A heat dissipation cabinet for wafer testing device

Abstract

The utility model provides a heat dissipation cabinet for wafer testing arrangement relates to wafer testing technical field, the utility model discloses a wafer testing arrangement can enter to the inside of cabinet along with slide rail, and every heat dissipation mechanism sets up at a support plate of cabinet, and every heat dissipation mechanism includes at least one drive part and heat dissipation fin, and every drive part is installed on the support plate, and is connected with heat dissipation fin. Every drive part sets up and is controlledly driven heat dissipation fin to move to the direction of approaching wafer testing arrangement when wafer testing arrangement is located the opposite position of corresponding heat dissipation mechanism, to contact with wafer testing arrangement, to wafer testing arrangement is carried out heat dissipation. The above technical scheme will heat dissipation fin design into can move, to can be in full contact with wafer testing arrangement, to improve the heat dissipation effect.

Description

Technical Field

[0001] This utility model relates to the field of wafer testing technology, and in particular to a heat sink cabinet for wafer testing equipment. Background Technology

[0002] Wafer testing equipment is a common tool in wafer aging testing, with the wafer housed inside. During aging testing, the wafer inside the testing equipment is heated, and the testing equipment itself is heated simultaneously. After the wafer completes the high-temperature aging test, the testing equipment needs to be cooled. Typically, this is done in a heat sink, but current heat sinks are not very effective at dissipating heat from the wafer testing equipment. Therefore, there is an urgent need to design a heat sink that can improve heat dissipation. Utility Model Content

[0003] One objective of this invention is to provide a heat dissipation cabinet for wafer testing equipment, thereby solving the technical problem of poor heat dissipation performance in existing heat dissipation cabinets.

[0004] A further objective of this invention is to prevent oxidation of the wafer during the cooling process.

[0005] Specifically, this utility model provides a heat dissipation cabinet for a wafer testing apparatus, comprising:

[0006] The cabinet has at least one support plate and at least one pair of slide rails arranged vertically at intervals inside. Each pair of slide rails is located on two opposite side walls inside the cabinet and is arranged in correspondence with one of the support plates. The wafer testing device is configured to slide in a controlled manner along the slide rails to enter the cabinet. The wafer testing device contains the wafer to be tested.

[0007] At least one heat dissipation mechanism, each of the heat dissipation mechanisms including at least one drive element and heat dissipation fins, each of the drive elements being mounted on the support plate and connected to the heat dissipation fins;

[0008] When the wafer testing device is positioned relative to the corresponding heat dissipation mechanism, each of the driving components can controllably drive the heat dissipation fins to move toward the wafer testing device, so that the heat dissipation fins contact the wafer testing device, thereby dissipating heat from the wafer testing device.

[0009] Optionally, each of the heat dissipation mechanisms further includes:

[0010] Multiple guide posts are installed on the corresponding support plates and are guided to the heat dissipation fins. Each guide post is configured to guide the heat dissipation fins during the lifting and lowering process of the heat dissipation fins.

[0011] Optionally, the wafer testing device is provided with at least one first vent hole, and each of the heat dissipation mechanisms further includes:

[0012] At least one sealing component is mounted on the heat sink fins and has a plug, at least a portion of which protrudes from the surface of the heat sink fins. When the heat sink fins come into contact with the wafer testing apparatus, the plug is configured to block the corresponding first vent hole.

[0013] Optionally, each of the plugging components further includes:

[0014] The first base is connected to the heat dissipation fins and has a first receiving cavity along the vertical direction;

[0015] The first elastic element is vertically disposed within the first receiving cavity;

[0016] The plug is located within the first receiving cavity, with one end abutting or connecting to the first elastic element and the other end protruding from the surface of the heat dissipation fins.

[0017] Optionally, the wafer testing device is further provided with a plurality of second vent holes, and each of the heat dissipation mechanisms further includes:

[0018] Multiple ventilation components are mounted on the heat sink fins. When the heat sink fins are in contact with the wafer testing device, each ventilation component is configured to communicate with the corresponding second ventilation hole.

[0019] At least one of the plurality of ventilation components is configured to fill the wafer testing apparatus with protective gas, and at least one of the ventilation components is configured to exhaust the gas in the wafer testing apparatus.

[0020] Optionally, each of the ventilation components further includes:

[0021] The second base is connected to the heat dissipation fins and has a vertical second receiving cavity;

[0022] The second elastic element is vertically disposed within the second receiving cavity;

[0023] A venting rod is snapped or connected to one end of the second elastic element. The venting rod has an internal venting channel that is connected to an external air supply device. When the heat sink fins contact the wafer testing device, the venting rod is configured to abut against the second venting hole, thereby connecting the venting channel with the corresponding second venting hole.

[0024] Optionally, a heating component and at least one temperature sensor are provided inside each of the wafer testing devices, and pins electrically connected to each of the temperature sensors are provided outside each of the wafer testing devices; each of the heat dissipation mechanisms further includes:

[0025] A temperature measuring component, including an adapter board and at least one adapter probe. The adapter board is mounted on the heat dissipation fins and connected to an external circuit. Each of the adapter probes is mounted on the adapter board and configured to contact the corresponding pin when the heat dissipation fins contact the wafer testing device, so as to obtain the signal of the temperature sensor.

[0026] Optionally, each of the heat dissipation mechanisms further includes:

[0027] At least one reinforcing strip, extending along the extension direction of the heat dissipation fins and mounted on the side of the heat dissipation fins. Each of the reinforcing strips has at least one ventilation hole.

[0028] Optionally, each of the slide rails includes:

[0029] Three guide rails, all extending along the depth direction of the cabinet. The three guide rails are in a "C" shape. Each of the guide rails has a plurality of rolling elements arranged at intervals along the depth direction of the cabinet. The rolling elements of the three guide rails respectively contact three surfaces of the wafer testing device.

[0030] Optionally, it further includes:

[0031] At least one set of reinforcing components. Each set of reinforcing components corresponds to a pair of the slide rails and includes at least one reinforcing plate. Each of the reinforcing plates extends along the width direction of the cabinet and is respectively connected to a pair of the slide rails at both ends.

[0032] In the utility model, the wafer testing device can enter the interior of the cabinet along the slide rails. Each heat dissipation mechanism includes at least one driving member and heat dissipation fins. Each driving member is mounted on a support plate and connected to the heat dissipation fins. When the wafer testing device is at the relative position corresponding to the heat dissipation mechanism, each driving member can be controlled to drive the heat dissipation fins to move towards the wafer testing device, so that the heat dissipation fins contact the wafer testing device, thereby dissipating heat from the wafer testing device. The above technical solution designs the heat dissipation fins to be movable, so as to fully contact the wafer testing device, improve the heat dissipation effect and the heat dissipation efficiency.

[0033] Furthermore, each heat dissipation mechanism in this invention also includes multiple ventilation components mounted on the heat dissipation fins. Each ventilation component is configured to communicate with the second vent of the wafer testing apparatus when the heat dissipation fins contact the wafer testing apparatus. At least one ventilation component is configured to introduce protective gas into the wafer testing apparatus, and at least one ventilation component is configured to exhaust gas from the wafer testing apparatus. The above technical solution enables the wafer testing apparatus to continue to be filled with protective gas during the cooling process, preventing oxidation of the wafer during cooling.

[0034] The above and other objects, advantages and features of this utility model will become more apparent to those skilled in the art from the following detailed description of specific embodiments of this utility model in conjunction with the accompanying drawings. Attached Figure Description

[0035] The following sections will describe some specific embodiments of the present invention in a detailed manner by way of example and not limitation, with reference to the accompanying drawings. The same reference numerals in the drawings denote the same or similar parts or components. Those skilled in the art should understand that these drawings are not necessarily drawn to scale. In the drawings:

[0036] Figure 1 This is a schematic structural diagram of the heat sink cabinet of a wafer testing device according to an embodiment of the present invention, taken from one angle.

[0037] Figure 2 This is a schematic structural diagram of the heat sink cabinet of a wafer testing device according to one embodiment of the present invention from another angle;

[0038] Figure 3 yes Figure 1 A schematic structural diagram of the slide rails and heat dissipation mechanism in the heat sink at one angle;

[0039] Figure 4 This is a schematic structural diagram of a wafer testing device according to an embodiment of the present invention;

[0040] Figure 5 This is a schematic cross-sectional view of a heat dissipation mechanism according to an embodiment of the present invention;

[0041] Figure 6 yes Figure 1 A schematic structural diagram of the slide rails and heat dissipation mechanism in the heat sink from another angle;

[0042] Figure 7 yes Figure 6 A schematic structural diagram of the temperature measuring component of the heat dissipation mechanism;

[0043] Figure 8 yes Figure 3 A schematic enlarged view of part A in the middle;

[0044] Figure 9 This is a schematic structural diagram of a reinforcing component according to an embodiment of the present invention.

[0045] Figure label:

[0046] 100-Heat dissipation cabinet, 200-Wafer testing device, 210-First vent, 220-Second vent, 230-Pin, 10-Cabinet body, 20-Heat dissipation mechanism, 11-Support plate, 12-Slide rail, 30-Reinforcing component, 40-Heat dissipation fan, 121-First guide rail, 122-Second guide rail, 123-Third guide rail, 124-Rolling element, 125-Magnet, 21-Heat dissipation fins, 22-Driver, 2 3-Mounting plate, 24-Reinforcing strip, 241-Ventilation hole, 25-Temperature measuring component, 26-Sealing component, 27-Ventilation component, 28-Guide post, 29-Signal sensor, 251-Adapter probe, 252-Adapter plate, 261-First base, 262-First elastic element, 263-Plug, 271-Second base, 272-Second elastic element, 273-Ventilation rod, 274-Ventilation channel, 31-Reinforcing plate. Detailed Implementation

[0047] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0048] In the description of this utility model, it should be understood that the terms "upper" and "lower" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0049] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature, that is, include one or more of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified. When a feature "includes or contains" one or more of the features it encompasses, unless otherwise specifically described, this indicates that other features are not excluded and may be further included.

[0050] Unless otherwise expressly specified and limited, the terms "connection," "installation," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art should be able to understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0051] Unless otherwise specified, all terms (including technical and scientific terms) used in the description of this embodiment have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0052] Figure 1 This is a schematic structural diagram of the heat sink 100 of the wafer testing device 200 according to an embodiment of the present invention, taken at one angle. Figure 2 This is a schematic structural diagram of the heat sink 100 of the wafer testing apparatus 200 according to one embodiment of the present invention from another angle. Figure 3 yes Figure 1 The diagram shows a schematic structural representation of the slide rail 12 and the heat dissipation mechanism 20 at one angle in the heat sink 100. Figure 4 This is a schematic structural diagram of a wafer testing device 200 according to an embodiment of the present invention.

[0053] like Figures 1 to 4 As shown, in one specific embodiment, the heat dissipation cabinet 100 of the wafer testing apparatus 200 includes a cabinet body 10 and at least one heat dissipation mechanism 20. The cabinet body 10 has at least one support plate 11 arranged vertically at intervals and at least one pair of slide rails 12. Each pair of slide rails 12 is located on two opposite side walls within the cabinet body 10 and corresponds to one support plate 11. The wafer testing apparatus 200 is configured to slide controlled along the slide rails 12 to enter the cabinet body 10, where the wafer to be tested is placed. Each heat dissipation mechanism 20 is located on a support plate 11 and includes at least one drive element 22 and heat dissipation fins 21. Each drive element 22 is mounted on the support plate 11 and connected to the heat dissipation fins 21. When the wafer testing apparatus 200 is positioned relative to the corresponding heat dissipation mechanism 20, each drive element 22 can controllably drive the heat dissipation fins 21 to move closer to the wafer testing apparatus 200, causing the heat dissipation fins 21 to contact the wafer testing apparatus 200, thereby dissipating heat from the wafer testing apparatus 200. Here, the part of the wafer testing apparatus 200 that contacts the heat dissipation fins 21 is made of aluminum, and the heat dissipation fins 21 are also made of aluminum. When the heat dissipation fins 21 contact the wafer testing apparatus 200, the heat from the wafer testing apparatus 200 is transferred to the heat dissipation fins 21, thereby dissipating heat from the wafer testing apparatus 200.

[0054] In this embodiment, the heat sink fins 21 are designed to be movable, so that they can make full contact with the wafer testing device 200 to improve the heat dissipation effect and efficiency.

[0055] In some embodiments, the front end of the cabinet 10 has an opening, through which the wafer testing device 200 enters the interior of the cabinet 10 along the slide rail 12. The rear end of the cabinet 10 is provided with multiple cooling fans 40, which dissipate heat from the heat sink fins 21 and the wafer testing device 200, thereby improving heat dissipation efficiency. Here, each heat sink fin 21 is provided with two cooling fans 40.

[0056] When the wafer testing device 200 enters the cabinet 10, it is positioned above the corresponding heat sink fins 21. Therefore, the drive unit 22 needs to drive the heat sink fins 21 upward to contact the wafer testing device 200 above. In other embodiments, the wafer testing device 200 can also be placed upside down. In this case, the heat sink fins 21 need to be positioned above the wafer testing device 200, so the drive unit 22 needs to drive the heat sink fins 21 downward to contact the wafer testing device 200 below. Therefore, the relative position of the heat sink fins 21 and the wafer testing device 200 needs to be designed according to the placement of the wafer testing device 200.

[0057] In some embodiments, the cabinet 10 has thirteen support plates 11, each support plate 11 having a heat dissipation fin 21 above it, for a total of thirteen heat dissipation fins 21. Each heat dissipation fin 21 can dissipate heat from one wafer testing device 200, so the heat dissipation cabinet 100 can simultaneously dissipate heat from thirteen wafer testing devices 200, thereby improving heat dissipation efficiency. In other embodiments, the number of support plates 11 and heat dissipation fins 21 of the cabinet 10 can be determined according to design requirements.

[0058] In some embodiments, the number of driving members 22 is two, and the two driving members 22 are respectively disposed on opposite sides of the heat sink fins 21. The two driving members 22 are configured to simultaneously drive the heat sink fins 21 to move. In other embodiments, the number of driving members 22 can be determined according to specific design requirements, for example, it can be set to three, four or five, etc.

[0059] In some embodiments, the heat dissipation fins 21 are provided with at least one clearance hole, each drive member 22 is disposed at one clearance hole, and a mounting plate 23 connected to the heat dissipation fins 21 is disposed above each clearance hole, and the drive member 22 is connected to the mounting plate 23. Here, the drive member 22 is a cylinder, and the piston rod of the cylinder is connected to the mounting plate 23.

[0060] In some embodiments, each heat dissipation mechanism 20 further includes a plurality of guide posts 28, which are mounted on a corresponding support plate 11 and guided to the heat dissipation fins 21. Each guide post 28 is configured to guide the heat dissipation fins 21 during their lifting and lowering process. Here, the heat dissipation fins 21 are square, and there are four guide posts 28, which are respectively located at the four corners of the heat dissipation fins 21, thereby ensuring the stability of the heat dissipation fins 21 during movement. In some embodiments, the guide posts 28 are linear bearings.

[0061] In some embodiments, the wafer testing apparatus 200 is provided with at least one first vent hole 210, and each heat dissipation mechanism 20 further includes at least one sealing component 26. Each sealing component 26 is mounted on a heat dissipation fin 21 and has a plug 263. At least a portion of the plug 263 protrudes from the surface of the heat dissipation fin 21. When the heat dissipation fin 21 contacts the wafer testing apparatus 200, the plug 263 is configured to block the corresponding first vent hole 210. This embodiment is equivalent to sealing the test chamber containing the wafer during the cooling process of the wafer testing apparatus 200, preventing external air from entering the test chamber and causing wafer oxidation. Here, each sealing component 26 is used to block one first vent hole 210. In other embodiments, if two first vent holes 210 are relatively close, then each sealing component 26 can also block two relatively close first vent holes 210 simultaneously, depending on the design requirements.

[0062] Figure 5 This is a schematic cross-sectional view of a heat dissipation mechanism 20 according to an embodiment of the present invention. Figure 5 As shown, and see Figure 3 In some embodiments, each sealing assembly 26 further includes a first base 261 and a first elastic member 262. The first base 261 is connected to the heat dissipation fins 21 and has a first receiving cavity in a vertical direction. The first elastic member 262 is disposed vertically within the first receiving cavity. A portion of the plug 263 is located within the first receiving cavity, with one end abutting or connected to the first elastic member 262 and the other end protruding from the surface of the heat dissipation fins 21. Here, the first elastic member 262 is a spring.

[0063] This embodiment, through the design of the first elastic element 262, can realize the elastic movement of the plug 263, which can avoid the plug 263 from making hard contact with the wafer testing device 200 when the heat sink fins 21 come into contact with the wafer testing device 200, thus avoiding damage to the wafer testing device 200.

[0064] In some embodiments, the wafer testing apparatus 200 is further provided with a plurality of second vent holes 220, and each heat dissipation mechanism 20 further includes a plurality of venting components 27 mounted on heat dissipation fins 21. When the heat dissipation fins 21 contact the wafer testing apparatus 200, each venting component 27 is configured to communicate with the corresponding second vent hole 220. At least one of the plurality of venting components 27 is configured to fill the wafer testing apparatus 200 with a protective gas, and at least one venting component 27 is configured to exhaust the gas inside the wafer testing apparatus 200. Here, the protective gas can be nitrogen. In this embodiment, a protective gas is also introduced into the test chamber of the wafer testing apparatus 200 during the cooling process of the wafer testing apparatus 200, which can prevent wafer oxidation. In some embodiments, the number of second vent holes 220 is two, and the number of venting components 27 is also two, one of which is used to introduce protective gas into the test chamber of the wafer testing apparatus 200, and the other is used to exhaust the gas inside the test chamber.

[0065] In some embodiments, each venting assembly 27 further includes a second base 271, a second elastic member 272, and a venting rod 273. The second base 271 is connected to the heat sink fins 21 and has a vertical second receiving cavity. The second elastic member 272 is vertically disposed within the second receiving cavity. The venting rod 273 is engaged or connected to one end of the second elastic member 272. The venting rod 273 has a venting channel 274 inside, and a nozzle connector is provided at the venting channel 274, which communicates with an external air supply device. When the heat sink fins 21 contact the wafer testing device 200, the venting rod 273 is configured to abut against the second vent hole 220, thereby communicating the venting channel 274 with the corresponding second vent hole 220. Here, the second elastic member 272 is a spring.

[0066] This embodiment, through the design of the second elastic element 272, can realize the elastic movement of the venting rod 273, which can avoid the venting rod 273 making hard contact with the wafer testing device 200 when the heat sink fins 21 come into contact with the wafer testing device 200, thus avoiding damage to the wafer testing device 200.

[0067] Figure 6 yes Figure 1 The schematic structural diagram of the slide rail 12 and the heat dissipation mechanism 20 in the heat sink 100 is shown from another angle. Figure 7 yes Figure 6 A schematic structural diagram of the temperature sensing component 25 of the heat dissipation mechanism 20. (See attached diagram.) Figure 6 and Figure 7As shown, in some embodiments, each wafer testing device 200 has a heating component and at least one temperature sensor inside, and each wafer testing device 200 has pins 230 electrically connected to each temperature sensor on its outer side; each heat dissipation mechanism 20 also includes a temperature measuring component 25, which includes an adapter plate 252 and at least one adapter probe 251. The adapter plate 252 is mounted on the heat dissipation fins 21 and connected to an external circuit. Each adapter probe 251 is mounted on the adapter plate 252 and is configured to contact the corresponding pin 230 when the heat dissipation fins 21 contact the wafer testing device 200, thereby acquiring the signal from the temperature sensor. Here, the adapter plate 252 is connected to the external circuit via a connector. When installing the temperature measuring component 25 onto the heat dissipation fins 21, the temperature measuring component 25 and the heat dissipation fins 21 are first positioned and then locked.

[0068] This embodiment can acquire the temperature inside the test chamber of the wafer testing device 200 in real time by setting the temperature measuring component 25.

[0069] In some embodiments, each wafer testing apparatus 200 is equipped with two temperature sensors and four adapter probes 251. The four adapter probes 251 are paired up and connected to the two temperature sensors respectively, thereby acquiring the signals from the two temperature sensors. Here, using two temperature sensors has two advantages: firstly, the average value can be calculated based on the two temperature sensors, allowing for a more accurate acquisition of the actual temperature inside the wafer testing apparatus 200; secondly, if one temperature sensor fails, the temperature inside the test chamber of the wafer testing apparatus 200 can be obtained through the other temperature sensor.

[0070] See Figure 3 In some embodiments, each heat dissipation mechanism 20 further includes at least one reinforcing strip 24 extending along the extension direction of the heat dissipation fin 21 and installed on the side of the heat dissipation fin 21. Each reinforcing strip 24 has at least one ventilation hole 241. Here, there are two reinforcing strips 24, arranged on opposite sides of the heat dissipation fin 21. Since the heat dissipation fin 21 has multiple holes, it is necessary to add reinforcing strips 24 to increase the strength of the heat dissipation fin 21. In addition, this embodiment provides ventilation holes 241 on the reinforcing strips 24, which can increase the strength of the heat dissipation fin 21 while avoiding affecting the heat dissipation effect of the heat dissipation fin 21.

[0071] In some embodiments, there are multiple ventilation holes 241, which are spaced apart along the extension direction of the reinforcing strip 24.

[0072] Figure 8 yes Figure 3 A schematic enlarged view of part A, as shown below. Figure 8 As shown, and see Figure 3, each slide rail 12 includes three guide rails. The three guide rails all extend along the depth direction of the cabinet body 10. The three guide rails are in a "C" shape. Each guide rail has a plurality of rolling elements 124 arranged at intervals along the depth direction of the cabinet body 10. The rolling elements 124 of the three guide rails respectively contact three faces of the wafer testing device 200. Here, the rolling element 124 is a bearing.

[0073] Specifically, the three guide rails are respectively a first guide rail 121, a second guide rail 122 and a third guide rail 123. The first guide rail 121 and the second guide rail 122 are arranged oppositely, and the second guide rail 122 is located above the first guide rail 121. The third guide rail 123 is arranged between the first guide rail 121 and the second guide rail 122. When the wafer testing device 200 slides along the slide rail 12, the upper surface of the wafer testing device 200 rolls along the rolling elements 124 of the second guide rail 122, the lower surface of the wafer testing device 200 rolls along the rolling elements 124 of the first guide rail 121, and the outer side surface of the wafer testing device 200 rolls along the rolling elements 124 of the third guide rail 123. Since the wafer testing device 200 enters the cabinet body 10 by means of automatic handling, setting three guide rails can reduce the friction between the wafer testing device 200 and the slide rail 12 and avoid wear during long-term use.

[0074] Figure 9 It is a schematic structural diagram of the strengthening component 30 according to an embodiment of the present invention. As Figure 9 shown, in one embodiment, the heat dissipation cabinet 100 further includes at least one group of strengthening components 30. Each group of strengthening components 30 corresponds to a pair of slide rails 12 and includes at least one strengthening plate 31. Each strengthening plate 31 extends along the width direction of the cabinet body 10 and is respectively connected to a pair of slide rails 12 at both ends.

[0075] In some embodiments, each group of strengthening components 30 includes two strengthening plates 31. The two strengthening plates 31 are arranged at intervals along the depth direction of the cabinet body 10. In other embodiments, the number of the strengthening plates 31 can also be determined according to specific design requirements. By setting the strengthening plate 31 in this embodiment, the strengthening effect on the slide rail 12 can be achieved, preventing the slide rail 12 from deforming and preventing situations such as the wafer testing device 200 being unable to enter the cabinet body 10 along the guide rail or tilting.

[0076] See Figure 3 , in some embodiments, a magnet 125 is provided on one side of each slide rail 12 close to the back of the cabinet body 10. An iron sheet is provided at the end of the wafer testing device 200. When the wafer testing device 200 moves along the slide rail 12 into the cabinet body 10, the magnet 125 adsorbs the iron sheet at the end of the wafer testing device 200, thereby fixing the wafer testing device 200.

[0077] See Figure 7In some embodiments, each heat dissipation mechanism 20 further includes at least one signal sensor 29, which is mounted on the corresponding support plate 11 and located below the corresponding heat dissipation fin 21. When the signal sensor 29 senses the heat dissipation fin 21, it indicates that the heat dissipation fin 21 is in its original state and has not been lifted upwards. When the signal sensor 29 does not sense the heat dissipation fin 21, it indicates that the heat dissipation fin 21 has been lifted upwards and is in contact with the wafer testing device 200. This embodiment, by setting the signal sensor 29, can determine whether the heat dissipation fin 21 has been lifted into position and is in full contact with the wafer testing device 200.

[0078] Therefore, those skilled in the art should recognize that although many exemplary embodiments of the present invention have been shown and described in detail herein, many other variations or modifications conforming to the principles of the present invention can be directly determined or derived from the disclosure of the present invention without departing from the spirit and scope of the present invention. Therefore, the scope of the present invention should be understood and recognized as covering all such other variations or modifications.

Claims

1. A heat dissipation cabinet for a wafer testing apparatus, characterized in that, include: The cabinet has at least one support plate and at least one pair of slide rails arranged vertically at intervals inside. Each pair of slide rails is located on two opposite side walls inside the cabinet and is arranged in correspondence with one of the support plates. The wafer testing device is configured to slide in a controlled manner along the slide rails to enter the cabinet. The wafer testing device contains the wafer to be tested. At least one heat dissipation mechanism, each of the heat dissipation mechanisms including at least one drive element and heat dissipation fins, each of the drive elements being mounted on the support plate and connected to the heat dissipation fins; When the wafer testing device is positioned relative to the corresponding heat dissipation mechanism, each of the driving components can controllably drive the heat dissipation fins to move toward the wafer testing device, so that the heat dissipation fins contact the wafer testing device, thereby dissipating heat from the wafer testing device.

2. The heat dissipation cabinet according to claim 1, characterized in that, Each of the heat dissipation mechanisms further includes: Multiple guide posts are installed on the corresponding support plates and are guided to the heat dissipation fins. Each guide post is configured to guide the heat dissipation fins during the lifting and lowering process of the heat dissipation fins.

3. The heat dissipation cabinet according to claim 1, characterized in that, The wafer testing device is provided with at least one first vent hole, and each of the heat dissipation mechanisms further includes: At least one sealing component is mounted on the heat sink fins and has a plug, at least a portion of which protrudes from the surface of the heat sink fins. When the heat sink fins come into contact with the wafer testing apparatus, the plug is configured to block the corresponding first vent hole.

4. The heat dissipation cabinet according to claim 3, characterized in that, Each of the aforementioned plugging components further includes: The first base is connected to the heat dissipation fins and has a first receiving cavity along the vertical direction; The first elastic element is vertically disposed within the first receiving cavity; The plug is located within the first receiving cavity, with one end abutting or connecting to the first elastic element and the other end protruding from the surface of the heat dissipation fins.

5. The heat dissipation cabinet according to claim 1, characterized in that, The wafer testing device is also provided with multiple second vents, and each heat dissipation mechanism further includes: Multiple ventilation components are mounted on the heat sink fins. When the heat sink fins are in contact with the wafer testing device, each ventilation component is configured to communicate with the corresponding second ventilation hole. At least one of the plurality of ventilation components is configured to fill the wafer testing apparatus with protective gas, and at least one of the ventilation components is configured to exhaust the gas in the wafer testing apparatus.

6. The heat dissipation cabinet according to claim 5, characterized in that, Each of the ventilation components further includes: The second base is connected to the heat dissipation fins and has a vertical second receiving cavity; The second elastic element is vertically disposed within the second receiving cavity; A venting rod is snapped or connected to one end of the second elastic element. The venting rod has an internal venting channel that is connected to an external air supply device. When the heat sink fins contact the wafer testing device, the venting rod is configured to abut against the second venting hole, thereby connecting the venting channel with the corresponding second venting hole.

7. The heat dissipation cabinet according to any one of claims 1-6, characterized in that, Each of the wafer testing devices has an internal heating component and at least one temperature sensor, and each of the wafer testing devices has pins on its external side that are electrically connected to each of the temperature sensors; each of the heat dissipation mechanisms further includes: The temperature measuring component includes an adapter board and at least one adapter probe. The adapter board is mounted on the heat dissipation fins and connected to an external circuit. Each adapter probe is mounted on the adapter board and is configured to contact the corresponding pin when the heat dissipation fins contact the wafer testing device, so as to obtain the signal of the temperature sensor.

8. The heat dissipation cabinet according to any one of claims 1-6, characterized in that, Each of the heat dissipation mechanisms further includes: At least one reinforcing strip, which extends along the extending direction of the heat dissipation fins and is mounted on the side of the heat dissipation fins. Each reinforcing strip is provided with at least one ventilation hole.

9. The heat dissipation cabinet according to any one of claims 1-6, characterized in that, Each of the slide rails includes: Three guide rails, all of which extend along the depth direction of the cabinet. The three guide rails are in a "C" shape. Each guide rail has a plurality of rolling elements arranged at intervals along the depth direction of the cabinet. The rolling elements of the three guide rails respectively contact three surfaces of the wafer testing device.

10. The heat dissipation cabinet according to claim 9, characterized in that, It further includes: At least one set of strengthening components. Each set of strengthening components corresponds to a pair of slide rails and includes at least one strengthening plate. Each strengthening plate extends along the width direction of the cabinet and is respectively connected to a pair of slide rails at both ends.

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