Terminal device and heat dissipation device thereof

Abstract

The application relates to a terminal device and a heat dissipation device thereof. The heat dissipation device comprises a main cooling module, an elastic component and a secondary cooling base module. The terminal device comprises a light cage, a light module and the heat dissipation device. In the heat dissipation process, the light module is inserted into the light cage from the first opening and is attached to the secondary cooling base module. The elastic component ensures that the secondary cooling base module can float during the plugging and unplugging of the light module, ensures the sealing of the internal liquid, and the boss of the secondary cooling base module is always closely attached to the light module. The main cooling module is internally provided with a first cooling flow channel, the secondary cooling base module is provided with a second cooling flow channel, the second cooling flow channel is communicated with the first cooling flow channel, the cooling liquid directly takes away the heat through the secondary cooling base in contact with the light module, and the heat transfer thermal resistance of the light module is greatly reduced. The cooling effect and the plugging and unplugging effect of the light module are ensured as a whole. The structure path is simple and the occupied space is small.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, and in particular to terminal equipment and its heat dissipation device. Background Technology

[0002] Currently, the heat and power consumption of optical modules are constantly increasing, and the existing air-cooling solutions are no longer sufficient for the normal operation of current 400G and even 800G optical modules. Overheating of optical modules not only affects data transmission rates, but in severe cases can also lead to system crashes or even data loss. Therefore, heat dissipation is crucial for optical modules.

[0003] Typically, optical module cooling solutions not only need to meet the heat dissipation requirements of the optical module but also ensure hot-swapping capability. Currently, optical modules primarily achieve heat transfer between the optical module and the heatsink through hard contact or TIM coating. Both methods suffer from uncontrolled insertion / removal forces and relatively high thermal resistance. Specifically, for liquid cooling environments, one current liquid cooling solution for optical modules involves a combination of a main cooling module, foam, and a secondary cooling base module. Heat from the optical module is transferred to the secondary cooling base module, which then conducts heat to the foam layer, which in turn conducts heat to the main cooling module (thermal conductive foam is used to provide flexibility for insertion / removal). This method suffers from poor heat dissipation and inconsistent insertion / removal forces due to manufacturing tolerances and the high thermal resistance of the foam. Another approach utilizes heat pipes, with one end connected to the secondary cooling base module and the other to the main cooling base module. The secondary cooling base module is secured to the optical cage using a retaining spring. The spring's elasticity allows for relatively stable insertion and extraction force of the optical module. However, this solution occupies a large space, and deformation of the heat pipe can lead to poor heat dissipation and adhesion of the optical module, resulting in reduced heat dissipation performance.

[0004] In summary, current liquid cooling solutions for optical modules have a long heat transfer path to the cooling medium, high thermal resistance, and require a large space for the heat dissipation structure. Utility Model Content

[0005] Therefore, it is necessary to provide a terminal device and its heat dissipation device to address the problems of the current liquid cooling solution for optical modules, which has a long heat conduction path from the optical module to the cooling medium, high thermal resistance, and large space occupation of the heat dissipation structure.

[0006] A heat dissipation device, comprising: a main cooling module, an elastic component, and a secondary cooling base module;

[0007] The protruding part of the secondary cold base module extends into the optical cage; wear-resistant thermal interface material can be optionally attached to the protrusion.

[0008] One end of the elastic component is connected to the main cooling module, and the other end is connected to the secondary cooling base module, so that the protruding surface of the secondary cooling base module abuts against the heat dissipation surface of the optical module inside the optical cage under the elastic force of the elastic component, and the direction of the elastic force applied by the elastic component to the secondary cooling base module is perpendicular to the contact surface between the secondary cooling base module and the optical module.

[0009] The main cooling module has a first cooling channel for coolant flow, and the secondary cooling base module has a second cooling channel for coolant flow. The first cooling channel and the second cooling channel are connected.

[0010] In actual use, the aforementioned heat dissipation device allows the protrusion of the secondary cooling base module to extend into the second opening. Due to the spring force, the protrusion is fully inserted into the optical cage. When the optical module is inserted into the optical cage from the first opening, the heat dissipation surface of the optical module is in close contact with the surface of the protrusion of the secondary cooling base module. The protrusion of the secondary cooling base module moves a certain distance outward from the second opening under force, satisfying the deformation during insertion. During stable operation after the optical module is fully inserted into the optical cage, it remains in contact with the protrusion surface. The heat from the optical module is transferred through the liquid in the second cooling channel inside the secondary cooling base to the first cooling channel 111 of the main cooling module, thus carrying away the heat. When the optical module is pulled out of the optical cage, the protrusion of the secondary cooling base module moves into the second opening due to the spring force of the elastic component until it is fully inserted. This heat dissipation device provides both heat dissipation benefits and hot-swappable advantages.

[0011] In terms of heat dissipation benefits, there are three main aspects:

[0012] 1. When the optical module is fully inserted into the optical cage for operation, it can ensure that the protrusion of the secondary cooling base module is stably attached to the heat dissipation surface of the optical module.

[0013] 2. Because the second cooling channel is inside the secondary cooling base, the heat transfer distance between the coolant and the heat dissipation surface of the optical module is reduced, which greatly reduces the thermal resistance.

[0014] 3. The protrusions of the secondary cooling base are coated with a wear-resistant thermal interface material. The wear-resistant layer of this material is encapsulated with a phase change thermal conductive material, which further reduces the contact thermal resistance.

[0015] Benefits of hot-swapping:

[0016] The spring sealing ring assembly satisfies the structural deformation and fluid sealing effect during the hot-plugging of the optical module. In addition, it meets the requirement of consistent insertion and extraction force, and the magnitude of the insertion and extraction force is adjustable.

[0017] The above structural path is simple and occupies little space.

[0018] In one embodiment, the elastic component includes a plurality of springs, one end of which is connected to or abuts against the secondary cooling base module, and the other end of which is connected to or abuts against the main cooling module.

[0019] In one embodiment, the main cooling module has multiple limiting grooves on the side near the secondary cooling base module;

[0020] The secondary cooling base module has multiple limiting posts protruding toward the main cooling module, and the multiple limiting posts, multiple springs, and multiple limiting grooves correspond one-to-one.

[0021] The spring is sleeved on the corresponding limiting post, one end of the spring is connected to or abuts against the bottom wall of the limiting groove, and the other end is connected to or abuts against the secondary cooling base module.

[0022] In one embodiment, the heat dissipation device further includes an inlet cylinder and an outlet cylinder;

[0023] The main cooling module has an inlet tank and an outlet tank on the side facing the secondary cooling base module, which are connected to the first cooling channel.

[0024] One end of the liquid inlet cylinder is connected to the second cooling channel, and the other end is located in the liquid inlet tank and is adapted to the inner wall of the liquid inlet tank. The outer wall of the liquid inlet cylinder is in sliding fit with the inner wall of the liquid inlet tank.

[0025] One end of the liquid outlet cylinder is connected to the second cooling channel, and the other end is located in the liquid outlet tank and is adapted to the inner wall of the liquid outlet tank. The outer wall of the liquid outlet cylinder is in sliding fit with the inner wall of the liquid outlet tank.

[0026] In one embodiment, the heat dissipation device includes a first set of sealing rings and a second set of sealing rings;

[0027] The outer wall of the liquid inlet cylinder is provided with a plurality of first annular grooves, and the outer wall of the liquid outlet cylinder is provided with a plurality of second annular grooves;

[0028] The first set of sealing rings is fitted inside the first annular groove and abuts against the inner wall of the liquid inlet groove. The first set of sealing rings can slide and engage with the inner wall of the liquid inlet groove.

[0029] The second set of sealing rings is fitted inside the second annular groove and abuts against the inner wall of the liquid outlet groove. The second set of sealing rings can slide and engage with the inner wall of the liquid outlet groove.

[0030] In one embodiment, the heat dissipation device further includes a limiting plate;

[0031] The limiting plate is connected to the main cooling module and covers the secondary cooling base module. The limiting plate has a through hole. The secondary cooling base module has a boss on the side near the optical module. The boss passes through the through hole and is fixed in the heat dissipation device. The boss is adapted to the through hole.

[0032] In one embodiment, the heat dissipation device includes a plurality of the secondary cooling base modules and a plurality of the elastic components;

[0033] The limiting plate has multiple through holes, and the multiple secondary cold base modules, multiple elastic components, multiple optical modules, and multiple through holes correspond one-to-one.

[0034] In one embodiment, the heat dissipation device includes an inlet pipe and an outlet pipe;

[0035] One end of the liquid inlet pipe is connected to the first cooling channel, and the other end is connected to the liquid cooling system for supplying liquid.

[0036] One end of the liquid outlet pipe is connected to the first cooling channel, and the other end is connected to the liquid cooling system for liquid return.

[0037] In one embodiment, a plurality of the secondary cooling base modules are arranged sequentially at intervals along a first direction, and the liquid inlet cylinder and the liquid outlet cylinder of each secondary cooling base module are distributed at both ends along a second direction;

[0038] The third direction is the elastic direction of the elastic component, and the first direction, the second direction, and the third direction are perpendicular to each other.

[0039] An embodiment of this application also provides a terminal device, the terminal device including: a terminal body, an optical cage, an optical module, and the aforementioned heat dissipation device;

[0040] The optical cage is disposed on the terminal body;

[0041] The optical cage is provided with a first opening for inserting and removing the optical module;

[0042] The light cage has a second opening on one side perpendicular to the first opening;

[0043] The second opening is used for the protrusion of the secondary cooling base module of the heat dissipation device to enter and abut against the heat dissipation surface of the optical module.

[0044] In actual use, the aforementioned heat dissipation device allows the protrusion of the secondary cooling base module to extend into the second opening. Due to the spring force, the protrusion is fully inserted into the optical cage. When the optical module is inserted into the optical cage from the first opening, the heat dissipation surface of the optical module is in close contact with the surface of the protrusion of the secondary cooling base module. The protrusion of the secondary cooling base module moves a certain distance outward from the second opening under force, satisfying the deformation during insertion. During stable operation after the optical module is fully inserted into the optical cage, it remains in contact with the protrusion surface. The heat from the optical module is transferred through the liquid in the second cooling channel inside the secondary cooling base to the first cooling channel 111 of the main cooling module, thus carrying away the heat. When the optical module is pulled out of the optical cage, the protrusion of the secondary cooling base module moves into the second opening due to the spring force of the elastic component until it is fully inserted. This heat dissipation device provides both heat dissipation benefits and hot-swappable advantages.

[0045] In terms of heat dissipation benefits, there are three main aspects:

[0046] 1. When the optical module is fully inserted into the optical cage for operation, it can ensure that the protrusion of the secondary cooling base module is stably attached to the heat dissipation surface of the optical module.

[0047] 2. Because the second cooling channel is inside the secondary cooling base, the heat transfer distance between the coolant and the heat dissipation surface of the optical module is reduced, which greatly reduces the thermal resistance.

[0048] 3. The protrusions of the secondary cooling base are coated with a wear-resistant thermal interface material. The wear-resistant layer of this material is encapsulated with a phase change thermal conductive material, which further reduces the contact thermal resistance.

[0049] Benefits of hot-swapping:

[0050] The spring-sealing ring assembly satisfies the structural deformation and fluid sealing requirements during the hot-plugging of the optical module, while also meeting the requirement for consistent insertion and extraction forces, which are adjustable. The aforementioned structural path is simple and occupies little space. Attached Figure Description

[0051] Figure 1 This is a schematic diagram of a heat dissipation device according to one embodiment.

[0052] Figure 2 for Figure 1 Exploded view.

[0053] Figure 3 for Figure 1 An enlarged view of the secondary cooling base module in the cross-sectional view.

[0054] Figure 4 for Figure 1 A schematic diagram of the arrangement of the secondary cooling base modules.

[0055] Explanation of icon numbers:

[0056] 100 - Heat dissipation device;

[0057] 110 - Main cooling module; 111 - First cooling channel; 112 - Limiting groove; 113 - Liquid inlet tank; 114 - Liquid outlet tank;

[0058] 120 - Elastic component; 121 - Spring;

[0059] 130 - Secondary cooling base module; 131 - Secondary cooling channel; 132 - Limiting post; 133 - Boss;

[0060] 140 - Inlet cylinder; 141 - Outlet cylinder; 142 - Sealing ring; 143 - First annular groove; 144 - Second annular groove; 145 - Inlet pipe; 146 - Outlet pipe;

[0061] 150 - Limiting plate; 151 - Through hole;

[0062] OX - First direction; OY - Second direction; OZ - Third direction. Detailed Implementation

[0063] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0064] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0065] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0066] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0067] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0068] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0069] See Figure 1 , Figure 1A schematic diagram of the structure of a heat dissipation device 100 in one embodiment of this application is shown. The heat dissipation device 100 provided in one embodiment of this application is used to cool an optical module (not shown). The optical module can be inserted into or pulled out from a first opening of an optical cage (not shown). The optical cage has a second opening at one end near the heat dissipation device 100. The heat dissipation device 100 includes: a main cooling module 110, an elastic component 120, and a secondary cooling base module 130.

[0070] See Figure 2 and Figure 3 In the aforementioned heat dissipation device 100, the protrusion 133 of the secondary cooling base module 130 extends into the optical cage. One end of the elastic component 120 is connected to the main cooling module 110, and the other end is connected to the secondary cooling base module 130, so that the secondary cooling base module 130 abuts against the optical module inside the optical cage under the elastic force of the elastic component 120, and the direction of the elastic force applied by the elastic component 120 to the secondary cooling base module 130 is perpendicular to the contact surface between the secondary cooling base module and the optical module. The main cooling module 110 has a first cooling channel 111 for coolant flow, and the secondary cooling base module 130 has a second cooling channel 131 for coolant flow, with the first cooling channel 111 and the second cooling channel 131 communicating with each other.

[0071] See Figure 2 and Figure 3 In one embodiment, the elastic component 120 includes multiple springs 121, one end of which is connected to or abuts against the secondary cooling base module 130, and the other end is connected to or abuts against the main cooling module 110. In this embodiment, the multiple springs 121 ensure that the secondary cooling base module 130 is stably attached to one end of the optical module and dissipates heat. The elastic component 120 can also be a rubber pad, elastic strip, or other components with elastic force; the specific form is not limited here.

[0072] See Figure 2 and Figure 3 In one embodiment, the main cooling module 110 has multiple recessed limiting grooves 112 on the side near the secondary cooling base module 130, facing away from the secondary cooling base module 130. The secondary cooling base module 130 has multiple limiting posts 132 protruding towards the main cooling module 110, and the multiple limiting posts 132, multiple springs 121, and multiple limiting grooves 112 correspond one-to-one. The springs 121 are sleeved on the corresponding limiting posts 132, with one end of the spring 121 connected to or abutting against the bottom wall of the limiting groove 112, and the other end connected to or abutting against the secondary cooling base module 130.

[0073] See Figure 2 and Figure 3In this embodiment, the limiting post 132 ensures that the spring 121 can be elastically deformed in a stable manner along the extension and contraction direction of the spring 121, so that the contact force of the multiple springs 121 on the secondary cold base module 130 can always maintain the contact force of the secondary cold base module 130 on the optical module as the extension and contraction of the spring 121 changes stably during the movement of the secondary cold base module 130.

[0074] See Figure 2 and Figure 3 In one embodiment, the heat dissipation device 100 further includes an inlet cylinder 140 and an outlet cylinder 141. The main cooling module 110 has an inlet groove 113 and an outlet groove 114 on the side facing the secondary cooling base module 130, which communicate with the first cooling channel 111. One end of the inlet cylinder 140 communicates with the second cooling channel 131, and the other end is located inside the inlet groove 113 and adapted to the inner wall of the inlet groove 113. The outer wall of the inlet cylinder 140 is slidably engaged with the inner wall of the inlet groove 113. One end of the outlet cylinder 141 communicates with the second cooling channel 131, and the other end is located inside the outlet groove 114 and adapted to the inner wall of the outlet groove 114. The outer wall of the outlet cylinder 141 is slidably engaged with the inner wall of the outlet groove 114. Thus, by inserting and unplugging the inlet cylinder 140 with the inlet tank 113, and the outlet cylinder 141 with the outlet tank 114, the coolant can flow through the first cooling channel 111 of the main cooling module 110 and the second cooling channel 131 of the secondary cooling base module 130, and leakage is less likely to occur.

[0075] See Figure 2 and Figure 3 In one embodiment, the heat dissipation device 100 includes a first set of sealing rings 142 and a second set of sealing rings 142. The outer wall of the inlet cylinder 140 has multiple first annular grooves 143, and the outer wall of the outlet cylinder 141 has multiple second annular grooves 144. The first set of sealing rings 142 is fitted within the first annular grooves 143 and abuts against the inner wall of the inlet groove 113, allowing for sliding engagement with the inner wall of the inlet groove 113. The second set of sealing rings 142 is fitted within the second annular grooves 144 and abuts against the inner wall of the outlet groove 114, allowing for sliding engagement with the inner wall of the outlet groove 114. The sliding engagement of the sealing ring 142 with the inner wall of the outlet or inlet tank 113 achieves a floating connection between the secondary cooling base module 130 and the main cooling module 110. This also allows coolant to exit from the second cooling channel 131 through the outlet tank 114 and outlet cylinder 141, and enter the second cooling channel 131 from the first cooling channel 111 through the inlet tank 113 and inlet cylinder 140 to cool the optical module. Simultaneously, each outlet cylinder 141 and inlet cylinder 140 is fitted with multiple sealing rings 142, achieving multi-stage sealing and further improving the sealing effect.

[0076] See Figure 2 and Figure 3In one embodiment, the heat dissipation device 100 further includes a limiting plate 150. The limiting plate 150 is connected to the main cooling module 110 and covers the secondary cooling base module 130. The limiting plate 150 has a through hole 151. The secondary cooling base module 130 has a boss 133 on the side near the optical module. The boss 133 passes through the through hole 151 and can fit with the optical module. The boss 133 is adapted to the through hole 151.

[0077] In this embodiment, the heat of the optical module is transferred to the coolant in the second cooling channel 131 through the boss 133. When the optical module is not inserted into the optical cage, the boss 133 extends into the second opening. In order to prevent the elastic member from pushing the secondary cooling base module 130 out of the main cooling module 110, the part of the limiting plate 150 without the through hole 151 abuts against the surface around the boss 133, thereby limiting the movement of the secondary cooling base module 130 and preventing the secondary cooling base module 130 from detaching from the main cooling module 110.

[0078] Specifically, the limiting plate 150 is connected to the main cooling module 110 by bolts or screws, thereby facilitating the disassembly of the limiting plate 150 and the maintenance of the secondary cooling base module 130 and the interior of the main cooling module 110.

[0079] See Figure 2 and Figure 3 In one embodiment, the heat dissipation device 100 includes a plurality of secondary cooling base modules 130 and a plurality of elastic components 120. The limiting plate 150 has a plurality of through holes 151, and the plurality of secondary cooling base modules 130, the plurality of elastic components 120, the plurality of optical modules, and the plurality of through holes 151 correspond one-to-one. In this embodiment, a heat dissipation device 100 includes a plurality of secondary cooling base modules 130, thereby enabling the cooling of multiple optical modules through a single heat dissipation device 100.

[0080] See Figure 1 and Figure 3In one embodiment, the heat dissipation device 100 includes an inlet pipe 145 and an outlet pipe 146. One end of the inlet pipe 145 is connected to the first cooling channel 111, and the other end is connected to the liquid cooling system for supplying liquid. One end of the outlet pipe 146 is connected to the first cooling channel 111, and the other end is connected to the liquid cooling system for returning liquid. The first cooling channel 111 includes an inlet channel and an outlet channel. The inlet channel is connected to the inlet pipe 145, and the outlet channel is connected to the outlet pipe 146. Multiple inlet slots 113 are connected to the inlet channels of the first cooling channel, and multiple outlet slots 114 are connected to the inlet channels of the first cooling channel. This allows the coolant to enter the inlet channel through the inlet pipe 145, and then be distributed to multiple inlet tanks 113 and inlet cylinders 140 before entering the second cooling channel 131. Subsequently, it passes through the outlet cylinder 141 to reach the outlet channel, then flows from the outlet channel to the outlet pipe 146, and finally returns to the cooling system from the outlet pipe 146, thus forming a coolant circulation.

[0081] See Figure 2 and Figure 3 In one embodiment, multiple secondary cooling base modules 130 are arranged sequentially at intervals along a first direction OX. The inlet cylinder 140 and outlet cylinder 141 of each secondary cooling base module 130 are arranged at intervals along a second direction OY. The inlet pipe 145 and outlet pipe 146 extend along the first direction OX and are also arranged at intervals along the second direction OY. The third direction OZ is the elastic direction of the elastic component 120. The first direction OX, the second direction OY, and the third direction OZ are perpendicular to each other. Specifically, the multiple secondary cooling base modules 130 are located between the inlet pipe 145 and the outlet pipe 146, thereby connecting the cooling channels of the multiple secondary cooling base modules 130 in parallel. The coolant flows along the second direction OY as a whole within the multiple second cooling channels 131, resulting in a more stable cooling effect and preventing turbulent cooling heat flow.

[0082] Specifically, each liquid outlet cylinder 141 is provided with two springs 121 on both sides along the first direction OX, and each liquid inlet cylinder 140 is provided with two springs 121 on both sides along the first direction OX. This arrangement ensures that the elastic force of the secondary cooling base module 130 is the same on both sides along the first direction OX, and the secondary cooling base module 130 can be stably attached to the optical module.

[0083] See Figure 4 Specifically, wear-resistant and thermally conductive material is mounted on the boss 133. This wear-resistant material is customized to achieve smooth insertion and removal and reduced interfacial thermal resistance.

[0084] Specifically, each inlet cylinder 140 is fitted with multiple sealing rings 142 on its outer wall, and each outlet cylinder 141 is fitted with multiple sealing rings 142 on its outer wall.

[0085] See Figure 2 and Figure 3 An embodiment of this application also provides a terminal device, which includes: an optical cage, an optical module, and a heat dissipation device 100. The optical cage is disposed on the terminal body, and the optical cage has a first opening for inserting and removing the optical module. A second opening is provided on one side of the optical cage perpendicular to the first opening, and the second opening is used for the protrusion 133 of the secondary cooling base module 130 of the heat dissipation device 100 to enter.

[0086] In actual use, the aforementioned heat dissipation device 100, due to the fact that the protrusion 133 of the secondary cooling base module can extend into the second opening, is completely inserted into the optical cage under the influence of the spring force. When the optical module is inserted into the optical cage from the first opening, the heat dissipation surface of the optical module is in close contact with the surface of the protrusion 133 of the secondary cooling base module 130, and the protrusion 133 of the secondary cooling base module moves a certain distance outward from the second opening under force, satisfying the deformation of the optical module during insertion. During the process of the optical module being fully inserted into the optical cage and operating stably, the optical module remains in contact with the surface of the protrusion 133. The heat of the optical module is transferred to the first cooling channel 111 of the main cooling module 110 through the liquid in the second cooling channel 131 inside the secondary cooling base module 130, thereby removing the heat. When the optical module is pulled out of the optical cage, under the influence of the elastic force of the elastic component 120, the protrusion 133 of the secondary cooling base module 130 moves into the second opening until it is completely inserted into the second opening. This type of heat dissipation device offers both heat dissipation benefits and the benefits of hot-swapping:

[0087] In terms of heat dissipation benefits, there are three main aspects:

[0088] 1. When the optical module is fully inserted into the optical cage for operation, the boss 133 of the secondary cooling base module 130 can be stably attached to the heat dissipation surface of the optical module.

[0089] 2. Because the second cooling channel 131 is inside the secondary cooling base, the heat transfer distance between the coolant and the heat dissipation surface of the optical module is reduced, which greatly reduces the thermal resistance.

[0090] 3. The protrusions of the secondary cooling base are coated with a wear-resistant thermal interface material. The wear-resistant layer of this material is encapsulated with a phase change thermal conductive material, which further reduces the contact thermal resistance.

[0091] Benefits of hot-swapping:

[0092] The spring-sealing ring assembly satisfies the structural deformation and fluid sealing requirements during the hot-plugging of the optical module, while also meeting the requirement for consistent insertion and extraction forces, which are adjustable. The aforementioned structural path is simple and occupies little space.

[0093] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0094] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A heat dissipation device, characterized in that, The heat dissipation device includes: a main cooling module, an elastic component, and a secondary cooling base module; The boss of the secondary cold base module extends into the optical cage, and wear-resistant thermal interface material can be optionally attached to the boss. One end of the elastic component is connected to the main cooling module, and the other end is connected to the secondary cooling base module, so that the protruding surface of the secondary cooling base module abuts against the heat dissipation surface of the optical module inside the optical cage under the elastic force of the elastic component, and the direction of the elastic force applied by the elastic component to the secondary cooling base module is perpendicular to the contact surface between the secondary cooling base module and the optical module. The main cooling module has a first cooling channel for coolant flow, and the secondary cooling base module has a second cooling channel for coolant flow. The first cooling channel and the second cooling channel are connected.

2. The heat dissipation device according to claim 1, characterized in that, The elastic component includes multiple springs, one end of which is connected to or abuts against the secondary cooling base module, and the other end is connected to or abuts against the main cooling module.

3. The heat dissipation device according to claim 2, characterized in that, The main cooling module has multiple limiting grooves on the side near the secondary cooling base module; The secondary cooling base module has multiple limiting posts protruding toward the main cooling module, and the multiple limiting posts, multiple springs, and multiple limiting grooves correspond one-to-one. The spring is sleeved on the corresponding limiting post, one end of the spring is connected to or abuts against the bottom wall of the limiting groove, and the other end is connected to or abuts against the secondary cooling base module.

4. The heat dissipation device according to claim 2, characterized in that, The heat dissipation device also includes an inlet cylinder and an outlet cylinder; The main cooling module has an inlet tank and an outlet tank on the side facing the secondary cooling base module, which are connected to the first cooling channel. One end of the liquid inlet cylinder is connected to the second cooling channel, and the other end is located in the liquid inlet tank and is adapted to the inner wall of the liquid inlet tank. The outer wall of the liquid inlet cylinder is slidably engaged with the inner wall of the liquid inlet tank. One end of the liquid outlet cylinder is connected to the second cooling channel, and the other end is located in the liquid outlet tank and is adapted to the inner wall of the liquid outlet tank. The outer wall of the liquid outlet cylinder is in sliding fit with the inner wall of the liquid outlet tank.

5. The heat dissipation device according to claim 4, characterized in that, The heat dissipation device includes a first set of sealing rings and a second set of sealing rings; The outer wall of the liquid inlet cylinder is provided with a plurality of first annular grooves, and the outer wall of the liquid outlet cylinder is provided with a plurality of second annular grooves; The first set of sealing rings is fitted inside the first annular groove and abuts against the inner wall of the liquid inlet groove. The first set of sealing rings can slide and engage with the inner wall of the liquid inlet groove. The second set of sealing rings is fitted inside the second annular groove and abuts against the inner wall of the liquid outlet groove. The second set of sealing rings can slide against the inner wall of the liquid outlet groove.

6. The heat dissipation device according to claim 4, characterized in that, The heat dissipation device also includes a limiting plate; The limiting plate is connected to the main cooling module and covers the secondary cooling base module. The limiting plate has a through hole. The secondary cooling base module has a boss on the side near the optical module. The boss passes through the through hole and fixes the secondary cooling base module in the heat dissipation device. The boss is adapted to the through hole.

7. The heat dissipation device according to claim 6, characterized in that, The heat dissipation device includes multiple secondary cooling base modules and multiple elastic components; The limiting plate has multiple through holes, and the multiple secondary cold base modules, multiple elastic components, multiple optical modules, and multiple through holes correspond one-to-one.

8. The heat dissipation device according to claim 7, characterized in that, The heat dissipation device includes an inlet pipe and an outlet pipe; One end of the liquid inlet pipe is connected to the first cooling channel, and the other end is connected to the liquid cooling system for supplying liquid. One end of the liquid outlet pipe is connected to the first cooling channel, and the other end is connected to the liquid cooling system for liquid return.

9. The heat dissipation device according to claim 8, characterized in that, Multiple secondary cooling base modules are arranged sequentially at intervals along a first direction, and the liquid inlet cylinder and the liquid outlet cylinder of each secondary cooling base module are distributed at both ends along a second direction; The third direction is the elastic direction of the elastic component, and the first direction, the second direction, and the third direction are perpendicular to each other.

10. A terminal device, characterized in that, The terminal device includes: a terminal body, an optical cage, an optical module, and a heat dissipation device as described in any one of claims 1-9; The optical cage is disposed on the terminal body; The optical cage is provided with a first opening for inserting and removing the optical module; The light cage has a second opening on one side perpendicular to the first opening; The second opening is used for the secondary cooling base module boss of the heat dissipation device to enter and abut against the heat dissipation surface of the optical module.

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