Wafer grinding machine

Abstract

The application relates to the technical field of wafer processing, in particular to a wafer grinding machine, which comprises horizontally and intervally arranged grinding support tables, a grinding wheel placing support table and an automatic replacement assembly arranged above the grinding support tables and the grinding wheel placing support table; the automatic replacement assembly comprises a moving platform, a lifting mechanism mounted on the moving platform and a main shaft mounted on the lifting mechanism; the surface of the grinding wheel placing support table is provided with at least two placing positions for placing grinding wheels; the moving platform drives the main shaft to move in the horizontal direction, so that the main shaft is located at a first position above a preselected placing position and coincides with the center axis of the grinding wheel or is located at a second position above the grinding support table. The wafer grinding machine can realize automatic replacement of the grinding wheel and effectively improves the production efficiency of the machine.

Description

Technical Field

[0001] This application relates to the field of wafer processing technology, and more specifically, to a wafer grinding machine. Background Technology

[0002] In wafer grinding, different types of grinding wheels are used to grind and thin the wafer surface. Because grinding wheels are designed and optimized for specific materials, a particular wheel can typically only efficiently grind one or a limited number of types of materials. For example, some grinding wheels may be particularly suitable for grinding silicon wafers, but less effective for other materials such as sapphire or ceramics. If different types of materials need to be processed or different grinding parameters are required, such as different grit levels, grinding wheels with different properties must be used. Since a machine has only one spindle, different grinding wheels must be used sequentially to complete the entire process. This involves machine downtime, manual wheel changes by operators, and recalibration, significantly reducing production efficiency. Utility Model Content

[0003] The purpose of this application is to provide a wafer grinding machine that can automatically change grinding wheels, thereby effectively improving the production efficiency of the machine.

[0004] The embodiments of this application are implemented as follows:

[0005] This application provides a wafer grinding machine, including a horizontally spaced grinding stage, a grinding wheel placement stage, and an automatic changing assembly disposed above the grinding stage and the grinding wheel placement stage. The automatic changing assembly includes a moving platform, a lifting mechanism mounted on the moving platform, and a spindle mounted on the lifting mechanism. The surface of the grinding wheel placement stage has at least two placement positions for placing grinding wheels. The moving platform drives the spindle to move horizontally, positioning the spindle at a first position above a pre-selected placement position and coinciding with the central axis of the grinding wheel, or at a second position above the grinding stage. In the first position, a mounting plate parallel to the grinding wheel is provided at the end of the spindle near the grinding wheel, and the lifting mechanism drives the spindle to approach the grinding wheel vertically. The mounting plate is provided with a grinding wheel connecting mechanism for connecting the grinding wheel to the mounting plate. In the second position, the spindle is driven to rotate the grinding wheel for grinding the wafer substrate on the grinding stage.

[0006] As an optional implementation, the grinding wheel connection mechanism includes a first electromagnet and a positioning pin, the positioning pin being disposed at the telescopic drive end of the first electromagnet; in a first position, the grinding wheel has a positioning hole on its surface near the spindle that corresponds to the position of the positioning pin, and the telescopic drive end pushes the positioning pin into the positioning hole in a direction perpendicular to the plane of the grinding wheel.

[0007] As an optional implementation, there are at least two locating pins, which are spaced apart around the central axis of the spindle.

[0008] As an optional implementation, the positioning pin includes a cylindrical pin with a tapered structure at its end, the tip of which faces the positioning hole; the opening of the positioning hole is provided with a guide slope.

[0009] As an optional implementation, the grinding wheel connection mechanism includes a rotary power module and a threaded connector; the rotary power module is disposed on the mounting base plate; the grinding wheel has a threaded hole in the middle; in a first position, the central axis of the threaded connector is aligned with the central axis of the threaded hole; the rotary power module can drive the threaded connector to rotate so that the threaded connector engages with the threaded hole.

[0010] As an optional implementation, the mounting base plate is provided with a pressure detection module on the side near the grinding wheel, and when the threaded connector is connected to the threaded hole, the pressure detection module abuts against the surface of the grinding wheel.

[0011] As an optional implementation, the grinding wheel placement platform is provided with a clamping assembly; the clamping assembly includes a plurality of clamping parts arranged at intervals around the circumference of the grinding wheel.

[0012] As an optional implementation, the clamping assembly includes a plurality of second electromagnets arranged at intervals around the circumference of the grinding wheel; the clamping part is disposed on the telescopic drive part of the second electromagnets; the second electromagnets can drive the clamping part to abut or separate from the side of the grinding wheel.

[0013] As an optional implementation, the circumferential side of the grinding wheel is provided with a groove corresponding to the position of the clamping part; the clamping part includes a snap-fit ​​component that engages with the groove.

[0014] As an optional implementation, the mounting base plate is provided with a torque sensor, which is used to detect the connection torque between the threaded connector and the threaded hole.

[0015] The beneficial effects of the embodiments of this application include:

[0016] This application embodiment automates the grinding wheel replacement process by introducing an automatic replacement component. Compared to traditional equipment that requires machine shutdown, manual replacement of the grinding wheel, and recalibration, this structure significantly shortens the replacement time and reduces waiting and operation time during non-processing periods, thereby significantly improving processing capacity and overall production efficiency per unit time. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is one of the structural schematic diagrams of a wafer grinding machine according to an embodiment of this application;

[0019] Figure 2 This is a second schematic diagram of the structure of the wafer grinding machine according to an embodiment of this application;

[0020] Figure 3 This is the third schematic diagram of the structure of the wafer grinding machine in the embodiments of this application.

[0021] Icons: 100-Grinding stage; 101-Grinding wheel placement stage; 102-Lifting mechanism; 103-Spindle; 104-Placement position; 105-Mounting substrate; 106-Grinding wheel connection mechanism; 107-Wafer substrate; 108-Positioning pin; 109-Positioning hole; 110-Conical structure; 111-Rotation power module; 112-Threaded connector; 113-Threaded hole. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0023] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0024] It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. Furthermore, the terms "first," "second," "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0025] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0026] In wafer grinding, different types of grinding wheels are used to grind and thin the wafer surface. Because grinding wheels are designed and optimized for specific materials, a particular wheel can typically only efficiently grind one or a limited number of types of materials. For example, some grinding wheels may be particularly suitable for grinding silicon wafers, but less effective for other materials such as sapphire or ceramics. If different types of materials need to be processed or different grinding parameters are required, such as different grit levels, grinding wheels with different properties must be used. Since a machine has only one spindle, different grinding wheels must be used sequentially to complete the entire process. This involves machine downtime, manual wheel changes by operators, and recalibration, significantly reducing production efficiency.

[0027] To address the aforementioned technical problems, this application provides a wafer grinding machine.

[0028] Reference Figure 1 , Figure 2 As shown in the embodiment of this application, the wafer grinding machine includes a grinding stage 100 arranged horizontally at intervals, a grinding wheel placement stage 101, and an automatic changing assembly disposed above the grinding stage 100 and the grinding wheel placement stage 101. The automatic changing assembly includes a moving platform, a lifting mechanism 102 mounted on the moving platform, and a spindle 103 mounted on the lifting mechanism 102. The surface of the grinding wheel placement stage 101 has at least two placement positions 104 for placing grinding wheels. The moving platform drives the spindle 103 to move horizontally, so that the spindle 103 is positioned... The grinding wheel can be placed at either the first position above the pre-selected placement position 104 and coinciding with the central axis of the grinding wheel, or at the second position above the grinding stage 100. In the first position, the spindle 103 is provided with a mounting base 105 parallel to the grinding wheel at one end near the grinding wheel. The lifting mechanism 102 drives the spindle 103 to approach the grinding wheel in the vertical direction. The mounting base 105 is provided with a grinding wheel connection mechanism 106 for connecting the grinding wheel to the mounting base 105. In the second position, the spindle 103 is driven to rotate the grinding wheel for grinding the wafer substrate 107 on the grinding stage 100.

[0029] It should be noted that the grinding stage 100 in this embodiment is used to support the wafer substrate 107 to be processed. The surface of the grinding wheel placement stage 101 is provided with at least two placement positions 104 for placing grinding wheels of different models. For example, the surface of the grinding wheel placement stage 101 is provided with three placement positions 104, and each of the three placement positions 104 is provided with a grinding wheel of a different model. The automatic changing component is located above the two stages and includes a moving platform, a lifting mechanism 102, and a spindle 103. The moving platform enables the spindle 103 to move in the horizontal direction, including a first horizontal direction and a second horizontal direction.

[0030] For example, the mobile platform includes a first electric guide rail and a second electric guide rail. The first electric guide rail can drive the main shaft 103 to move in a first direction, and the second electric guide rail can drive the main shaft 103 to move in a second direction. A lifting mechanism 102 is installed on the mobile platform to control the up and down movement of the main shaft 103.

[0031] The spindle 103 is used to mount and drive the grinding wheels to rotate. It enables automatic switching between multiple grinding wheels, eliminating the need for manual replacement and recalibration.

[0032] It should be noted that the first electric guide rail, the second electric guide rail, and the lifting mechanism 102 constitute a three-dimensional moving platform. The first direction can be understood as the X-axis, the second direction can be understood as the Y-axis, and the vertical driving direction of the lifting mechanism 102 can be understood as the Z-axis.

[0033] Regarding the explanation of the first position, the first position can be understood as the grinding wheel replacement position. The spindle 103 is located directly above a grinding wheel placement position 104; the lower end of the spindle 103 is provided with a mounting base plate 105 parallel to the grinding wheel; the lifting mechanism 102 drives the spindle 103 to descend, so that the mounting base plate 105 is close to the grinding wheel; the mounting base plate 105 is provided with a grinding wheel connecting mechanism 106, which can fix the grinding wheel on the spindle 103.

[0034] The second position can be understood as the grinding position. The spindle 103 moves to directly above the grinding stage 100; the spindle 103 drives the held grinding wheel to rotate at high speed; and the wafer substrate 107 is ground.

[0035] The mobile platform enables precise position control, and the grinding wheel connection mechanism 106 enables automatic connection and release of the grinding wheel, supporting rapid switching between different types of grinding wheels.

[0036] It should be noted that the grinding wheel connection mechanism 106 can be a pneumatically controlled mechanical claw, an electrically controlled mechanical buckle, or other gripping mechanism.

[0037] The technical effects that the embodiments of this application can produce are:

[0038] This application embodiment automates the grinding wheel replacement process by introducing an automatic replacement component. Compared to traditional equipment that requires machine shutdown, manual replacement of the grinding wheel, and recalibration, this structure significantly shortens the replacement time and reduces waiting and operation time during non-processing periods, thereby significantly improving processing capacity and overall production efficiency per unit time.

[0039] Due to the diverse types of wafer materials, such as silicon, sapphire, and ceramics, different materials typically require grinding wheels with different properties for efficient grinding. The machine structure provided in this application supports the centralized placement of multiple grinding wheels and allows for flexible selection of the required grinding wheel through a control system. This enables the same equipment to adapt to various materials and different process requirements, significantly enhancing the processing adaptability and application range of the equipment.

[0040] Traditional manual grinding wheel changing methods are prone to problems such as improper installation or misalignment of the grinding wheel due to improper operation, affecting processing quality and even causing equipment failure. This solution, however, uses precise mechanical positioning and an automated connection mechanism to ensure the accuracy and stability of each grinding wheel change, effectively reducing the uncertainty caused by human operation and improving the reliability of the processing and product consistency.

[0041] The embodiments of this application possess a high degree of automation, with the grinding wheel replacement process controlled by a program, requiring no manual intervention. This design facilitates seamless integration into fully automated wafer fabrication lines, enabling intelligent operation of the entire process from material loading and grinding to wheel replacement. This aligns with the current trend of manufacturing transformation towards automation and digitalization, and has significant industrial application value.

[0042] Reference Figure 2 as well as Figure 3 As shown, as an optional implementation, the grinding wheel connection mechanism 106 includes a first electromagnet and a positioning pin 108. The positioning pin 108 is located at the telescopic drive end of the first electromagnet. In the first position, the grinding wheel has a positioning hole 109 on the surface near the spindle 103 that corresponds to the position of the positioning pin 108. The telescopic drive end pushes the positioning pin 108 into the positioning hole 109 in a direction perpendicular to the plane where the grinding wheel is located.

[0043] It should be noted that when the spindle 103 moves to the first position and the grinding wheel is directly below the mounting base 105, the first electromagnet is energized, driving the positioning pin 108 to extend downwards along the plane perpendicular to the grinding wheel; the positioning pin 108 is inserted into the positioning hole 109 on the grinding wheel; achieving precise positioning between the grinding wheel and the spindle 103; then the grinding wheel connecting mechanism 106 fixes the grinding wheel. Subsequently, in the second position, the spindle 103 rotates to perform grinding with the grinding wheel. After grinding is completed, the spindle 103 returns to the first position, the grinding wheel connecting mechanism 106 releases the grinding wheel, and at the same time, the first electromagnet is de-energized, the positioning pin 108 retracts, and the grinding wheel returns to its original position.

[0044] It should be noted that the electromagnetically controlled telescopic positioning pin 108 can achieve precise alignment between the spindle 103 and the grinding wheel within seconds. The structure of the positioning pin 108 driven by the first electromagnet has a fast response speed and stable operation, which is beneficial to improving the efficiency of wheel changing. Since the positions of the positioning pin 108 and the positioning hole 109 correspond one-to-one and the insertion direction is perpendicular, it can ensure that there is a highly consistent assembly position between the positioning pin and the spindle 103 each time the grinding wheel is changed, avoiding vibration or uneven grinding problems caused by eccentricity or misalignment.

[0045] For example, there are at least two locating pins 108, which are arranged at intervals around the central axis of the main shaft 103.

[0046] More preferably, the positioning pin 108 includes a cylindrical pin, the end of which is provided with a tapered structure 110, the tip of which faces the positioning hole 109; the opening of the positioning hole 109 is provided with a guide slope.

[0047] It should be noted that the tapered structure 110 is located at the end of the cylindrical pin, with its tip facing the positioning hole 109. The tapered structure 110 helps guide the positioning pin 108 accurately into the positioning hole 109, especially in cases where there may be slight misalignment.

[0048] The guide ramp is located at the opening of the positioning hole 109 and cooperates with the tapered structure 110. The presence of the guide ramp helps the tapered structure 110 to be more easily inserted into the positioning hole 109, and can be successfully docked even when there is a certain positional error.

[0049] By providing a tapered structure 110 at the end of the cylindrical pin and designing a guide slope at the opening of the positioning hole 109, the positioning pin 108 can be effectively guided when approaching the positioning hole 109. Even if the initial alignment is not precise enough, the combination of the tapered structure 110 and the guide slope can help automatically correct positional errors, allowing the positioning pin 108 to smoothly enter the positioning hole 109. This not only improves the accuracy of alignment but also increases the system's tolerance to minor positional deviations during installation. In other words, the embodiments of this application enhance the fault tolerance and alignment accuracy during equipment operation, reducing the risk of failure due to minor alignment inaccuracies.

[0050] Furthermore, the tapered structure 110 and the guide ramp design not only help improve the success rate of initial alignment but also reduce wear or other mechanical damage that may be caused by forced insertion. This means that over long-term use, the various components of the equipment will be more durable, and maintenance costs will be reduced accordingly.

[0051] Reference Figure 3As shown, in one optional embodiment, the grinding wheel connection mechanism 106 includes a rotary power module 111 and a threaded connector 112; the rotary power module 111 is disposed on the mounting base plate 105; a threaded hole 113 is provided in the middle of the grinding wheel; in a first position, the central axis of the threaded connector 112 is aligned with the central axis of the threaded hole 113; the rotary power module 111 can drive the threaded connector 112 to rotate so that the threaded connector 112 engages and connects with the threaded hole 113.

[0052] It should be noted that, unlike the mechanical grippers and other mechanisms described above, the grinding wheel connecting mechanism 106 in this embodiment includes a rotary power module 111: mounted on the mounting base plate 105, used to provide rotary driving force. This module can be a small servo motor, stepper motor, or pneumatic motor, etc.

[0053] Threaded connector 112: It is a connecting rod or bolt structure with external threads, which is connected to the output end of the rotary power module 111 and driven to rotate.

[0054] Threaded hole 113: Located in the middle of the grinding wheel, with an internal thread on the inner wall that matches the threaded connector 112.

[0055] The working process of this application embodiment:

[0056] When the spindle 103 moves to the first position, that is, when the grinding wheel position is changed, the threaded connector 112 is aligned with the threaded hole 113 in the middle of the grinding wheel.

[0057] The rotary power module 111 is activated, driving the threaded connector 112 to rotate;

[0058] During rotation, the threaded connector 112 automatically screws into the threaded hole 113 along the axial direction to complete the connection;

[0059] After grinding is complete, simply rotate the wheel in the opposite direction to disconnect and release the grinding wheel.

[0060] It should be noted that a different type of grinding wheel can be reconnected as needed. This can be achieved through the control program settings of the control system. Those skilled in the art can set the control program as needed, and there are no special limitations on this.

[0061] This embodiment of the application utilizes a threaded connection to ensure a robust and stable mechanical connection between the grinding wheel and the spindle 103. This connection can withstand significant torque and centrifugal force from high-speed rotation, preventing the risk of the grinding wheel loosening or falling off during processing. Compared to other types of connection mechanisms, this embodiment improves connection strength and stability, ensuring processing safety and reliability.

[0062] Furthermore, a torque sensor is provided on the mounting base plate 105, which is used to detect the connection torque between the threaded connector 112 and the threaded hole 113.

[0063] It should be noted that the torque sensor is used to detect the output torque of the threaded connector 112 in real time during the process of screwing it into the threaded hole 113 of the grinding wheel; the obtained torque data can be used to determine whether the connection is in place, whether there is abnormal resistance or stripping; and to facilitate the control system to make judgments and control the rotary power module 111 according to the preset torque threshold.

[0064] When the threaded connector 112 rotates and is screwed into the grinding wheel threaded hole 113, the torque sensor measures the required torque at this time to determine the connection quality.

[0065] This application embodiment can accurately determine whether the thread is fully engaged, whether there is jamming, stripping, or obstruction by detecting torque changes during the connection process. Compared to methods that rely solely on the number of rotations or time control, torque feedback offers greater physical accuracy and repeatability.

[0066] Reference Figure 3 As shown, as an optional implementation, the mounting base plate 105 is provided with a pressure detection module on the side near the grinding wheel. When the threaded connector 112 is connected to the threaded hole 113, the pressure detection module abuts against the surface of the grinding wheel.

[0067] The pressure detection module of this embodiment is disposed on the side of the mounting base plate 105 close to the grinding wheel; the pressure detection module will come into contact with the surface of the grinding wheel during or after the threaded connector 112 is screwed into the threaded hole 113.

[0068] The pressure detection module can be a structure integrating a pressure sensor, such as a pressure-sensing pad with an elastic deformation layer or a miniature pressure probe. Its function is to detect the contact pressure value between the grinding wheel and the mounting base plate 105, thereby determining whether the connection is in place.

[0069] As an optional implementation, the grinding wheel placement platform 101 is provided with a clamping assembly; the clamping assembly includes a plurality of clamping parts arranged at intervals around the circumference of the grinding wheel.

[0070] The clamping assembly includes multiple second electromagnets arranged at intervals around the circumference of the grinding wheel; the clamping part is located on the telescopic drive part of the second electromagnets; the second electromagnets can drive the clamping part to abut or separate from the side of the grinding wheel.

[0071] The working principle of the embodiments of this application is as follows:

[0072] When the spindle 103 moves to the first position to prepare for gripping the grinding wheel, the second electromagnet is energized, the clamping part is extended, and the grinding wheel is clamped, improving the stability of the grinding wheel.

[0073] During the screwing of the threaded connector 112, the clamping assembly maintains a clamping force on the grinding wheel to prevent it from shifting or tilting.

[0074] After the operation is completed, the second electromagnet is de-energized, the clamping part retracts, the grinding wheel is released, and the spindle 103 can continue to perform the next action.

[0075] When the spindle 103 moves to the first position to place the grinding wheel, the second electromagnet is de-energized, the clamping part is in the retracted state, and the grinding wheel is allowed to be placed freely.

[0076] After the grinding wheel is correctly positioned, the second electromagnet is energized, pushing the clamping part to extend outward until it contacts the side of the grinding wheel and applies appropriate pressure; during the unscrewing of the threaded connector 112, the clamping assembly maintains a clamping force on the grinding wheel to prevent it from shifting or tilting.

[0077] As an optional implementation, the circumferential side of the grinding wheel is provided with a groove corresponding to the position of the clamping part; the clamping part includes a snap-fit ​​component that engages with the groove.

[0078] It should be noted that by introducing a locking mechanism between the slot and the connector, more precise positioning support can be provided during the grinding wheel installation process. Compared to clamping methods that rely solely on surface contact, this method significantly improves the stability and reliability of clamping, which is particularly important in applications involving high-speed rotation or requiring extremely high precision.

[0079] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A wafer grinding machine, characterized in that, The system includes a horizontally spaced grinding stage (100), a grinding wheel placement stage (101), and an automatic changing assembly positioned above the grinding stage (100) and the grinding wheel placement stage (101). The automatic changing assembly includes a moving platform, a lifting mechanism (102) mounted on the moving platform, and a spindle (103) mounted on the lifting mechanism (102). The surface of the grinding wheel placement stage (101) has at least two placement positions (104) for placing grinding wheels. The moving platform drives the spindle (103) to move horizontally, positioning the spindle (103) at a pre-selected placement position (104). The first position is above the grinding wheel and coincides with the central axis of the grinding wheel, or the second position is above the grinding stage (100); in the first position, the spindle (103) is provided with a mounting plate (105) parallel to the grinding wheel at one end near the grinding wheel, and the lifting mechanism (102) drives the spindle (103) to approach the grinding wheel in the vertical direction, and the mounting plate (105) is provided with a grinding wheel connection mechanism (106) for connecting the grinding wheel to the mounting plate (105); in the second position, the spindle (103) is driven to rotate the grinding wheel for grinding the wafer substrate (107) on the grinding stage (100).

2. The wafer grinding machine according to claim 1, characterized in that, The grinding wheel connection mechanism (106) includes a first electromagnet and a positioning pin (108). The positioning pin (108) is located at the telescopic drive end of the first electromagnet. In the first position, the grinding wheel has a positioning hole (109) on the surface near the spindle (103) that corresponds to the position of the positioning pin (108). The telescopic drive end pushes the positioning pin (108) into the positioning hole (109) in a direction perpendicular to the plane of the grinding wheel.

3. The wafer grinding machine according to claim 2, characterized in that, There are at least two of the locating pins (108), which are spaced apart around the central axis of the main shaft (103).

4. The wafer grinding machine according to claim 2, characterized in that, The positioning pin (108) includes a cylindrical pin, the end of which is provided with a tapered structure (110), the tip of which faces the positioning hole (109); the opening of the positioning hole (109) is provided with a guide slope.

5. The wafer grinding machine according to any one of claims 2-4, characterized in that, The grinding wheel connection mechanism (106) includes a rotary power module (111) and a threaded connector (112); the rotary power module (111) is disposed on the mounting base plate (105); the grinding wheel has a threaded hole (113) in the middle; in a first position, the central axis of the threaded connector (112) is aligned with the central axis of the threaded hole (113); the rotary power module (111) can drive the threaded connector (112) to rotate so that the threaded connector (112) and the threaded hole (113) are engaged and connected.

6. The wafer grinding machine according to claim 5, characterized in that, The mounting base plate (105) is provided with a pressure detection module on the side near the grinding wheel. When the threaded connector (112) is connected to the threaded hole (113), the pressure detection module abuts against the surface of the grinding wheel.

7. The wafer grinding machine according to claim 1, characterized in that, The grinding wheel placement platform (101) is provided with a clamping assembly; the clamping assembly includes a plurality of clamping parts arranged at intervals around the circumference of the grinding wheel.

8. The wafer grinding machine according to claim 7, characterized in that, The clamping assembly includes a plurality of second electromagnets arranged at intervals around the circumference of the grinding wheel; the clamping part is provided on the telescopic drive part of the second electromagnet; the second electromagnet can drive the clamping part to abut or separate from the side of the grinding wheel.

9. The wafer grinding machine according to claim 8, characterized in that, The grinding wheel has a groove on its circumferential side that corresponds to the position of the clamping part; the clamping part includes a snap-fit ​​component that engages with the groove.

10. The wafer grinding machine according to claim 5, characterized in that, The mounting base plate (105) is provided with a torque sensor, which is used to detect the connection torque between the threaded connector (112) and the threaded hole (113).

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