, an elastic contact can be formed between the grounding contact and the housing 200 to form a grounding path between the circuit board 300 and the housing 200.

[0058] It should be noted that static electricity will be generated on the circuit board 300. When the grounding path mentioned above is in a conductive state, the charge of the static electricity can be conducted to the outer casing 200, thereby realizing the discharge of static charge and thus realizing the grounding function of the circuit board 300, so as to avoid damage to the related components of the circuit board 300 due to electrostatic discharge failure (which can also be understood as the circuit board 300 being unable to be grounded or grounding failure).

[0059] It is understood that the spring 100 has a preset elastic deformation range, and there is a variable assembly gap between the surface of the housing 200 used to abut the grounding contact and the surface of the circuit board 300 used to weld and fix the spring 100.

[0060] In the embodiments of this application, the above-mentioned assembly spacing may vary depending on the machining tolerance, assembly gap and usage scenario (e.g., vibration, drop, etc.).

[0061] To further explain, the aforementioned assembly spacing does not exceed the elastic deformation range, so that the grounding contact can abut against the housing 200 during the change of the assembly spacing.

[0062] Specifically, the spring can deform appropriately within its elastic deformation range according to the machining tolerances and assembly gaps of the housing 200 and the circuit board 300, so as to ensure that the grounding contact of the spring 100 always remains in contact with the housing 200.

[0063] Furthermore, when the electronic device 1000 is subjected to vibration, drops, or other usage scenarios, the circuit board 300 and the housing 200 will experience relative movement. The spring 100 can deform synchronously with the relative movement between the circuit board 300 and the housing 200, further ensuring that the grounding contact of the spring 100 always remains in contact with the housing 200.

[0064] In summary, because the spring 100 has elastic deformation capability, the circuit board 300 and the housing 200 can be made conductive under any conditions, avoiding grounding or conductive failures caused by machining tolerances, assembly gaps, and the usage scenarios of the electronic device 1000. Furthermore, the circuit board 300 is made conductive to the housing 200 through the grounding contact of the spring 100, allowing the electrostatic charge on the circuit board 300 to be discharged through the housing 200, avoiding the potential conductive failure risk of traditional connection methods, and improving the reliability and stability of the electronic device 1000.

[0065] In some embodiments, the spring 100 has an elastic force that limits the tendency for the grounding contact and the circuit board 300 to close together.

[0066] When the spring 100 provides elastic force, the grounding contact can be tightly attached to the housing 200 to form a grounding path.

[0067] In addition, the aforementioned elastic force ensures good contact of the grounding path, thereby ensuring effective grounding of the circuit board.

[0068] In some embodiments, such as Figure 3 and Figure 4 As shown, the spring 100 includes: a welding part 1, a first bending part 2, a first elastic arm 3, a second bending part 4, a second elastic arm 5, and a contact part 6.

[0069] It should be noted that the grounding contact is located on the contact part 6.

[0070] It is understandable that the welding part 1 is welded and fixed on the circuit board 300, and one end of the first bent part 2 is connected to the welding part 1.

[0071] Specifically, the other end of the first bent portion 2 is connected to one end of the first elastic arm 3, and the other end of the first elastic arm 3 is connected to one end of the second bent portion 4.

[0072] To further explain, the other end of the second bent portion 4 is connected to one end of the second elastic arm 5, and the other end of the second elastic arm 5 is connected to the contact portion 6.

[0073] In some embodiments, according to Figure 3 and Figure 4It can be seen that the welding part 1, the first bending part 2, the first elastic arm 3, the second bending part 4, the second elastic arm 5, and the contact part 6 are integrally formed.

[0074] In some embodiments, refer to Figures 1-4 It is known that the welding part 1 includes: a substrate 11 and an arched protrusion 12.

[0075] In the embodiments of this application, the arched protrusion 12 is formed by stamping at least a portion of the substrate 11, and the arched protrusion 12 and the substrate 11 are an integral structure.

[0076] Among them, the arched protrusion 12 has good elasticity and can effectively absorb and disperse vibration and impact energy from the external environment. When the circuit board 300 is subjected to mechanical stress (e.g., mechanical stress generated under usage scenarios such as vibration and drop), the arched protrusion 12 can buffer these mechanical stresses through slight deformation, thereby protecting the solder joints from damage.

[0077] In addition, since the materials of the welding part 1 and the circuit board 300 are different, they have different coefficients of thermal expansion. When the temperature changes, the structural design of adding the arched protrusion 12 can allow a certain relative displacement between the welding part 1 and the circuit board 300, thereby compensating for the dimensional changes caused by thermal expansion and contraction and avoiding the cracking of the solder joint due to stress concentration.

[0078] In addition, during repeated deformation of the spring piece 100, the arched protrusion 12 can make the stress distribution of the welded part 1 more uniform, which helps to reduce the risk of fatigue fracture caused by stress concentration.

[0079] In some embodiments, please refer to Figure 3 and Figure 4 The substrate 11, the first elastic arm 3 and the second elastic arm 5 are all straight, the first bending part 2 and the second bending part 4 are both arc-shaped, and the contact part 6 is arc-shaped.

[0080] In some embodiments, combined with Figure 3 and Figure 4 It is known that the substrate 11 has a first surface 111 and a second surface 112 opposite to each other, and the first surface 111 abuts against the surface of the circuit board 300.

[0081] It should be noted that the arched protrusion 12 has a corresponding inner arch surface 121 and an outer arch surface 122, the first bent portion 2 has a corresponding first inner arc surface 201 and a first outer arc surface 202, the second bent portion 4 has a corresponding second inner arc surface 401 and a second outer arc surface 402, and the contact portion 6 has a corresponding contact arc surface 601 and a non-contact arc surface 602.

[0082] It is understood that the first surface 111, the inner arch surface 121, the first outer arc surface 202, the second inner arc surface 401, and the contact arc surface 601 are located on the same side, and the second surface 112, the outer arch surface 122, the first inner arc surface 201, the second outer arc surface 402, and the non-contact arc surface 602 are located on the same side.

[0083] In some embodiments, such as Figures 1-4 As shown, the contact arc surface 601 abuts against the housing 200, the first surface 111 abuts against the circuit board 300, the grounding contact is exposed on the contact arc surface 601, and the conductive material is exposed on the first surface 111, so that the grounding path is in a conductive state.

[0084] In some embodiments, combined with Figure 3 and Figure 4 It can be seen that the inner arch surface 121 has a first radial dimension, the outer arch surface 122 has a second radial dimension, and the first radial dimension is smaller than the second radial dimension.

[0085] In this embodiment, the first inner arc surface 201 has a third radial dimension, the first outer arc surface 202 has a fourth radial dimension, and the third radial dimension is smaller than the fourth radial dimension.

[0086] Specifically, the second inner arc surface 401 has a fifth radial dimension, the second outer arc surface 402 has a sixth radial dimension, and the fifth radial dimension is greater than the sixth radial dimension.

[0087] To further explain, the contact arc surface 601 has a seventh radial dimension, and the non-contact arc surface 602 has an eighth radial dimension, with the seventh radial dimension being greater than the eighth radial dimension.

[0088] Please see Figures 1-4 The electronic device 1000 includes: a device body 400, a circuit board 300, a housing 200, and the aforementioned contact conduction structure 100. The device body 400 and the circuit board 300 are both disposed inside the housing 200, and the circuit board 300 is provided with a preset exposed copper area (the exposed copper area can also be understood as a reserved exposed copper contact position, that is, the position for static electricity release).

[0089] It should be noted that the conductive material exposed on the first surface 111 of the substrate 11 of the spring contact 100 can form an electrical connection with the exposed copper area, and the grounding contact exposed on the contact arc surface 601 of the spring contact 100 can form an electrical connection with the housing 200, so that the static electricity on the circuit board 300 can be conducted to the housing 200 through the spring contact 100.

[0090] In summary, the contact conduction structure and electronic device provided by this utility model embodiment employ a spring-loaded design with a preset elastic deformation range. In the electronic device, the spring-loaded contact is soldered and fixed to the circuit board, and the outer casing of the electronic device abuts against the grounding contact on the spring-loaded contact, forming a grounding path between the circuit board and the outer casing. This grounding path, when conductive, can conduct static electricity from the circuit board to the outer casing, thereby preventing damage to the circuit board caused by static electricity failure or grounding inability. Furthermore, the spring-loaded contact can deform appropriately within its elastic deformation range according to the processing tolerances and assembly gaps of the outer casing and the circuit board, ensuring the contact... The ground contact always remains in contact with the outer casing. Furthermore, in scenarios involving vibration or drops, the electronic device experiences relative movement between the circuit board and the casing. This spring-loaded contact can deform synchronously with this relative movement, further ensuring that the ground contact remains in contact with the casing. In summary, due to its spring-loaded design, this contact conduction structure allows for a sufficiently effective ground between the circuit board and the casing. This effectively eliminates high-frequency noise and electrostatic interference on the circuit board, reducing the risk of damage caused by electrostatic discharge and improving the reliability of the electronic device while meeting safety regulations. Therefore, the contact conduction structure provided in this embodiment is novel compared to traditional contact conduction structures.

[0091] The above description, in conjunction with specific / preferred embodiments, provides a further detailed explanation of the present invention. It should not be construed that the specific implementation of the present invention is limited to these descriptions. Those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and all of these fall within the protection scope of the present invention.

Claims

1. A contact-through structure applied in an electronic device having a housing and a circuit board, characterized by, include: A spring clip, which is welded and fixed to the circuit board, and has a grounding contact that is movable relative to the circuit board; The grounding contact can form an elastic contact with the housing, so as to form a grounding path between the circuit board and the housing; The spring has a preset elastic deformation range, and there is a variable assembly gap between the surface of the housing that abuts the grounding contact and the surface of the circuit board that is used to weld and fix the spring. The assembly spacing does not exceed the elastic deformation range, so that the grounding contact can abut against the outer casing during the change of the assembly spacing.

2. The contact conduction structure according to claim 1, characterized in that, The spring has an elastic force that restricts the grounding contact from forming a tendency to close together with the circuit board; When the spring provides the elastic force, the grounding contact can be pressed tightly against the housing to form the grounding path.

3. The contact conduction structure according to claim 1, characterized in that, The spring clip includes: The assembly includes a welding section, a first bending section, a first elastic arm, a second bending section, a second elastic arm, and a contact section, with the grounding contact disposed on the contact section. The welding part is welded and fixed to the circuit board, and one end of the first bent part is connected to the welding part; The other end of the first bend is connected to one end of the first elastic arm, and the other end of the first elastic arm is connected to one end of the second bend. The other end of the second bend is connected to one end of the second elastic arm, and the other end of the second elastic arm is connected to the contact portion.

4. The contact conduction structure according to claim 3, characterized in that, The welding part, the first bending part, the first elastic arm, the second bending part, the second elastic arm, and the contact part are integrally formed.

5. The contact conduction structure according to claim 3, characterized in that, The welded portion includes: The substrate and the arched protrusion, wherein the arched protrusion is formed by stamping at least a portion of the substrate and the arched protrusion is an integral structure with the substrate.

6. The contact conduction structure according to claim 5, characterized in that, The substrate, the first elastic arm, and the second elastic arm are all straight, the first bending portion and the second bending portion are both arc-shaped, and the contact portion is arc-shaped.

7. The contact conduction structure according to claim 5, characterized in that, The substrate has opposing first and second surfaces, and the first surface abuts against the surface of the circuit board; The arched protrusion has opposing inner arch surfaces and outer arch surfaces, the first bent portion has opposing first inner arc surfaces and first outer arc surfaces, the second bent portion has opposing second inner arc surfaces and second outer arc surfaces, and the contact portion has opposing contact arc surfaces and non-contact arc surfaces. The first surface, the inner arched surface, the first outer arc surface, the second inner arc surface, and the contact arc surface are located on the same side, and the second surface, the outer arched surface, the first inner arc surface, the second outer arc surface, and the non-contact arc surface are located on the same side.

8. The contact conduction structure according to claim 7, characterized in that, The contact arc surface abuts against the outer shell, the first surface abuts against the circuit board, the grounding contact is exposed on the contact arc surface, and conductive material is exposed on the first surface, so that the grounding path is in a conductive state.

9. The contact conduction structure according to claim 7, characterized in that, The inner arch surface has a first radial dimension, the outer arch surface has a second radial dimension, and the first radial dimension is smaller than the second radial dimension; The first inner arc surface has a third radial dimension, the first outer arc surface has a fourth radial dimension, and the third radial dimension is smaller than the fourth radial dimension; The second inner arc surface has a fifth radial dimension, and the second outer arc surface has a sixth radial dimension, wherein the fifth radial dimension is greater than the sixth radial dimension; The contact arc surface has a seventh radial dimension, the non-contact arc surface has an eighth radial dimension, and the seventh radial dimension is greater than the eighth radial dimension.

10. An electronic device, characterized in that, include: The device body, circuit board, housing, and contact conduction structure as described in any one of claims 1-9, wherein the device body and the circuit board are both disposed inside the housing, and the circuit board has a preset exposed copper area; The conductive material exposed on the first surface of the substrate of the contact conduction structure can form an electrical connection with the exposed copper area, and the grounding contact exposed on the contact arc surface of the contact conduction structure can form an electrical connection with the outer shell, so that the static electricity on the circuit board can be conducted to the outer shell through the contact spring.

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