A microstrip test board suitable for testing multi-size surface mount packaged dual-port filters
By designing a four-layer PCB microstrip test board, the problem of adapting traditional test boards to multi-size filters was solved, realizing efficient and economical testing of multi-size filters and improving testing efficiency and electrical performance stability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- XIAN XIGU XINCHUANG ELECTRONIC TECH CO LTD
- Filing Date
- 2025-07-23
- Publication Date
- 2026-06-16
AI Technical Summary
Traditional test boards only support a single package and a single size, resulting in low testing efficiency and high costs, and cannot meet the testing needs of multi-size filters.
Design a four-layer PCB microstrip test board with a central isolation slot and adjustable pads. Combined with a modular structure and impedance matching, it supports the testing of filters of various sizes. Electrical performance stability and ease of operation are achieved through SMA connectors and trapezoidal cross-section RF transmission lines.
It enables adaptation to multiple package sizes without changing fixtures, improves batch testing efficiency, reduces signal loss and crosstalk, reduces procurement and maintenance costs, and is suitable for R&D and mass production.
Smart Images
Figure CN224366097U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of testing equipment technology, specifically to a microstrip test board suitable for multi-size surface-mount packaged dual-port filters. Background Technology
[0002] With the development of radio frequency communication technology, the application of dual-port filters is becoming increasingly widespread. Common packages such as 0805, 1608, and 3216 are no longer sufficient to support current development, and more sizes have emerged to meet market application needs. However, traditional test boards or test sockets often only support a single package and size, requiring frequent changes to dedicated test fixtures, resulting in low testing efficiency and high costs, and failing to meet current testing requirements. Therefore, it is necessary to develop a universal test board that can adapt to multiple sizes of surface-mount packages and ensure electrical connection stability. Utility Model Content
[0003] This invention provides a microstrip test board suitable for multi-size surface-mount packaged dual-port filters. Through innovative PCB layout, impedance matching design, and modular structure, it solves the adaptation problem of multi-size filter testing, and combines electrical performance stability, ease of operation, and economy. It is suitable for R&D verification and large-scale production scenarios, and promotes the standardization and efficiency of RF device testing technology.
[0004] To achieve the above objectives, this utility model provides the following technical solution: a microstrip test board suitable for multi-size surface-mount packaged dual-port filters, comprising: a board body, the board body being a four-layer PCB board, with an upper conductor layer on the top, an isolation groove penetrating both ends of the board body being provided in the center of the upper conductor layer, and pads being provided on the edge of the upper conductor layer corresponding to the isolation groove; SMA-K clamp connectors being arranged in pairs and respectively fixed at both ends of the board body, the outer conductors of each SMA-K clamp connector being electrically connected to each other through the upper conductor layer, and the inner conductors of each SMA-K clamp connector corresponding to both ends of the isolation groove; and an RF transmission line, the RF transmission line being disposed in the center of the isolation groove and electrically connected to the inner conductors of the two SMA-K clamp connectors through both ends.
[0005] Preferably, the bottom of the plate body is provided with a lower conductor layer that is electrically connected to the two sma-k clamp joints; the pads are electrically connected to the lower conductor layer through vias.
[0006] Preferably, the plate body has multiple pairs of SMA-K clamp connectors at both ends, and the upper conductor layer and the lower conductor layer connecting each pair of SMA-K clamp connectors are isolated from each other.
[0007] Preferably, the radio frequency transmission line has a trapezoidal cross-section, with the lower base of the cross-section being 0.53 mm and the upper base being 0.5 mm; the distance between the edge of the radio frequency transmission line and the edge of the isolation groove is 0.5 mm.
[0008] Preferably, the sma-k clamp joint is fixedly connected by bolts that pass through the plate.
[0009] Preferably, both the RF transmission line and the pad are provided with a gold plating layer.
[0010] The advantages of this invention are as follows: This technical solution addresses the testing needs of multi-size surface-mount dual-port filters by proposing an innovative microstrip test board design. Through a central isolation slot and adjustable pads, it can adapt to various package sizes such as 0805, 1608, and 3216 without changing fixtures, significantly reducing the cumbersome operation of frequently changing dedicated fixtures in traditional testing. Multiple pairs of isolated SMA connectors can be configured at both ends of the board, supporting simultaneous testing of multiple filters and further improving batch testing efficiency. The top upper conductor layer and the bottom lower conductor layer are connected by vias to form a complete grounding loop, reducing signal return path impedance and minimizing high-frequency signal loss and crosstalk. The isolation slot ensures that the signal path is isolated from surrounding conductors, avoiding parasitic coupling. The trapezoidal cross-section RF transmission line precisely controls the characteristic impedance to 50Ω, matching filter testing requirements and reducing signal reflection. Furthermore, the RF transmission line and pad surfaces are gold-plated to enhance conductivity and oxidation resistance, ensuring long-term contact stability. Bolted SMA connectors: SMA-K clamp connectors are secured with bolts that penetrate the board, avoiding stress deformation caused by welding and improving mechanical strength and high-frequency connection reliability. The upper and lower conductor layers are partitioned and isolated, allowing for flexible expansion of test channels (such as parallel testing of multiple devices) while avoiding crosstalk between channels.
[0011] This test version uses a universal design to replace multiple dedicated fixtures, reducing procurement and maintenance costs. It also allows for rapid switching of the device under test (DUT), supports batch testing, and is particularly suitable for high-frequency, multi-variety testing scenarios on production lines. Therefore, this solution, through innovative PCB layout, impedance matching design, and modular structure, solves the adaptation problem for testing multi-size filters, combining electrical performance stability, ease of operation, and economy. It is suitable for both R&D verification and large-scale production scenarios, promoting the standardization and efficiency of RF device testing technology. Attached Figure Description
[0012] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0013] Figure 1 This is a schematic diagram of the overall structure of this utility model;
[0014] Figure 2 This is a schematic diagram of a partial cross-sectional structure of the plate body of this utility model.
[0015] In the diagram: 1. Board body; 2. Upper conductor layer; 3. Isolation groove; 4. Pad; 5. SMA-K clamp connector; 6. Outer conductor; 7. Inner conductor; 8. RF transmission line; 9. Lower conductor layer; 10. Via; 11. Bolt. Detailed Implementation
[0016] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.
[0017] according to Figure 1 , Figure 2 As shown, a microstrip test board suitable for multi-size surface-mount packaged dual-port filters includes: a board body 1, which is a four-layer PCB board with an upper conductor layer 2 on top. An isolation groove 3 penetrating both ends of the board body 1 is provided in the center of the upper conductor layer 2, and pads 4 are provided on the edges of the upper conductor layer 2 corresponding to the isolation groove 3; SMA-K clamp connectors 5 are arranged in pairs and fixed to both ends of the board body 1 by bolts 11 penetrating the board body 1. The outer conductor 6 of each SMA-K clamp connector 5 is connected to the... The conductor layers 2 are electrically connected to each other, and the inner conductors 7 of each SMA-K clamp connector 5 correspond to the two ends of the isolation groove 3. An RF transmission line 8 is disposed in the center of the isolation groove 3 and electrically connected to the inner conductors 7 of the two SMA-K clamp connectors 5 at both ends. The RF transmission line 8 has a trapezoidal cross-section, with a lower base of 0.53 mm and an upper base of 0.5 mm. The edge of the RF transmission line 8 is 0.5 mm from the edge of the isolation groove 3. Furthermore, both the RF transmission line 8 and the pads 4 are gold-plated.
[0018] Furthermore, the bottom of the board body 1 is provided with a lower conductor layer 9 electrically connected to the two SMA-K clamp connectors 5; the pad 4 is electrically connected to the lower conductor layer 9 through a via 10. Multiple pairs of SMA-K clamp connectors 5 are provided at opposite ends of the board body 1, and the upper conductor layer 2 and the lower conductor layer 9 connecting each pair of SMA-K clamp connectors 5 are isolated from each other.
[0019] This technical solution addresses the testing needs of multi-size surface-mount dual-port filters by proposing an innovative microstrip test board design. Through a central isolation slot 3 and adjustable pads 4, it adapts to various package sizes such as 0805, 1608, and 3216 without requiring fixture changes, significantly reducing the cumbersome operation of frequently changing dedicated fixtures in traditional testing. Multiple pairs of isolated SMA connectors can be configured at both ends of the board body 1, supporting simultaneous testing of multiple filters and further improving batch testing efficiency. The top upper conductor layer 2 and the bottom lower conductor layer 9 are connected by vias 10, forming a complete grounding loop, reducing signal return path impedance and minimizing high-frequency signal loss and crosstalk. The isolation slot 3 ensures signal path isolation from surrounding conductors, avoiding parasitic coupling. The trapezoidal cross-section RF transmission line 8 precisely controls its characteristic impedance to 50Ω, matching filter testing requirements and reducing signal reflection. Furthermore, the RF transmission line 8 and pads 4 are gold-plated to enhance conductivity and oxidation resistance, ensuring long-term contact stability. Bolt 11 secures the SMA connector: Bolt 11, which penetrates through plate 1, tightens the SMA-K clamp connector 5, preventing stress deformation caused by welding and improving mechanical strength and high-frequency connection reliability. The upper conductor layer 2 and lower conductor layer 9 are partitioned and isolated, allowing for flexible expansion of test channels while avoiding crosstalk between channels.
[0020] This test version uses a universal design to replace multiple dedicated fixtures, reducing procurement and maintenance costs. It also allows for rapid switching of the device under test (DUT), supports batch testing, and is particularly suitable for high-frequency, multi-variety testing scenarios on production lines. Therefore, this solution, through innovative PCB layout, impedance matching design, and modular structure, solves the adaptation problem for testing multi-size filters, combining electrical performance stability, ease of operation, and economy. It is suitable for both R&D verification and large-scale production scenarios, promoting the standardization and efficiency of RF device testing technology.
[0021] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.
Claims
1. A microstrip test board suitable for multi-size surface-mount packaged two-port filters, characterized in that, include: Board (1), the board (1) is a four-layer PCB board, with an upper conductor layer (2) on the top, and an isolation groove (3) penetrating both ends of the board (1) in the center of the upper conductor layer (2), and pads (4) are provided on the edge of the upper conductor layer (2) corresponding to the isolation groove (3); SMA-K clamp connectors (5) are arranged in pairs and fixed at both ends of the plate (1). The outer conductors (6) of each SMA-K clamp connector (5) are electrically connected to each other through the upper conductor layer (2). The inner conductors (7) of each SMA-K clamp connector (5) correspond to both ends of the isolation groove (3). Radio frequency transmission line (8) is disposed in the center of the isolation groove (3) and electrically connected at both ends to the inner conductors (7) of the two SMA-K clamp connectors (5).
2. The microstrip test board for multi-size surface-mount packaged two-port filters according to claim 1, characterized in that: The bottom of the plate (1) is provided with a lower conductor layer (9) that is electrically connected to the two sma-k clamp joints (5); the pad (4) is electrically connected to the lower conductor layer (9) through a via (10).
3. A microstrip test board for multi-size surface-mount packaged two-port filters according to claim 2, characterized in that: The plate (1) has multiple pairs of SMA-K clamp connectors (5) at its two ends opposite each other, and the upper conductor layer (2) and the lower conductor layer (9) connecting each pair of SMA-K clamp connectors (5) are isolated from each other.
4. A microstrip line test board for multi-size surface-mount packaged two-port filters according to claim 3, characterized in that: The radio frequency transmission line (8) has a trapezoidal cross-section, and the lower base of the radio frequency transmission line (8) is 0.53 mm and the upper base is 0.5 mm; the distance between the edge of the radio frequency transmission line (8) and the edge of the isolation groove (3) is 0.5 mm.
5. A microstrip test board for multi-size surface-mount packaged two-port filters according to claim 1, characterized in that: The sma-k clamp joint (5) is fixedly connected by bolts (11) that pass through the plate (1).
6. A microstrip test board for multi-size surface-mount packaged two-port filters according to claim 1, characterized in that: The surfaces of the radio frequency transmission line (8) and the pad (4) are both plated with gold.