Circulating cooling electrophoresis device

Abstract

The application relates to a circulating cooling electrophoresis device, which comprises an electrophoretic liquid storage assembly, a first liquid power assembly, a semiconductor heat exchange assembly, an electrophoresis tank assembly and a second liquid power assembly. The liquid inlet of the first liquid power assembly is communicated with the electrophoretic liquid storage assembly. The semiconductor heat exchange assembly comprises a heat exchanger structure, a semiconductor refrigeration structure and a heat dissipation structure. The heat exchanger structure is located on the refrigeration side of the semiconductor refrigeration structure, and the heat dissipation structure is located on the heat dissipation side of the semiconductor refrigeration structure. The liquid outlet of the first liquid power assembly is communicated with the liquid inlet of the heat exchanger structure. The liquid outlet of the semiconductor heat exchanger structure is communicated with the liquid inlet of the electrophoresis tank assembly. The liquid inlet of the second liquid power assembly is communicated with the outlet of the electrophoresis tank assembly. The liquid outlet of the second liquid power assembly is communicated with the electrophoretic liquid storage assembly. The technical scheme of the application solves the problem that the temperature of the electrophoretic liquid of the electrophoresis device in the prior art is easy to exceed the suitable temperature range.

Description

Technical Field

[0001] This application relates to the technical field of electrophoresis apparatus, and more specifically, to a circulating cooling electrophoresis apparatus. Background Technology

[0002] Gel electrophoresis chromatography has been used to analyze a variety of complex mixtures, including biomass samples, food samples, environmental micro- and nano-particle pollutants, cosmic micro-matter, and some inorganic and organometallic particles.

[0003] The gel separation efficiency of gel electrophoresis chromatography is temperature-dependent, specifically having an upper and lower temperature limit. If the electrophoresis buffer is outside this temperature range, gel electrophoresis chromatography cannot function properly.

[0004] Some existing gel electrophoresis techniques require a constant temperature chamber for detection, necessitating a relatively large space for temperature control. Furthermore, even if the room temperature meets the requirements of the detection range, the temperature of the electrophoretic solution in the electrophoresis tank may sometimes fall outside this range, leading to decreased detection accuracy. Utility Model Content

[0005] This application provides a circulating cooling electrophoresis apparatus to solve the problem that the temperature of the electrophoresis solution in existing electrophoresis apparatuses easily exceeds the suitable temperature range.

[0006] A circulating cooling electrophoresis apparatus according to this application includes: an electrophoresis liquid storage assembly; a first liquid power assembly, the inlet of which is connected to the electrophoresis liquid storage assembly; a semiconductor heat exchange assembly, comprising a heat exchanger structure, a semiconductor refrigeration structure, and a heat dissipation structure, wherein the heat exchanger structure is located on the refrigeration side of the semiconductor refrigeration structure, the heat dissipation structure is located on the heat dissipation side of the semiconductor refrigeration structure, and the outlet of the first liquid power assembly is connected to the inlet of the heat exchanger structure; an electrophoresis tank assembly, the outlet of the semiconductor heat exchanger structure being connected to the inlet of the electrophoresis tank assembly; and a second liquid power assembly, the inlet of which is connected to the outlet of the electrophoresis tank assembly, and the outlet of which is connected to the electrophoresis liquid storage assembly.

[0007] Furthermore, the heat exchanger structure includes a heat transfer plate, heat exchange fins, and a sealing shell. The heat transfer plate is attached to the cooling side of the semiconductor refrigeration structure, and the sealing shell and the heat transfer plate form a receiving space. The heat exchange fins are disposed within the receiving space, and the liquid inlet and liquid outlet of the heat exchanger structure are located at the two ends of the sealing shell, respectively.

[0008] Furthermore, the heat transfer plate is bonded to the semiconductor cooling structure using heat transfer adhesive.

[0009] Furthermore, the heat dissipation structure includes a heat sink, a heat fin, and a fan. The heat sink is attached to the heat dissipation side of the semiconductor cooling structure, the heat fin is disposed on the heat sink, and the fan is located on the side of the heat fin away from the heat sink.

[0010] Furthermore, the electrophoresis apparatus also includes a housing assembly, in which the first liquid power assembly, the semiconductor heat exchange assembly, and the second liquid power assembly are all disposed. The housing assembly has an air outlet and an air inlet, and the fan is located at the air outlet of the housing assembly.

[0011] Furthermore, the electrophoretic fluid storage component is fitted to the outer wall of the housing component.

[0012] Furthermore, the electrophoresis tank assembly is fitted to the outer wall of the shell assembly, and the electrophoresis liquid storage assembly and the electrophoresis tank assembly are located on both sides of the shell assembly.

[0013] Furthermore, the electrophoresis apparatus also includes a control component, a temperature sensor, and a touch screen. The touch screen is located on the front wall of the housing assembly, the control component is located inside the housing assembly, and the temperature sensor is located inside the electrophoresis tank assembly. The control component is electrically connected to the first liquid propulsion assembly, the second liquid propulsion assembly, the temperature sensor, and the touch screen.

[0014] Furthermore, the control components include a controller and a memory, with the memory electrically connected to the controller.

[0015] By applying the technical solution of this application, the first liquid propulsion component introduces the liquid from the electrophoresis liquid storage component into the electrophoresis tank component through heat exchange via the semiconductor heat exchange component. The second liquid propulsion component then transports the liquid from the electrophoresis tank component to the electrophoresis liquid storage component. Through the circulation of the electrophoresis liquid and the heat exchange via the semiconductor heat exchange component, the electrophoresis liquid can be easily controlled within a suitable temperature range. The technical solution of this application effectively solves the problem that the temperature of the electrophoresis liquid in existing electrophoresis devices easily exceeds the suitable temperature range. Attached Figure Description

[0016] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0017] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 A schematic diagram of the process structure of the electrophoresis apparatus according to Embodiment 1 of this application is shown;

[0019] Figure 2 It shows Figure 1 A schematic diagram of the internal structure of the electrophoresis apparatus from the front view;

[0020] Figure 3 It shows Figure 1 A rear view schematic diagram of the electrophoresis apparatus;

[0021] Figure 4 It shows Figure 1 A schematic diagram of the internal structure of the heat exchanger in the electrophoresis apparatus;

[0022] Figure 5 It shows Figure 1 A schematic diagram of the control components of an electrophoresis apparatus.

[0023] The above figures include the following reference numerals:

[0024] 10. Electrophoresis solution storage assembly; 20. First liquid dynamic assembly; 30. Semiconductor heat exchange assembly; 31. Heat exchanger structure; 311. Heat transfer plate; 312. Heat exchange fin; 313. Sealed shell; 32. Semiconductor refrigeration structure; 33. Heat dissipation structure; 331. Heat sink; 332. Heat sink fin; 333. Fan; 40. Electrophoresis tank assembly; 50. Second liquid dynamic assembly; 60. Shell assembly. Detailed Implementation

[0025] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0026] It should be noted that the following detailed descriptions are illustrative and intended to provide further explanation of this application. Unless otherwise specified, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0027] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways, rotated 90 degrees, or in other orientations, and the spatial relative descriptions used herein will be interpreted accordingly.

[0028] like Figures 1 to 5 As shown, the circulating cooling electrophoresis apparatus of Embodiment 1 includes: an electrophoresis liquid storage assembly 10, a first liquid dynamic assembly 20, a semiconductor heat exchange assembly 30, an electrophoresis tank assembly 40, and a second liquid dynamic assembly 50. The inlet of the first liquid dynamic assembly 20 is connected to the electrophoresis liquid storage assembly 10. The semiconductor heat exchange assembly 30 includes a heat exchanger structure 31, a semiconductor cooling structure 32, and a heat dissipation structure 33. The heat exchanger structure 31 is located on the cooling side of the semiconductor cooling structure 32, and the heat dissipation structure 33 is located on the heat dissipation side of the semiconductor cooling structure 32. The outlet of the first liquid dynamic assembly 20 is connected to the inlet of the heat exchanger structure 31. The outlet of the semiconductor heat exchanger structure 31 is connected to the inlet of the electrophoresis tank assembly 40. The inlet of the second liquid dynamic assembly 50 is connected to the outlet of the electrophoresis tank assembly 40, and the outlet of the second liquid dynamic assembly 50 is connected to the electrophoresis liquid storage assembly 10.

[0029] Using the technical solution of Embodiment 1, the first liquid propulsion component 20 inputs the liquid in the electrophoresis liquid storage component 10 into the electrophoresis tank component 40 through heat exchange via the semiconductor heat exchange component 30. The second liquid propulsion component 50 transports the liquid in the electrophoresis tank component 40 to the electrophoresis liquid storage component 10. Thus, through the circulation of the electrophoresis liquid and the heat exchange via the semiconductor heat exchange component 30, the electrophoresis liquid can be easily controlled within a suitable temperature range. The technical solution of this embodiment effectively solves the problem that the temperature of the electrophoresis liquid in existing electrophoresis devices easily exceeds the suitable temperature range.

[0030] It should be noted that the above connections are made via silicone tubing. The silicone material provides both elasticity and prevents the peristaltic pump from binding and deforming the tubing, thus preventing blockage. Both the first and second fluid dynamic components include a peristaltic pump. The silicone tubing can be double-layered with a spiral steel wire in between, further preventing the silicone tubing from being flattened.

[0031] like Figure 1 and Figure 2 As shown, in the technical solution of Embodiment 1, the heat exchanger structure 31 includes a heat transfer plate 311, heat exchange plates 312, and a sealing shell 313. The heat transfer plate 311 is attached to the cooling side of the semiconductor refrigeration structure 32. The sealing shell 313 and the heat transfer plate 311 form a receiving space. The heat exchange plates 312 are disposed within the receiving space. The liquid inlet and liquid outlet of the heat exchanger structure 31 are located at both ends of the sealing shell 313, respectively. The heat transfer plate 311 can effectively conduct the temperature of the semiconductor refrigeration structure 32 to the heat exchange plates 312, resulting in a better heat exchange effect. It should be noted that the two ends mentioned above in this embodiment refer to the upper end and the lower end; in other embodiments, the left side and the right side are also possible. Figure 4 As shown, this embodiment has multiple heat exchange plates 312, and adjacent heat exchange plates 312 are staggered. For example, from bottom to top, the lowest heat exchange plate 312 is welded to one side of the sealing shell 313, and the liquid inlet is located on the bottom wall of the sealing shell 313 away from the heat transfer plate 311. The second layer of heat exchange plates is welded to the heat transfer plate 311, and so on. The liquid outlet is located on the upper wall of the sealing shell 313 and close to the heat transfer plate 311. The above-mentioned arrangement of the liquid inlet and outlet can improve the heat exchange efficiency. In addition, the serpentine flow path of the liquid can also improve the heat exchange efficiency.

[0032] In the technical solution of Embodiment 1 (not shown in the figure), the heat transfer plate 311 and the semiconductor cooling structure 32 are bonded together by a thermal adhesive. The above connection method does not require damaging the structure of the heat transfer plate 311 and the semiconductor cooling structure 32, and the thermal adhesive also has good thermal conductivity while bonding. For example, CTP thermally conductive structural adhesive XK-D25H has a thermal conductivity of 2.5 W / (m·K), which can meet the thermal conductivity requirements of the semiconductor cooling structure in this embodiment.

[0033] like Figure 1 and Figure 2As shown, in the technical solution of Embodiment 1, the heat dissipation structure 33 includes a heat sink 331, a heat sink 332, and a fan 333. The heat sink 331 is attached to the heat dissipation side of the semiconductor cooling structure 32, the heat sink 332 is disposed on the heat sink 331, and the fan 333 is located on the side of the heat sink 332 away from the heat sink 331. This structure is beneficial for improving heat dissipation efficiency. The forced heat dissipation of the heat dissipation structure 33 by the fan 333 improves the heat exchange efficiency. It should be noted that the heat sink 331 and the heat dissipation side of the semiconductor cooling structure 32 are also bonded together with thermal adhesive.

[0034] like Figure 1 and Figure 2 As shown, in the technical solution of Embodiment 1, the electrophoresis device further includes a housing assembly 60. The first liquid dynamic component 20, the semiconductor heat exchange component 30, and the second liquid dynamic component 50 are all disposed within the housing assembly 60. The housing assembly 60 has an air outlet and an air inlet, and the fan 333 is located at the air outlet of the housing assembly 60. This structure creates a forced heat exchange gas channel. It should be noted that the air outlet is located in the middle of the rear wall of the housing assembly 60, and the air inlets are located on both sides of the rear wall of the housing assembly 60. The airflow enters through the air inlets on both sides of the rear wall, and under the power of the fan 333, the heat-exchanged airflow flows out from the air outlet, preventing accumulation inside the housing assembly 60 and thus avoiding impact on heat exchange efficiency.

[0035] In the technical solution of Embodiment 1, the electrophoresis solution storage assembly 10 and the electrophoresis tank assembly 40 are independently arranged from the shell assembly 60. That is, the electrophoresis solution storage assembly 10 is located outside the shell assembly 60 and is connected to it through silicone tubing; the electrophoresis tank assembly 40 is located outside the shell assembly 60 and is connected to it through silicone tubing. An insulation layer may be provided on the circumferential outer side of the silicone tubing as needed, or the insulation layer may be omitted.

[0036] like Figure 2As shown, in the technical solution of Embodiment 1, the electrophoresis apparatus further includes a control component, a temperature sensor, and a touch screen. The touch screen is disposed on the front wall of the housing assembly 60, the control component is located inside the housing assembly 60, and the temperature sensor is located inside the electrophoresis tank assembly 40. The control component is electrically connected to the first liquid propulsion assembly 20, the second liquid propulsion assembly 50, the temperature sensor, the semiconductor cooling structure 32, and the touch screen. This structure improves the automation level of the electrophoresis apparatus. For example, through feedback from the temperature sensor, the control component can control the power of the semiconductor cooling structure 32 and the peristaltic pump. When the liquid temperature is higher than a predetermined temperature, the power of the semiconductor cooling structure 32 is higher, and the power of the peristaltic pump is greater; when the liquid temperature is lower than the predetermined temperature, the power of the semiconductor cooling structure 32 is lower, and the power of the peristaltic pump is less. The electrophoresis apparatus also includes a liquid level sensor, which is disposed inside the electrophoresis tank assembly 40 and electrically connected to the control component. The touch screen can display the liquid level and the liquid temperature inside the electrophoresis tank assembly 40. The semiconductor cooling structure 32, the first liquid power component 20, and the second liquid power component 50 are controlled by a pre-set program and feedback on liquid level and temperature.

[0037] It should be noted that, as Figure 5 As shown, the control component includes a controller and a memory, with the memory electrically connected to the controller. The memory can store information such as pre-set temperature thresholds, and the controller controls the first liquid propulsion component 20, the second liquid propulsion component 50, the temperature sensor, the semiconductor cooling structure 32, and the touch screen based on the information in the memory.

[0038] The difference between the technical solution of Embodiment 2 and Embodiment 1 lies in that the electrophoresis liquid storage component 10 is fitted with the outer wall of the housing component 60. That is, the electrophoresis liquid storage component 10 and the housing component 60 are detachable integrated structures. For example, the wall of the housing component 60 has a slot with the slot opening facing upwards, and the housing of the electrophoresis liquid storage component 10 has an insert plate that fits into the slot. When assembly is required, the insert plate is inserted into the slot. The electrophoresis tank component 40 fits with the outer wall of the housing component 60, and the electrophoresis liquid storage component 10 and the electrophoresis tank component 40 are located on opposite sides of the housing component 60. The electrophoresis liquid storage component 10 and the electrophoresis tank component 40 are also detachable integrated structures, also fitted by an insert plate and a slot. Of course, other connection relationships can be used in other embodiments, such as locking structures.

[0039] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0040] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented, for example, in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0041] The above are merely preferred embodiments of this application and are not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A circulating cooling electrophoresis apparatus, characterized in that, include: Electrophoresis solution storage assembly (10); The first liquid power assembly (20) has its inlet connected to the electrophoretic liquid storage assembly (10); A semiconductor heat exchange assembly (30) includes a heat exchanger structure (31), a semiconductor refrigeration structure (32), and a heat dissipation structure (33). The heat exchanger structure (31) is located on the refrigeration side of the semiconductor refrigeration structure (32), and the heat dissipation structure (33) is located on the heat dissipation side of the semiconductor refrigeration structure (32). The outlet of the first liquid power assembly (20) is connected to the inlet of the heat exchanger structure (31). The outlet of the semiconductor heat exchanger structure (31) is connected to the inlet of the electrophoresis tank assembly (40); The second liquid power assembly (50) has its inlet connected to the outlet of the electrophoresis tank assembly (40) and its outlet connected to the electrophoresis liquid storage assembly (10).

2. The circulating cooling electrophoresis apparatus according to claim 1, characterized in that, The heat exchanger structure (31) includes a heat transfer plate (311), heat exchange fins (312), and a sealing shell (313). The heat transfer plate (311) is attached to the cooling side of the semiconductor refrigeration structure (32). The sealing shell (313) and the heat transfer plate (311) form a receiving space. The heat exchange fins (312) are disposed in the receiving space. The liquid inlet and the liquid outlet of the heat exchanger structure (31) are located at both ends of the sealing shell (313).

3. The circulating cooling electrophoresis apparatus according to claim 2, characterized in that, The heat transfer plate (311) and the semiconductor cooling structure (32) are bonded together by heat transfer adhesive.

4. The circulating cooling electrophoresis apparatus according to claim 2, characterized in that, The heat dissipation structure (33) includes a heat sink (331), a heat sink (332), and a fan (333). The heat sink (331) is attached to the heat dissipation side of the semiconductor cooling structure (32), the heat sink (332) is disposed on the heat sink (331), and the fan (333) is located on the side of the heat sink (332) away from the heat sink (331).

5. The circulating cooling electrophoresis apparatus according to claim 4, characterized in that, The electrophoresis apparatus further includes a housing assembly (60), in which the first liquid power assembly (20), the semiconductor heat exchange assembly (30) and the second liquid power assembly (50) are all disposed. The housing assembly (60) has an air outlet and an air inlet, and the fan (333) is located at the air outlet of the housing assembly (60).

6. The circulating cooling electrophoresis apparatus according to claim 5, characterized in that, The electrophoretic solution storage assembly (10) is fitted with the outer wall of the housing assembly (60).

7. The circulating cooling electrophoresis apparatus according to claim 6, characterized in that, The electrophoresis tank assembly (40) is fitted with the outer wall of the shell assembly (60), and the electrophoresis liquid storage assembly (10) and the electrophoresis tank assembly (40) are respectively located on both sides of the shell assembly (60).

8. The circulating cooling electrophoresis apparatus according to claim 5, characterized in that, The electrophoresis apparatus also includes a control component, a temperature sensor, and a touch screen. The touch screen is disposed on the front wall of the housing assembly (60). The control component is located inside the housing assembly (60). The temperature sensor is located inside the electrophoresis tank assembly (40). The control component is electrically connected to the first liquid propulsion assembly (20), the second liquid propulsion assembly (50), the temperature sensor, and the touch screen.

9. The circulating cooling electrophoresis apparatus according to claim 8, characterized in that, The control component includes a controller and a memory, the memory being electrically connected to the controller.

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