A structure and heat dissipation integrated component

Abstract

This invention belongs to the field of heat transfer and heat dissipation component fabrication, specifically a component integrating structure and heat dissipation. The component basically comprises a thermally conductive non-metallic material layer, a non-curing thermal interface material layer, and a thermally conductive metallic material layer. The thermally conductive non-metallic material layer is located inside the component, the surface of the component is the thermally conductive metallic material layer, and the non-curing thermal interface material layer is located between the thermally conductive non-metallic material layer and the thermally conductive metallic layer. The thermally conductive non-metallic material layer and the thermally conductive metallic layer are relatively movable. By introducing a sliding interface and employing a non-curing thermal interface material layer, this component solves the reliability problem caused by thermal mismatch in existing composite materials. It possesses high strength, low thermal resistance, and high overall thermal conductivity, and can be used to fabricate components integrating structure and efficient heat dissipation functions, suitable for the heat transfer and heat dissipation fields of electronic devices.

Description

Technical Field

[0001] This utility model belongs to the field of heat transfer and heat dissipation component manufacturing, specifically a component integrating structure and heat dissipation. Background Technology

[0002] As electronic devices become more intelligent, miniaturized, lightweight, and highly integrated, heat accumulation causes a rapid rise in temperature. High thermal conductivity materials are needed to remove this heat from the inside, and heat sinks are used to dissipate it. Traditional high thermal conductivity materials mainly include aluminum, copper, graphite, and graphene. Heat sinks primarily use aluminum or copper, and their structures are generally made of metal or plastic.

[0003] While aluminum or copper can be used as integrated structural and heat dissipation components, their maximum thermal conductivity (237 W / mK for aluminum and 398 W / mK for copper) is insufficient to meet modern requirements for higher thermal conductivity. Therefore, current integrated structural and heat dissipation components with higher thermal conductivity utilize composite technology, combining aluminum or copper with materials of even higher thermal conductivity, such as copper and diamond or copper and graphite. Graphite, graphene, and diamond have low coefficients of thermal expansion, especially highly oriented graphite or graphene, which have negative coefficients of thermal expansion in the planar direction, while copper and aluminum have coefficients of thermal expansion of 17 × 10⁻⁶. -6 / ℃ and 23×10 -6 At temperatures ranging from 0°C to 100°C, copper and aluminum exhibit severe thermal mismatch and relative displacement with high thermal conductivity carbon materials, leading to significant component deformation, increased thermal resistance, and low overall thermal conductivity, thus hindering large-scale applications. Therefore, there is an urgent need to develop a method that can solve the thermal mismatch problem while reducing thermal resistance, resulting in a high-thermal-conductivity, high-reliability integrated structure and heat dissipation component.

[0004] The patent with publication number CN102516953A proposes a heat dissipation material with a graphite film and graphene composite structure and its implementation method. It uses a graphite film and a graphene layer to fix and composite the graphite film and graphene layer together with an adhesive or a metal layer to form a "graphene layer-graphite film layer-graphene layer" structure. It utilizes the composite effect of the graphite film layer and the graphene layer to improve heat dissipation performance, but it does not consider the problem caused by the difference in thermal expansion coefficient between the high thermal conductivity material and the metal material.

[0005] Patent CN118879280A discloses a thermally conductive interface material that combines a fluid thermally conductive medium with a constraint sheet made of a high thermal conductivity material to reduce contact thermal resistance and maintain good contact with the heat sink and heat-generating elements. However, the fluid medium is mechanically fixed by the constraint sheet, and its overflow is only limited by capillary force, but macroscopic relative movement between the high thermal conductivity material and the metal layer is not allowed, which cannot solve the problem of overall deformation caused by thermal mismatch.

[0006] The patent with publication number CN118156233A proposes a chip thermal conductive heat dissipation layer and its preparation method. It mainly achieves effective heat transfer of the heat-generating device through the structural design of a specific heat-generating unit, a thermal interface material layer and a heat dissipation unit. The heat conduction is achieved by forming an IMC layer with a metal plating layer and a steel sheet. However, the IMC layer is brittle and is prone to cracking during thermal cycling. Utility Model Content

[0007] To address the shortcomings of existing technologies, this invention proposes an integrated structural and heat dissipation component and its fabrication method. By introducing a sliding interface and employing a non-curing thermal interface material layer, the reliability problem caused by thermal mismatch in existing composite materials is solved.

[0008] The technical solution of this utility model is:

[0009] A component integrating structure and heat dissipation is disclosed. The component basically includes a thermally conductive non-metallic material layer, a non-curing thermal interface material layer, and a thermally conductive metallic material layer. The thermally conductive non-metallic material layer is placed inside the component, the surface of the component is a thermally conductive metallic material layer, and the non-curing thermal interface material layer is placed between the thermally conductive non-metallic material layer and the thermally conductive metallic material layer. The thermally conductive non-metallic material layer and the thermally conductive metallic material layer are movable relative to each other.

[0010] The aforementioned integrated structural and heat dissipation component basically comprises a thermally conductive non-metallic material layer, a non-curing thermal interface material layer, and a thermally conductive metallic material layer. Other material layers may be added as needed, and these additional material layers may be in the form of solid, liquid, or gas.

[0011] The aforementioned integrated structural and heat dissipation component has a thermal conductivity greater than 500 W / mK in one or more directions in its thermally conductive non-metallic material layer. The thermally conductive non-metallic material layer is made of one or more of the following materials: natural graphite, artificial graphite, graphene, diamond, boron nitride, and silicon carbide.

[0012] The aforementioned integrated structural and heat dissipation component has a non-cured thermal interface material layer with a thermal resistance of less than 60 mm. 2 • K / W, the non-curing thermal interface material layer adopts one or more of the following: thermal grease, thermal gel, thermal silicone pad, graphite pad, graphene pad, indium sheet, liquid metal, and the thickness of the non-curing thermal interface material layer ranges from 0.0001 to 10 mm.

[0013] Preferably, the thickness of the non-cured thermal interface material layer in the aforementioned integrated structural and heat dissipation component ranges from 0.001 to 1 mm.

[0014] The aforementioned integrated structural and heat dissipation component has a thermally conductive metal material layer that is one or more of the following: pure aluminum, aluminum alloy, pure copper, copper alloy, stainless steel, metallic silver, metallic titanium, and titanium alloy.

[0015] The aforementioned integrated structural and heat dissipation component has a thermally conductive non-metallic material layer thickness ranging from 0.01 to 100 mm, a thermally conductive metallic material layer thickness ranging from 0.01 to 100 mm, and a thermally conductive non-metallic material layer volume ratio ranging from 5% to 95%.

[0016] Preferably, the thickness of the thermally conductive non-metallic material layer in the aforementioned integrated structural and heat dissipation component ranges from 0.1 to 10 mm, the thickness of the thermally conductive metallic material layer ranges from 0.1 to 10 mm, and the volume ratio of the thermally conductive non-metallic material layer ranges from 20% to 90%.

[0017] The maximum relative movement distance between the thermally conductive non-metallic material layer and the thermally conductive metallic material layer in the aforementioned integrated structure and heat dissipation component is 0.1–10 mm.

[0018] The design concept of this utility model is:

[0019] In existing technologies, composite structures of high thermal conductivity materials and metals are typically connected via cured interfaces (such as welding or adhesives), which cannot accommodate differences in thermal expansion. This invention addresses this issue by using a non-cured thermal interface material layer to form a sliding interface. This non-cured thermal interface material layer (such as thermally conductive silicone grease or liquid metal) simultaneously reduces contact thermal resistance and provides sliding space, allowing relative movement between the high thermal conductivity non-metallic material layer and the thermally conductive metallic material layer (maximum movement distance 0.1–10 mm). This dynamically releases thermal stress. The non-cured thermal interface material does not require a curing reaction, avoiding a brittle interface layer. This approach balances thermal conductivity efficiency and reliability, solving the core problem of thermal expansion mismatch between high thermal conductivity carbon materials and metals.

[0020] This invention integrates a thermally conductive metal material layer as a structural element, achieving a unified "structure-heat dissipation" system and reducing the number of components. Furthermore, it integrates a sliding interface with the structural element, using a high thermal conductivity non-metallic material layer (such as graphene) as a heat transfer channel and the thermally conductive metal material layer as the structural element, connected by a non-curing medium to achieve a synergistic effect of "thermal conductivity and structure."

[0021] The advantages and beneficial effects of this utility model are:

[0022] 1. This utility model integrates structural and heat dissipation functions by constructing a metal structure and building a heat transfer channel through a layer of highly thermally conductive non-metallic material. The integrated structural and heat dissipation component refers to a novel functional material or device that integrates structural support and heat conduction / dissipation functions into a single component. Its core lies in using material composites and interface design to enable the component to withstand mechanical loads while efficiently transferring and dissipating heat, thus solving problems such as volume redundancy, high interface thermal resistance, and thermal mismatch inherent in traditional separate structural and heat dissipation designs.

[0023] 2. This utility model uses materials with ultra-high thermal conductivity (>500W / mK) and controls the proportion of thermally conductive metal material layer to a minimum of 10%, which significantly improves the thermal conductivity compared to pure metal.

[0024] 3. This utility model introduces a non-curing thermal interface material layer to separate the high thermal conductivity non-metallic material layer from the thermally conductive metal material layer, thereby creating a sliding channel and solving the problems of deformation and increased thermal resistance caused by thermal adaptation between the high thermal conductivity non-metallic material layer and the thermally conductive metal material layer. Attached Figure Description

[0025] Figures 1-5 This is a schematic diagram of the basic configuration of the integrated structure and heat dissipation component of this utility model; wherein, Figure 1 Main view, Figure 2 This is a top view. Figure 3 It is a 3D image. Figure 4 for Figure 2 AA section view in the middle, Figure 5 for Figure 4 Enlarged view of point B in the image. In the image, 1-thermal conductive non-metallic material layer, 2-non-cured thermal interface material layer, 3-thermal conductive metallic material layer.

[0026] Figures 6-12 This is a schematic diagram of the integrated heat dissipation component structure of Embodiment 2 of this utility model; wherein, Figure 6 Main view, Figure 7 It is a bottom view. Figure 8 This is a top view. Figure 9 This is a side view. Figure 10 It is a 3D image. Figure 11 for Figure 8 CC cross-section in the middle, Figure 12 for Figure 11 Enlarged view of point D in the image. In the image, 1-thermally conductive non-metallic material layer, 2-non-cured thermal interface material layer, 3-thermally conductive metallic material layer, 4-heat dissipation fins, 5-connecting chip bump.

[0027] Figures 13-18 This is a schematic diagram of the integrated heat dissipation component structure of Embodiment 3 of this utility model; wherein, Figure 13 Main view, Figure 14 This is a top view. Figure 15 for Figure 14 EE cross-section diagram in the middle, Figure 16 This is a side view. Figure 17 It is a 3D image. Figure 18 for Figure 15 Enlarged view of point F in the image. In the image, 1-thermal conductive non-metallic material layer, 2-non-cured thermal interface material layer, 3-thermal conductive metallic material layer. Detailed Implementation

[0028] like Figures 1-18 As shown, this utility model proposes an integrated structural and heat dissipation component. This component basically comprises a thermally conductive non-metallic material layer 1, a non-curing thermal interface material layer 2, and a thermally conductive metallic material layer 3. The thermally conductive non-metallic material layer 1 is located inside the component, the surface of the component is the thermally conductive metallic material layer 3, and the non-curing thermal interface material layer 2 is located between the thermally conductive non-metallic material layer 1 and the thermally conductive metallic material layer 3. The thermally conductive non-metallic material layer 1 and the thermally conductive metallic material layer 3 are relatively movable. This component can be directly assembled and formed by mechanical fixing, or it can be placed in a mold and pressed to ensure close contact between the thermally conductive non-metallic material layer, the thermally conductive metallic layer, and the non-curing thermal interface material layer.

[0029] The specific embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following three examples are for the purpose of illustrating this utility model, but should not be used to limit the scope of this utility model.

[0030] Example 1

[0031] like Figures 1-5 As shown, this embodiment uses a composite material that integrates structure and heat dissipation. The composite material has external dimensions of 100×300×1mm. A thermally conductive non-metallic material layer 1 is placed inside the composite material, and a thermally conductive metallic material layer 3 is placed on the surface of the composite material. A non-curing thermal interface material layer 2 is placed between the thermally conductive non-metallic material layer 1 and the thermally conductive metallic material layer 3. The thermally conductive non-metallic material layer 1 and the thermally conductive metallic material layer 3 are movable relative to each other. The upper thermally conductive metallic material layer has a groove-shaped structure, and the lower thermally conductive metallic material layer has a flat structure corresponding to the groove. Both the upper and lower non-curing thermal interface material layers are flat structures. The upper thermally conductive metallic material layer is covered by the groove and fastened to the outside of the thermally conductive metallic material layer and the thermally conductive non-metallic material layer.

[0032] The thermally conductive non-metallic material layer is a graphene plate with a thickness of 0.6 mm, a horizontal thermal conductivity of 1450 W / mK, and a vertical thermal conductivity of 8 W / mK. The non-cured thermal interface material layer is thermally conductive silicone grease with a thermal resistance of 7 mm. 2 ·K / W, thickness is 0.04mm, the thermally conductive metal material layer is 6061 aluminum alloy, the thickness of the upper and lower thermally conductive metal material layers is 0.16mm, the volume ratio of the thermally conductive non-metallic material layer is 60%, and the maximum relative movement between the thermally conductive non-metallic material layer and the thermally conductive metal material layer is 2mm.

[0033] In this embodiment, the composite material has a horizontal thermal conductivity of 910 W / mK and a vertical thermal resistance of 83 mm. 2 ·K / W.

[0034] Example 2

[0035] like Figures 6-12 As shown, this embodiment employs a heat sink that integrates structure and heat dissipation, with external dimensions of 100×100×12mm. A thermally conductive non-metallic material layer 1 is placed inside the heat sink, while the surface of the heat sink is a thermally conductive metallic material layer 3. A non-cured thermal interface material layer 2 is placed between the thermally conductive non-metallic material layer 1 and the thermally conductive metallic material layer 3. The thermally conductive non-metallic material layer 1 and the thermally conductive metallic material layer 3 are movable relative to each other. The lower thermally conductive metallic material layer has a groove on one side and heat dissipation fins 4 on the other. The upper thermally conductive metallic material layer has a flat structure with a chip-connecting protrusion 5 on one side and a corresponding groove on the other. Both the upper and lower non-cured thermal interface material layers are flat structures. The lower thermally conductive metallic material layer is secured to the outside of the thermally conductive metallic material layer and the thermally conductive non-metallic material layer by a groove.

[0036] The thermally conductive non-metallic material layer is a graphene plate with a thickness of 1mm, exhibiting a horizontal thermal conductivity of 1450W / mK and a vertical thermal conductivity of 8W / mK. The non-cured thermal interface material layer is a graphene thermally conductive pad with a thermal resistance of 13mm. 2 • K / W, thickness 0.06mm, thermally conductive metal layer is 6061 aluminum alloy, thermally conductive metal layer with heat dissipation fins is 0.5mm thick, thermally conductive metal layer with connecting chip bumps is 0.3mm thick. Thermally conductive non-metallic material layer accounts for 32% of the volume, and the maximum relative movement between the thermally conductive non-metallic material layer and the thermally conductive metal material layer is 1mm.

[0037] In this embodiment, the overall horizontal thermal conductivity of the heat sink substrate is 820 W / mK, and the overall vertical thermal resistance is 142 mm. 2 ·K / W.

[0038] Example 3

[0039] like Figures 13-18 As shown, this embodiment uses a heat-conducting tape that integrates structure and heat dissipation, with external dimensions of 130×32×31mm. A thermally conductive non-metallic material layer 1 is placed inside the heat-conducting tape, and a thermally conductive metallic material layer 3 forms the surface of the heat-conducting tape. A non-curing thermal interface material layer 2 is placed between the thermally conductive non-metallic material layer 1 and the thermally conductive metallic material layer 3. The thermally conductive non-metallic material layer 1 and the thermally conductive metallic material layer 3 are movable relative to each other. Both the lower and upper thermally conductive metallic material layers are strip-shaped structures, as are both the upper and lower non-curing thermal interface material layers. A non-curing thermal interface material layer and a thermally conductive metallic layer are symmetrically arranged on both sides of the strip-shaped thermally conductive non-metallic material layer.

[0040] The thermally conductive non-metallic material layer is a graphene plate with a thickness of 0.5 mm, a horizontal thermal conductivity of 1450 W / mK, and a vertical thermal conductivity of 8 W / mK. The non-cured thermal interface material layer is a graphene thermally conductive pad with a thermal resistance of 10 mm. 2 ·K / W, thickness is 0.05mm, the thermally conductive metal material layer is 1060 aluminum alloy, the thickness of the upper and lower thermally conductive metal material layers is 0.2mm, the volume ratio of the thermally conductive non-metallic material layer is 46%, and the maximum relative movement between the thermally conductive non-metallic material layer and the thermally conductive metal material layer is 2mm.

[0041] In this embodiment, the horizontal thermal conductivity of the heat-conducting substrate is 800 W / mK, and the vertical thermal resistance is 75 mm. 2 ·K / W.

[0042] As can be seen from Examples 1-3, this invention forms a sliding interface between a thermally conductive non-metallic material layer (such as a graphene plate) and a thermally conductive metallic material layer (such as 6061 aluminum alloy, 1060 aluminum alloy) using a non-curing thermal interface material layer (such as thermally conductive silicone grease, graphene thermal pad, etc.). The volume ratio of the thermally conductive non-metallic material layer is 32-60%, allowing the two layers to move relative to each other by 1-2 mm during alternating hot and cold temperatures. The overall thermal conductivity of the thermally conductive substrate in the horizontal direction is 800-910 W / mK, and the overall thermal resistance in the vertical direction is 75-142 mm. 2 The K / W ratio completely solves the problems of interface deformation and increased thermal resistance caused by differences in thermal expansion coefficients, enabling the creation of integrated structural and heat dissipation components. These components feature high strength, low thermal resistance, and high overall thermal conductivity, and can be used to fabricate integrated structural and efficient heat dissipation components suitable for heat transfer and heat dissipation in electronic devices. The three examples above further illustrate this invention. Any modifications and improvements to the materials used in each component, while satisfying the conditions in the claims, should also be considered within the scope of protection of this invention.

Claims

1. A component integrating structure and heat dissipation, characterized in that, The component basically consists of a thermally conductive non-metallic material layer, a non-curing thermal interface material layer, and a thermally conductive metallic material layer. The thermally conductive non-metallic material layer is located inside the component, the surface of the component is a thermally conductive metallic material layer, and the non-curing thermal interface material layer is located between the thermally conductive non-metallic material layer and the thermally conductive metallic material layer. The thermally conductive non-metallic material layer and the thermally conductive metallic material layer can move relative to each other.

2. The integrated structure and heat dissipation component according to claim 1, characterized in that, The component basically includes a thermally conductive non-metallic material layer, a non-curing thermal interface material layer, and a thermally conductive metallic material layer. Other material layers can be added on the basis of the above three materials as needed. The form of the added other material layers can be solid, liquid, or gas.

3. The integrated structure and heat dissipation component according to claim 1, characterized in that, The thermally conductive non-metallic material layer adopts one or more of the following: natural graphite, artificial graphite, graphene, diamond, boron nitride, and silicon carbide.

4. The integrated structure and heat dissipation component according to claim 1, characterized in that, The non-curing thermal interface material layer adopts one or more of the following: thermal grease, thermal gel, thermal silicone pad, graphite pad, graphene pad, indium sheet, and liquid metal. The thickness of the non-curing thermal interface material layer ranges from 0.0001 to 10 mm.

5. The integrated structure and heat dissipation component according to claim 1, characterized in that, The thermally conductive metal material layer is one or more of the following: pure aluminum, aluminum alloy, pure copper, copper alloy, stainless steel, metallic silver, metallic titanium, and titanium alloy.

6. The integrated structure and heat dissipation component according to claim 1, characterized in that, The thickness of the thermally conductive non-metallic material layer ranges from 0.01 to 100 mm, the thickness of the thermally conductive metallic material layer ranges from 0.01 to 100 mm, and the volume ratio of the thermally conductive non-metallic material layer ranges from 5% to 95%.

7. The integrated structure and heat dissipation component according to claim 1, characterized in that, The maximum relative movement distance between the thermally conductive non-metallic material layer and the thermally conductive metallic material layer ranges from 0.1 to 10 mm.

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