A device capable of monitoring the contact state of a tire bead in real time

Abstract

This utility model relates to a device for real-time monitoring of the contact state of a tire bead, belonging to the field of wheel technology. It includes a sensor module, with one or more sensors mounted on the rim. The sensor module comprises multiple interdigitated capacitive MEMS acoustic emission sensors, arranged along any radial section of the rim near the bead side, with the monitoring direction perpendicular to the rim surface. This utility model overcomes the bottlenecks of traditional monitoring methods. Based on the interdigitated capacitive MEMS acoustic emission sensors, it can monitor the real-time dynamic displacement curve of the bead-rim contact area under static inflation, static load, and rolling conditions, detecting whether abnormal slippage or misalignment occurs at the bead. This provides crucial information for optimizing the bead curve, helping to design a bead shape that better conforms to mechanical distribution, reducing the risk of fatigue damage, improving the durability and reliability of the tire bead area, extending tire life, and ensuring vehicle safety.

Description

Technical Field

[0001] This utility model relates to the field of wheel technology, and in particular to a device that can monitor the contact status of tire beads in real time. Background Technology

[0002] The dynamic fit between the tire bead and the rim has a decisive impact on vehicle safety and tire life. Due to complex stress distribution, frequent dynamic loads, differences in material properties, and environmental factors, the contact surface between the tire bead and the rim is a critical area prone to fatigue damage. Especially under the combined effects of various factors such as tire pressure changes, load, driving speed, and road conditions, the contact area between the tire bead and the rim is prone to slippage or misalignment during tire rolling. This adverse phenomenon not only causes tire bead cracking and abnormal bead wear, but also reduces the overall tire performance, increases the risk of tire blowout, and thus seriously affects vehicle safety and handling stability.

[0003] Korean patent KR 10-2021-0004136A discloses a vehicle wheel with shock absorption and bead damage monitoring functions. The wheel has a pressure sensor embedded in the rim contact surface to monitor the bead contact pressure and tire pressure. However, the pressure sensor cannot quantify the dynamic displacement change of the bead caused by bead deformation. Therefore, the accuracy of the wheel in presenting the dynamic fit between the bead and the rim needs to be further improved. Utility Model Content

[0004] To address the shortcomings of related technologies, this invention provides a device capable of real-time monitoring of the tire bead contact state. Based on an interdigitated capacitive MEMS acoustic emission sensor, it can monitor the real-time dynamic displacement curve of the bead-rim contact area under static inflation, static load, and rolling conditions, detecting whether abnormal slippage or misalignment occurs at the bead. This invention solves the problem that traditional monitoring methods cannot quantify the dynamic displacement changes of the bead caused by bead deformation.

[0005] This invention provides a device for real-time monitoring of tire bead contact status, comprising: a sensor module, one or more of which are mounted on the rim. The sensor module includes: interdigitated capacitive MEMS acoustic emission sensors, multiple of which are disposed along any radial section of the rim near the bead side, with the monitoring direction perpendicular to the rim surface.

[0006] In some embodiments, the sensor module further includes: a plurality of piezoelectric thin film sensors disposed along the edge of the radial section of the rim near the rim opening; the piezoelectric thin film sensors are located between the interdigitated capacitive MEMS acoustic emission sensor and the rim.

[0007] In some embodiments, the sensor module further includes an electrical signal shielding layer located between the interdigitated capacitive MEMS acoustic emission sensor and the piezoelectric thin film sensor.

[0008] In some of these embodiments, both the piezoelectric thin-film sensor and the interdigitated capacitive MEMS acoustic emission sensor are electrically connected to other structures via elastic contacts.

[0009] In some embodiments, the piezoelectric thin film sensor and the interdigitated capacitive MEMS acoustic emission sensor are in one-to-one correspondence, and the corresponding piezoelectric thin film sensor and interdigitated capacitive MEMS acoustic emission sensor are aligned vertically.

[0010] In some embodiments, the device further includes a transmission module, mounted on the rim, for establishing a signal connection between the sensor module and other devices. The transmission module uses wireless communication for signal transmission.

[0011] In some embodiments, the device further includes a power supply module disposed on the outer side of the rim and connected to the sensor module and the transmission module.

[0012] The charging port is located on the wheel rim and connects to the power supply module.

[0013] In some embodiments, the power supply module includes a housing that is fixedly connected to the rim.

[0014] The capacitor, located inside the housing, is connected to the sensor module, the transmission module, and the charging port.

[0015] A piezoelectric device, located inside a housing and connected to a capacitor, is used to convert the vibration, deformation, and centrifugal force of a wheel into electrical energy.

[0016] In some embodiments, an opening is provided on the side of the housing away from the rim. The power supply module also includes a locking mechanism that engages with the inner wall of the opening.

[0017] In some embodiments, the power supply module further includes a flexible circuit board with voltage regulation and overvoltage protection circuitry. Piezoelectric devices are connected to capacitors via the flexible circuit board.

[0018] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0019] 1. This invention breaks through the bottleneck of traditional monitoring methods. Based on an interdigitated capacitive MEMS acoustic emission sensor, it can monitor the real-time dynamic displacement curve of the bead-rim contact area under static inflation, static load, and rolling conditions, detecting whether abnormal slippage or misalignment occurs at the bead. This provides crucial information for optimizing the bead curve, helping to design a bead shape that better conforms to mechanical distribution, reducing the risk of fatigue damage, improving the durability and reliability of the tire bead area, extending tire life, and ensuring vehicle safety.

[0020] 2. Based on a piezoelectric thin film sensor and an interdigitated capacitive MEMS acoustic emission sensor, this invention can monitor the real-time dynamic displacement curve and real-time contact pressure distribution at the contact point between the tire bead and the rim under static inflation, static load and rolling conditions, which helps to monitor with high precision whether the tire bead will slip or misalign. Attached Figure Description

[0021] The accompanying drawings, which are included to provide a further understanding of the present invention and form part of this application, illustrate exemplary embodiments of the present invention and, together with the description thereof, serve to explain the present invention and do not constitute an undue limitation thereof. In the drawings:

[0022] Figure 1 This is a schematic diagram of the structure of this utility model installed on a wheel.

[0023] Figure 2 for Figure 1 Enlarged view of region A in the middle;

[0024] Figure 3 This is a schematic diagram illustrating the structure of the power supply module in this utility model;

[0025] Figure 4 for Figure 3 Enlarged schematic diagram of region B in the middle.

[0026] In the diagram: 1. Sensor module; 11. Flexible substrate; 12. Piezoelectric thin film sensor; 13. Electrical signal shielding layer; 2. Shielded twisted pair cable; 3. Power supply module; 31. Housing; 32. Capacitor; 33. Piezoelectric device; 34. Locking structure; 341. Chamfer; 35. Flexible circuit board; 4. Charging port; 5. Sub-port; 6. Rim; 61. Second mounting slot. Detailed Implementation

[0027] The technical solutions in the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.

[0028] In the description of this utility model, it should be understood that the terms "center", "lateral", "longitudinal", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0029] The terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first," "second," or "third" may explicitly or implicitly include one or more of that feature.

[0030] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0031] like Figure 1-4 As shown, in an embodiment of the device for real-time monitoring of tire bead contact status according to this utility model, the device for real-time monitoring of tire bead contact status includes at least:

[0032] This invention provides a device for real-time monitoring of the contact state of a tire bead 5, comprising: a sensor module 1, with one or more sensors mounted on the rim 6. Each sensor module 1 monitors the contact state between a bead 5 and the rim 6 in real time.

[0033] Sensor module 1 includes multiple interdigitated capacitive MEMS acoustic emission sensors located on the same plane. All interdigitated capacitive MEMS acoustic emission sensors in a single sensor module 1 are distributed along the edge of the radial section of the rim 6 near the notch 5, and the monitoring range of a single sensor module 1 covers the full width of the notch 5 in the radial direction of the tire. The monitoring direction of a single interdigitated capacitive MEMS acoustic emission sensor is the normal to the surface of its corresponding area on the rim 6. The aforementioned interdigitated capacitive MEMS acoustic emission sensor is prior art, and its structure is described in Chinese Patent CN117214304A, and will not be elaborated upon here.

[0034] Taking a single sensor module 1 as an example, during wheel rotation, the interdigitated capacitive MEMS acoustic emission sensor monitors the distance between the tire bezel 5 and the rim 6 in real time. Based on the monitoring results of all interdigitated capacitive MEMS acoustic emission sensors, the contour of the bezel 5 can be drawn. By overlaying the contours of the bezel 5 at different time periods, the dynamic displacement change of the bezel 5 relative to the rim 6 can be analyzed. Compared with the conventional method of analyzing the dynamic contact state between the bezel 5 and the rim 6 based solely on pressure sensors, the aforementioned sensor module 1 can quantify the displacement change between the bezel 5 and the rim 6 in real time, and the sensor module 1 provides a higher accuracy in presenting the dynamic contact state between the bezel 5 and the rim 6.

[0035] Furthermore, all interdigitated capacitive MEMS acoustic emission sensors in a single sensor module 1 are mounted on the same flexible substrate 11, which is fixed to the wheel rim 6. All interdigitated capacitive MEMS acoustic emission sensors can be connected as a single unit via the flexible substrate 11, and then mounted on the wheel rim 6 via the flexible substrate 11, thereby improving the installation efficiency and positional accuracy of the interdigitated capacitive MEMS acoustic emission sensors. In addition, the flexible substrate 11 can better conform to the shape of the wheel rim 6, which helps to improve monitoring accuracy. The interdigitated capacitive MEMS acoustic emission sensors are located within the flexible substrate 11. Figure 2 The image does not show an interdigitated capacitive MEMS acoustic emission sensor.

[0036] Preferably, the elastic modulus of the flexible substrate 11 is 10-100 MPa, and the matching error between the curvature of the flexible substrate 11 on the rim 6 and the curvature of the rim 6 is less than ±0.5 mm.

[0037] Furthermore, the flexible substrate 11 is made of insulating material to reduce mutual interference between different interdigitated capacitive MEMS acoustic emission sensors. The flexible substrate 11 is preferably a flexible polyimide film. Wires are disposed within the flexible substrate 11, and all interdigitated capacitive MEMS acoustic emission sensors are electrically connected to other structures via different wires.

[0038] Furthermore, the conductor is a shielded twisted pair 2 to reduce common-mode interference.

[0039] In some embodiments, the sensor module 1 is provided in two groups, with at least one sensor module 1 in each group, and the two groups of sensor modules 1 respectively monitor the contact status between the two sub-holes 5 and the rim 6.

[0040] Furthermore, the two sets of sensor modules 1 are symmetrically arranged on the wheel rim 6.

[0041] In some embodiments, multiple sensor modules 1 are provided, and all sensor modules 1 monitor the contact state between the same sub-hole 5 and the rim 6. All sensor modules 1 are distributed around the axis of the rim 6.

[0042] In some embodiments, the sensor module 1 further includes piezoelectric thin film sensors 12, with multiple sensors arranged along the edge of the radial section of the rim 6 near the slot 5. The piezoelectric thin film sensors 12 are common commercial products, and their structure and principle will not be described in detail here.

[0043] Taking a single sensor module 1 as an example, during wheel rotation, the piezoelectric thin-film sensor 12 monitors the contact pressure between the inlet 5 and the rim 6 in real time. Based on the monitoring results of all piezoelectric thin-film sensors 12, the pressure distribution of the contact area between the rim 6 and the inlet 5 can be plotted. By combining and analyzing the pressure distribution at different time periods, the dynamic contact pressure changes between the rim 6 and the inlet 5 can be obtained. Combining and analyzing the monitoring results of the piezoelectric thin-film sensor 12 and the interdigitated capacitive MEMS acoustic emission sensor can further improve the accuracy of presenting the dynamic contact state between the inlet 5 and the rim 6.

[0044] Furthermore, all piezoelectric thin-film sensors 12 are electrically connected to other structures via different wires. The wires are shielded twisted-pair cables 2 to reduce common-mode interference.

[0045] Furthermore, the piezoelectric thin film sensor 12 is located between the interdigitated capacitive MEMS acoustic emission sensor and the wheel rim 6 to reduce the area occupied by the sensor module 1 on the wheel rim 6 and reduce the interference of the sensor module 1 on the connection between the tire and the wheel rim 6.

[0046] Furthermore, a thickness of 0.1 mm is preferred for the piezoelectric thin film sensor 12 to better fit the shape of the rim 6 and improve monitoring accuracy.

[0047] In some embodiments, the piezoelectric thin film sensor 12 and the interdigitated capacitive MEMS acoustic emission sensor are in one-to-one correspondence, and the corresponding piezoelectric thin film sensor 12 and interdigitated capacitive MEMS acoustic emission sensor are aligned vertically to establish a one-to-one mapping relationship and improve monitoring accuracy.

[0048] Furthermore, it is preferable that the angle between the normal of each piezoelectric thin film sensor 12 and the normal of its corresponding interdigitated capacitive MEMS acoustic emission sensor is less than or equal to 1°. It is preferable that the spatial coordinate deviation between each piezoelectric thin film sensor 12 and its corresponding interdigitated capacitive MEMS acoustic emission sensor is less than or equal to 0.1 mm, so as to further improve the alignment accuracy of the piezoelectric thin film sensor 12 and the interdigitated capacitive MEMS acoustic emission sensor.

[0049] In some embodiments, the sensor module 1 further includes an electrical signal shielding layer 13 located between the interdigitated capacitive MEMS acoustic emission sensor and the piezoelectric thin film sensor 12.

[0050] Furthermore, the electrical signal shielding layer 13 is a flexible structure to better fit the shape of the rim 6 and improve the monitoring accuracy of the sensor module 1.

[0051] Furthermore, the electrical signal shielding layer 13 is preferably made of copper foil, and is grounded to eliminate electromagnetic interference caused by the external environment to the sensor module 1. The grounding impedance of the electrical signal shielding layer 13 is less than 1Ω. A copper foil thickness of 0.05mm is preferred for the electrical signal shielding layer 13.

[0052] Furthermore, the flexible substrate 11 is fixed to the side of the electrical signal shielding layer 13 away from the rim 6.

[0053] In some embodiments, the device further includes a transmission module, disposed on the rim 6, for establishing a signal connection between the sensor module 1 and other devices. The transmission module uses wireless communication for signal transmission. Figure 1 Not shown in the image.

[0054] In some embodiments, the device further includes a power supply module 3, disposed on the outer side of the rim 6, and connected to the sensor module 1 and the transmission module.

[0055] Charging port 4 is located on the rim 6 and is connected to the power supply module 3.

[0056] Furthermore, the charging port 4 is equipped with an openable and closable flip cover to prevent foreign objects from hitting the charging port 4 during vehicle operation.

[0057] Furthermore, a sealing structure is provided between the charging port 4 and the rim 6 to achieve waterproof and dustproof effects, protecting the sensor module 1, power supply module 3, and transmission module. The sealing structure is not shown in the diagram.

[0058] In some embodiments, the power supply module 3 includes a housing 31, which is fixedly connected to the rim 6.

[0059] Capacitor 32, located inside housing 31, is connected to sensor module 1, transmission module, and charging port 4. Capacitor 32 is used to power sensor module 1 and transmission module, and receives power from an external power source through charging port 4.

[0060] A piezoelectric device 33, located inside the housing 31 and connected to the capacitor 32, is used to convert the vibration, deformation, and centrifugal force of the wheel into electrical energy. The piezoelectric device 33 includes, but is not limited to, piezoelectric films and piezoelectric ceramics.

[0061] The piezoelectric device 33 has a conventional structure and will not be described in detail here. When the wheel rotates, the piezoelectric device 33 converts the wheel's vibration, deformation, and centrifugal force into electrical energy, which is stored in the capacitor 32. Prolonged parking can cause the capacitor 32 to self-discharge. In this case, the capacitor 32 can be charged through the charging port 4 to ensure the normal operation of the piezoelectric thin-film sensor 12 and the interdigitated capacitive MEMS acoustic emission sensor in the sensor module 1.

[0062] Furthermore, capacitor 32 is a supercapacitor made of graphene and MXene. Supercapacitor 32 is an existing product, and its structure and principle will not be described in detail here.

[0063] Preferably, the rated voltage of the supercapacitor 32 is 3.6V and the capacitance of the supercapacitor 32 is 10F.

[0064] Furthermore, the housing 31 is a plastic structure with a certain degree of elasticity, so that the elastic deformation of the housing 31 can absorb the thermal expansion and vibration deformation between the rim 6 and the power supply module 3, thus maintaining the structural stability of the housing 31. Preferably, the housing 31 is a glass fiber reinforced nylon housing.

[0065] In some embodiments, the housing 31 has an opening. The power supply module 3 also includes a locking structure 34, which is detachably connected to the opening in the housing 31 to facilitate the removal and maintenance of the electrical structures inside the housing 31.

[0066] Furthermore, the opening is located on the side of the housing 31 away from the rim 6, and the locking structure 34 engages with the annular snap-fit ​​on the inner wall of the opening, evenly distributing the force exerted by the locking structure 34 on the housing 31 to each side wall of the housing 31, thus avoiding local stress concentration. When the wheel rotates at high speed, the centrifugal force can increase the connection strength between the locking structure 34 and the housing 31.

[0067] Furthermore, the locking structure 34 is a thin-walled structure made of spring steel.

[0068] Furthermore, the edge of the locking structure 34 on the side away from the rim 6 is chamfered 341 so that it can be snapped into the inside of the opening.

[0069] In some embodiments, the power supply module 3 further includes a flexible circuit board 35, which has a voltage regulator circuit and an overvoltage protection circuit. The piezoelectric device 33 is connected to the capacitor 32 through the flexible circuit board 35.

[0070] Furthermore, the piezoelectric device 33 has an elastic damping layer to attenuate high-frequency vibrations and protect the piezoelectric device 33.

[0071] In some embodiments, the piezoelectric device 33 is a piezoelectric film located on the side of the capacitor 32 away from the rim 6, and the flexible circuit board 35 is located between the piezoelectric film and the capacitor 32. The flexible circuit board 35 is a highly reliable and extremely flexible printed circuit board made of polyimide or polyester film as a substrate.

[0072] Furthermore, a piezoelectric film thickness of 2-3 mm is preferred, and a flexible circuit board thickness of 0.3 mm is preferred.

[0073] Furthermore, the piezoelectric film is composed of a flexible piezoelectric layer and an elastic damping layer. The elastic damping layer can attenuate high-frequency vibrations and protect the flexible piezoelectric layer. The flexible piezoelectric layer is preferably a flexible polyvinylidene fluoride layer, and the elastic damping layer is preferably an elastic silicone layer.

[0074] In some embodiments, the rim 6 is provided with a first mounting groove for mounting the sensor module 1, in order to further reduce the interference of the sensor module 1 on the connection between the tire and the rim 6. The first mounting groove is not shown in the figure.

[0075] Furthermore, the rim 6 has a silicon nitride protective layer to improve the structural strength of the rim 6 and reduce the impact of opening the first mounting groove on the structural strength of the rim 6. The silicon nitride protective layer is not shown in the figure.

[0076] Furthermore, a cured silicone sealant is also provided within the first mounting groove. This cured silicone sealant encapsulates the sensor module 1 within the first mounting groove to protect it. After the sensor module 1 is placed in the first mounting groove, liquid silicone sealant is injected into the groove, completely submerging the sensor module 1. The liquid silicone sealant is then photocured to transform it into a cured silicone sealant. The cured silicone sealant is not shown in the diagram.

[0077] In some embodiments, both the piezoelectric thin-film sensor 12 and the interdigitated capacitive MEMS acoustic emission sensor are electrically connected to other structures via elastic contacts. These elastic contacts are small in size and offer high electrical connection reliability, making them less prone to disconnection under vibration. Other structures referred to herein include, but are not limited to, the power supply module 3 and the transmission module. The elastic contacts are not shown in the figures.

[0078] Furthermore, the elastic contact includes a spring pin and a copper sheet, which are in elastic contact. Each piezoelectric thin-film sensor 12 corresponds to one elastic contact, and each interdigitated capacitive MEMS acoustic emission sensor corresponds to one elastic contact. The piezoelectric thin-film sensor 12 is connected to its corresponding spring pin, and the copper sheet corresponding to the spring pin is mounted on the electrical connection object of the piezoelectric thin-film sensor 12. The interdigitated capacitive MEMS acoustic emission sensor is connected to its corresponding spring pin, and the copper sheet corresponding to the spring pin is mounted on the electrical connection object of the interdigitated capacitive MEMS acoustic emission sensor.

[0079] In some embodiments, the rim 6 is provided with a second mounting groove 61 for mounting the power supply module 3, so as to reduce the interference of the power supply module 3 on the connection between the tire and the rim 6.

[0080] Furthermore, in the radial direction of the wheel, the distance between the power supply module 3 and the tire rim is greater than or equal to 15mm, so as to prevent tire deformation from interfering with the normal operation of the power supply module 3.

[0081] Through the description of several embodiments of the device for real-time monitoring of the contact state of the tire bead 5 according to the present invention, it can be seen that the embodiments of the device for real-time monitoring of the contact state of the tire bead 5 according to the present invention have at least one or more of the following advantages:

[0082] 1. This invention breaks through the bottleneck of traditional monitoring methods. Based on an interdigitated capacitive MEMS acoustic emission sensor, it can monitor the real-time dynamic displacement curve of the contact area between the bead 5 and the rim 6 of the tire under static inflation, static load, and rolling conditions, and detect whether abnormal slippage or misalignment occurs at the bead 5. This provides crucial information for optimizing the bead 5 curve, helping to design a bead 5 shape that better conforms to mechanical distribution, reducing the risk of fatigue damage, thereby improving the durability and reliability of the tire bead 5, extending tire life, and ensuring vehicle safety.

[0083] 2. Based on the piezoelectric thin film sensor 12 and the interdigitated capacitive MEMS acoustic emission sensor, this utility model can monitor the real-time dynamic displacement curve and real-time contact pressure distribution of the contact area between the tire bead 5 and the rim 6 under static inflation, static load and rolling conditions, which helps to monitor with high precision whether the tire bead 5 has abnormal slippage or misalignment.

[0084] Finally, it should be noted that the various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0085] The above embodiments are only used to illustrate the technical solution of this utility model and not to limit it; although the utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications can still be made to the specific implementation of this utility model or equivalent substitutions can be made to some technical features without departing from the spirit of the technical solution of this utility model, and all such modifications and substitutions should be covered within the scope of the technical solution claimed by this utility model.

Claims

1. A device capable of real-time monitoring of tire bead contact status, characterized in that, include: A sensor module is provided on the wheel rim, including one or more interdigitated capacitive MEMS acoustic emission sensors, multiple of which are provided along any radial section of the wheel rim near the rim opening, with the monitoring direction perpendicular to the wheel rim surface.

2. The device for real-time monitoring of tire bead contact status according to claim 1, characterized in that, The sensor module also includes: piezoelectric thin film sensors, multiple of which are arranged along the edge of the radial section of the wheel rim near the rim opening; the piezoelectric thin film sensors are located between the interdigitated capacitive MEMS acoustic emission sensor and the wheel rim.

3. The device for real-time monitoring of tire bead contact status according to claim 2, characterized in that, The sensor module also includes an electrical signal shielding layer located between the interdigitated capacitive MEMS acoustic emission sensor and the piezoelectric thin film sensor.

4. The device for real-time monitoring of tire bead contact status according to claim 2, characterized in that, Both piezoelectric thin-film sensors and interdigitated capacitive MEMS acoustic emission sensors are electrically connected to other structures via elastic contacts.

5. The device for real-time monitoring of tire bead contact status according to claim 2, characterized in that, The piezoelectric thin film sensor and the interdigitated capacitive MEMS acoustic emission sensor are in one-to-one correspondence, and the corresponding piezoelectric thin film sensor and interdigitated capacitive MEMS acoustic emission sensor are aligned vertically.

6. A device for real-time monitoring of tire bead contact status according to any one of claims 1-5, characterized in that, Also includes: The transmission module, mounted on the wheel rim, is used to establish signal connections between the sensor module and other devices; The transmission module uses wireless communication to transmit signals.

7. The device for real-time monitoring of tire bead contact status according to claim 6, characterized in that, Also includes: The power supply module is located on the outside of the wheel rim and connects to the sensor module and the transmission module. The charging port is located on the wheel rim and connects to the power supply module.

8. The device for real-time monitoring of tire bead contact status according to claim 7, characterized in that, The power supply module includes: a housing, which is fixedly connected to the wheel rim; The capacitor, located inside the housing, is connected to the sensor module, the transmission module, and the charging port. A piezoelectric device, located inside a housing and connected to a capacitor, is used to convert the vibration, deformation, and centrifugal force of a wheel into electrical energy.

9. The device for real-time monitoring of tire bead contact status according to claim 8, characterized in that, An opening is provided on the side of the housing away from the rim; the power supply module also includes a locking structure that engages with the inner wall of the opening.

10. The device for real-time monitoring of tire bead contact status according to claim 8, characterized in that, The power supply module also includes a flexible circuit board, which has a voltage regulator circuit and an overvoltage protection circuit; the piezoelectric device is connected to the capacitor through the flexible circuit board.

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