A wire arranging device for wafer multi-wire sawing

Abstract

The utility model discloses a kind of wire arranging devices of wafer multi-wire cutting, including the lower mounting plate being set on multi-wire cutting machine, servo motor, first bearing seat, second bearing seat and rear mounting seat are sequentially set on the lower mounting plate from back to front, rotate and set on first bearing seat and second bearing seat, and the rear end is connected with servo motor's screw rod, with the screw rod nut seat of screw thread connection of screw rod, front mounting seat is fixed on screw rod nut seat, inlay in rear mounting seat, and at least be configured with two's sliding sleeve, rear end is fixedly connected with front mounting seat, and a number of slide bars are one-to-one corresponding and set in sliding sleeve, wire arranging wheel support frame is arranged at the front end of slide bar, and first wire arranging wheel and second wire arranging wheel are arranged on wire arranging wheel support frame, and rotate and support to metal wire. By the above scheme, the utility model has the advantages of simple structure, reliable adjustment, etc. It has very high practical value and popularization value in wafer processing technology field.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing technology, and in particular to a wire-laying device for multi-wire wafer cutting. Background Technology

[0002] Wafer slicing is the process of cutting a grown monolithic crystal (such as silicon or sapphire) into thin slices of a certain thickness, i.e., wafers, to prepare for subsequent semiconductor device manufacturing processes. The main methods of wafer slicing include: internal circular dicing, external circular dicing, and wire dicing. Wire dicing uses a thin metal wire (such as steel or molybdenum wire), applying tension between the wire and the crystal, and using electrical discharge or mechanical friction to guide the wire along a predetermined path to cut the crystal. Its advantages include extremely high cutting precision, enabling the cutting of very complex shapes; and minimal stress generated during the cutting process, causing almost no damage to the wafer. However, the wire adjustment process requires adjustment, and current wire adjustment equipment is quite complex.

[0003] Therefore, there is an urgent need to propose a simple and reliable multi-wire wafer cutting wiring device. Utility Model Content

[0004] To address the aforementioned problems, the purpose of this utility model is to provide a wire-laying device for multi-wire wafer cutting. The technical solution adopted by this utility model is as follows:

[0005] A wire-laying device for multi-wire wafer dicing, mounted on a multi-wire dicing machine, provides rotatable support for the metal wire. It includes a lower mounting plate on the multi-wire dicing machine; a servo motor, a first bearing housing, a second bearing housing, and a rear mounting base, arranged sequentially from back to front on the lower mounting plate; a lead screw rotatably mounted on the first and second bearing housings and connected at its rear end to the servo motor; a lead screw nut housing threaded to the lead screw; a front mounting base fixed to the lead screw nut housing; at least two sliding sleeves embedded in the rear mounting base; several sliding rods fixedly connected at their rear ends to the front mounting base and correspondingly mounted in the sliding sleeves; a wire-laying wheel support frame at the front end of the sliding rods; and a first and second wire-laying wheels mounted on the wire-laying wheel support frame for rotatable support of the metal wire. A coupling is provided between the lead screw and the servo motor.

[0006] Furthermore, a reinforcing support plate is provided between the front end of the rear mounting base and the lower mounting plate.

[0007] Furthermore, two sliding sleeves are provided, and they are respectively placed on both sides of the reinforcing support plate.

[0008] Furthermore, the cable guide wheel support frame includes an integrally formed support frame, a vertical support frame, and a horizontal support frame; the support frame, the vertical support frame, and the horizontal support frame are arranged perpendicularly to each other; the first cable guide wheel is mounted on the vertical support frame; and the second cable guide wheel is mounted on the horizontal support frame.

[0009] Furthermore, the vertical support frame and the horizontal support frame have the same structure, and the front end of the horizontal support frame is provided with a first rolling bearing and a second rolling bearing; the first rolling bearing and the second rolling bearing are respectively arranged on the front and rear sides of the horizontal support frame; the second cable wheel is rotatably sleeved on the first rolling bearing and the second rolling bearing.

[0010] Compared with the prior art, the present invention has the following beneficial effects:

[0011] (1) This utility model provides adjustment of the lead screw assembly by setting a first bearing seat, a second bearing seat, a servo motor, a lead screw, and a lead screw nut seat, ensuring the reliability of its adjustment movement. In addition, this utility model ensures the reliability of its sliding support by setting a front mounting seat, a rear mounting seat, a sliding sleeve, and a sliding rod, and at least two sets of sliding sleeves and sliding rods are configured.

[0012] (2) By setting a first rolling bearing and a second rolling bearing, which are respectively arranged on the front and rear sides of the transverse support frame, this utility model ensures that the first and second wire guide wheels are reliably supported by rolling.

[0013] In summary, this utility model has the advantages of simple structure and reliable adjustment, and has high practical and promotional value in the field of wafer processing technology. Attached Figure Description

[0014] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope of protection. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 This is a structural schematic diagram of the present invention from a first angle.

[0016] Figure 2 This is a structural schematic diagram of the present invention from a second angle.

[0017] Figure 3 This is a structural schematic diagram of the present invention from a third angle.

[0018] In the above figures, the component names corresponding to the reference numerals are as follows:

[0019] 1. Lower mounting plate; 2. First bearing housing; 3. Second bearing housing; 4. Servo motor; 5. Lead screw; 6. Lead screw nut housing; 7. Front mounting base; 8. Rear mounting base; 9. Sliding sleeve; 10. Reinforcing support plate; 11. Sliding rod; 12. Cable guide wheel support frame; 13. First cable guide wheel; 14. Second cable guide wheel; 15. Coupling; 121. Support frame; 122. Vertical support frame; 123. Horizontal support frame; 1231. First rolling bearing; 1232. Second rolling bearing. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of this application clearer, the present invention will be further described below with reference to the accompanying drawings and embodiments. The embodiments of this utility model include, but are not limited to, the following embodiments. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.

[0021] In this embodiment, the term "and / or" is merely a description of the relationship between related objects, indicating that there can be three relationships. For example, A and / or B can represent three situations: A exists alone, A and B exist simultaneously, and B exists alone.

[0022] The terms "first" and "second," etc., used in the specification and claims of this embodiment are used to distinguish different objects, not to describe a specific order of objects. For example, "first target object" and "second target object," etc., are used to distinguish different target objects, not to describe a specific order of target objects.

[0023] In the embodiments of this application, the terms "exemplary" or "for example" are used to indicate that something is an example, illustration, or description. Any embodiment or design that is described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or design. Specifically, the use of the terms "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0024] In the description of the embodiments in this application, unless otherwise stated, "multiple" means two or more. For example, multiple processing units means two or more processing units; multiple systems means two or more systems.

[0025] like Figures 1 to 3As shown, this embodiment provides a wire routing device for multi-wire wafer dicing, which is mounted on a multi-wire dicing machine and provides rotational support for the metal wire. Compared to the conventional method of fixing the first wire routing wheel 13 and the second wire routing wheel 14 in a fixed manner, its adjustment is more flexible and reliable. It should be noted that the first wire routing wheel 13 and the second wire routing wheel 14, as well as their winding method of the (metal) wire, are existing technologies and will not be described in detail here.

[0026] In this embodiment, the wire-laying device for multi-wire wafer cutting includes a lower mounting plate 1 mounted on a multi-wire cutting machine, a servo motor 4, a first bearing seat 2, a second bearing seat 3, and a rear mounting seat 8 arranged sequentially from back to front on the lower mounting plate 1, a lead screw 5 rotatably sleeved on the first bearing seat 2 and the second bearing seat 3 and connected to the servo motor 4 at its rear end, a lead screw nut seat 6 threadedly connected to the lead screw 5, a front mounting seat 7 fixed on the lead screw nut seat 6, at least two sliding sleeves 9 embedded in the rear mounting seat 8, several sliding rods 11 fixedly connected to the front mounting seat 7 at their rear ends and correspondingly sleeved in the sliding sleeves 9, a wire-laying wheel support frame 12 located at the front end of the sliding rods 11, and a first wire-laying wheel 13 and a second wire-laying wheel 14 located on the wire-laying wheel support frame 12 and providing rotational support for the metal wire. A coupling 15 is provided between the lead screw 5 and the servo motor 4. Additionally, a reinforcing support plate 10 is provided between the front end of the rear mounting seat 8 and the lower mounting plate 1. In this embodiment, two sliding sleeves 9 can be provided and placed on both sides of the reinforcing support plate 10 respectively to ensure the reliability of the sliding support.

[0027] The cable reel support frame 12 in this embodiment includes an integrally formed support frame 121, a vertical support frame 122, and a horizontal support frame 123. The support frame 121, vertical support frame 122, and horizontal support frame 123 are arranged perpendicularly to each other; that is, the vertical support frame 122 is perpendicular to the support frame 121, and the vertical support frame 122 is perpendicular to the horizontal support frame 123, and the support frame 121 is perpendicular to the horizontal support frame 123. The first cable reel 13 is mounted on the vertical support frame 122, and the second cable reel 14 is mounted on the horizontal support frame 123. In this embodiment, to ensure the reliable rolling support of the first cable reel 13 and the second cable reel 14, the vertical support frame 122 and the horizontal support frame 123 have the same structure. Taking the horizontal support frame 123 as an example, a first rolling bearing 1231 and a second rolling bearing 1232 are provided at its front end. The first rolling bearing 1231 and the second rolling bearing 1232 are respectively arranged on the front and rear sides of the transverse support frame 123, and the second wire guide wheel 14 is rotated and sleeved on the first rolling bearing 1231 and the second rolling bearing 1232.

[0028] The above embodiments are merely preferred embodiments of this utility model and are not intended to limit the scope of protection of this utility model. Any changes made based on the design principles of this utility model, or any non-creative changes made on this basis, shall fall within the scope of protection of this utility model.

Claims

1. A wire-laying device for multi-wire wafer cutting, mounted on a multi-wire cutting machine, and providing rotational support for the metal wire, characterized in that... The system includes a lower mounting plate (1) mounted on a multi-wire cutting machine, a servo motor (4), a first bearing housing (2), a second bearing housing (3), and a rear mounting seat (8) mounted on the lower mounting plate (1) from back to front, a lead screw (5) rotatably sleeved on the first bearing housing (2) and the second bearing housing (3) and connected to the servo motor (4) at its rear end, a lead screw nut seat (6) threadedly connected to the lead screw (5), a front mounting seat (7) fixed on the lead screw nut seat (6), and a rear mounting seat (8) embedded in the rear mounting plate (8). The mounting base (8) contains at least two sliding sleeves (9), the rear end of which is fixedly connected to the front mounting base (7) and is fitted one-to-one with several sliding rods (11) inside the sliding sleeves (9), a wire guide wheel support frame (12) is set at the front end of the sliding rods (11), and a first wire guide wheel (13) and a second wire guide wheel (14) are set on the wire guide wheel support frame (12) and provide rotational support for the metal wire; a coupling (15) is provided between the lead screw (5) and the servo motor (4).

2. The wafer multi-wire cutting wiring device according to claim 1, characterized in that, A reinforcing support plate (10) is provided between the front end of the rear mounting base (8) and the lower mounting plate (1).

3. The wafer multi-wire cutting wiring device according to claim 2, characterized in that, Two sliding sleeves (9) are provided, and are respectively placed on both sides of the reinforcing support plate (10).

4. The wafer multi-wire cutting wiring device according to claim 1, characterized in that, The cable guide support frame (12) includes an integrally formed support frame (121), a vertical support frame (122), and a horizontal support frame (123); the support frame (121), the vertical support frame (122), and the horizontal support frame (123) are arranged perpendicularly to each other; the first cable guide (13) is mounted on the vertical support frame (122); and the second cable guide (14) is mounted on the horizontal support frame (123).

5. The wafer multi-wire cutting wiring device according to claim 4, characterized in that, The vertical support frame (122) and the horizontal support frame (123) have the same structure, and the front end of the horizontal support frame (123) is provided with a first rolling bearing (1231) and a second rolling bearing (1232); the first rolling bearing (1231) and the second rolling bearing (1232) are respectively arranged on the front and rear sides of the horizontal support frame (123); The second cable wheel (14) is rotatably mounted on the first rolling bearing (1231) and the second rolling bearing (1232).

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