A packaging frame

Abstract

This utility model discloses a packaging frame, including a frame body, a first base island, and a second base island for mounting components. The first and second base islands are respectively disposed on the frame body. A wafer for mounting an optical sensor is disposed on the first base island, and a dam for blocking adhesive is provided around the first base island. The second base island is provided with a groove for preventing short circuits in the components. This design improves integration, airtightness, and prevents adhesive from overflowing into the first base island.

Description

Technical Field

[0001] This utility model relates to the field of packaging technology, and in particular to a packaging frame based on an optical sensor. Background Technology

[0002] Optical sensors are sensors that measure based on optical principles. They have features such as non-contact and non-destructive measurement, minimal interference, high-speed transmission, and remote measurement and control capabilities. Most optical sensors are equipped with a packaging frame.

[0003] Traditional packaging frameworks can only encapsulate wafers and cannot encapsulate other electronic components. The types of packaged devices are limited and the integration is low.

[0004] In traditionally packaged optical sensors, if too little adhesive is applied to the top cover, it can lead to problems such as weak adhesion and poor airtightness. If too much adhesive is applied, it can easily overflow onto the base island, affecting the installation of components on the base island. Utility Model Content

[0005] In order to overcome the shortcomings of the prior art, the purpose of this utility model is to provide a packaging frame that can improve integration, airtightness and prevent glue from overflowing onto the base island.

[0006] The objective of this utility model is achieved through the following technical solution:

[0007] An encapsulation frame includes a frame body, a first base island, and a second base island for mounting components. The first base island and the second base island are respectively disposed on the frame body. A wafer for mounting an optical sensor is disposed on the first base island. A dam for blocking adhesive is disposed around the first base island. A groove for preventing short circuits of components is disposed on the second base island.

[0008] Preferably, the encapsulation frame further includes a cover for protecting the first base island.

[0009] Preferably, the cover is a light-shielding cover, and the dam is arranged around the light-shielding cover.

[0010] Preferably, the lid includes an annular hole in the middle, and a central hole is provided at the center of the annular hole.

[0011] Preferably, the second base island includes an adhesive layer for protecting the components, the adhesive layer covering the components.

[0012] Preferably, both the first base island and the second base island are provided with multiple pin lines, and the groove is disposed between two pin lines.

[0013] Preferably, the groove is provided with a support post that facilitates the installation of components, and the support is disposed between the groove walls.

[0014] Preferably, the packaging frame further includes a substrate, and the frame body is fixed on the substrate.

[0015] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0016] The packaging frame disclosed in this utility model includes a first base island and a second base island. The first base island is provided with a first dam for blocking adhesive, which allows for multiple application of adhesive, thereby improving the airtightness of the packaging and preventing adhesive from overflowing onto the first base island and affecting the installation of components. The second base island can install other electronic components, thereby improving the integration of the packaging.

[0017] In addition, the groove can prevent short circuits in the pins of components, and a protective adhesive layer can be placed inside the groove, thereby improving reliability. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the planar structure of the packaging frame of this utility model;

[0019] Figure 2 This is a schematic diagram of the planar structure of the packaging frame after the cover is installed.

[0020] Figure 3 This is a schematic diagram of the side structure of the groove of this utility model.

[0021] In the diagram: 100, packaging frame; 10, frame body; 20, first base island; 21, dam; 22, wafer; 23, lead line; 30, second base island; 31, groove; 311, support pillar; 312, groove wall; 32, capacitor; 40, cover; 41, annular hole; 42, center hole. Detailed Implementation

[0022] The present invention will now be further described in conjunction with the accompanying drawings and specific embodiments:

[0023] In the description of this utility model, it should be noted that the terms "upper," "lower," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of describing this utility model and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," and "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0024] Implementation Method 1

[0025] like Figures 1-2 As shown, the present application discloses a packaging frame 100, including a frame body 10, a first base island 20 and a second base island 30 for mounting components. The first base island 20 and the second base island 30 are respectively disposed on the frame body 10. A wafer 22 for mounting an optical sensor is disposed on the first base island 20. A dam 21 for blocking adhesive is disposed around the first base island 20. A groove 31 for preventing short circuits of components is disposed on the second base island 30.

[0026] In the above embodiment, the packaging frame 100 includes a first base island 20 and a second base island 30. The first base island 20 is provided with a dam 21 for blocking adhesive, which allows for more adhesive to be applied when applying adhesive to the cover 40, thereby improving the airtightness of the packaging and preventing adhesive from overflowing onto the first base island 20 and affecting the installation of components. The second base island 30 can accommodate more other electronic components, such as capacitors and resistors, thereby improving the integration of the packaging.

[0027] In addition, the groove 31 can prevent short circuits of the component pins, and a protective adhesive layer (not shown) can be provided in the groove to improve reliability.

[0028] Implementation Method 2

[0029] In a preferred embodiment, such as Figures 1-2 As shown, the encapsulation frame 100 also includes a cover 40 for protecting the first base island 20. The cover 40 is a light-shielding cover, and the dam 21 is disposed around the light-shielding cover. Preferably, the cover 40 has an annular hole 41 in the center that facilitates installation, and a central hole 42 is provided at the center of the annular hole 41.

[0030] In the above embodiment, the cover 40 is a light-shielding cover that can block external light and prevent exposure or the influence of external light on the photosensitive sensor. The cover 40 can be snapped onto the first base island 20 through the annular hole 41. The central hole 42 facilitates observation of the state of the wafer or the photosensitive body.

[0031] Implementation Method 3

[0032] In a preferred embodiment, such as Figure 1 As shown, both the first base island 20 and the second base island 30 are provided with multiple pin lines 23, and the groove 31 is disposed between two pin lines 23. Preferably, the groove 31 is provided with a support post 311 that facilitates the installation of components, and the support post 311 is disposed between the groove walls 312 of the groove 31. Figures 2-3 As shown, the encapsulation frame 100 further includes a substrate, the frame body 10 is fixed to the substrate, and the dam 21 can be fixed to the substrate. The second base island 30 includes an adhesive layer for protecting the components (capacitors), the adhesive layer covering the components.

[0033] In the above embodiment, the lead wire 23 can be electrically connected or soldered to the lead of the component via conductive adhesive. The groove 31 can prevent overflowing conductive adhesive from electrically connecting the lead at both ends of the component, thus preventing a short circuit. The support column 311 can support the component, facilitating component installation. The substrate can serve as the base of the frame body 10, and the first base island 20 and the second base island 30 can be disposed on the substrate.

[0034] After components such as resistors or capacitors are mounted on the groove 31, an adhesive layer is formed by applying glue to the second base island 30 to cover the capacitor, thus protecting the capacitor. This adhesive layer prevents the capacitor from being directly exposed and thus avoiding damage during subsequent production and application.

[0035] In summary, the packaging framework disclosed in this application can integrate not only photosensitive wafers through the first base island 20, but also components such as capacitors and resistors through the second base island 30. The first base island 20 is surrounded by a dam 21, which can prevent adhesive overflow and increase the airtightness of the optical sensor. The second base island 30 is also provided with a groove 31 between the pins of the capacitors 32 or resistors and other components attached to it. The groove 31 can prevent conductive adhesive from overflowing and causing short circuits in the pins of the components, thereby improving reliability and practicality.

[0036] For those skilled in the art, various other corresponding changes and modifications can be made based on the technical solutions and concepts described above, and all such changes and modifications should fall within the protection scope of the claims of this utility model.

Claims

1. An encapsulation framework, characterized in that: The device includes a frame body, a first base island, and a second base island for mounting components. The first base island and the second base island are respectively disposed on the frame body. A wafer for mounting an optical sensor is disposed on the first base island. A dam for blocking adhesive is disposed around the first base island. A groove for preventing short circuits of components is disposed on the second base island.

2. The encapsulation frame according to claim 1, characterized in that: The encapsulation frame also includes a cover for protecting the first base island.

3. The encapsulation framework according to claim 2, characterized in that: The cover is a light-blocking cover, and the dam is set around the light-blocking cover.

4. The packaging frame according to claim 3, characterized in that: The lid includes an annular hole in the middle, and a central hole is provided at the center of the annular hole.

5. The packaging frame according to claim 4, characterized in that: The second base island includes an adhesive layer for protecting the components, the adhesive layer covering the components.

6. The encapsulation framework according to claim 1, characterized in that: Both the first base island and the second base island are provided with multiple pin lines, and the groove is disposed between two pin lines.

7. The encapsulation frame according to claim 6, characterized in that: The groove is provided with support posts that facilitate the installation of components, and the support posts are disposed between the groove walls.

8. The encapsulation framework according to claim 1, characterized in that: The packaging frame also includes a substrate, and the frame body is fixed on the substrate.

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