A device for rapid curing of conductive adhesive

Abstract

The utility model discloses a kind of electrically-conductive glue quick curing device, including heating box, the side of heating box is provided with sealing door, the inside bottom of heating box is fixedly installed with metal electrode plate, the top of the inside wall of heating box and located above metal electrode plate is fixedly installed with infrared lamp tube, the outside of heating box is fixedly installed with vacuum pump, the air outlet of vacuum pump extends to the inside of heating box, the inside of heating box is fixedly connected with nitrogen injection pipe, the inside of heating box is provided with nitrogen perfusion structure, the output end of nitrogen perfusion structure is fixedly connected with nitrogen injection pipe.The utility model is through the synergic effect of infrared lamp tube and metal electrode plate, realizes the quick even heating of electrically-conductive glue, infrared radiation can quickly promote electrically-conductive glue surface temperature, and metal electrode plate applies alternating electric field, by dielectric loss selectively heating metal particles (such as silver powder) in electrically-conductive glue, make curing time shorten to 1 / 10 of traditional hot air curing, greatly improve production efficiency.

Description

Technical Field

[0001] This utility model relates to the field of electronic packaging technology, specifically to a device for rapid curing of conductive adhesive. Background Technology

[0002] Electronic packaging technology refers to the key technology that reliably connects electronic components to external circuits and protects their normal operation. As electronic products develop towards higher density, miniaturization, and higher performance, packaging technology plays an increasingly important role in improving device performance and extending lifespan. Conductive adhesive, as an important connecting material, is widely used in electronic packaging due to its excellent conductivity and strong adaptability.

[0003] Existing conductive adhesive rapid curing devices typically use hot air curing for conductive adhesive curing. However, the hot air curing process takes 5-10 minutes, which is difficult to meet the high-efficiency production requirements of modern electronics manufacturing. At the same time, prolonged exposure to air at high temperatures can easily cause the metal particles (such as silver powder, copper powder, etc.) in the conductive adhesive to oxidize, resulting in a decrease in conductivity of more than 30%, which seriously affects the reliability and service life of the product. To solve the above problems, we propose a conductive adhesive rapid curing device. Utility Model Content

[0004] The purpose of this invention is to provide a device for rapid curing of conductive adhesive to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a conductive adhesive rapid curing device, comprising a heating chamber, a sealed door on one side of the heating chamber, a metal electrode plate fixedly installed at the bottom inner side of the heating chamber, an infrared lamp tube fixedly installed above the metal electrode plate and at the top of the inner wall of the heating chamber, a vacuum pump fixedly installed on the outer side of the heating chamber, the vacuum pump's suction port extending into the interior of the heating chamber, a nitrogen injection pipe fixedly connected to the inner side of the heating chamber, a nitrogen filling structure provided inside the heating chamber, the output end of the nitrogen filling structure fixedly connected to the nitrogen injection pipe, and an operation display panel fixedly installed on one side of the sealed door and on the outer side of the heating chamber.

[0006] As a further preferred embodiment of this technical solution, the nitrogen filling structure includes a cavity, which is opened inside the heating chamber. A pressure reducing valve is fixedly installed between the inner walls of the cavity. The output end of the pressure reducing valve is fixedly connected to the nitrogen injection pipe, and the input end of the pressure reducing valve extends to the outside of the heating chamber and is fixedly connected to a nitrogen connector.

[0007] As a further preferred embodiment of this technical solution, an installation plate is fixedly connected to the outside of the heating box, an exhaust fan is fixedly installed on the top of the installation plate, the input end of the exhaust fan extends into the interior of the heating box, and a solenoid valve is fixedly installed on the inside of the heating box and at the input port of the exhaust fan.

[0008] As a further preferred embodiment of this technical solution, an electrochemical oxygen sensor is fixedly installed inside the heating box and on one side of the solenoid valve, and a thermal conductivity gas sensor is fixedly installed below the solenoid valve and inside the heating box. The information transmission terminals of both the electrochemical oxygen sensor and the thermal conductivity gas sensor are electrically connected to the operation display panel.

[0009] As a further preferred embodiment of this technical solution, a ceramic plate is fixedly connected to the top of the metal electrode plate.

[0010] As a further preferred embodiment of this technical solution, a sealing strip is fixedly connected to one side of the sealing door and inside the heating box.

[0011] As a further preferred embodiment of this technical solution, the heating box has heat dissipation holes on its outer side, and the heat dissipation holes communicate with the cavity.

[0012] This invention provides a device for rapid curing of conductive adhesive, which has the following advantages:

[0013] (1) This utility model achieves rapid and uniform heating of conductive adhesive through the synergistic effect of infrared lamp tube and metal electrode plate. Infrared radiation can rapidly increase the surface temperature of conductive adhesive, while the metal electrode plate applies an alternating electric field to selectively heat metal particles (such as silver powder) in conductive adhesive through dielectric loss, thereby shortening the curing time to 1 / 10 of the traditional hot air curing time and greatly improving production efficiency.

[0014] (2) By using a vacuum pump in conjunction with a nitrogen filling structure, the present invention first draws a vacuum and then fills in high-purity nitrogen, which can control the oxygen content in the heating box to below 5%, effectively prevent the oxidation of metal particles in the conductive adhesive, ensure the stability of the conductive properties after curing, and at the same time, the nitrogen environment can also avoid the fire hazard caused by the volatilization of organic solvents, thus improving production safety. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0016] Figure 2 This is a schematic diagram of the rear view structure of this utility model;

[0017] Figure 3 This is a schematic diagram of the cavity cross-sectional structure of this utility model;

[0018] Figure 4This is a schematic diagram of the internal structure of the heating box from the left side of this utility model;

[0019] Figure 5 This is a schematic diagram of the internal structure of the heating box of this utility model from a downward angle;

[0020] In the diagram: 1. Heating chamber; 2. Sealed door; 3. Metal electrode plate; 4. Ceramic plate; 5. Infrared lamp; 6. Vacuum pump; 7. Mounting plate; 8. Exhaust fan; 9. Cavity; 10. Pressure reducing valve; 11. Nitrogen connector; 12. Nitrogen injection pipe; 13. Solenoid valve; 14. Electrochemical oxygen sensor; 15. Thermal conductivity gas sensor; 16. Sealing strip; 17. Heat dissipation hole; 18. Operation display panel. Detailed Implementation

[0021] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0022] This utility model provides a technical solution: such as Figures 1-5 As shown, in this embodiment, a conductive adhesive rapid curing device includes a heating chamber 1. A sealing door 2 is provided on one side of the heating chamber 1. A metal electrode plate 3 is fixedly installed on the bottom inner side of the heating chamber 1. An infrared lamp tube 5 is fixedly installed above the metal electrode plate 3 and on the top of the inner wall of the heating chamber 1. A vacuum pump 6 is fixedly installed on the outer side of the heating chamber 1. The suction port of the vacuum pump 6 extends into the interior of the heating chamber 1. A nitrogen injection pipe 12 is fixedly connected to the inner side of the heating chamber 1. A nitrogen filling structure is provided inside the heating chamber 1. The output end of the nitrogen filling structure is fixedly connected to the nitrogen injection pipe 12. An operation display panel 18 is fixedly installed on one side of the sealing door 2 and on the outer side of the heating chamber 1. A mounting plate 7 is fixedly connected, and an exhaust fan 8 is fixedly installed on the top of the mounting plate 7. The input end of the exhaust fan 8 extends into the interior of the heating box 1. A solenoid valve 13 is fixedly installed on the inside of the heating box 1 and at the input port of the exhaust fan 8. An electrochemical oxygen sensor 14 is fixedly installed on the inside of the heating box 1 and to one side of the solenoid valve 13. A thermal conductivity gas sensor 15 is fixedly installed below the solenoid valve 13 and on the inside of the heating box 1. The information transmission ends of both the electrochemical oxygen sensor 14 and the thermal conductivity gas sensor 15 are electrically connected to the operation display panel 18. A ceramic plate 4 is fixedly connected to the top of the metal electrode plate 3. A sealing strip 16 is fixedly connected to one side of the sealing door 2 and on the inside of the heating box 1.

[0023] When using the conductive adhesive rapid curing device, first connect the heating chamber 1 to an external power source to power on the entire device. Then, open the sealing door 2 and place the coated circuit board to be cured on top of the ceramic plate 4. Then close the sealing door 2, so that the heating chamber 1 is sealed by the sealing door 2 and the sealing strip 16. Next, the vacuum pump 6 first evacuates the vacuum to reduce oxidation. The nitrogen filling structure then injects inert gas to further isolate oxygen. The electrochemical oxygen sensor 14 and the thermal conductivity gas sensor 15 monitor the environment inside the chamber in real time, and the data is fed back to the operation display panel 18. Finally, the metal electrode plate 3 and the infrared lamp 5 work together to achieve bidirectional rapid heating (the ceramic plate 4 ensures uniform heating). After the curing work is completed, the solenoid valve 13 and the exhaust fan 8 can be adjusted through the operation display panel 18 to exhaust the injected nitrogen. This device significantly reduces the oxidation risk during the curing process of conductive adhesive through a dual anti-oxidation mechanism combining vacuum and nitrogen replacement, thereby improving product reliability. The bidirectional heating design greatly shortens the curing time and ensures uniform temperature distribution. Combined with an intelligent gas monitoring system, it achieves precise oxygen control and efficient waste removal, which not only ensures curing quality but also reduces energy consumption. It is especially suitable for the curing process of conductive adhesive for high-precision electronic components.

[0024] like Figures 1-5 As shown, the nitrogen filling structure includes a cavity 9, which is located inside the heating chamber 1. A pressure reducing valve 10 is fixedly installed between the inner walls of the cavity 9. The output end of the pressure reducing valve 10 is fixedly connected to the nitrogen injection pipe 12. The input end of the pressure reducing valve 10 extends to the outside of the heating chamber 1 and is fixedly connected to a nitrogen connector 11. A heat dissipation hole 17 is provided on the outside of the heating chamber 1, and the heat dissipation hole 17 communicates with the cavity 9.

[0025] The nitrogen connector 11 is connected to an external nitrogen tank. With the help of the pressure reducing valve 10, the inert nitrogen gas inside the nitrogen tank is introduced into the interior of the heating chamber 1 through the nitrogen injection pipe 12. By injecting nitrogen into the interior of the heating chamber 1, residual oxygen can be replaced and an inert gas protective environment can be formed, which further inhibits the oxidation reaction of the conductive adhesive during the high-temperature curing process.

[0026] This utility model provides a conductive adhesive rapid curing device, the specific working principle of which is as follows: When using the conductive adhesive rapid curing device, firstly, the heating box 1 is connected to an external power source to power on the entire device. Then, the adhesive-coated circuit board is placed on the ceramic plate 4 and the heating box 1 is sealed. The vacuum pump 6 evacuates the chamber to reduce the oxygen content. Subsequently, the nitrogen injection structure regulates the nitrogen flow rate through the pressure reducing valve 10 and injects nitrogen into the chamber through the nitrogen injection pipe 12 to form an inert atmosphere. The electrochemical oxygen sensor 14 and the thermal conductivity gas sensor 15 monitor the oxygen concentration and gas composition in real time, and the data is fed back to the operation display panel 18 to dynamically adjust the nitrogen injection and exhaust. The metal electrode plate 3 and the infrared lamp tube 5 are simultaneously activated for bidirectional heating. The ceramic plate 4 ensures uniform heat conduction and rapid attainment of the curing temperature. After curing, the exhaust fan 8 and the solenoid valve 13 work together to exhaust the waste gas.

[0027] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A rapid curing device for conductive adhesive, comprising a heating chamber (1), characterized in that: A sealing door (2) is provided on one side of the heating box (1). A metal electrode plate (3) is fixedly installed on the bottom inner side of the heating box (1). An infrared lamp tube (5) is fixedly installed on the top of the inner wall of the heating box (1) above the metal electrode plate (3). A vacuum pump (6) is fixedly installed on the outer side of the heating box (1). The exhaust port of the vacuum pump (6) extends into the interior of the heating box (1). A nitrogen injection pipe (12) is fixedly connected to the inner side of the heating box (1). A nitrogen filling structure is provided inside the heating box (1). The output end of the nitrogen filling structure is fixedly connected to the nitrogen injection pipe (12). An operation display panel (18) is fixedly installed on one side of the sealing door (2) and on the outer side of the heating box (1).

2. The conductive adhesive rapid curing device according to claim 1, characterized in that: The nitrogen filling structure includes a cavity (9) which is located inside the heating box (1). A pressure reducing valve (10) is fixedly installed between the inner walls of the cavity (9). The output end of the pressure reducing valve (10) is fixedly connected to the nitrogen injection pipe (12). The input end of the pressure reducing valve (10) extends to the outside of the heating box (1) and is fixedly connected to a nitrogen connector (11).

3. The conductive adhesive rapid curing device according to claim 1, characterized in that: An installation plate (7) is fixedly connected to the outside of the heating box (1). An exhaust fan (8) is fixedly installed on the top of the installation plate (7). The input end of the exhaust fan (8) extends into the interior of the heating box (1). A solenoid valve (13) is fixedly installed on the inside of the heating box (1) and at the input port of the exhaust fan (8).

4. The conductive adhesive rapid curing device according to claim 3, characterized in that: An electrochemical oxygen sensor (14) is fixedly installed inside the heating box (1) and on one side of the solenoid valve (13). A thermally conductive gas sensor (15) is fixedly installed below the solenoid valve (13) and inside the heating box (1). The information transmission terminals of the electrochemical oxygen sensor (14) and the thermally conductive gas sensor (15) are both electrically connected to the operation display panel (18).

5. The conductive adhesive rapid curing device according to claim 1, characterized in that: A ceramic plate (4) is fixedly connected to the top of the metal electrode plate (3).

6. The conductive adhesive rapid curing device according to claim 1, characterized in that: A sealing strip (16) is fixedly connected to one side of the sealing door (2) and inside the heating box (1).

7. The conductive adhesive rapid curing device according to claim 2, characterized in that: The heating box (1) has a heat dissipation hole (17) on its outer side, and the heat dissipation hole (17) is connected to the cavity (9).

Images