A package base, a combination board, and an electronic device

Abstract

This utility model relates to the field of electronic packaging technology, and discloses a packaging base, a combination board, and an electronic device. The packaging base includes an insulating substrate, a metal layer, multiple external connection terminals, a first wiring, a second wiring, and a third wiring. The insulating substrate includes a base and a frame. The base has a first surface, and the frame has a second surface. The outer wall of the base and the outer wall of the frame extend in a first direction to form an outer surface. One end of the first wiring extends within the frame and connects to the metal layer. The second wiring is located within the frame. The third wiring is located within the base. The advantages of this utility model are: it facilitates the conductive connection of the electroplated wiring inside the packaging base, is suitable for packaging bases made with a single insulating film layer, can further reduce the size of the packaging base, eliminates the need for through-hole conductors in the frame, reduces the risk of cracking of the frame due to thermal stress, and simplifies the electroplated wiring structure, improving the uniformity of the plating on the packaging base.

Description

Technical Field

[0001] This utility model relates to the field of electronic packaging technology, and in particular to a packaging base, a combination board, and an electronic device. Background Technology

[0002] Encapsulation bases are commonly used to encapsulate electronic components such as quartz crystals and semiconductor chips. The encapsulated components (such as semiconductor devices, temperature-compensated oscillators (TCXOs), tuning fork resonators, thermistor resonators, automotive components, general-purpose oscillators (OSCs), and pressure-compensated oscillators (VCXOs)) are widely used in various electronic devices. A typical encapsulation base consists of an insulating substrate and conductive patterns on the substrate. The insulating substrate includes a base insulator and a frame insulator (hereinafter referred to as the base and frame). The base and frame together form a cavity for placing the electronic component. After the electronic component is placed in the cavity, a cover plate is used to seal the cavity opening, thus achieving encapsulation of the electronic component.

[0003] In the prior art, the traditional electroplated wiring scheme requires printing electroplated wiring on multiple insulating film layers, and then stacking multiple insulators to prepare the required packaging base. The through-hole conductors in the frame are used to realize the conduction between the toroidal metal layer and other electroplated wiring in the base.

[0004] With the miniaturization of electronic devices, packaging substrates also need to be miniaturized and thinned to meet application requirements. However, in the process of producing miniaturized and thinner packaging substrates, the overall volume reduction of the packaging substrate leads to a decrease in the mechanical strength of the insulator in the frame. Using traditional electroplating wiring methods, thermal expansion differences can easily occur between the through-hole conductors located in the frame and the insulator in the frame, resulting in thermal stress cracking of the frame. Secondly, traditional electroplating wiring requires the packaging substrate to be composed of multiple insulating film layers, which is not suitable for packaging substrates made with a single insulating film layer, limiting further reduction in packaging substrate size. In addition, due to the complexity of the circuitry, traditional electroplating wiring methods can easily cause poor plating uniformity when applied to miniaturized and thinner packaging substrates. Utility Model Content

[0005] The purpose of this invention is to provide a packaging substrate, a combination board, and electronic devices that facilitate the interconnection of electroplated wiring within the packaging substrate. This is suitable for packaging substrates fabricated with a single insulating film layer, and can further reduce the size of the packaging substrate. Simultaneously, it eliminates the need for through-hole conductors in the frame, reducing the risk of frame cracking due to thermal stress. Furthermore, it simplifies the electroplated wiring structure, improves the uniformity of the plating on the packaging substrate, and promotes the miniaturization and thinning of the packaging substrate.

[0006] To achieve the above objectives, this utility model provides a packaging base, including an insulating substrate, a metal layer, multiple external connection terminals, a first wiring, a second wiring, and a third wiring;

[0007] The insulating substrate includes a base and a frame. The frame has a through groove formed in the first direction. One end face of the base is connected to the frame so that the sidewall of the through groove and the end face of the base enclose a cavity. The base has a first surface on the side away from the frame, and the frame has a second surface on the side away from the base. The outer wall of the base and the outer wall of the frame extend in the first direction to form an outer surface.

[0008] The metal layer is disposed on the second surface and surrounds the cavity;

[0009] Multiple external connection terminals are disposed on the first surface;

[0010] One end of the first wiring extends within the frame and is connected to the metal layer, and the other end of the first wiring extends within the base and is connected to an external connection terminal through a through-hole conductor.

[0011] The second wiring is disposed inside the frame portion, one end of the second wiring is connected to the metal layer, and the other end extends to the outer side surface and forms a first exposed portion;

[0012] The third wiring is disposed within the base, one end of the third wiring is connected to the external connection terminal, and the other end extends to the outer side and is exposed to form a second exposed portion.

[0013] Furthermore, one end of the outer surface in the first direction is connected to the first surface via a dividing bevel, and the other end of the outer surface in the first direction is connected to the second surface via a dividing bevel.

[0014] The first exposed portion is disposed away from the dividing slope, and / or,

[0015] The second exposed portion is positioned away from the dividing slope.

[0016] Furthermore, the insulating substrate has a first corner region and a third corner region arranged diagonally, as well as a second corner region and a fourth corner region arranged diagonally, with a side region between adjacent corner regions;

[0017] The third wiring is provided within the edge region; or,

[0018] The third wiring is provided in any corner region among the first corner region, the second corner region, the third corner region, and the fourth corner region.

[0019] Furthermore, each of the external connection terminals is connected to at least two of the third wirings, and the two third wirings are located in adjacent edge regions.

[0020] Furthermore, the second wiring is provided on both the first corner region and the third corner region, and the fourth wiring is provided on both the second corner region and the fourth corner region;

[0021] The fourth wiring is located inside the frame portion, and one end of the fourth wiring extends to the outer side to form a third exposed portion. The fourth wiring is insulated from the metal layer.

[0022] Furthermore, the first wiring is provided on the first corner region, one end of the first wiring is located in the frame portion and extends to connect with the metal layer, and the other end of the first wiring is located in the base portion and connected to an external connection terminal through the through-hole conductor.

[0023] Furthermore, the first wiring is provided in both the first corner region and the third corner region; one end of the first wiring located at the base is connected to an external terminal through the through-hole conductor.

[0024] Furthermore, it also includes a first electrode pad and a second electrode pad, which are diagonally arranged within the cavity. The first electrode pad has a through-hole conductor connected to an external connection terminal located below the second corner region; the second electrode pad is connected to an external connection terminal located below the fourth corner region.

[0025] This utility model also provides a packaging base assembly plate, which is formed by arranging the packaging bases described in any of the above claims. The insulating substrate has a first corner region and a third corner region arranged diagonally, as well as a second corner region and a fourth corner region arranged diagonally, and a side region is provided between adjacent corner regions.

[0026] A second wiring is provided within the edge region, and the second wiring is electrically connected between two adjacent packaging bases on both sides; and the third wiring is electrically connected between two adjacent packaging bases on both sides; or,

[0027] The first corner region and the third corner region are respectively provided with the second wiring, the side region is provided with the third wiring, the second corner region is provided with the fourth wiring, the fourth wiring is located inside the frame, one end of the fourth wiring extends to the outer side to form a third exposed part, and the fourth wiring is insulated from the metal layer;

[0028] The second wiring of two diagonally adjacent package bases is electrically connected through the fourth wiring of the side-adjacent package bases, and the third wiring is electrically connected between the two side-adjacent package bases.

[0029] This utility model also provides an electronic device, including the packaging base described in any of the above claims, further including electronic components disposed in the cavity, and a cover plate for sealing the cavity.

[0030] Compared with the prior art, the present invention provides a packaging base, a combination board, and electronic devices, which have the following advantages: The present invention includes a first wiring, a second wiring, and a third wiring. One end of the first wiring extends within the frame and connects to the metal layer, while the other end extends within the base and connects to an external connection terminal via a through-hole conductor. The second wiring is located within the frame, with one end connected to the metal layer and the other end extending to the outer surface and forming a first exposed portion. The third wiring is located within the base, with one end connected to the external connection terminal and the other end extending to the outer surface and forming a second exposed portion. This enables electroplating conductivity between conductive wirings within the packaging base and electroplating wiring conductivity between adjacent packaging bases. This solution simplifies the electroplating wiring structure, facilitates the fabrication of the packaging base combination board, and is applicable to the fabrication of packaging bases with a single insulating film layer, further reducing the size of the packaging base. Simultaneously, the electroplating wiring structure of this solution improves the uniformity of the plating layer on the packaging base, which is beneficial for the miniaturization and thinning of the packaging base. Furthermore, this invention eliminates the need for through-hole conductors in the frame, reducing the risk of cracking in the frame due to thermal stress. Attached Figure Description

[0031] Figure 1 This is a perspective view of the packaging base according to an embodiment of the present invention;

[0032] Figure 2 This is an external view of the packaging base according to an embodiment of the present invention;

[0033] Figure 3 This is a schematic diagram of the distribution of conductive patterns on the packaging base according to an embodiment of this utility model;

[0034] Figure 4 This is a top view of the packaging base according to an embodiment of the present invention;

[0035] Figure 5 This is a top-view perspective view of the packaging base of this utility model embodiment;

[0036] Figure 6 yes Figure 5 Sectional view at point BB;

[0037] Figure 7 yes Figure 5Sectional view at CC;

[0038] Figure 8 yes Figure 5 Sectional view at point DD;

[0039] Figure 9 This is a partial schematic diagram of the packaging base assembly plate according to an embodiment of this utility model;

[0040] Figure 10 This is a schematic diagram showing the connection of conductive patterns of adjacent encapsulation bases in the encapsulation base assembly plate of this utility model embodiment;

[0041] Figure 11 This is a perspective view of another structure of the packaging base according to an embodiment of the present utility model;

[0042] Figure 12 yes Figure 11 A schematic diagram of the conductive pattern inside the intermediate packaging base;

[0043] Figure 13 This is a schematic diagram of another wiring structure connection between adjacent packaging bases in the packaging base assembly board of this utility model embodiment;

[0044] Figure 14 yes Figure 9 Top perspective view of the mid-mount base assembly board;

[0045] Figure 15 yes Figure 14 Sectional view at EE;

[0046] Figure 16 yes Figure 14 Sectional view at FF;

[0047] Figure 17 yes Figure 14 Sectional view at point GG;

[0048] Figure 18 yes Figure 13 Top perspective view of the mid-mount base assembly board;

[0049] Figure 19 yes Figure 18 Sectional view at HH;

[0050] Figure 20 yes Figure 18 Sectional view at point II;

[0051] Figure 21 yes Figure 18 A cross-sectional view at point JJ.

[0052] In the figure, 1 is an insulating substrate; 11 is a base; 111 is a first surface; 12 is a frame; 121 is a second surface; 100 is an outer surface; 101 is a cavity; 102 is a dividing bevel; 2 is a metal layer; 3 is an external connection terminal; 4 is a first wiring; 5 is a through-hole conductor; 6 is a second wiring; 61 is a first exposed portion; 7 is a third wiring; 71 is a second exposed portion; 8 is a fourth wiring; 81 is a third exposed portion; 9 is a first electrode pad; 10 is a second electrode pad; a is a first corner region; c is a third corner region; b is a second corner region; d is a fourth corner region; e is an edge region; A1 is a first package base; A2 is a second package base; A3 is a third package base; A4 is a fourth package base; K is a dividing groove; X is a first direction; Y is a second direction; Z is a third direction. Detailed Implementation

[0053] The specific embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this utility model, but are not intended to limit its scope.

[0054] In the description of this utility model, it should be understood that the terms "upper", "lower", "front", "rear", "inner", "outer" and other terms used in this utility model to indicate the orientation or positional relationship are based on the positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device and element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0055] In the description of this utility model, it should be understood that the terms "first," "second," etc., are used to describe various information, but this information should not be limited to these terms. These terms are only used to distinguish information of the same type from each other. For example, without departing from the scope of this utility model, "first" information can also be referred to as "second" information, and similarly, "second" information can also be referred to as "first" information.

[0056] like Figures 1 to 21 As shown, a preferred embodiment of the present invention includes an insulating substrate 1, a metal layer 2, multiple external connection terminals 3, a first wiring 4, a second wiring 6, and a third wiring 7; wherein, the insulating substrate 1 serves as a carrier for mounting other components. For ease of explanation, the height direction of the insulating substrate 1 is defined as the first direction X, the length direction as the second direction Y, and the width direction as the third direction Z.

[0057] See Figure 1 , Figures 6 to 8The insulating substrate 1 includes a base 11 and a frame 12. The base 11 has a first surface 111 on the side away from the frame 12, and the frame 12 has a second surface 121 on the side away from the base 11. The outer walls of the base 11 and the frame 12 extend in a first direction X to form an outer surface 100. A through groove is formed in the frame 12 in the first direction X. One end face of the base 11 is connected to the frame 12, so that the sidewall of the through groove and one end face of the base 11 enclose a cavity 101. Specifically, electronic components are installed in the cavity 101. After the electronic components are installed, a cover plate is soldered onto the cavity 101 for encapsulation. A metal layer 2 is disposed on the second surface 121 and surrounds the cavity 101. Multiple external connection terminals 3 are disposed on the first surface 111 for connection to the internal wiring structure and for electrical connection to external electronic devices for signal transmission.

[0058] To achieve electroplating conductivity between different conductive layers inside the encapsulation base, and to form electroplating conductivity between any two adjacent encapsulation bases in the encapsulation base assembly board, a first wiring 4, a second wiring 6, and a third wiring 7 are provided. One end of the first wiring 4 extends within the frame portion 12 and connects to the metal layer 2, while the other end extends within the base portion 11 and connects to an external connection terminal 3 through a through-hole conductor 5. The second wiring 6 is located within the frame portion 12, with one end connected to the metal layer 2 and the other end extending to the outer side surface 100 to form a first exposed portion 61. The third wiring 7 is located within the base portion 11, with one end connected to the external connection terminal 3 and the other end extending to the outer side surface 100 to form a second exposed portion 71. The first exposed portion 61 and the second exposed portion 71 can be used for wiring between adjacent encapsulation bases. In this invention, there is no need to provide through-hole conductors 5 in the frame portion 12, thereby avoiding the structural influence of the through-hole conductors 5 on the frame portion 12, reducing the thermal expansion difference in the frame portion 12 area, and thus reducing the risk of cracking of the encapsulation base. At the same time, it simplifies the wiring of the encapsulation base, facilitates the fabrication of the encapsulation base assembly board, is applicable to the case of preparing encapsulation bases with a single insulating film layer, and can further reduce the size of the encapsulation base; and improves the uniformity of the plating on the encapsulation base, which is conducive to the miniaturization and thinning of the encapsulation base.

[0059] When the first wiring 4 and the second wiring 6 are not directly connected, but are respectively connected to the metal layer 2, two connection points are generated between the metal layer 2 and the first wiring 4 and the second wiring 6. The increase in the number of connection points leads to uneven resistance distribution of the electroplated wiring, resulting in poor uniformity of the electroplated layer thickness of the packaging substrate. At the same time, parasitic capacitance may also be generated between the second wiring 6 and the first wiring 4, causing signal interference in the packaging substrate in practical applications. Therefore, in this embodiment, the end of the second wiring 6 connected to the metal layer 2 is connected to the first wiring 4, that is, the end of the second wiring 6 away from the first exposed part 61 is directly connected to the first wiring 4. This reduces the number of connection points, improves the resistance uniformity of the electroplated wiring, and makes the overall symmetry of the electroplated wiring of the packaging substrate better, improving the uniformity of current, thereby ensuring the uniformity of the electroplated layer thickness of the packaging substrate. At the same time, it avoids the generation of parasitic capacitance between the first wiring 4 and the second wiring 6, reducing signal interference in the practical application of the packaging substrate.

[0060] Furthermore, in this embodiment, refer to Figure 9 The beveled surfaces 102 between adjacent package bases cooperate to form a dividing groove K. When the wiring structure is distributed on the package base assembly board, if part of the wiring structure is exposed in the dividing groove K, the adjacent package bases near the exposed part are prone to sticking together during electroplating of the assembly board. Therefore, in this embodiment, one end of the outer surface 100 in the first direction X is connected to the first surface 111 through the beveled surface 102, and the other end of the outer surface 100 in the first direction X is connected to the second surface 121 through the beveled surface 102; the first exposed part 61 is disposed away from the beveled surface 102, and / or the second exposed part 71 is disposed away from the beveled surface 102. That is, the first exposed part 61 and the second exposed part 71 cannot be exposed through the beveled surface 102.

[0061] Furthermore, in order to facilitate the distribution of the wiring structure within the insulating substrate 1, therefore, see... Figure 4The insulating substrate 1 is divided into two parts. Specifically, the insulating substrate 1 has a first corner region a, a third corner region c, a second corner region b, and a fourth corner region d arranged diagonally. A side region e is provided between adjacent corner regions. A third wiring 7 is provided in the side region e; or, the third wiring 7 is provided in any corner region among the first corner region a, the second corner region b, the third corner region c, and the fourth corner region d. When the encapsulation base is prepared by hot pressing, the electroplated wiring (i.e., wiring structures such as the first wiring 4, the second wiring 6, and the third wiring 7) and the cavity 101 are formed as follows: a conductive coating and a ceramic slurry coating covering part or all of the conductive coating are sequentially printed on the upper / lower surface of the substrate of the insulating substrate 1. Then, the substrate is heated and pressed into shape by a mold. The substrate and the coating printed on it will deform according to the structure of the mold and fill the mold cavity. The ceramic slurry layer protruding from the surface of the substrate sinks to the surface of the substrate due to pressure, thereby forming the cavity 101 and the conductive coating structure inside the encapsulation base.

[0062] Since the third wiring 7 is formed by hot pressing a conductive coating printed on the lower surface of the substrate, and the lower surface of the substrate has a low degree of deformation during hot pressing, in order to ensure that the first surface 111 of the insulating substrate 1 has good flatness after hot pressing, it is necessary to reduce the printing thickness of the ceramic paste on the lower surface of the substrate. Therefore, the shortest distance between the second exposed part 71 of the third wiring 7 and the first surface 111 is small. When the third wiring 7 is located in the corner area, the corner area will be subjected to two pressure deformations (i.e., pressure in the second direction Y and the third direction Z) during the formation of the dividing groove K of the packaging base assembly plate, resulting in a deeper dividing groove K. This increases the risk of the third wiring 7 being exposed in the dividing groove K and causing electroplating adhesion, and may even cause the third wiring 7 between adjacent packaging bases to disconnect. Therefore, the third wiring 7 is located in the edge area e. The edge area e is only subjected to one pressure deformation during the formation of the dividing groove K of the packaging base assembly plate, and the depth of the dividing groove K is moderate, thereby reducing the risk of the third wiring 7 being exposed in the dividing groove K and causing electroplating adhesion, while avoiding the disconnection of the third wiring 7 between adjacent packaging bases.

[0063] Furthermore, in this embodiment, refer to Figure 1 , Figure 2 , Figure 3 Each external connection terminal 3 is connected to at least two third wirings 7, and the two third wirings 7 are located within adjacent edge regions e. That is, in this embodiment, a complete package base includes four external connection terminals 3, which correspondingly form eight third wirings 7. The distribution of the third wirings 7 is as follows... Figure 1 As shown.

[0064] Furthermore, in this embodiment, a second wiring 6 is provided on the first corner region a and the third corner region c, and a fourth wiring 8 is provided on the second corner region b and the fourth corner region d. The fourth wiring 8 is located inside the frame portion 12, and one end of the fourth wiring 8 extends to the outer side surface 100 to form a third exposed portion 81. The fourth wiring 8 is insulated from the metal layer 2.

[0065] During the formation of the insulating substrate 1, the second surface 121 of the insulating substrate 1 needs to undergo a hot pressing process to form a cavity 101, resulting in a high degree of deformation of the second surface 121 during the hot pressing process. Since in the packaging base assembly board, the corner area of ​​the insulating substrate 1 of one packaging base shares an angle with the corner areas of the other three adjacent insulating substrates 1, compared with the side area e that only shares an edge with the insulating substrate 1, the corner area requires more filler (insulator and coating) to fill. Otherwise, the corner area of ​​the formed insulating substrate 1 will have a concave phenomenon, resulting in poor flatness. Therefore, in this utility model, the second wiring 6 and the third wiring 7 are respectively set in the corner area, which can effectively increase the filler volume of the corner area, so that the corner area is fully filled during the hot pressing process, and the packaging base has better flatness.

[0066] Similarly, in some implementations, to ensure sufficient filling of corner areas, refer to... Figures 1 to 10 A first wiring 4 is provided on the first corner region a. One end of the first wiring 4 is located in the frame portion 12 and extends to connect with the metal layer 2. The other end of the first wiring 4 is located in the base portion 11 and is connected to an external connection terminal 3 through the through-hole conductor 5.

[0067] In some other embodiments, to ensure sufficient filling of the corner regions, see [reference needed]. Figure 11 , Figure 12 , Figure 13 First wiring 4 is provided in both the first corner region a and the third corner region c; the first wiring 4 is connected to an external terminal at one end of the frame 12 through a through-hole conductor 5.

[0068] Furthermore, in this embodiment, for ease of electrical connection with electronic components, refer to... Figure 1 The packaging base also includes a first electrode pad 9 and a second electrode pad 10, wherein the first electrode pad 9 and the second electrode pad 10 are diagonally arranged in the cavity 101, the through-hole conductor 5 of the first electrode pad 9 is connected to an external connection terminal 3 located below the second corner region b; the second electrode pad 10 is connected to an external connection terminal 3 located below the fourth corner region d.

[0069] The packaging substrate is typically fabricated on a large-size insulating substrate 1 to obtain a packaging substrate assembly board composed of multiple packaging substrates. The conductive patterns on adjacent packaging substrates are connected by electroplated wiring on the packaging substrate assembly board to achieve electroplating of all packaging substrates. After electroplating, the assembly board can be divided into individual packaging substrates by a pre-set dividing groove K.

[0070] Therefore, this utility model also provides a packaging base assembly board, which is composed of packaging bases arranged according to any of the above. Specifically, the insulating substrate 1 has a first corner region a and a third corner region c arranged diagonally, and a second corner region b and a fourth corner region d arranged diagonally. A side region e is provided between adjacent corner regions. A second wiring 6 (not shown in the figure) is provided in the side region e. The two adjacent packaging bases on the side have a second wiring 6 that is electrically connected to each other, and the two adjacent packaging bases on the side have a third wiring 7 that is electrically connected to each other.

[0071] In some other embodiments, see Figures 9 to 21 The encapsulation base assembly is composed of encapsulation bases arranged in the second direction Y and the third direction Z. To facilitate the explanation of the conductive relationship between adjacent encapsulation bases, a partial structure of the encapsulation base assembly is selected for illustration. See [link to documentation]. Figures 9 to 21 The packaging base assembly board includes a first packaging base A1, a second packaging base A2, a third packaging base A3, and a fourth packaging base A4. The first packaging base A1 and the second packaging base A2, and the third packaging base A3 and the fourth packaging base A4 are arranged adjacent to each other on the upper side of the third direction Z; the first packaging base A1 and the fourth packaging base A4, and the second packaging base A2 and the third packaging base A3 are arranged adjacent to each other on the upper side of the second direction Y. The first packaging base A1 and the third packaging base A3 are arranged angularly adjacent, as are the second packaging base A2 and the fourth packaging base A4. It should be noted that... Figure 9 , Figure 10 It can be seen that "edge adjacent" means that two package bases are adjacent in the second direction Y or the third direction Z, and the dividing slope 102 is set opposite to each other to form the dividing groove K. "Diagonally adjacent" means that two package bases are adjacent and their diagonals are on the same straight line.

[0072] In each package base, a second wiring 6 is provided in the first corner region a and the third corner region c, a third wiring 7 is provided in the side region e, and a fourth wiring 8 is provided in the second corner region b. The fourth wiring 8 is located inside the frame portion 12, and one end of the fourth wiring 8 extends to the outer side surface 100 to form a third exposed portion 81. The fourth wiring 8 is insulated from the metal layer 2. Furthermore, the second wiring 6 of diagonally adjacent package bases are electrically connected through the fourth wiring 8 of oppositely adjacent package bases. Specifically, the second wiring 6 in the first package base A1 is electrically connected to the second wiring 6 in the third package base A3 through the fourth wiring 8 in the fourth package base A4.

[0073] Two adjacent packaging bases are electrically connected by a third wiring 7. Specifically, a portion of the third wiring 7 in the first packaging base A1 is connected to a portion of the third wiring 7 in the fourth packaging base A4; a portion of the third wiring 7 in the first packaging base A1 is connected to a portion of the third wiring 7 in the second packaging base A2; a portion of the third wiring 7 in the second packaging base A2 is connected to a portion of the third wiring 7 in the third packaging base A3; and a portion of the third wiring 7 in the third packaging base A3 is connected to a portion of the third wiring 7 in the fourth packaging base A4. That is, the third wiring 7 of one packaging base is connected to the third wiring 7 of other packaging bases located on its periphery, thereby realizing the internal wiring conduction of the packaging base assembly board.

[0074] This utility model provides an electronic device, including a packaging base of any of the above, an electronic component disposed in a cavity 101, and a cover plate for sealing the cavity 101.

[0075] In summary, this utility model embodiment provides a packaging base, a combined board, and an electronic device, comprising a first wiring 4, a second wiring 6, and a third wiring 7. One end of the first wiring 4 extends within the frame portion 12 and connects to the metal layer 2, while the other end extends within the base portion 11 and connects to an external connection terminal 3 via a through-hole conductor 5. The second wiring 6 is disposed within the frame portion 12, with one end connected to the metal layer 2 and the other end extending to the outer side surface 100 and forming a first exposed portion 61. The third wiring 7 is disposed within the base portion 11, with one end connected to the metal layer 2 and the other end extending to the outer side surface 100 and forming a first exposed portion 61. An external connection terminal 3 is connected, with the other end extending to the outer side 100 and forming a second exposed portion 71. This enables electroplating conductivity between conductive wirings inside the packaging substrate, as well as electroplating conductivity between two adjacent packaging substrates. This solution simplifies the electroplating wiring structure, facilitates the fabrication of the packaging substrate assembly board, and is applicable to packaging substrates fabricated with a single insulating film layer, further reducing the size of the packaging substrate. Simultaneously, the electroplating wiring structure of this solution improves the uniformity of the plating on the packaging substrate, which is beneficial for the miniaturization and thinning of the packaging substrate. Furthermore, this invention eliminates the need for through-hole conductors 5 in the frame portion 12, reducing the risk of cracking in the frame portion 12 due to thermal stress.

[0076] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and substitutions can be made without departing from the technical principles of the present utility model, and these improvements and substitutions should also be considered within the protection scope of the present utility model.

Claims

1. A packaging base, characterized in that: It includes an insulating substrate, a metal layer, multiple external connection terminals, a first wiring, a second wiring, and a third wiring; The insulating substrate includes a base and a frame. The frame has a through groove formed in the first direction. One end face of the base is connected to the frame so that the sidewall of the through groove and the end face of the base enclose a cavity. The base has a first surface on the side away from the frame, and the frame has a second surface on the side away from the base. The outer wall of the base and the outer wall of the frame extend in the first direction to form an outer surface. The metal layer is disposed on the second surface and surrounds the cavity; Multiple external connection terminals are disposed on the first surface; One end of the first wiring extends within the frame and is connected to the metal layer, and the other end of the first wiring extends within the base and is connected to an external connection terminal through a through-hole conductor. The second wiring is disposed inside the frame portion, one end of the second wiring is connected to the metal layer, and the other end extends to the outer side surface and forms a first exposed portion; The third wiring is disposed within the base, one end of the third wiring is connected to the external connection terminal, and the other end extends to the outer side and is exposed to form a second exposed portion.

2. The packaging base as described in claim 1, characterized in that: One end of the outer surface in the first direction is connected to the first surface through a dividing bevel, and the other end of the outer surface in the first direction is connected to the second surface through a dividing bevel; The first exposed portion is disposed away from the dividing slope, and / or, The second exposed portion is positioned away from the dividing slope.

3. The packaging base as described in claim 1, characterized in that: The insulating substrate has a first corner region and a third corner region arranged diagonally, as well as a second corner region and a fourth corner region arranged diagonally, with a side region between adjacent corner regions; The third wiring is provided within the edge region; or, The third wiring is provided in any corner region among the first corner region, the second corner region, the third corner region, and the fourth corner region.

4. The packaging base as described in claim 3, characterized in that: Each of the external connection terminals is connected to at least two of the third wirings, and the two third wirings are located in adjacent edge regions.

5. The packaging base as described in claim 3, characterized in that: The second wiring is provided on both the first corner region and the third corner region, and the fourth wiring is provided on both the second corner region and the fourth corner region; The fourth wiring is located inside the frame portion, and one end of the fourth wiring extends to the outer side to form a third exposed portion. The fourth wiring is insulated from the metal layer.

6. The packaging base as described in claim 3, characterized in that: The first wiring is provided on the first corner region. One end of the first wiring is located in the frame and extends to connect with the metal layer. The other end of the first wiring is located in the base and is connected to an external connection terminal through the through-hole conductor.

7. The packaging base as described in claim 3, characterized in that: The first wiring is provided in both the first corner region and the third corner region; one end of the first wiring located at the base is connected to an external terminal through the through-hole conductor.

8. The packaging base as described in claim 3, characterized in that: It also includes a first electrode pad and a second electrode pad, which are arranged diagonally within the cavity. The first electrode pad has a through-hole conductor connected to an external connection terminal located below the second corner region; the second electrode pad is connected to an external connection terminal located below the fourth corner region.

9. A packaging base assembly plate, formed by arranging the packaging bases according to any one of claims 1-8, characterized in that: The insulating substrate has a first corner region and a third corner region arranged diagonally, as well as a second corner region and a fourth corner region arranged diagonally, with a side region between adjacent corner regions; A second wiring is provided within the edge region, and the second wiring is electrically connected to each other between two adjacent packaging bases; and the third wiring is electrically connected to each other between two adjacent packaging bases; or... The first corner region and the third corner region are respectively provided with the second wiring, the side region is provided with the third wiring, the second corner region is provided with the fourth wiring, the fourth wiring is located inside the frame, one end of the fourth wiring extends to the outer side to form a third exposed part, and the fourth wiring is insulated from the metal layer; The second wiring of two diagonally adjacent package bases is electrically connected through the fourth wiring of the side-adjacent package bases, and the third wiring is electrically connected between the two side-adjacent package bases.

10. An electronic device comprising the packaging base according to any one of claims 1-8, characterized in that: It also includes electronic components disposed within the cavity, and a cover plate for sealing the cavity.

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