Ultrasonic diagnostic apparatus

Abstract

Embodiments relate to an ultrasonic diagnostic apparatus. The number of probe connection terminal sections can be increased without making the apparatus as a whole large, and an ultrasonic probe can be easily plugged in and unplugged. An ultrasonic diagnostic apparatus according to the embodiments is provided with an apparatus main body. In the apparatus main body, a plurality of probe connection terminal sections connected to a connector of an ultrasonic probe are arranged in one direction in the front surface. At least one of the plurality of probe connection terminal sections is arranged at a position offset in another direction intersecting the one direction.

Description

[0001] Reference for related applications:

[0002] This application enjoys the benefit of priority to Japanese Patent Application No. 2024-068948, filed on April 22, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The embodiments disclosed in this specification and accompanying drawings relate to ultrasound diagnostic devices. Background Technology

[0004] An ultrasonic diagnostic device is known in which, during the examination of a subject, a user performs an ultrasonic scan using an ultrasonic probe, thereby generating an ultrasonic image of the subject. In the ultrasonic diagnostic device, multiple probe connection terminals are provided on the front side of the device body. These multiple probe connection terminals are connectors on the device body side that connect to the connectors of the ultrasonic probes. Typically, the multiple probe connection terminals are arranged in a single row, for example, horizontally or vertically.

[0005] Due to the diverse range of examinations, there is a tendency to increase the number of probe connection terminals mounted on ultrasonic diagnostic devices. When the number of probe connection terminals is increased horizontally or vertically, the spacing between them becomes narrower due to their dense arrangement. This makes it difficult for the user to insert and remove the ultrasonic probe connector relative to the connection terminals, reducing user efficiency. Furthermore, the narrowing spacing between the probe connection terminals complicates the wiring on the substrate housing them. Increasing the width or height of the device body to avoid complicating the wiring results in a larger overall device size. Utility Model Content

[0006] One of the problems that the embodiments disclosed in this specification and accompanying drawings aim to solve is that the number of probe connection terminals can be increased without increasing the overall size of the device, and the ultrasonic probe can be easily plugged in and removed. However, the problems solved by the embodiments disclosed in this specification and accompanying drawings are not limited to the above-mentioned problems. Problems corresponding to the effects of the various configurations shown in the embodiments described below can also be identified as other problems.

[0007] The ultrasonic diagnostic apparatus according to this embodiment includes an apparatus body. In the apparatus body, a plurality of probe connection terminals, which are connected to connectors of ultrasonic probes, are arranged in one direction. At least one of the plurality of probe connection terminals is positioned offset from other directions intersecting the first direction.

[0008] Furthermore, in the aforementioned ultrasonic diagnostic device, the plurality of probe connection terminals may be arranged at intervals from each other in one direction, the positions of the two probe connection terminals at both ends of the plurality of probe connection terminals may be the same in other directions, and the position of at least one of the probe connection terminals other than the two probe connection terminals at both ends may be different from the position of the two probe connection terminals at both ends in other directions.

[0009] Furthermore, in the aforementioned ultrasonic diagnostic device, the positions of the probe connection terminals other than the two probe connection terminals at both ends may be the same in other directions, while the positions of the two probe connection terminals at both ends may be different in other directions from the positions of the probe connection terminals other than the two probe connection terminals at both ends.

[0010] Furthermore, in the aforementioned ultrasonic diagnostic device, the positions of adjacent probe connection terminals may differ in other directions, except for the two probe connection terminals at both ends.

[0011] Furthermore, in the aforementioned ultrasonic diagnostic device, the plurality of probe connection terminals may be arranged at intervals from each other in one direction, and the positions of adjacent probe connection terminals may differ in other directions.

[0012] Furthermore, in the aforementioned ultrasonic diagnostic device, the positions of probe connection terminals located symmetrically with respect to the arrangement center may be the same in other directions, while the positions of probe connection terminals located asymmetrically with respect to the arrangement center may be different in other directions.

[0013] Furthermore, in the aforementioned ultrasonic diagnostic device, the multiple probe connection terminals may be arranged in a V-shape.

[0014] Furthermore, in the aforementioned ultrasonic diagnostic device, at least two of the plurality of probe connection terminals may be located at the same position in one direction and at different positions in the other directions.

[0015] Utility model effect:

[0016] According to the ultrasonic diagnostic apparatus of this embodiment, the number of probe connection terminals can be increased without increasing the overall size of the apparatus, making it easier to insert and remove the ultrasonic probe. Attached Figure Description

[0017] Figure 1 This is a schematic diagram showing the appearance of the ultrasonic diagnostic device according to this embodiment.

[0018] Figure 2 This is a block diagram illustrating an example configuration of the ultrasound diagnostic apparatus according to this embodiment.

[0019] Figure 3A This is a front view of the housing in the main body of the ultrasonic diagnostic apparatus according to this embodiment, in which multiple probe connection terminals are arranged.

[0020] Figure 3B Is as Figure 3A The front view of the substrate portion inside the main body of the device when the casing is removed.

[0021] Figure 4A This is a front view of the housing of the ultrasonic diagnostic apparatus according to the first variation of this embodiment, in which a plurality of probe connection terminals are arranged in the main body of the apparatus.

[0022] Figure 4B Is as Figure 4A The front view of the substrate portion inside the main body of the device when the casing is removed.

[0023] Figure 5A This is a front view of the housing of the ultrasonic diagnostic apparatus according to the second variation of this embodiment, in which a plurality of probe connection terminals are arranged in the main body of the apparatus.

[0024] Figure 5B Is as Figure 5A The front view of the substrate portion inside the main body of the device when the casing is removed.

[0025] Figure 6A This is a front view of the housing of the ultrasonic diagnostic apparatus according to the third variation of this embodiment, in which a plurality of probe connection terminals are arranged in the main body of the apparatus.

[0026] Figure 6B Is as Figure 6A The front view of the substrate portion inside the main body of the device when the casing is removed.

[0027] Figure 7A This is a diagram illustrating an example of the configuration of multiple probe connection terminals. It is a front view of a housing in the main body of an ultrasonic diagnostic apparatus in which multiple probe connection terminals are configured.

[0028] Figure 7B Is as Figure 7A The front view of the substrate portion inside the main body of the device when the casing is removed. Detailed Implementation

[0029] The ultrasonic diagnostic apparatus according to the embodiments will now be described with reference to the accompanying drawings. Furthermore, the embodiments are not limited to those described below. In addition, the content described in one embodiment is generally applicable to other embodiments as well.

[0030] Figure 1 This is a schematic diagram showing the appearance of the ultrasonic diagnostic device 1 according to this embodiment. Figure 2 This is a block diagram illustrating a configuration example of the ultrasonic diagnostic apparatus 1 according to this embodiment. Here, Figure 1 Omitted Figure 2 The diagram shows the ultrasonic probe 101. Figure 2 Omitted Figure 1 The illustration shows the caster 104, the probe head holder 105, and the probe connection terminal 200.

[0031] like Figure 1 As shown, the ultrasonic diagnostic apparatus 1 according to this embodiment includes an apparatus body 100, an input device 102, a display 103, casters 104, a probe head holding part 105, and a plurality of probe connection terminal parts 200.

[0032] At the lower part of the device body 100, casters 104 are provided, which enable the device body 100 to move. At the upper part of the device body 100, an input device 102 is provided, which serves as an operation panel. Above the device body 100, a display 103 is mounted.

[0033] On the side of the input device 102, a probe head holding part 105 is provided for holding the head of the ultrasonic probe. Additionally, on the front side of the device body 100, a plurality of probe connection terminal parts 200 are provided. These plurality of probe connection terminal parts 200 are connectors on the device body 100 side that connect to the connectors of the ultrasonic probes. Details regarding the configuration of the plurality of probe connection terminal parts 200 will be described later.

[0034] like Figure 2 As shown, the ultrasonic diagnostic device 1 according to this embodiment also includes an ultrasonic probe 101. The ultrasonic probe 101, the input device 102, and the display 103 are respectively connected to the device body 100.

[0035] The ultrasound probe 101 performs ultrasound transmission and reception (ultrasound scanning). For example, the ultrasound probe 101 contacts the body surface of the subject P (e.g., the abdomen of a pregnant woman) and performs ultrasound transmission and reception to an area including at least a portion of the fetus within the pregnant woman's uterus. The ultrasound probe 101 has multiple piezoelectric resonators. The multiple piezoelectric resonators are piezoelectric elements having a piezoelectric effect that converts electrical signals (pulse voltage) and mechanical vibrations (sound-based vibrations) to each other, and generate ultrasound waves based on a drive signal (electrical signal) supplied from the device body 100. The generated ultrasound waves are reflected at the unconformity surface of the acoustic impedance within the subject P, and are received by the multiple piezoelectric resonators as reflected wave signals (electrical signals), including components scattered by scatterers within the tissue. The ultrasound probe 101 transmits the reflected wave signals received by the multiple piezoelectric resonators back to the device body 100.

[0036] Furthermore, in this embodiment, the ultrasonic probe 101 may also be a 1D array probe having a plurality of piezoelectric vibrators arranged in one dimension in a predetermined direction, or a 2D array probe having a plurality of piezoelectric vibrators arranged in a grid pattern in two dimensions. Alternatively, the ultrasonic probe 101 may also be a mechanical 4D probe, which scans a three-dimensional region by mechanically oscillating a plurality of piezoelectric vibrators arranged in one dimension, or any other type of ultrasonic probe.

[0037] The input device 102 includes a mouse, keyboard, buttons, panel switches, touch command screen, foot switch, wheel switch, trackball, joystick, etc. The input device 102 accepts various setting requests from the operator of the ultrasound diagnostic device 1 and forwards these requests to the device body 100.

[0038] The display 103 shows a GUI (Graphical User Interface) for the operator of the ultrasound diagnostic device 1 to input various setting requests using the input device 102, or displays ultrasound image data generated in the device body 100. In addition, the display 103 displays various messages to inform the operator of the processing status of the device body 100.

[0039] The main body 100 is a device for generating ultrasonic image data based on the reflected wave signals received by the ultrasonic probe 101. The ultrasonic image data generated by the main body 100 can be either two-dimensional ultrasonic image data generated based on two-dimensional reflected wave signals or three-dimensional ultrasonic image data generated based on three-dimensional reflected wave signals.

[0040] like Figure 2 As shown, the main body of the device 100 includes, for example, a transceiver circuit 110, a B-mode processing circuit 120, a Doppler processing circuit 130, an image processing circuit 140, an image memory 150, a storage circuit 160, and a control circuit 170. The transceiver circuit 110, the B-mode processing circuit 120, the Doppler processing circuit 130, the image processing circuit 140, the image memory 150, the storage circuit 160, and the control circuit 170 are interconnected in a communicative manner. Furthermore, the main body of the device 100 is connected to a network 2 within the hospital.

[0041] The transceiver circuit 110 controls the transmission of ultrasonic waves by the ultrasonic probe 101. For example, based on the instruction of the control circuit 170, the transceiver circuit 110 applies the aforementioned drive signal (drive pulse) to the ultrasonic probe 101 at a timing that assigns a predetermined transmission delay time to each oscillator. Thus, the transceiver circuit 110 causes the ultrasonic probe 101 to transmit an ultrasonic beam formed by the convergence of ultrasonic waves. Additionally, the transceiver circuit 110 controls the ultrasonic probe 101 to receive reflected wave signals. The reflected wave signals are signals formed by the reflection of ultrasonic waves transmitted from the ultrasonic probe 101 onto the internal tissues of the subject P.

[0042] The B-mode processing circuit 120 performs various signal processing operations on the reflected wave data generated by the transceiver circuit 110 based on the reflected wave signal. The B-mode processing circuit 120 performs logarithmic amplification, envelope detection, and other processing on the reflected wave data received from the transceiver circuit 110 to generate data (B-mode data) representing the signal strength of each sample point (observation point) as a measure of brightness. The B-mode processing circuit 120 then sends the generated B-mode data to the image processing circuit 140.

[0043] The Doppler processing circuit 130 generates Doppler data based on the reflected wave data generated from the reflected wave signal by the transceiver circuit 110, extracting motion information based on the Doppler effect of the moving body at each sample point within the scanning area. Here, the motion information of the moving body includes information such as the average velocity, variance, and power value of the moving body; the moving body may be, for example, blood flow, tissue such as the heart wall, or a contrast agent. The Doppler processing circuit 130 sends the generated Doppler data to the image processing circuit 140. For example, if the moving body is blood flow, the motion information of the blood flow includes information such as the average velocity, variance, and power value of the blood flow (blood flow information). The blood flow information is obtained, for example, using color Doppler imaging.

[0044] The image processing circuit 140 performs image data (ultrasound image data) generation and various image processing operations on the image data. For example, based on the two-dimensional B-mode data generated by the B-mode processing circuit 120, the image processing circuit 140 generates two-dimensional B-mode image data, where brightness represents the intensity of the reflected wave. Additionally, based on the two-dimensional Doppler data generated by the Doppler processing circuit 130, the image processing circuit 140 generates two-dimensional Doppler image data that transforms blood flow information into an image. The two-dimensional Doppler image data can be velocity image data representing the average velocity of blood flow, variance image data representing the variance of blood flow, energy image data representing blood flow, or a combination of these. The image processing circuit 140 generates color Doppler image data that displays blood flow information such as average velocity, variance, and energy in color, or generates Doppler image data that displays one piece of blood flow information in grayscale, as Doppler image data.

[0045] B-mode data and Doppler data are ultrasound image data before scanning conversion processing. The data generated by the image processing circuit 140 is the ultrasound image data for display after scanning conversion processing. Furthermore, B-mode data and Doppler data are also referred to as raw data. The image processing circuit 140 generates two-dimensional ultrasound image data for display based on the two-dimensional ultrasound image data before scanning conversion processing.

[0046] Furthermore, the image processing circuit 140 performs coordinate transformation on the three-dimensional B-mode data generated by the B-mode processing circuit 120 to generate three-dimensional B-mode image data. Additionally, the image processing circuit 140 performs coordinate transformation on the three-dimensional Doppler data generated by the Doppler processing circuit 130 to generate three-dimensional Doppler image data.

[0047] Furthermore, the image processing circuit 140 performs rendering processing on the volume image data to generate various two-dimensional image data for displaying volume image data on the display 103. For example, the rendering processing performed by the image processing circuit 140 includes generating MPR image data from the volume image data by performing Multi Plane Reconstruction (MPR). Additionally, the rendering processing performed by the image processing circuit 140 includes volume rendering (VR) processing to generate two-dimensional image data reflecting three-dimensional image information. Furthermore, the rendering processing performed by the image processing circuit 140 includes surface rendering (SR) processing to generate two-dimensional image data obtained by extracting only the surface information of the three-dimensional image.

[0048] The image processing circuit 140 stores the generated image data or the image data after various image processing into the image memory 150. In addition, the image processing circuit 140 may also generate, along with the image data, information indicating the display position of each image data, various information to assist in the operation of the ultrasound diagnostic device 1, patient information, and other diagnostic-related ancillary information, and store them into the image memory 150.

[0049] The image memory 150 and the storage circuit 160 are, for example, semiconductor memory elements such as RAM (Random Access Memory) and Flash Memory, or storage devices such as hard disks and optical discs.

[0050] Image memory 150 is a memory that stores image data such as B-mode image data or Doppler image data generated by image processing circuit 140 as ultrasound image data. Additionally, image memory 150 can also store image data such as B-mode data generated by B-mode processing circuit 120 or Doppler data generated by Doppler processing circuit 130 as ultrasound image data. The ultrasound image data stored in image memory 150 can be retrieved by the operator after diagnosis and displayed via image processing circuit 140.

[0051] The storage circuit 160 stores various data, including control programs for ultrasound transceiver, image processing, and display processing; diagnostic information (such as patient ID, physician's findings); diagnostic protocols; and various body marks. Furthermore, the data stored in the storage circuit 160 can be forwarded to external devices via an interface (not shown). External devices may include, for example, a PC (Personal Computer) used by the physician performing the image diagnosis, storage media such as CDs or DVDs, or a printer. Alternatively, if the ultrasound diagnostic device 1 can access the storage circuit 160 on the network 2, the storage circuit 160 may not need to be built into the ultrasound diagnostic device 1.

[0052] The control circuit 170 controls the overall processing of the ultrasound diagnostic device 1. Specifically, the control circuit 170 controls the processing of the ultrasound probe 101, transceiver circuit 110, B-mode processing circuit 120, Doppler processing circuit 130, image processing circuit 140, etc., based on various setting requests input by the operator via the input device 102 or various control programs and data read from the storage circuit 160.

[0053] The overall configuration of the ultrasonic diagnostic apparatus 1 according to this embodiment has been described above. Here, an example of the configuration of the multiple probe connection terminals will be described.

[0054] Figure 7A This is a diagram illustrating an example of the configuration of multiple probe connection terminals. It is a front view of a housing 1000a in which multiple probe connection terminals 1200 are configured in the main body of an ultrasonic diagnostic apparatus. Figure 7B Is as Figure 7A The front view of the substrate portion when the housing 1000a is removed from the interior of the main body of the device.

[0055] Typically, multiple probe connection terminals are arranged in a single column, either horizontally or vertically. For example, such as Figure 7A As shown, on the front side of the housing 1000a, which is the main body of the device, multiple probe connection terminal parts 1200 are arranged in a row as probe connection terminal parts 1200a to 1200e in the X-axis direction (lateral direction).

[0056] Due to the diverse range of examinations, there is a tendency to increase the number of probe connection terminals mounted on ultrasonic diagnostic devices. In this case, with the addition of probe connection terminals 1200 in the X-axis direction, the close proximity of multiple probe connection terminals 1200 results in a narrower spacing between them. This makes it difficult for the user to insert or remove the connector of the ultrasonic probe 101 relative to the probe connection terminals 1200, reducing user efficiency. On the other hand, increasing the width or height of the device body increases the overall size of the device.

[0057] Furthermore, the narrowing spacing between the probe connection terminals 1200 complicates the wiring of the substrate housing the probe connection terminals 1200. For example, Figure 7B When the housing 1000a is removed from the interior of the device, the number of layers on the substrate 1210 increases because the spacing between the probe connection terminals 1200 becomes narrower.

[0058] For example, such as Figure 7B As shown, the substrate 1210 is equipped with probe connection terminals 1200a-1200e, which serve as multiple probe connection terminals 1200, and multiple switching circuits 1300. The multiple switching circuits 1300 output switching signals to the control circuit 170, indicating whether the probe connection terminals 1200a-1200e are connected to the connector of the ultrasonic probe 101. Furthermore, based on the control signals from the control circuit 170, the multiple switching circuits 1300 cause the ultrasonic probe 101 to perform ultrasonic wave transmission and reception (ultrasonic scanning) via the probe connection terminals 1200a-1200e that are connected to the connector of the ultrasonic probe 101.

[0059] Here, inside the main body of the device, there is a single substrate with a layered structure. For example, multiple switching circuits 1300 are wired on the two layers 1210 of the layered substrate 1210. Specifically, on the first layer 1210a of the substrate 1210, probe connection terminals 1200a to 1200e and switching circuits 1300a and 1300b are wired, and on the second layer 1210b of the substrate 1210, switching circuits 1300c and 1300d are wired.

[0060] For example, multiple pins are provided on the connector of the ultrasonic probe 101. In this embodiment, in Figure 7B In this design, the connector of the ultrasonic probe is provided with 6 pins (male side). In this case, the probe connection terminal portions 1200a to 1200e are provided with 6 terminals (female side) for connecting the 6 pins respectively, and each of these 6 terminals is connected to the switching circuit 1300 via 6 wires. Figure 7B In the example shown, at the probe connection terminals 1200a and 1200e at both ends of the plurality of probe connection terminals 1200, the switching circuits 1300a and 1300b are connected to the first layer 1210a of the substrate 1210 via six wirings.

[0061] However, due to the dense arrangement of multiple probe connection terminals 1200, the spacing between the probe connection terminals 1200 is narrow. Therefore, it is not possible to arrange all 6 wirings on the first layer 1210a of the substrate 1210 at probe connection terminals 1200b, 1200c, and 1200d other than the probe connection terminals 1200a and 1200e at both ends.

[0062] For example, at the probe connection terminals 1200b and 1200d, the probes are connected to the switching circuits 1300a and 1300b via four of the six wirings on the first layer 1210a of the substrate 1210. However, in Figure 7B In the area enclosed by the circle on the left and right, the remaining two of the six wires cannot be arranged on the first layer 1210a of the substrate 1210 due to the narrow spacing between the probe connection terminals 1200. Therefore, at the probe connection terminals 1200b and 1200d, the remaining two wires are connected to the switching circuits 1300c and 1300d on the second layer 1210b of the substrate 1210.

[0063] Additionally, at the probe connection terminal 1200c, it is connected to the switching circuits 1300a and 1300b via two of the six wirings on the first layer 1210a of the substrate 1210. However, in Figure 7BIn the two central regions enclosed by the circle, the remaining four of the six wires cannot be arranged on the first layer 1210a of the substrate 1210 due to the narrow spacing between the probe connection terminals 1200. Therefore, at the probe connection terminal 1200c, the remaining four wires are connected to the switching circuits 1300c and 1300d on the second layer 1210b of the substrate 1210.

[0064] As such, the dense arrangement of multiple probe connection terminals 1200 results in a narrower spacing between them, making the wiring of the substrate mounting the probe connection terminals 1200 more complex. Specifically, if the wiring becomes complex and dense, it becomes a multi-layer structure, thus increasing the thickness of the substrate. If the substrate thickness increases, the overall size of the device needs to be increased.

[0065] Therefore, in the ultrasonic diagnostic apparatus 1 according to this embodiment, in order to increase the number of probe connection terminals without increasing the overall size of the apparatus, and to facilitate the insertion and removal of the ultrasonic probe, the following configuration is adopted. On the front of the main body 100 of the ultrasonic diagnostic apparatus 1 according to this embodiment, a plurality of probe connection terminals 200 connected to the connector of the ultrasonic probe 101 are arranged in the X-axis direction (lateral direction), and at least one of the plurality of probe connection terminals 200 is positioned offset in the Y-axis direction (longitudinal direction) intersecting the X-axis direction. Here, the X-axis direction is an example of "one direction," and the Y-axis direction is an example of "other directions."

[0066] The following describes in detail the configuration of the plurality of probe connection terminal portions 200 in the ultrasonic diagnostic apparatus 1 according to this embodiment.

[0067] Figure 3A This is a front view of the housing 100a of the main body 100 of the ultrasonic diagnostic apparatus 1 according to this embodiment, in which a plurality of probe connection terminal portions 200 are arranged. Figure 3B Is as Figure 3A This is a front view of the substrate portion inside the main body 100 of the device, with the housing 100a removed. Here, in this embodiment, Figure 3A , Figure 3B The X-axis direction is orthogonal to the Y-axis direction.

[0068] For example, such as Figure 3A As shown, on the front side of the housing 100a, which serves as the main body of the device 100, a plurality of probe connection terminal portions 200 are arranged as probe connection terminal portions 200a to 200e in the X-axis direction. For example, the plurality of probe connection terminal portions 200a to 200e are arranged at intervals between each other in the X-axis direction.

[0069] The multiple probe connection terminal section 200 is, for example, rectangular when viewed from the front. The short side of the probe connection terminal section 200 is in the X-axis direction, and the long side is in the Y-axis direction. Furthermore, regarding the multiple probe connection terminal section 200, the orientation and direction for inserting and removing the connector of the ultrasonic probe 101 are as follows: Figure 1 The Z-axis direction (orthogonal to the X-axis and Y-axis directions) is predetermined. For example, the connector of the ultrasonic probe 101 and the multiple probe connection terminals 200 are configured to prevent reverse connection.

[0070] exist Figure 3A In the example shown, the center positions (or the positions of one end of the probe connection terminals 200a and 200e at both ends of the plurality of probe connection terminals 200a to 200e) are the same in the Y-axis direction. Furthermore, the center position of at least one of the probe connection terminals 200b, 200c, and 200d other than the two probe connection terminals 200a and 200e at both ends is different from the center position of the probe connection terminals 200a and 200e in the Y-axis direction.

[0071] Specifically, in Figure 3A In this configuration, the center positions of probe connection terminal portions 200b and 200d differ from the center positions of probe connection terminal portions 200a, 200c, and 200e in the Y-axis direction. That is, among the multiple probe connection terminal portions 200a to 200e, the center positions of adjacent probe connection terminal portions differ in the Y-axis direction.

[0072] Like this, in Figure 3A In the example shown, at least one of the multiple probe connection terminals 200 is positioned offset in the Y-axis direction, so the multiple probe connection terminals 200 are not densely packed, and the spacing between the probe connection terminals 1200 is not narrowed. Therefore, it is easier for the user to plug and unplug the connector of the ultrasonic probe 101 relative to the probe connection terminal 200, improving the user's efficiency.

[0073] In addition, Figure 3A In the example shown, there is space between the probe connection terminal portions 200, so the wiring of the substrate mounting the probe connection terminal portions 200 does not become complicated. Inside the device body 100, a single substrate with a layered structure is mounted. For example, Figure 3B The substrate 210, which is the interior of the device body 100 with the housing 100a removed, forms a space between the probe connection terminal portions 200, thereby allowing for connection with... Figure 7A , Figure 7BCompared to the example shown, the number of layers in substrate 210 can be reduced. Specifically, if the wiring becomes complex and high-density, it becomes a multi-layer structure, thus increasing the substrate thickness. Increasing the substrate thickness requires a larger overall device size, but... Figure 3A In the example shown, the number of layers in the substrate 210 can be reduced, so the overall size of the device does not need to be increased.

[0074] For example, such as Figure 3B As shown, multiple switching circuits 300 are wired on the first layer of the layered substrate 210. Specifically, probe connection terminals 200a-200e, which serve as multiple probe connection terminals 200, and switching circuits 300a-300e, which serve as multiple switching circuits 300, are wired on the substrate 210. The multiple switching circuits 300 output switching signals to the control circuit 170, indicating whether the probe connection terminals 200a-200e are connected to the connector of the ultrasonic probe 101. In addition, the multiple switching circuits 300, through the control signals from the control circuit 170, cause the ultrasonic probe 101 to perform ultrasonic wave transmission and reception (ultrasonic scanning) via the probe connection terminals 200 among the probe connection terminals 200a-200e that are connected to the connector of the ultrasonic probe 101.

[0075] For example, multiple pins are provided on the connector of the ultrasonic probe 101. In this embodiment, in Figure 3B In this design, the connector of the ultrasonic probe 101 is provided with 6 pins (male side). In this case, the probe connection terminal portions 200a-200e are provided with 6 terminals (female side) for connecting to each of the 6 pins, and each of these 6 terminals is connected to the switching circuit 300 via 6 wires. Figure 3B In the example shown, a space is formed between the probe connection terminal portions 200, thereby connecting the multiple probe connection terminal portions 200 to the switching circuit 300 on the substrate 210 via 6 wires.

[0076] For example, at probe connection terminal 200a, it is connected to switching circuits 300a and 300b via six wires on substrate 210. At probe connection terminal 200b, it is connected to switching circuits 300a to 300c via six wires on substrate 210. At probe connection terminal 200c, it is connected to switching circuits 300b to 300d via six wires on substrate 210. At probe connection terminal 200d, it is connected to switching circuits 300c to 300e via six wires on substrate 210. At probe connection terminal 200e, it is connected to switching circuits 300d and 300e via six wires on substrate 210.

[0077] In this way, in the ultrasonic diagnostic apparatus 1 according to this embodiment, a space is formed between the probe connection terminal portions 200, thereby allowing for connection with... Figure 7A , Figure 7B Compared to the example shown, the number of layers in the substrate 210 can be reduced. Furthermore, in the ultrasonic diagnostic apparatus 1 according to this embodiment, spaces are formed between the probe connection terminal portions 200, thereby preventing the wiring of the substrate housing the probe connection terminal portions 200 from becoming complex and eliminating the need to increase the overall size of the apparatus.

[0078] Based on the above description, regarding the ultrasonic diagnostic apparatus 1 according to this embodiment, on the front side of the apparatus body 100, a plurality of probe connection terminal portions 200 connected to the connector of the ultrasonic probe 101 are arranged in the X-axis direction, and at least one of the plurality of probe connection terminal portions 200 is disposed at a position offset in the Y-axis direction intersecting the X-axis direction. Therefore, in the ultrasonic diagnostic apparatus 1 according to this embodiment, the number of probe connection terminal portions can be increased without increasing the overall size of the apparatus, making it easier to insert and remove the ultrasonic probe.

[0079] (First variation)

[0080] Figure 4A This is a front view of the housing 100a of the ultrasonic diagnostic apparatus 1 according to the first modification of this embodiment, in which a plurality of probe connection terminal portions 200 are arranged in the main body 100 of the apparatus. Figure 4B Is as Figure 4A This is a front view of the substrate portion inside the main body 100 of the device, with the housing 100a removed. Here, in this embodiment, Figure 4A , Figure 4B The X-axis direction is orthogonal to the Y-axis direction.

[0081] exist Figure 4A In the example shown, the center positions of the probe connection terminals 200b, 200c, and 200d other than the two probe connection terminals 200a and 200e at both ends are different in the Y-axis direction from the center positions of the two probe connection terminals 200a and 200e at both ends.

[0082] Specifically, the centers of probe connection terminals 200b, 200c, and 200d are at the same position in the Y-axis direction, while the centers of probe connection terminals 200a and 200e are at different positions in the Y-axis direction from those of probe connection terminals 200b, 200c, and 200d.

[0083] Like this, in Figure 4A In the example shown, also with Figure 3ASimilarly, in the example shown, at least one of the multiple probe connection terminals 200 is positioned offset in the Y-axis direction, so the multiple probe connection terminals 200 are not densely packed, and the spacing between the probe connection terminals 1200 is not narrowed. Therefore, it is easier for the user to plug and unplug the connector of the ultrasonic probe 101 relative to the probe connection terminal 200, improving the user's efficiency.

[0084] In addition, Figure 4A In the example shown, a space is formed along the long side of the probe connection terminal portion 200, thus preventing the wiring of the substrate mounting the probe connection terminal portion 200 from becoming complex. Inside the device body 100, a single substrate with a layered structure is mounted. For example, Figure 4B The substrate 210, which is the interior of the device body 100 with the housing 100a removed, has a space formed along the long side of the probe connection terminal portion 200, thereby connecting with... Figure 3A The example shown also demonstrates the ability to reduce the number of layers in substrate 210. Specifically, if the wiring becomes complex and high-density, it becomes a multi-layer structure, thus increasing the substrate thickness. If the substrate thickness increases, the overall device size needs to be increased, but... Figure 4A In the example shown, the number of layers in the substrate 210 can be reduced, so the overall size of the device does not need to be increased.

[0085] For example, such as Figure 4B As shown, multiple switching circuits 300 are wired on the first layer of the layered substrate 210. Specifically, the substrate 210 is wired with probe connection terminals 200a to 200e, which serve as multiple probe connection terminal portions 200, and switching circuits 300a and 300b, which serve as multiple switching circuits 300.

[0086] For example, multiple pins are provided on the connector of the ultrasonic probe 101. In this embodiment, in Figure 4B In this design, the connector of the ultrasonic probe 101 is provided with 6 pins (male side). In this case, the probe connection terminal portions 200a-200e are provided with 6 terminals (female side) for connecting to each of the 6 pins, and each of these 6 terminals is connected to the switching circuit 300 via 6 wires. Figure 4B In the example shown, a space is formed in the long side direction of the probe connection terminal 200 in the area enclosed by the circle in the figure. Therefore, at the probe connection terminal 200a to 200e, the switching circuits 300a and 300b are connected to the substrate 210 via 6 wires.

[0087] In this way, in the ultrasonic diagnostic apparatus 1 according to the first modification of this embodiment, a space is formed in the long side direction of the probe connection terminal portion 200, so the wiring of the substrate on which the probe connection terminal portion 200 is mounted does not become complicated, and the overall size of the apparatus does not need to be increased. Therefore, in the first modification of this embodiment, the number of probe connection terminals can be increased without increasing the overall size of the apparatus, and the ultrasonic probe 101 can be easily plugged in and out.

[0088] (Second variation)

[0089] Figure 5A This is a front view of the housing 100a of the ultrasonic diagnostic apparatus 1 according to the second variation of this embodiment, in which a plurality of probe connection terminal portions 200 are arranged in the main body 100 of the apparatus. Figure 5B Is as Figure 5A This is a front view of the substrate portion inside the main body 100 of the device, with the housing 100a removed. Here, in this embodiment, Figure 5A , Figure 5B The X-axis direction is orthogonal to the Y-axis direction.

[0090] exist Figure 5A In the example shown, the center positions of the probe connection terminals 200b, 200c, and 200d other than the two probe connection terminals 200a and 200e at both ends are different in the Y-axis direction from the center positions of the two probe connection terminals 200a and 200e at both ends.

[0091] Specifically, the multiple probe connection terminals 200a to 200e are arranged in a V-shape when viewed from the front. For example, among the multiple probe connection terminals 200a to 200e, the centers of probe connection terminals 200a and 200e, which are located symmetrically with respect to the probe connection terminal 200c (which is the center of the arrangement), are at the same position in the Y-axis direction, and the centers of probe connection terminals 200b and 200d are at the same position in the Y-axis direction. Furthermore, the centers of probe connection terminals 200a and 200d, which are located asymmetrically with respect to the center of the arrangement, are at different positions in the Y-axis direction, and the centers of probe connection terminals 200b and 200e are at different positions in the Y-axis direction.

[0092] Like this, in Figure 5A In the example shown, also with Figure 3A Similarly, in the example shown, at least one of the multiple probe connection terminals 200 is positioned offset in the Y-axis direction, so the multiple probe connection terminals 200 are not densely packed, and the spacing between the probe connection terminals 200 is not narrowed. Therefore, it is easier for the user to plug and unplug the connector of the ultrasonic probe 101 relative to the probe connection terminal 200, improving the user's efficiency.

[0093] In addition, Figure 5A In the example shown, there is space between the probe connection terminal portions 200, so the wiring of the substrate mounting the probe connection terminal portions 200 does not become complicated. Inside the device body 100, a single substrate with a layered structure is mounted. For example, Figure 5B The substrate 210, which is the interior of the device body 100 with the housing 100a removed, forms a space between the probe connection terminal portions 200, thereby allowing for connection with... Figure 3A The example shown also demonstrates the ability to reduce the number of layers in substrate 210. Specifically, if the wiring becomes complex and high-density, it becomes a multi-layer structure, thus increasing the substrate thickness. If the substrate thickness increases, the overall device size needs to be increased, but... Figure 5A In the example shown, the number of layers in the substrate 210 can be reduced, so the overall size of the device does not need to be increased.

[0094] For example, such as Figure 5B As shown, multiple switching circuits 300 are wired on the first layer of the layered substrate 210. Specifically, the substrate 210 is wired with probe connection terminals 200a to 200e, which serve as multiple probe connection terminal portions 200, and switching circuits 300a to 300e, which serve as multiple switching circuits 300.

[0095] For example, multiple pins are provided on the connector of the ultrasonic probe 101. In this embodiment, in Figure 5B In this design, the connector of the ultrasonic probe 101 is provided with 6 pins (male side). In this case, the probe connection terminal portions 200a-200e are provided with 6 terminals (female side) for connecting to each of the 6 pins, and each of these 6 terminals is connected to the switching circuit 300 via 6 wires. Figure 5B In the example shown, a space is formed between the probe connection terminal portions 200, thereby connecting the multiple probe connection terminal portions 200 to the switching circuit 300 on the substrate 210 via 6 wires.

[0096] For example, at probe connection terminal 200a, it is connected to switching circuits 300a and 300b via six wires on substrate 210. At probe connection terminal 200b, it is connected to switching circuits 300a to 300c via six wires on substrate 210. At probe connection terminal 200c, it is connected to switching circuits 300b to 300d via six wires on substrate 210. At probe connection terminal 200d, it is connected to switching circuits 300c to 300e via six wires on substrate 210. At probe connection terminal 200e, it is connected to switching circuits 300d and 300e via six wires on substrate 210.

[0097] In this way, in the ultrasonic diagnostic apparatus 1 according to the second modification of this embodiment, a space is formed between the probe connection terminal portions 200, thereby allowing for... Figure 3A Similarly, in the example shown, the wiring of the substrate on which the probe connection terminal 200 is mounted does not become complicated, and there is no need to increase the overall size of the device. Therefore, in the second variation of this embodiment, the number of probe connection terminals can be increased without increasing the overall size of the device, making it easy to plug and unplug the ultrasonic probe 101.

[0098] (3rd variation)

[0099] Figure 6A This is a front view of the housing 100a of the ultrasonic diagnostic apparatus 1 according to the third variation of this embodiment, in which a plurality of probe connection terminal portions 200 are arranged in the main body 100 of the apparatus. Figure 6B Is as Figure 6A This is a front view of the substrate portion inside the main body 100 of the device, with the housing 100a removed. Here, in this embodiment, Figure 6A , Figure 6B The X-axis direction is orthogonal to the Y-axis direction.

[0100] exist Figure 6A In the example shown, at least two of the multiple probe connection terminals 200a to 200e are located at the same position in the X-axis direction, but at different positions in the Y-axis direction.

[0101] Specifically, the centers of the two probe connection terminals 200a and 200d at both ends of the plurality of probe connection terminals 200a to 200e are at the same position in the Y-axis direction. Additionally, the centers of the two probe connection terminals 200b and 200e at both ends are at the same position in the Y-axis direction. Furthermore, the center of the probe connection terminal 200c, excluding the probe connection terminals 200a, 200b, 200d, and 200e at both ends, is at a different position in the Y-axis direction than the centers of the probe connection terminals 200a, 200b, 200d, and 200e at both ends.

[0102] Like this, in Figure 6A In the example shown, also with Figure 3A Similarly, in the example shown, at least one of the multiple probe connection terminals 200 is positioned offset in the Y-axis direction, so the multiple probe connection terminals 200 are not densely packed, and the spacing between the probe connection terminals 1200 is not narrowed. Therefore, it is easier for the user to plug and unplug the connector of the ultrasonic probe 101 relative to the probe connection terminal 200, improving the user's efficiency.

[0103] In addition, Figure 6AIn the example shown, spaces are formed between the probe connection terminal portions 200, thus preventing the wiring of the substrate mounting the probe connection terminal portions 200 from becoming complex. Inside the device body 100, a single substrate with a layered structure is mounted. For example, Figure 6B The substrate 210, which is the interior of the device body 100 with the housing 100a removed, has a space formed along the long side of the probe connection terminal portion 200, thereby connecting with... Figure 3A The example shown also demonstrates the ability to reduce the number of layers in substrate 210. Specifically, if the wiring becomes complex and high-density, it becomes a multi-layer structure, thus increasing the substrate thickness. If the substrate thickness increases, the overall device size needs to be increased, but... Figure 6A In the example shown, the number of layers in the substrate 210 can be reduced, so the overall size of the device does not need to be increased.

[0104] For example, such as Figure 6B As shown, multiple switching circuits 300 are wired on the first layer of the layered substrate 210. Specifically, the substrate 210 is wired with probe connection terminals 200a to 200e, which serve as multiple probe connection terminal portions 200, and switching circuits 300a and 300b, which serve as multiple switching circuits 300.

[0105] For example, multiple pins are provided on the connector of the ultrasonic probe 101. In this embodiment, in Figure 6B In this design, the connector of the ultrasonic probe 101 is provided with 6 pins (male side). In this case, the probe connection terminal portions 200a-200e are provided with 6 terminals (female side) for connecting to each of the 6 pins, and each of these 6 terminals is connected to the switching circuit 300 via 6 wires. Figure 6B In the example shown, a space is formed in the long side direction of the probe connection terminal 200, thereby connecting the probe connection terminal 200a to 200e to the switching circuit 300 on the substrate 210 via 6 wirings.

[0106] For example, at probe connection terminals 200a and 200d, six wires are connected to the switching circuit 300a on the substrate 210. At probe connection terminals 200b and 200e, six wires are connected to the switching circuit 300b on the substrate 210. At probe connection terminal 200c, six wires are connected to the switching circuits 300a and 300b on the substrate 210.

[0107] In this way, in the ultrasonic diagnostic apparatus 1 according to the third modification of this embodiment, a space is formed between the probe connection terminal portions 200, thereby allowing for... Figure 3ASimilarly, in the example shown, the wiring of the substrate on which the probe connection terminal 200 is mounted does not become complicated, and there is no need to increase the overall size of the device. Therefore, in the third variation of this embodiment, the number of probe connection terminals can be increased without increasing the overall size of the device, making it easy to insert and remove the ultrasonic probe 101.

[0108] According to at least one embodiment described above, the number of probe connection terminals can be increased without increasing the overall size of the device, making it easier to plug and unplug the ultrasonic probe.

[0109] Furthermore, in this embodiment and its variations, "one direction" is defined as the X-axis direction, and "other directions" as the Y-axis direction, but this is not a limitation. For example, "one direction" could be the Y-axis direction, and "other directions" could be the X-axis direction. In this case, in this embodiment and its variations, on the front side of the device body 100, a plurality of probe connection terminal portions 200 connected to the connector of the ultrasonic probe 101 are arranged in the Y-axis direction (longitudinal direction), and at least one of the plurality of probe connection terminal portions 200 is positioned offset in the X-axis direction (lateral direction). In this case, in this embodiment and its variations, as described above, the number of probe connection terminal portions can be increased without increasing the overall size of the device, making it easier to insert and remove the ultrasonic probe 101.

[0110] Furthermore, in this embodiment and its variations, "one direction" and "other directions" are orthogonal to each other, but this is not a limitation. For example, the multiple probe connection terminals 200 may also be rhomboid when viewed from the front, and "one direction" and "other directions" may not be orthogonal to each other. In this case, in this embodiment and its variations, as described above, the number of probe connection terminals can be increased without increasing the overall size of the device, making it easier to insert and remove the ultrasonic probe 101.

[0111] Several embodiments have been described above, but these embodiments are given as examples and are not intended to limit the scope of the utility model. These embodiments can be implemented in various other ways, and various omissions, substitutions, modifications, and combinations of embodiments are possible without departing from the spirit of the utility model. These embodiments and their variations are included in the scope or spirit of the utility model, and are included in the scope of the utility model and its equivalents as set forth in the claims.

Claims

1. An ultrasonic diagnostic device, wherein, The device includes a main body in which multiple probe connection terminals, which connect to the connectors of ultrasonic probes, are arranged in one direction. At least one of the plurality of probe connection terminals is configured at a position offset from other directions intersecting the first direction.

2. The ultrasonic diagnostic device as described in claim 1, wherein, The plurality of probe connection terminals are arranged at intervals from each other in one direction. The positions of the two probe connection terminals at both ends of the plurality of probe connection terminals are the same in the other directions. The position of at least one of the probe connection terminals other than the two probe connection terminals at both ends is different from the position of the two probe connection terminals at both ends in the other directions.

3. The ultrasonic diagnostic device as described in claim 2, wherein, The positions of the probe connection terminals other than the two probe connection terminals at both ends are the same in the other directions. The positions of the two probe connection terminals at both ends are different from the positions of the probe connection terminals other than the two probe connection terminals at both ends in other directions.

4. The ultrasonic diagnostic device as described in claim 2, wherein, In the probe connection terminals other than the two probe connection terminals at both ends, the positions of adjacent probe connection terminals are different in the other directions.

5. The ultrasonic diagnostic device as described in claim 1, wherein, The plurality of probe connection terminals are arranged at intervals from each other in one direction. Among the plurality of probe connection terminals, the positions of adjacent probe connection terminals differ in the other directions.

6. The ultrasonic diagnostic device as described in claim 2, wherein, Among the plurality of probe connection terminals, the positions of probe connection terminals located symmetrically with respect to the arrangement center are the same in the other directions, while the positions of probe connection terminals located asymmetrically with respect to the arrangement center are different in the other directions.

7. The ultrasound diagnostic device as described in claim 2 or 6, wherein, The multiple probe connection terminals are arranged in a V-shape.

8. The ultrasonic diagnostic device as described in claim 1, wherein, At least two of the plurality of probe connection terminals are located at the same position in one direction and at different positions in the other directions.

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