Semiconductor refrigeration device

Abstract

The application provides a semiconductor refrigeration device, which comprises a cold-guiding fin, a semiconductor refrigeration sheet and a radiator are sequentially attached to the outside of the cold-guiding fin; the radiator comprises a main body and a heat-dissipating flat pipe arranged in a snake shape; the main body is provided with a hollow inner cavity for storing a heat-conducting medium; the upper end of the hollow inner cavity is provided with a first circulating interface, and the lower end of the hollow inner cavity is provided with a second circulating interface; the height of the first circulating interface is higher than that of the second circulating interface; the heat-dissipating flat pipe is connected to the first circulating interface and the second circulating interface, so that the heat-dissipating flat pipe and the hollow inner cavity form a closed loop; the surface of the heat-dissipating flat pipe is provided with heat-dissipating fins; and the heat-dissipating flat pipe is flat and internally provided with capillary ports at intervals. The semiconductor refrigeration device can be applied to the fields of water-cooled blankets, water-cooled air conditioners, air coolers and the like; the radiator can quickly circulate heat exchange to take away heat, so that the refrigeration effect of the semiconductor refrigeration sheet is not affected by the heat dissipation efficiency.

Description

Technical Field

[0001] This application relates to the field of semiconductor refrigeration technology, and specifically to a semiconductor refrigeration device. Background Technology

[0002] The working principle of a thermoelectric cooler is mainly based on the thermoelectric effect. Heat is transferred through the semiconductor material via an electric current, achieving cooling from one end to the other. The advantages of a thermoelectric cooler are its small size, thinness, light weight, and space-saving design. The heating end of the thermoelectric cooler needs to dissipate heat promptly through a heat sink; inadequate heat dissipation will significantly reduce the cooling effect. Therefore, its heat dissipation efficiency directly affects the cooling performance of the thermoelectric cooler.

[0003] Taking Chinese invention patent application number 202410470123.5 as an example, it discloses a miniature cooling device, including a box for holding liquid, a water-cooled plate, and a heat dissipation assembly on the top surface of the water-cooled plate; the box has a liquid storage tank in the center to accommodate the water-cooled plate; the bottom surface of the water-cooled plate is surrounded by a flow guide baffle assembly to form a liquid flow channel through which the liquid can flow, and the top surface of the water-cooled plate has a first groove for placing a semiconductor cooling chip. This invention patent uses a heat dissipation fin design on the top surface of the water-cooled plate for cooling; however, during prolonged use, if the heat dissipation fin itself does not dissipate heat in time, its heat dissipation efficiency will affect the cooling effect of the water-cooled plate. Summary of the Invention

[0004] (a) Technical problems to be solved

[0005] In view of this, this application provides a semiconductor cooling device with a heat sink that has high circulating heat dissipation efficiency, thereby minimizing the impact of heat dissipation efficiency issues on the cooling effect of the semiconductor cooling chip.

[0006] (II) Technical Solution

[0007] The embodiments in this specification provide the following technical solutions:

[0008] This specification provides a semiconductor cooling device, including cooling fins. A semiconductor cooling chip and a heat sink are sequentially attached to the outer side of the cooling fins. The heat sink includes a main body and a serpentine reciprocating heat dissipation flat tube. The main body has a hollow inner cavity for storing a heat-conducting medium. A first circulation interface is provided at the upper end of the hollow inner cavity, and a second circulation interface is provided at the lower end. The height of the first circulation interface is higher than that of the second circulation interface. One end of the heat dissipation flat tube is sealed to the first circulation interface, and the other end is sealed to the second circulation interface, so that the heat dissipation flat tube and the hollow inner cavity form a closed loop. Heat dissipation fins are arranged on the surface of the heat dissipation flat tube. The heat dissipation flat tube is flat and has capillary openings arranged at intervals inside.

[0009] In this design, a semiconductor refrigeration chip is used for cooling. Its cooling end is connected to cooling fins, and its heating end is connected to a heat sink for heat dissipation. The heat dissipation flat tube is flat to increase the surface area and improve heat dissipation efficiency. The heat sink body contains a heat-conducting medium. Utilizing the phase change principle of the heat-conducting medium (usually a liquid), the heat transferred from the heating end of the semiconductor refrigeration chip causes the heat-conducting medium to rapidly absorb heat and vaporize. This vapor then enters the flat heat dissipation flat tube through the first circulation port, and exchanges heat with the outside through the heat dissipation fins arranged on its surface. The heat-conducting medium re-condenses into a liquid and flows back to the hollow inner cavity of the main body through the second circulation port. The height of the first circulation port is higher than the second circulation port, ensuring that the vaporized heat-conducting medium can only enter the heat dissipation flat tube through the first circulation port, re-condense, and then flow back through the second circulation port, thus forming a circulating heat dissipation system. The purpose is to quickly remove the heat absorbed by the heat sink, transferring the heat away and preventing the cooling effect of the semiconductor refrigeration chip from being affected by heat dissipation efficiency issues. The cooling fins can be connected to a water tank to cool the water inside, and can be used in products such as water-cooled blankets and portable water-cooled air conditioners; the cooling fins can be directly connected to a fan to be used as a cooling fan.

[0010] In some embodiments, a base is provided at the lower end of the main body, the bottom of the base is attached to the semiconductor cooling chip, and the cooling fins are fixed on the base.

[0011] In this design, the base is used to install the cooling fins and attach the thermoelectric cooler; the upper surface of the cooling fins is a flat surface for contacting the thermoelectric cooler, and the lower surface is provided with spaced fins.

[0012] In some embodiments, a cooling fan is provided on the outside of the heat dissipation flat tube, and the cooling fan is used to quickly transfer the heat from the heat dissipation fins to the external environment; and / or, a heat insulation pad is provided around the semiconductor cooling chip, and the heat insulation pad is located between the base and the heat-conducting fins.

[0013] In some embodiments, one end of the heat dissipation flat tube forms an access end connected to the first circulation interface, and the other end forms a return end connected to the second circulation interface. The return end is connected to the second circulation interface through a connecting post, so that the height of the second circulation interface is lower than that of the first circulation interface.

[0014] In this design, both the inlet and outlet are flat and have capillary openings for the passage of the heat transfer medium. The inlet can be directly mounted on the main body. The connecting column is used to collect the condensed heat transfer medium from the outlet to the second circulation port, which then flows back into the hollow inner cavity to form a circulation. By setting the connecting column, the height of the second circulation port is ensured to be lower than that of the first circulation port.

[0015] In some embodiments, the main body is cylindrical; the heat dissipation fins are concentrated in the serpentine reciprocating arrangement area of ​​the heat dissipation flat tube.

[0016] In some embodiments, the system further includes a cooling water tank, and the cooling fins are installed inside the cooling water tank; the cooling water tank includes an inlet pipe and an outlet pipe, and the inlet pipe and the outlet pipe are staggered.

[0017] In this design, the combination of a semiconductor cooling chip and cooling fins can cool the water in the cooling water tank. Therefore, this semiconductor cooling device can be applied to household products such as water-cooled blankets and portable water-cooled air conditioners. Horizontally, the inlet and outlet pipes are staggered, which, compared to a coaxial arrangement, helps prevent water entering the cooling water pipes from flowing out of the outlet pipes too quickly, thus avoiding any impact on the cooling effect.

[0018] In some embodiments, the cooling water tank is provided with a flared opening at the inlet pipe and the outlet pipe; and / or, the height of the inlet pipe is lower than that of the outlet pipe.

[0019] In this design, a flared opening is incorporated to prevent obstruction by the cooling fins, thus ensuring smooth water flow in both the inlet and outlet pipes. The inlet pipe is positioned lower than the outlet pipe to prevent overflow and leakage.

[0020] In some embodiments, the cooling fins are inserted into the cooling water tank from top to bottom, and a sealing ring is installed between the cooling water tank and the cooling fins. This sealing ring is positioned at the upper end of the cooling water tank.

[0021] In some embodiments, the cooling water tank is fixedly connected to the cooling fins by bolts, so that the cooling water tank, cooling fins, semiconductor cooling chip and heat sink form an integral unit; or, the cooling water tank is fixedly connected to the base by bolts.

[0022] In this design, the cooling fins are fixed to the base of the radiator. Therefore, the cooling water tank, cooling fins, semiconductor cooling chip and radiator can be connected as a whole by fixing the cooling water tank to the cooling fins or by fixing the cooling water tank to the base.

[0023] In some embodiments, a fan is directly mounted at the bottom of the cooling fins, which can be used directly as a cooling fan.

[0024] (III) Beneficial Effects

[0025] Compared with the prior art, the beneficial effects that at least one technical solution adopted in the embodiments of this specification can achieve include at least:

[0026] This utility model's heat sink can quickly remove heat from the heating end of a semiconductor cooling chip. The heat dissipation flat tubes are flat and arranged in a serpentine reciprocating pattern, which helps to increase the surface area and improve heat dissipation efficiency. Heat dissipation fins are also arranged along the serpentine reciprocating heat dissipation flat tubes, further expanding the heat dissipation surface area. Utilizing the phase change principle of the heat-conducting medium inside the heat sink, the heat-conducting medium, after absorbing heat and vaporizing, enters the inlet end of the heat dissipation flat tube from the first circulation interface. It then exchanges heat with the external environment through the heat dissipation fins arranged in the serpentine reciprocating area. Combined with the cooling fan, the heat is quickly and effectively removed. This cycle dissipates heat from the hot end of the semiconductor cooling chip and circulates the heat away, minimizing the impact of heat dissipation efficiency on the cooling effect of the semiconductor cooling chip.

[0027] The cooling fins of this invention can be directly connected to a cooling water tank to cool the liquid (mainly water) inside, making it applicable to household products such as water-cooled blankets and portable water-cooled air conditioners; the cooling fins can also be directly connected to a fan to form a cooling fan. Attached Figure Description

[0028] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 This is a perspective view in this application;

[0030] Figure 2 This is a top view of this application;

[0031] Figure 3 It is in this application Figure 2 AA section view;

[0032] Figure 4 It is in this application Figure 3 BB flowchart;

[0033] Figure 5 This is a schematic diagram of the heat sink in this application;

[0034] Figure 6 This is a perspective view of the semiconductor cooling chip and the heat insulation pad in this application;

[0035] Figure 7 This is a perspective view of the cooling fins in this application;

[0036] Figure 8 This is a perspective view of the cooling water tank in this application;

[0037] Figure 9 This is a cross-sectional view of the cooling water tank in this application;

[0038] Figure 10 This is a perspective view of the heat dissipation fins of one embodiment of this application;

[0039] Figure 11 This is a schematic diagram of another layout of the heat sink in this application;

[0040] In the diagram: 1 is the cooling water tank, 2 is the cooling fin, 3 is the semiconductor cooling chip, 4 is the heat sink, 5 is the heat insulation pad, 101 is the water inlet pipe, 102 is the water outlet pipe, 103 is the flared end, 401 is the main body, 402 is the heat dissipation flat tube, 403 is the hollow inner cavity, 404 is the first circulation interface, 405 is the second circulation interface, 406 is the heat dissipation fin, 407 is the capillary tube opening, 408 is the base, 409 is the inlet end, 410 is the return end, and 411 is the connecting post. Detailed Implementation

[0041] The embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0042] The following specific examples illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. This application can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this application. It should be noted that, in the absence of conflict, the following embodiments and features in the embodiments can be combined with each other. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0043] It should be noted that various aspects of embodiments within the scope of the appended claims are described below. It will be apparent that the aspects described herein can be embodied in a wide variety of forms, and any particular structure and / or function described herein is merely illustrative. Based on this application, those skilled in the art will understand that one aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number and aspects set forth herein can be used to implement the device and / or practice the method. Additionally, this device and / or method can be implemented using structures and / or functionalities other than one or more of the aspects set forth herein.

[0044] It should also be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of this application. The illustrations only show the components related to this application and are not drawn according to the number, shape and size of the components in actual implementation. In actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0045] Additionally, specific details are provided in the following description to facilitate a thorough understanding of the examples. However, those skilled in the art will understand that practice can be carried out without these specific details.

[0046] Combination Figures 1-11 As shown, this application provides a semiconductor cooling device, including a cooling fin 2. A semiconductor cooling chip 3 and a heat sink 4 are sequentially attached to the outer side of the cooling fin 2. The heat sink 4 includes a main body 401 and a heat dissipation flat tube 402 arranged in a serpentine pattern. Heat dissipation fins 406 are arranged on the surface of the heat dissipation flat tube 402. The heat dissipation flat tube 402 is flat and has capillary openings 407 arranged at intervals inside. The cooling end of the semiconductor cooling chip 3 is connected to the cooling fin 2, and the heating end of the semiconductor cooling chip 3 is connected to the heat sink 4 for heat dissipation.

[0047] like Figure 1 and Figure 4 As shown, the heat dissipation flat tube 402 is flat to increase the surface area, and the capillary openings 407 are arranged at equal intervals inside the heat dissipation flat tube 402.

[0048] The main body 401 has a hollow inner cavity 403 for storing the heat transfer medium. A first circulation port 404 is located at the upper end of the hollow inner cavity 403, and a second circulation port 405 is located at the lower end. The height of the first circulation port 404 is higher than that of the second circulation port 405. One end of the heat dissipation flat tube 402 is sealed to the first circulation port 404, and the other end is sealed to the second circulation port 405, forming a closed loop between the heat dissipation flat tube 402 and the hollow inner cavity 403. The height of the first circulation port 404 is higher than that of the second circulation port 405 to ensure that the vaporized heat transfer medium can only enter the heat dissipation flat tube 402 through the first circulation port 404, re-condense, and then flow back through the second circulation port 405, thus forming a circulating heat dissipation. The purpose is to quickly remove the heat from the radiator 4 after heat absorption, transferring the heat away and reducing the impact of heat dissipation efficiency on the cooling effect of the semiconductor cooling chip 3.

[0049] The heat sink 4 utilizes the phase change principle of the heat-conducting medium (usually a liquid). The heat transferred from the heating end of the semiconductor cooling chip 3 causes the heat-conducting medium to quickly absorb heat and vaporize. After turning into steam, it enters the flat heat dissipation tube 402 through the first circulation interface 404, and then exchanges heat with the outside through the heat dissipation fins 406 arranged on the surface. The heat-conducting medium re-condenses into liquid and flows back to the hollow inner cavity 403 of the main body 401 through the second circulation interface 405.

[0050] In one example, a cooling fan is provided on the outside of the heat dissipation flat tube 402. The cooling fan is used to quickly transfer the heat from the heat dissipation fins 406 to the external environment for heat exchange. Figure 4 As shown, the cooling fan (not shown in the figure) can be placed above the heat dissipation flat tube 402.

[0051] It should be noted that the shape of the heat sink fins 406 is not limited; the purpose is simply to increase the surface area for rapid heat dissipation. In one example, such as... Figure 1 and Figure 2 As shown, the heat dissipation fins 406 have an X-shaped cross-section and are concentrated in the serpentine arrangement of the heat dissipation flat tubes 402.

[0052] In another example, such as Figure 11 or Figure 10 As shown, the heat dissipation fins 406 have a strip-shaped cross section and are arranged in a serpentine pattern on the heat dissipation flat tubes 402.

[0053] It should be noted that there are no restrictions on the orientation of the serpentine arrangement of the 402 heat dissipation flat tubes; it can be set according to actual needs or the limitations of the actual installation space. For example... Figure 1 and Figure 4 As shown, its heat dissipation flat tube 402 can be located at the side end of the main body 401 and is perpendicular to the main body 401.

[0054] In another example, such as Figure 11 As shown, its heat dissipation flat tube 402 is located above the main body 401.

[0055] In some embodiments, such as Figure 2 and Figure 5 As shown, one end of the heat dissipation flat tube 402 forms an inlet end 409 connecting to the first circulation interface 404, and the other end forms a return end 410 connecting to the second circulation interface 405. Both the inlet end 409 and the return end 410 are flat and have capillary openings 407 inside for the passage of heat-conducting medium; Figure 1 and Figure 3As shown, the access terminal 409 can be directly installed on the main body 401, while the return terminal 410 is connected to the second circulation interface 405 through a connecting post 411, so that the height of the second circulation interface 405 is lower than that of the first circulation interface 404.

[0056] In some embodiments, such as Figures 1-5 As shown, a base 408 is provided at the lower end of the main body 401, the bottom of the base 408 is attached to the semiconductor cooling chip 3, and the cooling fins 2 are fixed on the base 408.

[0057] like Figure 7 As shown, the upper surface of the cooling fin 2 is a flat surface for contacting the semiconductor cooling chip 3, and the lower surface is provided with fins arranged at intervals.

[0058] In one example, such as Figure 3 , Figure 4 and Figure 6 As shown, a heat insulation pad 5 is provided around the semiconductor cooling chip 3, and the heat insulation pad 5 is located between the base 408 and the cooling fins 2.

[0059] In some embodiments, such as Figure 5 As shown, the main body 401 is cylindrical, specifically a cylindrical shape; the heat dissipation fins 406 are concentrated in the serpentine reciprocating arrangement area of ​​the heat dissipation flat tube 402.

[0060] In one embodiment, such as Figures 1-5 As shown, the semiconductor refrigeration device also includes a cooling water tank 1. Cooling fins 2 are installed inside the cooling water tank 1. The semiconductor refrigeration chip 3 can cool the water in the cooling water tank 1 through the cooling fins 2. Therefore, this semiconductor refrigeration device can be applied to household products such as water-cooled blankets and portable water-cooled air conditioners. The cooling water tank 1 includes an inlet pipe 101 and an outlet pipe 102, which are staggered.

[0061] When applied to a water-cooled blanket, the inlet pipe 101 and outlet pipe 102 are connected to the water pipes of the blanket body to form a water circulation to cool the blanket body.

[0062] like Figure 3 , Figure 4 and Figure 8 As shown, the cooling fins 2 are inserted into the cooling water tank 1 from top to bottom, and a sealing ring is installed between the cooling water tank 1 and the cooling fins 2. The sealing ring is placed at the upper end of the cooling water tank 1, and the upper end of the cooling water tank 1 is provided with an installation cavity for installing the sealing ring.

[0063] In some embodiments, such as Figure 8 and Figure 9As shown, the cooling water tank 1 has a flared opening 103 at the inlet pipe 101 and the outlet pipe 102. By setting the flared opening 103, it will not be blocked by the cooling fins 2, and therefore will not affect the water inlet of the inlet pipe 101 and the water outlet of the outlet pipe 102.

[0064] In some embodiments, the height of the inlet pipe 101 is lower than that of the outlet pipe 102, mainly to prevent water overflow and leakage.

[0065] In one example, such as Figure 3 and Figure 4 As shown, the cooling fins 2 are fixed to the cooling water tank 1 by bolts, so that the cooling water tank 1, the cooling fins 2, the semiconductor cooling chip 3 and the heat sink 4 form a whole.

[0066] It should be noted that in other examples, the base 408 is fixed to the cooling water tank 1 by bolts. The cooling water tank 1, the cooling fins 2, the semiconductor cooling chip 3 and the heat sink 4 are connected as a whole through the fixed connection between the cooling water tank 1 and the base 408.

[0067] In another embodiment, a fan is directly mounted on the bottom of the cooling fin 2, which can be used directly as a cooling fan.

[0068] In this specification, the same or similar parts between the various embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, the descriptions of the embodiments described later are relatively simple, and relevant parts can be referred to the descriptions of the foregoing embodiments.

[0069] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A semiconductor cooling device, comprising cooling fins (2), wherein a semiconductor cooling chip (3) and a heat sink (4) are sequentially attached to the outer side of the cooling fins (2); characterized in that, The radiator (4) includes a main body (401) and a heat dissipation flat tube (402) arranged in a serpentine pattern. The main body (401) has a hollow inner cavity (403) for storing heat-conducting medium. The upper end of the hollow inner cavity (403) is provided with a first circulation interface (404), and the lower end is provided with a second circulation interface (405). The height of the first circulation interface (404) is higher than that of the second circulation interface (405). One end of the heat dissipation flat tube (402) is sealed to the first circulation interface (404), and the other end is sealed to the second circulation interface (405), so that the heat dissipation flat tube (402) and the hollow inner cavity (403) form a closed loop. Heat dissipation fins (406) are arranged on the surface of the heat dissipation flat tube (402). The heat dissipation flat tube (402) is flat and has capillary openings (407) arranged at intervals inside.

2. The semiconductor cooling device according to claim 1, characterized in that, The lower end of the main body (401) is provided with a base (408), the bottom of the base (408) is attached to the semiconductor cooling chip (3), and the cooling fins (2) are fixed on the base (408).

3. The semiconductor cooling device according to claim 2, characterized in that, A cooling fan is provided on the outside of the heat dissipation flat tube (402); and / or, A heat insulation pad (5) is provided around the semiconductor cooling chip (3), and the heat insulation pad (5) is located between the base (408) and the cooling fins (2).

4. The semiconductor cooling device according to claim 1, characterized in that, One end of the heat dissipation flat tube (402) forms an access end (409) connected to the first circulation interface (404), and the other end forms a return end (410) connected to the second circulation interface (405). The return end (410) is connected to the second circulation interface (405) through a connecting post (411), so that the height of the second circulation interface (405) is lower than that of the first circulation interface (404).

5. The semiconductor cooling device according to claim 1, characterized in that, The main body (401) is cylindrical; the heat dissipation fins (406) are concentrated in the serpentine reciprocating arrangement area of ​​the heat dissipation flat tube (402).

6. The semiconductor cooling device according to claim 2 or 3, characterized in that, It also includes a cooling water tank (1), and the cooling fins (2) are installed inside the cooling water tank (1); the cooling water tank (1) includes an inlet pipe (101) and an outlet pipe (102), and the inlet pipe (101) and the outlet pipe (102) are staggered.

7. The semiconductor cooling device according to claim 6, characterized in that, The cooling water tank (1) is provided with a flared mouth (103) at the water inlet pipe (101) and the water outlet pipe (102); and / or, the height of the water inlet pipe (101) is lower than that of the water outlet pipe (102).

8. The semiconductor cooling device according to claim 6, characterized in that, The cooling fins (2) are inserted into the cooling water tank (1) from top to bottom, and a sealing ring is installed between the cooling water tank (1) and the cooling fins (2).

9. The semiconductor cooling device according to claim 6, characterized in that, The cooling water tank (1) is fixedly connected to the cooling fins (2) by bolts, so that the cooling water tank (1), the cooling fins (2), the semiconductor cooling chip (3) and the radiator (4) form a whole; Alternatively, the cooling water tank (1) is fixedly connected to the base (408) by bolts.

10. The semiconductor cooling device according to any one of claims 1-5, characterized in that, A fan is directly mounted on the bottom of the cooling fins (2).

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