Ceramic substrate surface copper thickness measuring device

Abstract

The utility model provides a kind of ceramic substrate surface copper thickness measuring device, it includes feeding mechanism, carousel mechanism, measuring mechanism, manipulator, OK unloading mechanism and NG unloading mechanism, the carousel mechanism is equipped with the fixed position of placing substrate, when the carousel mechanism rotates, so that the fixed position sequentially passes the feeding mechanism, measuring mechanism and the manipulator, the manipulator is used to place and take the substrate on the carousel mechanism to OK unloading mechanism or the NG unloading mechanism;The feeding mechanism includes material frame conveying line, and the material frame overturning component corresponding with the material frame conveying line, and the push frame component that material frame on the material frame conveying line is pushed to the material frame overturning component, and the substrate conveying line corresponding with the material frame overturning component, and the hook plate component that substrate in the material frame is hooked one by one to the substrate conveying line, and the substrate pick-and-place component that substrate on the substrate conveying line is placed and taken to the fixed position on the carousel mechanism.

Description

Technical Field

[0001] This utility model relates to the field of ceramic substrate testing, and in particular to a device for measuring the thickness of copper coating on the surface of a ceramic substrate. Background Technology

[0002] Copper-clad ceramic substrates (such as direct-bonded copper-ceramic substrates, DCB) are core components of power electronic devices, and the uniformity and accuracy of their copper thickness directly determine the device's heat dissipation efficiency, current carrying capacity, and long-term reliability. Traditional methods for measuring copper thickness often rely on manual operation or semi-automatic equipment. These methods suffer from low measurement efficiency, unstable accuracy, and difficulty in achieving fully automated production. For example, manual interpretation results in slow testing speeds, making it difficult to meet the demands of high-speed production lines; traditional microscopic cross-section methods require cutting and polishing samples, making them unsuitable for online quality monitoring, and the destructive nature of these methods increases costs and time.

[0003] Therefore, it is necessary to design a device for measuring the copper thickness on the surface of a ceramic substrate to solve the above problems. Utility Model Content

[0004] The purpose of this invention is to provide a device for measuring the copper thickness on the surface of a ceramic substrate, so as to realize the full automation of the process from automatic feeding, positioning, and measurement of the substrate to automatic sorting and unloading based on the measurement results.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a ceramic substrate surface copper coating thickness measuring device, comprising a feeding mechanism, a turntable mechanism, a measuring mechanism, a robotic arm, an OK unloading mechanism, and an NG unloading mechanism. The turntable mechanism is provided with a fixed position for placing the substrate. When the turntable mechanism rotates, the fixed position passes sequentially through the feeding mechanism, the measuring mechanism, and the robotic arm. The robotic arm is used to pick up and place the substrate on the turntable mechanism to the OK unloading mechanism or the NG unloading mechanism. The feeding mechanism includes a material frame conveying line, a material frame flipping assembly corresponding to the material frame conveying line, a pusher assembly that pushes the material frames on the material frame conveying line to the material frame flipping assembly, a substrate conveying line corresponding to the material frame flipping assembly, a hooking plate assembly that hooks the substrates in the material frames one by one onto the substrate conveying line, and a substrate picking and placing assembly that picks up the substrates on the substrate conveying line and places them onto the fixed position of the turntable mechanism.

[0006] As a further improvement of the present invention, the material frame flipping assembly includes a platform for carrying the material frame, a flipping drive for driving the platform to flip, and a lifting drive for driving the platform to rise and fall. The material frame flipping assembly drives the material frame to flip between a position with the opening facing upward and a position with the opening facing the substrate conveying line.

[0007] As a further improvement of the present invention, the push frame assembly includes a bracket, a rodless cylinder, a rotary motor, a push plate, a motor base, and a guide rail. The rodless cylinder is horizontally disposed on one side of the bracket. The rotary motor is mounted on the rodless cylinder via the motor base and is driven to translate by the rodless cylinder. The motor base moves along the guide rail. The push plate is disposed on the rotary motor and is driven to rotate by the rotary motor.

[0008] As a further improvement of the present invention, the turntable mechanism includes a turntable and a motor that drives the turntable to rotate horizontally, and a plurality of fixed positions are provided on the turntable.

[0009] As a further improvement of the present invention, the substrate conveying line includes two rows of parallel rollers, and the hook plate assembly includes a horizontal drive member, a hook disposed on the horizontal drive member, and a guide rail. The guide rail is disposed between the two rows of rollers in the front-back direction, and the hook moves horizontally along the guide rail to hook the substrates in the material frame one by one from top to bottom onto the rollers.

[0010] As a further improvement of the present invention, the substrate picking and placing assembly includes a gripper, a lifting module for lifting the gripper up and down, and a translation module for moving the gripper horizontally.

[0011] As a further improvement of this utility model, it also includes a laser marking mechanism, which is located on the moving path of the fixed position of the turntable mechanism.

[0012] As a further improvement of the present invention, the fixed position is set to 4, and is evenly distributed in a circle on the turntable. The four fixed positions correspond one-to-one with the loading position of the substrate picking and placing component, the measuring position of the measuring mechanism, the marking position of the laser marking mechanism, and the unloading position of the robot arm.

[0013] As a further improvement of the present invention, the invention also includes a material frame picking and placing mechanism on the empty material frame of the material frame flipping assembly to the material frame picking and placing mechanism on the OK unloading mechanism or the NG unloading mechanism. The material frame picking and placing mechanism includes a gripper assembly, a lifting assembly for lifting the gripper assembly, and a translation assembly for moving the gripper assembly.

[0014] As can be seen from the above technical solutions, the copper cladding thickness measuring device for ceramic substrates of this utility model enables continuous operation of each station through the cyclic rotation of the turntable mechanism, greatly improving the overall efficiency of the measurement process; the use of a specialized measuring mechanism for precise measurement of copper cladding thickness significantly improves the accuracy and consistency of measurement compared to manual measurement; from substrate loading and measurement to unloading, the entire process requires no manual intervention, realizing a fully automated process, reducing the impact of human factors on the measurement results, and also reducing labor intensity and production costs; by precisely controlling the copper cladding thickness, circuit performance problems caused by excessively thick or thin copper layers can be effectively avoided, thereby improving the quality stability and reliability of the final product. Attached Figure Description

[0015] Figure 1 This is a top view schematic diagram of a ceramic substrate surface copper coating thickness measuring device according to an embodiment of the present invention.

[0016] Figure 2 for Figure 1 Partial view of the feeding mechanism.

[0017] Figure 3 This is a partial view of the substrate transport line and hook plate assembly.

[0018] Figure 4 for Figure 2 A 3D view of the material frame flipping assembly.

[0019] Figure 5 for Figure 2 A 3D view of the push-box component.

[0020] Figure 6 for Figure 1 A 3D view of the turntable mechanism.

[0021] Figure 7 This diagram shows the positional relationships between the turntable mechanism, the robotic arm, the OK unloading mechanism, and the NG unloading mechanism.

[0022] Figure 8 for Figure 1 A 3D view of the material handling mechanism. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0024] Please refer to Figure 1 As shown, this utility model provides a device for measuring the copper coating thickness on the surface of a ceramic substrate, which includes a feeding mechanism 10, a turntable mechanism 20, a measuring mechanism 30, a laser marking mechanism 40, a robotic arm 50, an OK unloading mechanism 60, an NG unloading mechanism 70, and a material frame picking and placing mechanism 80.

[0025] Please participate together Figure 2 and Figure 3 As shown, the feeding mechanism 10 includes a material frame conveying line 11, a material frame flipping assembly 12, a pusher assembly 15, a substrate conveying line 13, a hook plate assembly 14, and a substrate picking and placing assembly 16. The material frame flipping assembly 12 corresponds to the material frame conveying line 11, and the pusher assembly 15 is located on one side of the material frame conveying line 11 and the material frame flipping assembly 12, and is used to push the material frame 100 on the material frame conveying line 11 onto the material frame flipping assembly 12.

[0026] Please refer to Figure 4 As shown, the material frame flipping assembly 12 includes a platform 123 that carries the material frame 100, a flipping drive 122 that drives the platform 123 to flip, and a lifting drive 121 that drives the platform to rise and fall. The material frame flipping assembly 12 drives the material frame 100 to flip between a position with the opening facing upward and a position with the opening facing the substrate conveying line 13.

[0027] Please refer to Figure 5 As shown, the push-frame assembly 15 includes a bracket 151, a rodless cylinder 152, a rotary motor 154, a push plate 155, a motor mount (not labeled), and a guide rail 153. The rodless cylinder 152 is horizontally mounted on one side of the bracket 151. The rotary motor 154 is mounted on the rodless cylinder 152 via the motor mount and is driven to translate by the rodless cylinder 152. The motor mount moves along the guide rail 153. The push plate 155 is mounted on the rotary motor 154 and is driven to rotate by the rotary motor 154.

[0028] The substrate conveyor line 13 corresponds to the material frame flipping assembly 12, and the hook plate assembly 14 is used to hook the substrates in the material frame 100 on the material frame flipping assembly 12 one by one onto the substrate conveyor line 13. Please refer to... Figure 3 As shown, the substrate conveying line 13 includes a bracket 131 and two rows of parallel rollers 132. The hook plate assembly 14 includes a horizontal drive member (not shown), a hook 141 disposed on the horizontal drive member, and a guide rail 142. The guide rail 142 is disposed between the two rows of rollers 132 in the front-back direction. The hook 141 moves horizontally along the guide rail 142 to hook the substrates in the material frame one by one from top to bottom onto the rollers 132.

[0029] The substrate pick-and-place assembly is used to pick up and place substrates from the substrate conveyor line 13 onto the turntable mechanism 20. The substrate pick-and-place assembly includes grippers, a lifting module that drives the grippers to rise and fall, and a translation module that drives the grippers to move horizontally.

[0030] Please refer to Figure 6 and Figure 7As shown, the turntable mechanism 20 includes a turntable 21 and a motor 22 that drives the turntable 21 to rotate horizontally. The turntable 21 has multiple fixed positions 23 for placing substrates. In this embodiment, four fixed positions are set and evenly distributed circumferentially on the turntable 21. A laser marking mechanism 40 is located on the moving path of the fixed positions 23 of the turntable mechanism 20 and is used to laser mark substrates with a measurement result of NG. A robot arm 50 is used to pick up and place substrates from the turntable mechanism 20 to the OK unloading mechanism 60 or the NG unloading mechanism 70. The turntable 21 rotates, causing each fixed position 23 to sequentially pass through the loading position of the loading mechanism 10, the measurement position of the measuring mechanism 30, the marking position of the laser marking mechanism 40, and the unloading position of the robot arm 50. The four fixed positions 23 can simultaneously correspond one-to-one with the loading position of the loading mechanism 10, the measurement position of the measuring mechanism 30, the marking position of the laser marking mechanism 40, and the unloading position of the robot arm 50. With this setup, the processes of loading, measuring, marking, and unloading can be carried out simultaneously, greatly improving work efficiency.

[0031] The OK unloading mechanism 60 is similar in structure to the loading mechanism 10, but operates in the opposite manner. First, a robotic arm picks up and places OK substrates from the turntable onto the substrate conveyor line. Then, the substrates are collected through the cooperation of the substrate conveyor line and the material frame flipping assembly. Finally, the full-load material frame containing the collected substrates is flipped and conveyed onto the material frame conveyor line. The NG unloading mechanism works similarly and will not be described in detail here.

[0032] Please refer to Figure 1 and Figure 8 As shown, the material frame pick-up and place mechanism 80 picks up and places empty material frames from the material frame flipping assembly 12 onto the OK unloading mechanism 60 or the NG unloading mechanism 70 to collect the measured products. The material frame pick-up and place mechanism 80 includes a gripper assembly 84, a lifting assembly 83 that drives the gripper assembly 84 to rise and fall, a translation assembly 82 that drives the gripper assembly 84 to move horizontally, and a bracket 81 that supports the above-mentioned components.

[0033] The terms used herein to indicate relative spatial positions are for illustrative purposes and to describe the relationship of one feature relative to another, as shown in the accompanying drawings. It is understood that, depending on the product's placement, the terms "relative spatial positions" may be intended to include different orientations besides those shown in the figures, and should not be construed as limiting the claims.

[0034] Furthermore, the above embodiments are only used to illustrate the present utility model and are not intended to limit the technical solutions described in the present utility model. The understanding of this specification should be based on those skilled in the art. Although the present utility model has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still make modifications or equivalent substitutions to the present utility model. All technical solutions and improvements that do not depart from the spirit and scope of the present utility model should be covered within the scope of the claims of the present utility model.

Claims

1. A device for measuring the thickness of copper plating on a ceramic substrate, characterized in that: The system includes a loading mechanism, a turntable mechanism, a measuring mechanism, a robotic arm, an OK unloading mechanism, and an NG unloading mechanism. The turntable mechanism has a fixed position for placing substrates. When the turntable mechanism rotates, the fixed position passes sequentially through the loading mechanism, the measuring mechanism, and the robotic arm. The robotic arm is used to pick up and place substrates from the turntable mechanism onto the OK unloading mechanism or the NG unloading mechanism. The loading mechanism includes a material frame conveyor line, a material frame flipping assembly corresponding to the material frame conveyor line, a pusher assembly that pushes material frames from the material frame conveyor line to the material frame flipping assembly, a substrate conveyor line corresponding to the material frame flipping assembly, a hook assembly that hooks substrates from the material frame one by one onto the substrate conveyor line, and a substrate picking and placing assembly that picks up substrates from the substrate conveyor line onto the fixed position of the turntable mechanism.

2. The ceramic substrate copper coating thickness measuring device as described in claim 1, characterized in that: The material frame flipping assembly includes a platform that carries the material frame, a flipping drive that drives the platform to flip, and a lifting drive that drives the platform to rise and fall. The material frame flipping assembly drives the material frame to flip between a position with the opening facing upward and a position with the opening facing the substrate conveying line.

3. The ceramic substrate copper coating thickness measuring device as described in claim 1, characterized in that: The push frame assembly includes a bracket, a rodless cylinder, a rotary motor, a push plate, a motor base, and a guide rail. The rodless cylinder is horizontally mounted on one side of the bracket. The rotary motor is mounted on the rodless cylinder via the motor base and is driven to translate by the rodless cylinder. The motor base moves along the guide rail. The push plate is mounted on the rotary motor and is driven to rotate by the rotary motor.

4. The ceramic substrate copper coating thickness measuring device as described in claim 1, characterized in that: The turntable mechanism includes a turntable and a motor that drives the turntable to rotate horizontally, and a plurality of fixed positions are provided on the turntable.

5. The ceramic substrate copper coating thickness measuring device as described in claim 1, characterized in that: The substrate conveying line includes two rows of parallel rollers. The hook plate assembly includes a horizontal drive component, a hook disposed on the horizontal drive component, and a guide rail. The guide rail is disposed between the two rows of rollers in the front-back direction. The hook moves horizontally along the guide rail to hook the substrates in the material frame one by one from top to bottom onto the rollers.

6. The ceramic substrate copper coating thickness measuring device as described in claim 1, characterized in that: The substrate picking and placing assembly includes grippers, a lifting module for raising and lowering the grippers, and a translation module for moving the grippers horizontally.

7. The ceramic substrate surface copper coating thickness measuring device as described in claim 4, characterized in that: It also includes a laser marking mechanism, which is located on the moving path of the fixed position of the turntable mechanism.

8. The ceramic substrate copper coating thickness measuring device as described in claim 7, characterized in that: The four fixed positions are arranged in a circular pattern on the turntable. Each of the four fixed positions corresponds to the loading position of the substrate picking and placing assembly, the measuring position of the measuring mechanism, the marking position of the laser marking mechanism, and the unloading position of the robot arm.

9. The ceramic substrate copper coating thickness measuring device as described in claim 1, characterized in that: It also includes a material frame picking and placing mechanism on the empty material frame of the material frame flipping assembly to the OK unloading mechanism or the NG unloading mechanism. The material frame picking and placing mechanism includes a gripper assembly, a lifting assembly that drives the gripper assembly to rise and fall, and a translation assembly that drives the gripper assembly to move horizontally.

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