A circuit board and a battery

Abstract

This application provides a circuit board and a battery, including a circuit board body and a conductive portion disposed on the circuit board body. The circuit board body has a receiving groove on its side along its width direction. The conductive portion is embedded in the receiving groove and exposed through an opening in the receiving groove. The conductive portion is used to electrically connect with a tab through the opening in the receiving groove. The receiving groove limits the conductive portion, preventing it from moving or tilting during soldering, thus ensuring soldering quality. Furthermore, the conductive portion utilizes the internal space of the circuit board body, not occupying space on the component surface (i.e., the vertical surface) of the circuit board, which can further reduce the size of the circuit board.

Description

Technical Field

[0001] This utility model relates to the field of battery technology, specifically to a circuit board and a battery. Background Technology

[0002] Batteries are mainly composed of cells, circuit boards, insulating tape, and other structural components. Currently, many batteries place the circuit board vertically at the head of the cell. The connector used to connect the cell tabs is L-shaped, with one end attached to the vertical surface of the circuit board and connected to the solder pads on the vertical surface, and the other end attached to the side of the circuit board and connected to the cell tabs. This reduces the packaging space of the circuit board, decreases the space occupied by the battery package, and increases the battery capacity.

[0003] However, this structure still has some defects. The connectors are soldered to the pads on the circuit board by solder paste. When the solder paste is heated, it melts into a liquid state and has a certain fluidity. When the solder paste flows, it can easily move the connectors, causing them to be skewed. When the skewed connectors are soldered to the battery cell tabs, there will be problems with poor soldering. In addition, the L-shaped connectors will occupy the soldering space of the components on the vertical surface of the circuit board, which will prevent the width of the circuit board from being further reduced. Utility Model Content

[0004] This utility model provides a circuit board and a battery to solve the problem that L-shaped connectors are prone to skewing and occupy component space in related technologies.

[0005] To solve the above-mentioned technical problems, this utility model is implemented as follows:

[0006] In a first aspect, the present invention provides a circuit board, including a circuit board body and a conductive part disposed on the circuit board body. The circuit board body has a receiving groove on its side along its width direction. The conductive part is embedded in the receiving groove and exposed through the opening of the receiving groove. The conductive part is used to be electrically connected to a tab through the opening of the receiving groove.

[0007] Optionally, the circuit board body has a first surface and a second surface opposite to each other along the thickness direction. A first through hole is provided on the first surface and / or the second surface at a position corresponding to the receiving groove, and a copper plating layer is provided on the wall of the first through hole. The conductive part is electrically connected to the copper plating layer through the first through hole.

[0008] Optionally, the circuit board body includes a plurality of copper foil layers and a plurality of insulating layers stacked along the thickness direction. One of the insulating layers is disposed between two adjacent copper foil layers. The circuit board body has at least one second via extending along the thickness direction. The wall of the second via has a copper plating layer. At least two copper foil layers are connected to the copper plating layer of the second via to electrically connect the plurality of copper foil layers. At least one copper foil layer has a third via penetrating to the receiving groove. The wall of the third via has a copper plating layer. The conductive part is electrically connected to the plurality of copper foil layers through the third via.

[0009] Optionally, components are provided on the outermost surface of the circuit board body along the thickness direction, and the components are electrically connected to the copper plating layer.

[0010] Optionally, the first via is a blind via, the second via is at least one of a through via, a buried via, and a blind via, and the third through via is at least one of a blind via and a buried via.

[0011] Optionally, there is a gap between the conductive part and the receiving groove, and the gap is filled with an insulating medium.

[0012] Optionally, there are multiple receiving slots and conductive parts, with each receiving slot and conductive part corresponding to the other, and the multiple receiving slots are distributed at intervals along the extension direction of the circuit board body.

[0013] Optionally, the distance between the side of each conductive portion used for electrical connection with the tab and the side of the circuit board body is the same.

[0014] Optionally, the receiving groove is rectangular in shape, having an opening and five inner walls, with the conductive part exposed to the receiving groove through the opening, and each inner wall abutting against the conductive part.

[0015] Secondly, this utility model also discloses a battery, including a battery cell, a tab, and a circuit board as described in any of the first aspects, wherein the tab is disposed at the head of the battery cell, the side of the circuit board body is disposed opposite to the head of the battery cell, and the conductive part is connected to the tab.

[0016] This invention utilizes a conductive portion embedded in the circuit board to replace the connectors attached to the circuit board surface for connection to the battery cell tabs. The conductive portion is embedded in a receiving groove on the side of the circuit board body along its width, with one side exposed above the circuit board body. This exposed portion is soldered to the battery cell tab. Because the shape of the conductive portion matches the shape of the receiving cavity, the receiving groove acts as a limit for the conductive portion, preventing it from moving or tilting during soldering and ensuring soldering quality. Furthermore, the conductive portion utilizes the internal space of the circuit board body, without occupying space on the component surface or vertical surface of the circuit board, which can further reduce the size of the circuit board. Attached Figure Description

[0017] Figure 1 This is a cross-sectional view of a circuit board provided in an embodiment of the present invention;

[0018] Figure 2 express Figure 1 The diagram shows a circuit board with vias on its first surface.

[0019] Figure 3 express Figure 1 The diagram shows a circuit board with vias on its first and second surfaces.

[0020] Figure 4 express Figure 1 A bottom view of the circuit board shown;

[0021] Figure 5 express Figure 1 A schematic diagram of the front of the circuit board shown;

[0022] Figure 6 A bottom view of a circuit board with four receiving slots;

[0023] Figure 7 This is a front view of a circuit board with four receiving slots.

[0024] Figure label:

[0025] 10: Circuit board body; 11: Receiving groove; 12: First surface; 13: Second surface; 14: First via; 20: Conductive part; 30: Solder pad. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0027] It should be understood that the phrase "one embodiment" or "an embodiment" throughout the specification means that a specific feature, structure, or characteristic related to the embodiment is included in at least one embodiment of the present invention. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification do not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

[0028] Mobile phone batteries are mainly composed of battery cells, circuit boards, insulating tape, and other structural auxiliary materials. Under a given battery size, the smaller the package size of the circuit board, the larger the space left for the battery cells, and the battery capacity can be further increased.

[0029] Therefore, many battery products now place the circuit board vertically at the battery head instead of horizontally in the cell recess. The factor affecting the battery package size has been changed from the width of the circuit board to the thickness of the circuit board. In addition, in order to further compress the packaging space of the circuit board, the connector used to connect the cell is designed on the side of the circuit board. Specifically, this connector is an L-shaped nickel brick, one end of which is soldered to the vertical surface of the circuit board and connected to the pad, and the other end is attached to the side of the circuit board and soldered to the cell tab on the side.

[0030] However, since there is no structure on the circuit board to limit the position of the connectors, they are prone to deviating from their target position when fixed to the circuit board. This is especially true in soldering processes that require flux and solder paste, where the fluidity of the flux and solder paste can cause the connectors to move, making them more likely to become misaligned. This can affect the soldering quality, and misaligned connectors may result in cold solder joints when soldered to the battery cell tabs. Furthermore, the end of the connector that connects to the vertical surface of the circuit board will occupy the soldering space for components on the vertical surface of the circuit board, preventing the width of the circuit board from being further reduced.

[0031] To address the above problems, this utility model provides a circuit board. Figure 1 This is a cross-sectional view of the circuit board. Figures 2-3 This is a schematic diagram showing how the conductive parts of a circuit board are connected to components on the surface of the circuit board through vias. Figures 4-7 This is a schematic diagram of a circuit board with different numbers of receiving slots and conductive parts.

[0032] The circuit board in this embodiment includes a circuit board body 10 and a conductive part 20 disposed on the circuit board body 10. The circuit board body 10 has a receiving groove 11 on its side along its width direction. The conductive part 20 is embedded in the receiving groove 11 and exposed through the opening of the receiving groove 11. The conductive part 20 is used to be electrically connected to the electrode tab through the opening of the receiving groove 11.

[0033] like Figure 1As shown, the side of the circuit board has a recessed receiving groove 11 on the surface of the circuit board body 10. The conductive part 20 is embedded in the receiving groove 11. The receiving groove 11 can limit the conductive part 20 and fix it in the receiving groove 11. The conductive part 20 is exposed to the side of the circuit board body 10 through the opening of the receiving groove 11, so that the conductive part 20 can be connected to the battery cell tab through the opening of the receiving groove 11. The part of the conductive part 20 not exposed to the opening of the receiving groove 11 is connected to the metal structure inside the circuit board body 10. The conductive part 20 and the battery cell tab connected to the conductive part 20 are connected to the circuit inside the circuit board body 10, which meets the electrical conductivity requirements when the circuit board is set perpendicular to the battery cell head. Specifically, the conductive part 20 is a metal block with good conductivity, such as a copper block or a nickel block. The conductive part 20 is welded to the tab.

[0034] Understandably, the shape of the receiving groove 11 matches the shape of the conductive part 20, thus limiting the movement of the conductive part 20 along the side of the circuit board body 10. The molten flux and solder paste during soldering will not affect the soldering position of the conductive part 20 and the tab.

[0035] This design ensures the stability and reliability of the soldering process, thereby improving the overall performance of the circuit board. In electronic devices, the precise alignment of the conductive part 20 and the tab reduces the risk of short circuits while ensuring smooth current flow, which is crucial for high-precision and high-efficiency electronic devices. Furthermore, the design of the receiving slot 11 simplifies the assembly process; automated assembly equipment can more accurately position the conductive part 20, thereby accelerating production speed and reducing labor costs.

[0036] Furthermore, the receiving groove 11 has an opening only on the side of the circuit board body 10, with the rest of the portion enclosed by the circuit board body 10. The conductive part 20 embedded in the receiving groove 11 is also exposed to the outside only through the opening on the side of the circuit board body 10. The conductive part 20 can be a square nickel brick structure, and the corresponding receiving groove 11 can be a square groove structure. The two are compatible, allowing the square nickel brick structure to be embedded in the square groove structure. The square nickel brick is connected to the electrode tab only through the opening. Compared with the L-shaped nickel brick used in the prior art, the conductive part 20 only occupies part of the space on the side of the circuit board body 10. The components on the circuit board are concentrated on the vertical surface of the circuit board body 10. In multilayer circuit boards, surface mount components can also be set on the inner layer board. The side of the circuit board body 10 itself does not have a special purpose. In this embodiment, the conductive part 20 connected to the electrode tab is set on the side of the circuit board body 10. Without affecting the operation of the circuit board, the space on the vertical surface of the circuit board used for soldering connectors is freed up, improving the space utilization of the circuit board. This is conducive to further reducing the size of the circuit board and saving host space, which can solve the problem of the large package size of the circuit board of current battery products and the limited placement of components.

[0037] In addition, in some optional embodiments, the circuit board body 10 has a first surface 12 and a second surface 13 opposite to each other along the thickness direction. A first through hole 14 is provided on the first surface 12 and / or the second surface 13 at a position corresponding to the receiving groove 11, and a copper plating layer is provided on the wall of the first through hole. The conductive part 20 is electrically connected to the copper plating layer through the first through hole 14.

[0038] In this embodiment, the top and bottom surfaces of the circuit board body 10 are defined as the first surface 12 and the second surface 13, respectively. The first surface 12 and the second surface 13 are used for laying components and traces. The conductive part 20 located inside the circuit board body 10 is connected to the surface traces of the circuit board body 10 through the copper plating layer of the first via 14. Figure 2 As shown, a plurality of first vias 14 penetrating into the receiving groove 11 are provided on the first surface 12 at positions corresponding to the receiving groove 11. The walls of the first vias 14 are plated with copper. The end of the first via 14 near the first surface 12 is connected to the circuit of the circuit board, and the end near the receiving groove 11 is in contact with the metal surface of the conductive part 20, thereby realizing the conduction between the circuit of the circuit board and the battery cell. When there are lines on the second surface 13, the first vias 14 can also be provided between the second surface 13 and the receiving groove 11. Depending on actual needs, the number of first vias 14 can be one or more.

[0039] Optionally, such as Figure 3 As shown, the conductive part 20 can also be connected on both sides. Both the first surface 12 and the second surface 13 are provided with through holes 14 that penetrate to the receiving groove 11. The first surface 12 and the second surface 13 can be electrically connected to the conductive part 20 at the same time.

[0040] In this embodiment, an electrical connection between the conductive part 20 and the circuit board body 10 is achieved by providing a first via 14 inside the circuit board body 10, thereby connecting the circuit of the circuit board to the electrode tab of the battery cell. Furthermore, a solder pad 30 is also provided on the first surface 12 or the second surface 13 of the circuit board body 10, and the solder pad 30 is used to connect to external electrical equipment.

[0041] In some alternative embodiments, the circuit board body 10 includes a plurality of copper foil layers and a plurality of insulating layers stacked along the thickness direction. One of the insulating layers is disposed between two adjacent copper foil layers. The circuit board body 10 has at least one second via extending along the thickness direction. The wall of the second via has a copper plating layer. At least two copper foil layers are connected to the copper plating layer of the second via to electrically connect the plurality of copper foil layers. At least one copper foil layer has a third via penetrating to the receiving groove 11. The wall of the third via has a copper plating layer. The conductive part 20 is electrically connected to the plurality of copper foil layers through the third via.

[0042] The circuit board can be a multilayer board, composed of multiple layers of copper foil and insulating layers stacked and laminated alternately. The insulating layer is generally a prepreg, which insulates adjacent copper foil layers. The outermost copper foil layer of the multilayer circuit board is used for component placement, while the inner copper foil layers are used for traces. The multilayer circuit board transfers surface signal lines to the inner layers to optimize the available space on the circuit board and provide more space for component placement. The copper foil layers are electrically connected to each other through a second via. In the case of a multilayer circuit board, the conductive part 20 can be directly electrically connected to the outermost copper foil layer or to the inner copper foil layer. Therefore, the third via used to connect the conductive part 20 and the circuit board body 10 can penetrate from the outermost copper foil layer to the receiving groove 11 or from the inner copper foil layer to the receiving groove 11, and then the conductive part 20 is electrically connected to other copper foil layers through the second vias between the copper foil layers. Similarly, the number of second and third vias can be one or more, and the conductive part 20 can be connected to multiple copper foil layers simultaneously.

[0043] Optionally, components are provided on the outermost surface of the circuit board body 10 along the thickness direction, and the components are electrically connected to the copper plating layer.

[0044] In addition, in some optional embodiments, the first via 14 is a blind via, the second via is at least one of a through via, a buried via, and a blind via, and the third through via is at least one of a blind via and a buried via.

[0045] Blind vias are used to connect the outermost and inner layers. A first via 14 extends from the first surface 12 and the second surface 13 to the receiving groove 11, connecting the outermost and inner layers. Through-holes can connect arbitrarily between the outermost and inner layers, while buried vias are used to connect inner layers to each other. Second vias used to connect the various copper foil layers can be selected arbitrarily from blind vias, through-holes, and buried vias, thus achieving complex circuit connections. A third via connects at one end to the internal receiving groove 11, and the other end can be selected as a blind via or a buried via depending on whether it connects to the outermost or inner layer of the conductive part 20. Through this flexible via design, the circuit board can achieve denser wiring and a more rational layout, while maintaining good electrical performance and mechanical strength.

[0046] In some alternative embodiments, there is a gap between the conductive part 20 and the receiving groove 11, and the gap is filled with an insulating medium.

[0047] A gap exists between the conductive part 20 and the receiving groove 11, so that the conductive part 20 can be placed into the receiving groove 11 after the etching and lamination of the circuit board body 10 are completed. The insulating medium can be an insulating colloid, which serves to fix the conductive part 20. In the case of a multilayer circuit board, each inner copper foil layer may be directly exposed to the inner wall of the receiving groove 11. The insulating medium also serves to insulate the conductive part 20 from the copper foil layer and prevent short circuits.

[0048] Specifically, the gap between the conductive part 20 and the receiving groove 11 is greater than 0.05mm to provide sufficient installation space. If the gap is too small, the conductive part 20 will interfere with the external structure of the circuit board body 10 during installation, affecting the installation of the conductive part 20.

[0049] In addition, in some optional embodiments, there are multiple receiving grooves 11 and conductive parts 20, with each receiving groove 11 and conductive part 20 corresponding to one another, and the multiple receiving grooves 11 are distributed at intervals along the extension direction of the circuit board body 10.

[0050] like Figures 4-7 As shown, when there are multiple cells in the battery, there are also multiple sets of tabs. Multiple receiving slots 11 and conductive parts 20 can be provided on the circuit board body 10 as needed, and the number is a multiple of 2, corresponding one-to-one with the number and position of the positive and negative tabs.

[0051] In some alternative embodiments, the side of each conductive portion 20 that is electrically connected to the tab is at the same distance from the side of the circuit board body 10.

[0052] In practical applications, the shapes and sizes of the multiple receiving grooves 11 and conductive parts 20 can be the same or different. The conductive parts 20 can be recessed into the opening of the receiving groove 11, flush with the opening of the receiving groove 11, or protrude from the opening of the receiving groove 11, without affecting the soldering with the electrode tab. However, the distance between the side of the multiple conductive parts 20 exposed in the receiving groove 11 and the side of the circuit board body 10 should be consistent. When soldering with the electrode tab, different solder joints can maintain consistency, which is beneficial for automated equipment to perform soldering operations uniformly and ensure stable product quality.

[0053] In some alternative embodiments, the receiving groove 11 is rectangular in shape, has an opening and five inner walls, and the conductive part 20 is exposed to the receiving groove 11 through the opening, with each inner wall abutting against the conductive part 20.

[0054] The shapes of the receiving groove 11 and the conductive part 20 are adapted to each other, and the receiving groove 11 is open at only one end. All five inner walls of the receiving groove 11 abut against the conductive part 20. In particular, the two ends of the conductive part 20 abut against the inner walls of the receiving groove 11, which restricts the lateral movement of the conductive part 20. This prevents the conductive part 20 from moving during welding and affecting the welding quality.

[0055] In actual production, the etching and lamination of the circuit board body 10 can be completed first, and then slots can be uniformly cut on the side of the circuit board body 10. Receiving slots 11 for embedding conductive parts 20 can be cut into the inner layer of the circuit board body 10. After the conductive parts 20 are placed in, they are fixed with insulating adhesive. Alternatively, openings can be made in each layer board that is directly connected to the receiving slots 11, and the conductive parts 20 can be placed in the receiving slots 11 after stacking them sequentially. Then, the layers are laminated together, and the electrical connection between the copper foil of other circuit layers and the conductive parts 20 is achieved through electroplating vias 14. Finally, the areas where exposure is required are formed by routing, so that one side of the conductive parts 20 is exposed on the side of the circuit board body 10.

[0056] This utility model embodiment also discloses a battery, including a battery cell, a tab, and a circuit board of any of the above embodiments. The tab is disposed at the head of the battery cell, the side of the circuit board body 10 is disposed opposite to the head of the battery cell, and the conductive part 20 is connected to the tab.

[0057] In this embodiment, the circuit board is placed vertically at the head of the battery cell, with its vertical surface perpendicular to the cell head and its side facing the cell head. The circuit board body 10 has a receiving groove 11 on its side facing the cell head, and a conductive part 20 is embedded within the receiving groove 11. The conductive part 20 is soldered to the electrode tab of the cell head through the opening of the receiving groove 11. This placement method allows the battery cell head's encapsulation size to depend on the circuit board's thickness during battery packaging. Compared to a scheme where the circuit board is placed parallel to the cell head and the encapsulation size depends on the circuit board's width, the circuit board's thickness is obviously smaller than its width, thus reducing the encapsulation size and saving space in the main unit.

[0058] When designing the circuit board, the number and position of the receiving slots 11 on the circuit board body 10 correspond to the number of tabs and their positions on the battery cell. In practical applications, the length of the circuit board also matches the size of the battery cell head. Thus, only the two ends of the circuit board need to be aligned with the sides of the battery cell, and the receiving slots 11 and the conductive parts 20 in the receiving slots 11 correspond one-to-one with the tabs. Precise positioning of the soldering position is not required, and the conductive parts 20 are constrained by the receiving slots 11, so they will not move during the soldering process, ensuring the soldering quality.

[0059] Furthermore, the conductive part 20 is embedded inside the circuit board body 10 and is only exposed on the side of the circuit board body 10. It does not occupy the space on the two vertical surfaces of the circuit board body 10. The vertical surfaces of the circuit board body 10 can be used entirely for the placement of components. More components can be placed in a limited area, which is in line with the current trend of battery miniaturization and high energy density.

[0060] This invention utilizes a conductive portion embedded in the circuit board to replace the connectors attached to the circuit board surface for connection with the battery cell tabs. The conductive portion is embedded in a receiving groove on the side of the circuit board body, with one side exposed above the circuit board body. This exposed part is soldered to the battery cell tab. Because the shape of the conductive portion matches the shape of the receiving cavity, the receiving groove acts as a limit for the conductive portion, preventing it from moving or tilting during soldering and ensuring soldering quality. Furthermore, the conductive portion utilizes the space inside the circuit board body, without occupying space on the component surface or vertical surface of the circuit board, which can further reduce the size of the circuit board.

[0061] It should be noted that the various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0062] Although alternative embodiments of the present invention have been described, those skilled in the art, upon learning the basic inventive concept, can make further changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the alternative embodiments as well as all changes and modifications falling within the scope of the present invention.

[0063] Finally, it should be noted that in this document, relational terms such as "first" and "second" are used merely to distinguish one entity from another, and do not necessarily require or imply any such actual relationship or order between these entities. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that an article or terminal device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such an article or terminal device. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the article or terminal device that includes that element.

[0064] The technical solution provided by this utility model has been described in detail above. Specific examples have been used to illustrate the principle and implementation of this utility model. At the same time, for those skilled in the art, there will be changes in the specific implementation and application scope based on the principle and implementation of this utility model. Therefore, the content of this specification should not be construed as a limitation of this utility model.

Claims

1. A circuit board, characterized in that, The circuit board includes a circuit board body (10) and a conductive part (20). The circuit board body (10) has a receiving groove (11) on its side along its width direction. The conductive part (20) is embedded in the receiving groove (11) and exposed through the opening of the receiving groove (11). The conductive part (20) is used to be electrically connected to the tab through the opening of the receiving groove (11).

2. The circuit board according to claim 1, characterized in that, The circuit board body (10) has a first surface (12) and a second surface (13) opposite each other along the thickness direction. A first via (14) is provided on the first surface (12) and / or the second surface (13) at a position corresponding to the receiving groove (11) and extends through the receiving groove (11). The wall of the first via (14) has a copper plating layer. The conductive part (20) is electrically connected to the copper plating layer through the first via (14).

3. The circuit board according to claim 1, characterized in that, The circuit board body (10) includes a plurality of copper foil layers and a plurality of insulating layers stacked along the thickness direction. One of the insulating layers is disposed between two adjacent copper foil layers. The circuit board body (10) is provided with at least one second via extending along the thickness direction. The wall of the second via has a copper plating layer. At least two copper foil layers are connected to the copper plating layer of the second via to make the plurality of copper foil layers electrically connected. At least one copper foil layer is provided with a third via penetrating to the receiving groove (11). The wall of the third via has a copper plating layer. The conductive part (20) is electrically connected to the plurality of copper foil layers through the third via.

4. The circuit board according to any one of claims 2-3, characterized in that, The circuit board body (10) has components on its outermost surface along the thickness direction, and the components are electrically connected to the copper plating layer.

5. The circuit board according to any one of claims 2-3, characterized in that, The first via (14) is a blind via, the second via is at least one of a through hole, a buried via, and a blind via, and the third through hole is at least one of a blind via and a buried via.

6. The circuit board according to claim 1, characterized in that, There is a gap between the conductive part (20) and the receiving groove (11), and the gap is filled with an insulating medium.

7. The circuit board according to claim 1, characterized in that, The number of the receiving grooves (11) and the conductive parts (20) is multiple, and the receiving grooves (11) and the conductive parts (20) correspond one-to-one. The multiple receiving grooves (11) are distributed at intervals along the extension direction of the circuit board body (10).

8. The circuit board according to claim 7, characterized in that, The distance between the side of each conductive part (20) for electrical connection with the tab and the side of the circuit board body (10) is the same.

9. The circuit board according to claim 1, characterized in that, The receiving groove (11) is rectangular in shape, and has an opening and five inner walls. The conductive part (20) is exposed to the receiving groove (11) through the opening, and each of the inner walls abuts against the conductive part (20).

10. A battery comprising a cell, tabs, and a circuit board as described in any one of claims 1-9, wherein the tabs are disposed at the head of the cell, the side of the circuit board body (10) is disposed opposite to the head of the cell, and the conductive portion (20) is connected to the tabs.

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