Temperature control device for cascade semiconductor process
By integrating a cascaded temperature control device with a compressor and a Peltier refrigeration system, the problems of low efficiency under low load and slow response under extreme conditions of traditional temperature control devices are solved, achieving high-precision temperature control and energy efficiency optimization, which is suitable for high heat load and rapid temperature change scenarios in semiconductor manufacturing.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SANHE TONGFEI REFRIGERATION
- Filing Date
- 2025-07-11
- Publication Date
- 2026-06-12
AI Technical Summary
Traditional temperature control devices are inefficient at low loads, have limited heat dissipation and cannot handle high heat loads, and single cooling modes have sluggish response under extreme conditions, affecting process accuracy and energy consumption.
It adopts a cascaded temperature control device, which combines the compressor temperature control unit, the Peltier temperature control unit and the medium circulation unit. Heat exchange is achieved through the refrigerant heat exchanger and the medium circulator. It integrates compressor circulation and Peltier refrigeration to achieve high-precision temperature control and energy efficiency optimization.
It achieves temperature control accuracy of ±0.1℃, millisecond-level response speed, improved energy efficiency, and compact equipment size, adapting to the space constraints of small equipment compartments.
Smart Images
Figure CN224354764U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor process technology, and specifically to a temperature control device for a cascaded semiconductor process. Background Technology
[0002] In the semiconductor manufacturing industry, the accuracy and stability of temperature control are crucial to chip yield and equipment lifespan. With the increasing integration of chips and the refinement of processes (such as photolithography and etching), traditional compressor-type cooling is inefficient at low loads. Peltier thermostats, when used alone, are difficult to handle high heat loads due to heat dissipation limitations, resulting in high energy consumption. In addition, single cooling modes have sluggish response and insufficient temperature stability under extreme conditions (such as rapid heating and cooling), affecting process accuracy. Utility Model Content
[0003] In view of the above-mentioned defects or deficiencies in the prior art, this application aims to provide a temperature control device for cascaded semiconductor processes, so as to achieve both high precision and high efficiency in temperature control. The temperature control device includes:
[0004] A compressor temperature control unit, comprising a compressor, a condenser, and an evaporator;
[0005] A Peltier temperature control unit, comprising a Peltier patch, a circulating medium heat exchanger connected to the cold side of the Peltier patch, and a refrigerant heat exchanger connected to the hot side of the Peltier patch;
[0006] A media circulation unit, comprising a media tank and circulation pipelines;
[0007] The refrigerant inlet of the refrigerant heat exchanger is connected to the refrigerant outlet of the evaporator, and the refrigerant outlet of the refrigerant heat exchanger is connected to the suction port of the compressor.
[0008] The medium circulation unit exchanges heat with the compressor temperature control unit through the evaporator, and with the Peltier temperature control unit through the circulating medium heat exchanger.
[0009] According to the technical solution provided in the embodiments of this application, the compressor temperature control unit further includes an oil separator, a first throttling component, a liquid receiver, a dryer filter, and an electric heater; the compressor exhaust port is sequentially connected to the oil separator, the condenser, the liquid receiver, the dryer filter, and the first throttling component, the outlet of the first throttling component is connected to the evaporator, and the electric heater is located on the pipeline between the refrigerant outlet of the refrigerant heat exchanger and the refrigerant inlet of the evaporator.
[0010] According to the technical solution provided in the embodiments of this application, in the Peltier temperature control unit, the medium outlet of the circulating medium heat exchanger is connected to the medium inlet of the evaporator to form a series heat exchange path.
[0011] According to the technical solution provided in the embodiments of this application, the medium circulation unit further includes a circulation pump, a level indicator and a low level switch; the circulation pump is located on the outlet pipeline of the medium tank to drive the medium to flow sequentially through the circulating medium heat exchanger and the evaporator, and the level indicator and the low level switch are installed inside the medium tank.
[0012] According to the technical solution provided in the embodiments of this application, the medium circulation unit further includes a drain valve, a liquid inlet and a flow meter. The drain valve is located at the bottom of the medium tank, the liquid inlet is located at the top of the medium tank, and the flow meter is located on the outlet pipe of the circulation pump.
[0013] According to the technical solution provided in the embodiments of this application, the compressor temperature control unit further includes a second throttling component; the inlet of the second throttling component is connected to the pipeline between the condenser and the oil separator, and the outlet of the second throttling component is connected to the refrigerant inlet of the evaporator.
[0014] According to the technical solution provided in the embodiments of this application, it further includes a pressure sensing component and a temperature sensing component. The pressure sensing component includes multiple pressure sensors, and the temperature sensing component includes multiple temperature sensors.
[0015] According to the technical solution provided in the embodiments of this application, the refrigerant outlet of the refrigerant heat exchanger is connected to the suction port of the compressor through the electric heater.
[0016] According to the technical solution provided in the embodiments of this application, the compressor is a fixed frequency or variable frequency compressor, and the circulating pump is a fixed frequency or variable frequency compressor.
[0017] According to the technical solution provided in the embodiments of this application, the condenser adopts water cooling or air cooling heat dissipation method, and the medium tank is a single water tank or a double water tank structure.
[0018] In summary, this application proposes a temperature control device for a cascaded semiconductor process, comprising: a compressor temperature control unit, including a compressor, a condenser, and an evaporator; a Peltier temperature control unit, including a Peltier plate, a circulating medium heat exchanger connected to the cold side of the Peltier plate, and a refrigerant heat exchanger connected to the hot side of the Peltier plate; a medium circulation unit, including a medium tank and circulation pipelines; wherein, the refrigerant inlet of the refrigerant heat exchanger is connected to the refrigerant outlet of the evaporator, and the refrigerant outlet of the refrigerant heat exchanger is connected to the suction port of the compressor; the medium circulation unit exchanges heat with the compressor temperature control unit through the evaporator and with the Peltier temperature control unit through the circulating medium heat exchanger.
[0019] Compared with the prior art, the beneficial effects of this application are as follows: This device integrates a compressor cycle, a Peltier refrigeration system, and a media circulation system, achieving:
[0020] I. Improved temperature control accuracy and response speed: PAL patch enables millisecond-level rapid fine-tuning to compensate for the inertial delay of the compressor system; dual-mode collaboration can stably control the medium temperature within ±0.1℃, meeting the stringent requirements of processes such as semiconductor lithography.
[0021] II. Energy Efficiency Optimization and Energy Consumption Reduction: The refrigerant heat exchanger recovers waste heat from the Peltier hot side to the compressor circulation system, reducing the external heat dissipation demand; the compressor bears the main heat load, the Peltier is dynamically fine-tuned, the overall energy efficiency (COP) is improved, and the compressor evaporator provides pre-cooling medium for the Peltier, avoiding Peltier overload.
[0022] 3. Enhanced space utilization and adaptability: Eliminating the need for a separate Peltier heat dissipation module, the equipment is compact and adaptable to space-constrained scenarios such as small equipment compartments in wafer fabs. Attached Figure Description
[0023] Figure 1 This is a schematic diagram of the structure of a temperature control device for a cascaded semiconductor process provided in an embodiment of this application.
[0024] The text labels in the image represent:
[0025] 1. Compressor; 2. Third temperature sensor; 3. Oil separator; 4. Second throttling assembly; 5. Condenser; 6. Receiver tank; 7. Fourth pressure sensor; 8. Dryer filter; 9. First throttling assembly; 10. Electric heater; 11. Medium tank pressure sensor; 12. First temperature sensor; 13. Second temperature sensor; 14. First pressure sensor; 15. Flow meter; 16. Circulating medium heat exchanger; 17. Peltier patch; 18. Refrigerant heat exchanger; 19. Evaporator; 20. Drain valve; 21. Circulating pump; 22. Filler port; 23. Medium tank; 24. Liquid level indicator; 25. Low liquid level switch; 26. Compressor return gas temperature sensor; 27. Fifth pressure sensor; 28. Fourth temperature sensor; 29. Fifth temperature sensor; 30. Second pressure sensor; 31. Third pressure sensor. Detailed Implementation
[0026] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, only the parts relevant to the invention are shown in the accompanying drawings.
[0027] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.
[0028] Example 1
[0029] As mentioned in the background section, in view of the problems in the prior art, this application proposes a temperature control device for cascaded semiconductor processes, such as... Figure 1 As shown, it includes:
[0030] A compressor temperature control unit, comprising a compressor 1, a condenser 5, and an evaporator 19;
[0031] The Peltier temperature control unit includes a Peltier patch 17, a circulating medium heat exchanger 16 connected to the cold side of the Peltier patch 17, and a refrigerant heat exchanger 18 connected to the hot side of the Peltier patch 17.
[0032] A media circulation unit, comprising a media tank 23 and circulation pipelines;
[0033] The refrigerant inlet of the refrigerant heat exchanger 18 is connected to the refrigerant outlet of the evaporator 19, and the refrigerant outlet of the refrigerant heat exchanger 18 is connected to the suction port of the compressor 1.
[0034] The medium circulation unit exchanges heat with the compressor temperature control unit through the evaporator 19, and with the Peltier temperature control unit through the circulating medium heat exchanger 16.
[0035] Furthermore, the compressor 1 is a fixed-frequency or variable-frequency compressor, and the circulating pump 21 is a fixed-frequency or variable-frequency pump.
[0036] Furthermore, the condenser 5 employs water cooling or air cooling for heat dissipation, and the medium tank 23 has a single or double water tank structure. Specifically, the medium tank 23 is used to contain the medium, which can be water. The circulating pump 21 is a water pump, the Peltier plate 17 is a semiconductor refrigeration chip, the refrigerant heat exchanger 18 is a cooling water plate, and the medium tank 23 is a water tank.
[0037] The technical principle is explained as follows: Through the synergy of the compressor temperature control unit (large cooling capacity), the Peltier temperature control unit (precise temperature regulation), and the medium circulation unit (heat transfer carrier), a full range of functions from macroscopic refrigeration to microscopic precise temperature control is achieved. Compressor unit 1 provides basic cooling capacity (-40℃ to room temperature), suitable for high heat load scenarios (such as semiconductor etching). The Peltier unit, based on the thermoelectric effect, achieves ±0.1℃ precision temperature control through current direction control, with a response speed of milliseconds. The medium circulation unit, as the heat transfer medium, connects the two temperature control systems, achieving efficient heat transfer. The refrigerant heat exchanger 18 acts as a bridge, receiving the low-temperature refrigerant output from the evaporator 19 in the compressor temperature control unit, while simultaneously absorbing heat from the hot end of the Peltier unit. This allows the heat from the Peltier unit to be transferred to the refrigerant. The heated refrigerant after passing through the refrigerant heat exchanger 18 enters the compressor 1 suction port. The waste heat generated at the hot end of the Peltier plate 17 is absorbed by the low-temperature return refrigerant of the compressor 1 system, replacing traditional water cooling. This approach can improve energy efficiency by utilizing the residual heat from the refrigeration system, reducing additional heat dissipation energy consumption; enhance stability by avoiding the accumulation of Peltier hot end temperature that leads to efficiency degradation; and reduce size by eliminating the need for a separate heat dissipation module, thus reducing the size of the equipment.
[0038] Furthermore, the DC power polarity of the PAL patch 17 is switchable. When the current direction is reversed, the circulating medium heat exchanger 16 is converted to the heat release side, and the refrigerant heat exchanger 18 is converted to the heat absorption side, thereby realizing the heating mode of the medium circulation unit.
[0039] Specifically, when the DC power polarity of the Peltier patch 17 is reversed, its cold / hot side functions are interchanged: the original cold side (circulating medium heat exchanger 16 side) becomes the heat release side, and the original hot side (refrigerant heat exchanger 18 side) becomes the heat absorption side (absorbing heat from the refrigerant). In heating mode, the refrigerant heat exchanger 18 acts as a "low-temperature heat source," absorbing heat from the refrigerant (at this time, the refrigerant comes from the low-temperature gaseous refrigerant in the evaporator 19), preventing overheating of the Peltier patch's hot side. When the Peltier patch 17 switches to heating mode, the electric heater 10 automatically shuts off to prevent overheating of the suction gas. It also increases the opening of the second throttling component 4, allowing more high-temperature refrigerant to bypass to the suction port of the compressor 1, thereby improving the system's heating capacity.
[0040] In a preferred embodiment, the compressor temperature control unit further includes an oil separator 3, a first throttling component 9, a liquid receiver 6, a dryer filter 8, and an electric heater 10; the exhaust port of the compressor 1 is sequentially connected to the oil separator 3, the condenser 5, the liquid receiver 6, the dryer filter 8, and the first throttling component 9, the outlet of the first throttling component 9 is connected to the evaporator 19, and the electric heater 10 is disposed on the pipeline between the refrigerant outlet of the refrigerant heat exchanger 18 and the refrigerant inlet of the evaporator 19.
[0041] Furthermore, the compressor temperature control unit also includes a second throttling component 4; the inlet of the second throttling component 4 is connected to the pipeline between the condenser 5 and the oil separator 3, and the outlet of the second throttling component 4 is connected to the refrigerant inlet of the evaporator 19.
[0042] Specifically, the first throttling component 9 is the main throttling valve, which adjusts its opening in real time according to the superheat of the evaporator 19 outlet to ensure complete vaporization of the refrigerant within the evaporator 19. The electric heater 10 provides critical protection: anti-liquid slugging mechanism: when the Peltier unit's cooling is too strong, causing the return temperature to be too low, the electric heater 10 activates to prevent liquid refrigerant from entering the compressor 1. Energy efficiency balance: activated only under extreme conditions to avoid energy loss from continuous heating (COP improvement). The oil separator 3 ensures lubricating oil returns to the compressor 1, reducing the oil film thermal resistance of the evaporator 19 and improving heat exchange efficiency.
[0043] Specifically, the second throttling component 4 is a thermal bypass expansion valve, forming a bypass circuit from the high-pressure side to the evaporator. It is connected in parallel with the main throttling valve (first throttling component 9) to form a dual-path throttling structure (main path: condenser 5 → liquid receiver 6 → first throttling component 9 → evaporator 19; bypass path: oil separator 3 → second throttling component 4 → evaporator 19). By adjusting the refrigerant flow rate from the high-pressure side (before condenser 5) to the inlet of evaporator 19, the system pressure and temperature are dynamically balanced. When the load changes, the high-temperature refrigerant in the bypass section can quickly respond to temperature fluctuations, avoiding frequent start-stop of compressor 1. In heating mode, increasing the opening of the second throttling component 4 can increase the flow rate of high-temperature gaseous refrigerant, raising the inlet temperature of evaporator 19 and preventing the compressor from sucking in liquid refrigerant, which could lead to liquid slugging.
[0044] Furthermore, the refrigerant outlet of the refrigerant heat exchanger 18 is connected to the suction port of the compressor 1 via the electric heater 10.
[0045] Specifically, compressor 1 is located between the refrigerant outlet of refrigerant heat exchanger 18 and the refrigerant inlet of evaporator 19. Electric heater 10 is located on the straight pipe between refrigerant heat exchanger 18 and compressor 1. The refrigerant flow path is: through compressor 1, condenser 5, evaporator 19, then through refrigerant heat exchanger 18, through electric heater 10, and back to the suction pipe of compressor 1. The outlet of refrigerant heat exchanger 18 is connected to the suction port of compressor 1 via electric heater 10, which prevents low-temperature refrigerant droplets from entering compressor 1. The electric heater 10 is installed on the straight pipe section between the refrigerant outlet of refrigerant heat exchanger 18 and the suction port of compressor 1. When the suction temperature is lower than a first preset temperature (selectable as 5°C), the heater starts, causing the refrigerant to completely vaporize. This embodiment achieves anti-liquid slugging protection: under low-temperature start-up conditions, the compressor 1 has a zero damage rate. Energy efficiency balance: heating energy consumption accounts for only 3% of the total system power consumption, far lower than the cost of liquid slugging repairs.
[0046] In a preferred embodiment, in the Peltier temperature control unit, the medium outlet of the circulating medium heat exchanger 16 is connected to the medium inlet of the evaporator 19, forming a series heat exchange path.
[0047] Specifically, in the Peltier temperature control unit, the medium outlet of the circulating medium heat exchanger 16 is connected to the medium inlet of the evaporator 19, forming a series heat exchange path. The circulating medium heat exchanger 16 serves as the cold-side heat exchange interface of the Peltier plate 17, directly absorbing heat from the medium circulation system. Its installation position is close to the cold side of the Peltier plate 17, and the medium flows through its internal channels to achieve primary cooling. The evaporator 19 performs secondary deep cooling through refrigerant evaporation from the compressor 1 system. Its installation position is connected in series downstream of the circulating medium heat exchanger 16, and the medium flows directly into the evaporator 19 after exiting the heat exchanger.
[0048] Specifically, the medium is first cooled by Peltier plates 17 in the circulating medium heat exchanger 16, and then enters the evaporator 19 for secondary cooling. Series connection optimizes the temperature gradient: the Peltier plates are responsible for rapid response to temperature fluctuations, while the compressor 1 system handles high-load heat dissipation, thus improving energy efficiency through division of labor and collaboration. It also achieves energy saving and consumption reduction: Peltier pre-cooling reduces the load on the evaporator 19, lowers the start-stop frequency of the compressor 1, and improves the overall energy efficiency ratio (COP). Furthermore, it ensures stability: dual-stage cooling avoids overload of a single system, maintaining temperature control accuracy even under extreme conditions (such as those required for semiconductor lithography processes). Applicable scenarios: suitable for applications requiring rapid cooling and ultra-high precision, such as laser cooling and medical cryogenic equipment.
[0049] In a preferred embodiment, the medium circulation unit further includes a circulation pump 21, a level indicator 24, and a low level switch 25; the circulation pump 21 is located on the outlet pipe of the medium tank 23 to drive the medium to flow sequentially through the circulating medium heat exchanger 16 and the evaporator 19, and the level indicator 24 and the low level switch 25 are installed inside the medium tank 23.
[0050] Specifically, the circulating pump 21 provides the power for media circulation, and its flow rate is adjustable. The circulating pump 21 is installed on the outlet pipe of the media tank 23, and its frequency conversion control matches the refrigeration requirements. The level gauge 24 and low-level switch 25 display the media capacity in real time and automatically shut down for protection when the level is too low. They are installed vertically embedded in the side wall of the media tank 23, and contact sensing avoids false alarms. The level gauge provides visual management (scale + digital display), and the low-level switch 25 triggers PLC control to cut off the power to compressor 1 and the Peltier compressor, preventing dry burning damage.
[0051] In a preferred embodiment, the medium circulation unit further includes a drain valve 20, a liquid inlet 22, and a flow meter 15. The drain valve 20 is located at the bottom of the medium tank 23, the liquid inlet 22 is located at the top of the medium tank 23, and the flow meter 15 is located on the outlet pipe of the circulation pump 21.
[0052] Specifically, the drain valve 20 is used to empty the liquid in the medium tank 23 for easy maintenance or medium replacement. It is installed at the lowest point of the bottom of the medium tank 23 and uses a ball valve structure to prevent clogging. The liquid inlet 22 is a sealed filling port to prevent oxidation and contamination. It is installed at the top of the tank and has a quick-connect interface with an air filter. The flow meter 15 monitors the medium flow rate in real time and feeds back to the control system. It is installed on the outlet pipe of the circulating pump 21, adjacent to the inlet of the evaporator 19. The flow meter 15 uses a turbine-type sensor, and the data is linked to the PLC to dynamically adjust the pump speed. It automatically increases the speed when the flow is insufficient to prevent the evaporator 19 from freezing, and reduces the speed to save energy when the flow is excessive.
[0053] In a preferred embodiment, the system further includes a pressure sensing component and a temperature sensing component, wherein the pressure sensing component includes a plurality of pressure sensors and the temperature sensing component includes a plurality of temperature sensors.
[0054] Specifically, the pressure sensors include a first pressure sensor 14, a second pressure sensor 30, a third pressure sensor 31, a fourth pressure sensor 7, and a fifth pressure sensor 27. The first pressure sensor 14 is installed at the medium inlet of the circulating medium heat exchanger 16, the second pressure sensor 30 is installed at the inlet pipe of the plant water used to dissipate heat from the condenser 5, the third pressure sensor 31 is installed at the outlet pipe of the plant water used to dissipate heat from the condenser 5, the fourth pressure sensor 7 is installed on the pipeline between the liquid storage tank 6 and the dryer filter 8, and the fifth pressure sensor 27 is installed on the straight pipe section before the suction port of the compressor 1.
[0055] Specifically, the temperature sensors include a first temperature sensor 12 located on the pipeline of the circulating pump 21 away from the medium tank 23, and a second temperature sensor 13 located at the medium inlet of the circulating medium heat exchanger 16. It also includes a compressor return gas temperature sensor 26, installed on the straight pipe section before the suction port of the compressor 1, to control the electric heater 10; it activates heating when the temperature is low to prevent liquid slugging, and reduces the opening of the expansion valve to increase superheat when the temperature is too high. It also includes a third temperature sensor 2 installed on the pipeline between the discharge port of the compressor 1 and the oil separator 3 to monitor the discharge temperature of the compressor 1 and prevent system overheating damage. Finally, it includes a fourth temperature sensor 28 installed on the inlet pipe of the plant water system for cooling the condenser 5, and a fifth temperature sensor 29 installed on the outlet pipe of the plant water system for cooling the condenser 5.
[0056] This document uses specific examples to illustrate the principles and implementation methods of this application. The descriptions of the above embodiments are only for the purpose of helping to understand the methods and core ideas of this application. The above descriptions are only preferred embodiments of this application. It should be noted that due to the limitations of written expression, while there are objectively infinite specific structures, those skilled in the art can make several improvements, modifications, or changes without departing from the principles of this invention, and can also combine the above technical features in an appropriate manner. These improvements, modifications, changes, or combinations, or the direct application of the inventive concept and technical solution to other situations without modification, should all be considered within the scope of protection of this application.
Claims
1. A temperature control device for a cascaded semiconductor process, characterized in that, include: The compressor temperature control unit includes a compressor (1), a condenser (5) and an evaporator (19). The Peltier temperature control unit includes a Peltier patch (17), a circulating medium heat exchanger (16) connected to the cold side of the Peltier patch (17), and a refrigerant heat exchanger (18) connected to the hot side of the Peltier patch (17). The medium circulation unit includes a medium tank (23) and circulation pipelines; The refrigerant inlet of the refrigerant heat exchanger (18) is connected to the refrigerant outlet of the evaporator (19), and the refrigerant outlet of the refrigerant heat exchanger (18) is connected to the suction port of the compressor (1). The medium circulation unit exchanges heat with the compressor temperature control unit through the evaporator (19) and with the Peltier temperature control unit through the circulating medium heat exchanger (16).
2. The temperature control device for cascaded semiconductor processes according to claim 1, characterized in that: The compressor temperature control unit also includes an oil separator (3), a first throttling component (9), a liquid storage tank (6), a dryer filter (8), and an electric heater (10); the exhaust port of the compressor (1) is connected in sequence to the oil separator (3), the condenser (5), the liquid storage tank (6), the dryer filter (8), and the first throttling component (9); the outlet of the first throttling component (9) is connected to the evaporator (19); and the electric heater (10) is located on the pipeline between the refrigerant outlet of the refrigerant heat exchanger (18) and the refrigerant inlet of the evaporator (19).
3. The temperature control device for cascaded semiconductor processes according to claim 1, characterized in that: In the Peltier temperature control unit, the medium outlet of the circulating medium heat exchanger (16) is connected to the medium inlet of the evaporator (19), forming a series heat exchange path.
4. The temperature control device for cascaded semiconductor processes according to claim 1, characterized in that: The medium circulation unit also includes a circulation pump (21), a level indicator (24), and a low level switch (25); the circulation pump (21) is located on the outlet pipe of the medium tank (23) to drive the medium to flow sequentially through the circulating medium heat exchanger (16) and the evaporator (19); the level indicator (24) and the low level switch (25) are installed inside the medium tank (23).
5. The temperature control device for cascaded semiconductor processes according to claim 4, characterized in that: The medium circulation unit also includes a drain valve (20), a liquid inlet (22) and a flow meter (15). The drain valve (20) is located at the bottom of the medium tank (23), the liquid inlet (22) is located at the top of the medium tank (23), and the flow meter (15) is located on the outlet pipe of the circulation pump (21).
6. The temperature control device for cascaded semiconductor processes according to claim 2, characterized in that: The compressor temperature control unit also includes a second throttling component (4); the inlet of the second throttling component (4) is connected to the pipeline between the condenser (5) and the oil separator (3), and the outlet of the second throttling component (4) is connected to the refrigerant inlet of the evaporator (19).
7. The temperature control device for cascaded semiconductor processes according to claim 1, characterized in that: It also includes a pressure sensing component and a temperature sensing component, wherein the pressure sensing component includes multiple pressure sensors and the temperature sensing component includes multiple temperature sensors.
8. The temperature control device for cascaded semiconductor processes according to claim 2, characterized in that: The refrigerant outlet of the refrigerant heat exchanger (18) is connected to the suction port of the compressor (1) through the electric heater (10).
9. The temperature control device for cascaded semiconductor processes according to claim 4, characterized in that: The compressor (1) is either fixed frequency or variable frequency, and the circulating pump (21) is either fixed frequency or variable frequency.
10. The temperature control device for cascaded semiconductor processes according to claim 1, characterized in that: The condenser (5) adopts water cooling or air cooling heat dissipation method, and the medium tank (23) is a single water tank or a double water tank structure.