A set type pre-plastic packaging feeding equipment
By setting up a feeding base that facilitates positioning and assembly, and an alternating feeding mechanism, combined with the telescopic structure of cylinders and clamping frames, the problem of unstable clamping in existing equipment has been solved, achieving stable feeding and diverse adaptability of integrated circuit wafers, and improving the working efficiency and accuracy of the equipment.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- DONGGUAN LANGCHENGWEI ELECTRONIC EQUIP CO LTD
- Filing Date
- 2025-06-25
- Publication Date
- 2026-06-16
Smart Images

Figure CN224361464U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of integrated pre-molding feeding technology, specifically an integrated pre-molding feeding device. Background Technology
[0002] When in use, the integrated pre-molding feeding equipment can feed integrated circuit wafers and stably transport them to the corresponding production tooling, thereby controlling the stability of integrated circuit wafer molding. However, during use, it is inconvenient to control the feeding stability. Generally, manual positioning feeding is used, which can easily lead to slight deviations in feeding and affect the stability of subsequent molding.
[0003] To overcome the above-mentioned shortcomings, the prior art (Chinese patent application CN218131131U, filed on 2022-02-10) provides a plasticizer stirring device that facilitates quantitative control. This device uses a weighing module to accurately determine the weight of the material in the feeding cylinder, facilitating quantitative feeding and meeting mixing ratio requirements. Different types of materials can be initially mixed after falling into the mixing cylinder, reducing the mixing time in the mixing vessel. Simultaneously, the relative movement between the grinding cylinder and the mixing cylinder gradually breaks up agglomerated materials, ensuring sufficient contact area for reaction and improving reaction efficiency. While the prior art can complete the feeding and molding process, it is inconvenient to perform centered clamping and limiting during operation, and it is difficult to control the position of the grippers when the size of the integrated circuit wafer changes, affecting the versatility of the feeding equipment.
[0004] To address the aforementioned issues, there is an urgent need for innovative design based on the existing pre-sealing feeding equipment. Utility Model Content
[0005] The purpose of this utility model is to provide an integrated pre-molding feeding device to solve the problems mentioned in the background art, such as the inconvenience of centering and clamping during operation, and the inconvenience of controlling the position of the grippers when the size of the integrated circuit wafer changes, which affects the versatility of the feeding device during operation.
[0006] To achieve the above objectives, this utility model provides the following technical solution: a modular pre-sealing feeding device, comprising a feeding base for easy positioning and assembly, with finished tooling mounted on the upper surface of the feeding base, and a three-axis moving frame mounted on the upper surface of the feeding base; including: a feeding assembly, mounted on the rear side of the upper surface of the feeding base, with a feeding frame 1 slidably connected to the right side of the feeding assembly, and a feeding frame 2 threadedly slidably connected to the left side of the feeding assembly, and the feeding assembly is provided with an alternating feeding mechanism; a vertical frame, slidably connected to the three-axis moving frame, with a telescopic assembly vertically connected to the front side of the inner surface of the vertical frame, and a cylinder 3 mounted on the lower side of the telescopic assembly, with a clamping frame 1 telescopically connected to the cylinder 3 via a push rod, and a gripper 1 mounted on the outer side of the clamping frame 1, and a cylinder 4 mounted on the side of the cylinder 3, with a clamping frame 2 telescopically connected to the cylinder 4 via a push rod, and the clamping frame 2 is provided with a limiting telescopic mechanism.
[0007] Preferably, the alternating feeding mechanism includes cylinder one and cylinder two mounted on the lower side of the inner surface of the feeding assembly, and cylinder one is connected to a support plate for lifting and lowering, and cylinder two is connected to a top plate for lifting and lowering, while the push rod on the lower side of the support plate passes through the inner surface of the top plate.
[0008] Preferably, the feeding component and the feeding base form an integrated structure, and the feeding component forms a sliding structure through feeding frame one and feeding frame two. The feeding component, cylinder one and cylinder two form an integrated structure. At the same time, cylinder one and the supporting plate form a lifting structure, and cylinder two and the top plate form a telescopic structure. Meanwhile, the supporting plate and the top plate form a through structure through a push rod.
[0009] Preferably, the vertical frame and the three-axis moving frame form a sliding structure, and the vertical frame and the telescopic component form a telescopic structure. The telescopic component, cylinder three, and cylinder four form an integrated structure. At the same time, cylinder three forms a telescopic structure with clamping frame one and clamping claw one, and cylinder four forms a telescopic structure with clamping frame two.
[0010] Preferably, the limiting telescopic mechanism includes a rack slidably connected to the inner surface of the clamping frame two, and a telescopic frame is installed on the outer surface of the rack, and a clamping jaw two is connected to the outer surface of the telescopic frame, while an integrated circuit chip is clamped and connected to the inner surface of the clamping jaw two; the clamping frame two forms a telescopic structure with the telescopic frame through the rack, and the telescopic frame and the clamping jaw two form an integrated structure, and the clamping jaw two and the integrated circuit chip form a clamping structure.
[0011] Preferably, the inner surface of the second clamping frame is rotatably connected to a drive shaft, and the outer surface of the second clamping frame is equipped with a meshing gear. A rack is meshed with the outer surface of the meshing gear. A locking shaft is installed on the front spur gear of the meshing gear. A locking block is engaged with the inner surface of the locking shaft. A limit component is slidably connected to the outer surface of the locking block. A return spring is elastically connected between the limit component and the locking block. The limit component is installed on the lower surface of the second clamping frame.
[0012] Preferably, the second clamping frame and the drive shaft form a rotating structure, and the drive shaft forms a meshing structure with the rack through meshing gears, and the drive shaft forms a linkage structure with the locking shaft through meshing gears. At the same time, the locking shaft and the locking block form a limiting engagement structure, and the locking block forms an elastic sliding structure with the limiting component through a return spring.
[0013] Compared with the prior art, the beneficial effects of this utility model are:
[0014] 1. This integrated pre-molding feeding equipment is equipped with finished tooling for easy positioning and assembly for later molding. It also features adjustable feeding racks 1 and 2, as well as a support plate and a top plate, to control the concentration of integrated circuit wafers on the support plate. This facilitates the clamping and feeding of the integrated circuit wafers by multi-axis driven grippers 1 and 2, thereby improving the stability of pre-molding feeding of integrated circuit wafers.
[0015] 2. This integrated pre-packaging feeding equipment is equipped with an alternating feeding mechanism, which facilitates alternating feeding via feeding rack one and feeding rack two. In conjunction with the lifting control of the supporting plate and the top plate, it can effectively perform alternating feeding and positioning of integrated circuit wafers and provide convenient conditions for the clamping mechanism.
[0016] 3. This integrated pre-packaging loading equipment is equipped with a limiting telescopic mechanism, which can effectively control the telescopic frame on the second clamping frame to perform limited telescopic adjustment, and can control the distance between the two grippers, improving the convenience of adjustment when clamping integrated circuit wafers of different lengths; furthermore, through the use of the third cylinder, the clamping pair on the first clamping frame can be effectively controlled to clamp the width of the integrated circuit wafer, improving the stability of lateral clamping; furthermore, through the cooperation of the meshing gear in the second clamping frame with the drive shaft and locking shaft, the position of the telescopic frame is controlled in linkage, and with the built-in locking block of the limiting component, the adjusted grippers are limited and locked to prevent loosening. Attached Figure Description
[0017] Figure 1 This is a three-dimensional structural diagram of the feeding base of this utility model;
[0018] Figure 2 This is a half-sectional three-dimensional structural diagram of the feeding base of this utility model;
[0019] Figure 3 This is a partial cross-sectional perspective view of the three-dimensional structure of the feeding component of this utility model;
[0020] Figure 4 This is a partial cross-sectional three-dimensional structural diagram of the telescopic component of this utility model;
[0021] Figure 5 This is a partial cross-sectional three-dimensional structural diagram of the clamping frame of this utility model;
[0022] Figure 6 This is a bottom-view three-dimensional structural diagram of the clamping frame of this utility model.
[0023] In the diagram: 1. Loading base; 2. Finished product tooling; 3. Three-axis moving frame; 4. Feeding assembly; 5. Feeding rack one; 6. Feeding rack two; 7. Cylinder one; 8. Support plate; 9. Cylinder two; 10. Top plate; 11. Vertical frame; 12. Telescopic assembly; 13. Cylinder three; 14. Clamping frame one; 15. Gripper one; 16. Cylinder four; 17. Clamping frame two; 18. Rack; 19. Telescopic frame; 20. Gripper two; 21. Integrated circuit chip; 22. Drive shaft; 23. Meshing gear; 24. Locking shaft; 25. Clamping block; 26. Limiting assembly; 27. Return spring. Detailed Implementation
[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0025] Please see Figures 1-6 The present invention provides the following technical solution: a modular pre-sealing feeding device, which is provided with a feeding base 1 for easy positioning and assembly, and a finished tooling 2 is installed on the upper surface of the feeding base 1, and a three-axis moving frame 3 is installed on the upper surface of the feeding base 1.
[0026] Example 1: As Figures 1-3The technical solution shown in this utility model provides the following technical solution: A modular pre-sealing feeding device, comprising: a feeding assembly 4, installed on the rear side of the upper surface of the feeding base 1, with a feeding frame 5 slidably connected to the right side of the feeding assembly 4, and a feeding frame 6 threadedly slidably connected to the left side of the feeding assembly 4; the feeding assembly 4 is also provided with an alternating feeding mechanism; the alternating feeding mechanism includes a cylinder 7 and a cylinder 9 installed on the lower side of the inner surface of the feeding assembly 4, and a support plate 8 is vertically connected to the upper side of the cylinder 7. Furthermore, the upper side of cylinder 2 9 is connected to the top plate 10 for lifting, and the push rod on the lower side of the material support plate 8 passes through the inner surface of the top plate 10; the feeding assembly 4 and the feeding base 1 form an integrated structure, and the feeding assembly 4 forms a sliding structure through the feeding frame 1 5 and the feeding frame 2 6, and the feeding assembly 4 forms an integrated structure with cylinder 1 7 and cylinder 2 9, while cylinder 1 7 and the material support plate 8 form a lifting structure, and cylinder 2 9 and the top plate 10 form a telescopic structure, while the material support plate 8 forms a through structure with the top plate 10 through the push rod.
[0027] In use, the control feeding base 1 is used to position and assemble the finished product tooling 2, so that the dispersed integrated circuit wafers 21 can be stably placed on the finished product tooling 2. This facilitates the subsequent feeding and forming of the wafer biscuits. The feeding frame 5, assembled by the feeding assembly 4, is used for initial feeding. When the wafers reach the upper side of the support plate 8, the control cylinder 7 is used to adjust the support plate 8 to move upward, supporting the first group of wafers and detaching them from the feeding frame 5. The feeding frame 5 is then reset to continue feeding. The feeding frame 6 is then controlled to move to the upper side of the support plate 8, and the control cylinder 9 is used to adjust the top plate 10 to move upward, supporting the second group of wafers and detaching them from the feeding frame 6. The feeding frame 6 is then reset to continue feeding, and the top plate 10 is moved downward to ensure that both the second and first groups of wafers are placed on the support plate 8, improving the stability of the initial feeding of the integrated circuit wafers 21.
[0028] Example 2: Figure 1 , Figure 2 , Figure 4 and Figure 5The technical solution shown, based on Embodiment 1, further discloses the adjustment of the three-axis moving frame 3 for the gripper 15 and gripper 20. The specific details are as follows: A vertical frame 11 is slidably connected to the three-axis moving frame 3. A telescopic assembly 12 is vertically connected to the front side of the inner surface of the vertical frame 11. A cylinder 13 is installed on the lower side of the telescopic assembly 12. Simultaneously, the cylinder 13 extends and retracts a clamping frame 14 via a push rod. Gripper 15 is installed on the outer side of the clamping frame 14. A cylinder 16 is installed on the side of the cylinder 13. Simultaneously, the cylinder 16 extends and retracts a clamping frame 27 via a push rod. The clamping frame 27 is equipped with a limiting telescopic mechanism. The vertical frame 11 and the three-axis moving frame 3 form a sliding structure, and the vertical frame 11 and the telescopic assembly 1... 2. A telescopic structure is formed, and the telescopic component 12, cylinder 3 13, and cylinder 4 16 form an integrated structure. At the same time, cylinder 3 13 forms a telescopic structure with clamping jaw 15 through clamping frame 14, and cylinder 4 16 forms a telescopic structure with clamping frame 2 17. The limiting telescopic mechanism includes a rack 18 slidably connected to the inner surface of clamping frame 2 17, and a telescopic frame 19 is installed on the outer surface of rack 18. A clamping jaw 20 is connected to the outer surface of telescopic frame 19, and an integrated circuit chip 21 is clamped and connected to the inner surface of clamping jaw 20. The clamping frame 2 17 forms a telescopic structure with the telescopic frame 19 through rack 18, and the telescopic frame 19 and clamping jaw 20 form an integrated structure. The clamping jaw 20 and integrated circuit chip 21 form a clamping structure.
[0029] After the integrated circuit wafer 21 is placed on the support plate 8, the vertical frame 11 of the control three-axis moving frame 3 is adjusted to control the telescopic component 12 to move downward. The telescopic component 12 drives the cylinder three 13 to adjust the clamping frame one 14 to move in the center, so that the jaws one 15 on the clamping frame one 14 clamp the narrow side of the integrated circuit wafer 21. At the same time, the cylinder four 16 is controlled to adjust the rack 18 connected to the clamping frame two 17 and the jaws two 20 assembled by the telescopic frame 19 to clamp the wide side of the integrated circuit wafer 21, thereby lifting the integrated circuit wafer 21 from the support plate 8 and controlling the integrated circuit wafer 21 to be transported to the finished product tooling 2, improving the stability and accuracy of the loading of the finished product tooling 2.
[0030] Example 3: Figure 1 , Figure 2 , Figure 5 and Figure 6The technical solution shown, based on Embodiment 2, further discloses the position adjustment of the telescopic frame 19 on the clamping frame 2 17. The specific details are as follows: a drive shaft 22 is rotatably connected to the inner surface of the clamping frame 2 17, and a meshing gear 23 is mounted on the outer surface of the clamping frame 2 17. A rack 18 is meshed with the outer surface of the meshing gear 23. A locking shaft 24 is mounted on the front spur gear of the meshing gear 23, and a locking block 25 is engaged with the inner surface of the locking shaft 24. A limit assembly 2 is slidably connected to the outer surface of the locking block 25. 6. Simultaneously, a return spring 27 is elastically connected between the limiting component 26 and the locking block 25, and the limiting component 26 is installed on the lower surface of the clamping frame 27; the clamping frame 27 and the drive shaft 22 form a rotating structure, and the drive shaft 22 forms a meshing structure with the rack 18 through the meshing gear 23, and the drive shaft 22 forms a linkage structure with the locking shaft 24 through the meshing gear 23, while the locking shaft 24 and the locking block 25 form a limiting engagement structure, and the locking block 25 forms an elastic sliding structure with the limiting component 26 through the return spring 27.
[0031] When adjusting the position of the telescopic frame 19 assembled by the clamping frame 21 according to the length of the integrated circuit wafer 21, the control block 25 compresses the return spring 27 and retracts it into the limiting component 26, and controls the drive shaft 22 of the clamping frame 21 to rotate. The drive shaft 22 drives the meshing gear 23 to adjust the position of the rack 18 in the clamping frame 21, thereby controlling the position of the gripper 20 installed on the telescopic frame 19. After adjusting to the corresponding position, the drive shaft 22 is stopped, thereby simultaneously adjusting the locking shaft 24 to stop rotating, and the block 25 slidably assembled by the limiting component 26 is released. The block 25 cooperates with the return spring 27 to perform stable elastic reset, and the block 25 is limited and locked inside the locking shaft 24, increasing the limiting stability of the gripper 20 and improving the convenience of spacing adjustment.
[0032] The contents not described in detail in this specification are existing technologies known to those skilled in the art.
[0033] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A modular pre-sealing feeding device, comprising a feeding base (1) for easy positioning and assembly, wherein a finished tooling (2) is installed on the upper surface of the feeding base (1), and a three-axis moving frame (3) is installed on the upper surface of the feeding base (1); Its features are, include: The feeding assembly (4) is installed on the rear side of the upper surface of the feeding base (1), and the feeding assembly (4) is slidably connected to the right side of the feeding frame one (5), and the feeding assembly (4) is threadedly connected to the left side of the feeding frame two (6). At the same time, the feeding assembly (4) is provided with an alternating feeding mechanism. A vertical frame (11) is slidably connected to the three-axis moving frame (3), and a telescopic assembly (12) is lifted and lowered on the front side of the inner surface of the vertical frame (11). A cylinder three (13) is installed on the lower side of the telescopic assembly (12). At the same time, the cylinder three (13) extends and retracts with a clamping frame one (14) through a push rod. A clamping claw one (15) is installed on the outside of the clamping frame one (14). A cylinder four (16) is installed on the side of the cylinder three (13). At the same time, the cylinder four (16) extends and retracts with a clamping frame two (17) through a push rod. The clamping frame two (17) is provided with a limiting telescopic mechanism.
2. The integrated pre-sealing feeding equipment according to claim 1, characterized in that: The alternating feeding mechanism includes cylinder 1 (7) and cylinder 2 (9) installed on the lower side of the inner surface of the feeding assembly (4). The upper side of cylinder 1 (7) is connected to a support plate (8), and the upper side of cylinder 2 (9) is connected to a top plate (10). At the same time, the push rod on the lower side of the support plate (8) passes through the inner surface of the top plate (10).
3. The integrated pre-sealing feeding equipment according to claim 1, characterized in that: The feeding assembly (4) and the loading base (1) form an integrated structure. The feeding assembly (4) forms a sliding structure through the feeding frame one (5) and the feeding frame two (6). The feeding assembly (4) forms an integrated structure with the cylinder one (7) and the cylinder two (9). At the same time, the cylinder one (7) and the supporting plate (8) form a lifting structure. The cylinder two (9) and the top plate (10) form a telescopic structure. At the same time, the supporting plate (8) and the top plate (10) form a through structure through the push rod.
4. The integrated pre-sealing feeding equipment according to claim 1, characterized in that: The vertical frame (11) and the three-axis moving frame (3) form a sliding structure, and the vertical frame (11) and the telescopic component (12) form a telescopic structure. The telescopic component (12), cylinder three (13) and cylinder four (16) form an integrated structure. At the same time, cylinder three (13) forms a telescopic structure with clamping frame one (14) and clamping claw one (15), and cylinder four (16) forms a telescopic structure with clamping frame two (17).
5. The integrated pre-sealing feeding equipment according to claim 1, characterized in that: The limiting telescopic mechanism includes a rack (18) slidably connected to the inner surface of the clamping frame two (17), and a telescopic frame (19) is installed on the outer surface of the rack (18). The outer surface of the telescopic frame (19) is connected to a jaw two (20), and the inner surface of the jaw two (20) clamps and connects to an integrated circuit chip (21). The clamping frame two (17) and the telescopic frame (19) form a telescopic structure through the rack (18), and the telescopic frame (19) and the jaw two (20) form an integrated structure. The jaw two (20) and the integrated circuit chip (21) form a clamping structure.
6. The integrated pre-sealing feeding equipment according to claim 5, characterized in that: The inner surface of the clamping frame two (17) is rotatably connected to a drive shaft (22), and the outer surface of the clamping frame two (17) is equipped with a meshing gear (23). The outer surface of the meshing gear (23) is meshed with a rack (18). At the same time, the front spur gear of the meshing gear (23) is equipped with a locking shaft (24), and the inner surface of the locking shaft (24) is engaged with a locking block (25). The outer surface of the locking block (25) is slidably connected with a limit component (26). At the same time, a return spring (27) is elastically connected between the limit component (26) and the locking block (25), and the limit component (26) is installed on the lower surface of the clamping frame two (17).
7. The integrated pre-sealing feeding equipment according to claim 5, characterized in that: The clamping frame 2 (17) and the drive shaft (22) form a rotating structure, and the drive shaft (22) and the rack (18) form a meshing structure through the meshing gear (23), and the drive shaft (22) and the locking shaft (24) form a linkage structure through the meshing gear (23), while the locking shaft (24) and the locking block (25) form a limiting locking structure, and the locking block (25) and the limiting component (26) form an elastic sliding structure through the return spring (27).