A thermoelectric refrigeration temperature control system

Abstract

The utility model belongs to equipment heat dissipation technical field, concretely relates to a thermoelectric refrigeration temperature control system for the heat dissipation of heating device, and the heating device is in heat conduction connection with the thermoelectric refrigeration device, and the system includes heat transfer structure, and the heat transfer structure is in heat conduction connection with heating device, and the metal block is arranged on heat transfer structure, and the metal block is in heat conduction connection with heat transfer structure, and the metal block contacts with piezoelectric ceramic I or pressure sensor I, and piezoelectric ceramic I or pressure sensor I is electrically connected with temperature control module, and temperature control module is electrically connected with thermoelectric refrigeration device. In the utility model, the device generates heat, and the metal block is deformed, and then piezoelectric ceramic or pressure sensor generates electric signal, and the electric signal can control the power of thermoelectric refrigeration device through temperature control module, and it is no longer dependent on traditional temperature sensor, solves the installation and arrangement problem of temperature sensor, and the metal block, piezoelectric ceramic or pressure sensor structure is simple, can improve the reliability, realizes miniaturization design.

Description

Technical Field

[0001] This utility model belongs to the field of equipment heat dissipation technology, specifically relating to a thermoelectric refrigeration temperature control system. Background Technology

[0002] like Figure 1 The thermoelectric cooling device shown is located between the inner and outer shells of the chassis. It adjusts the thermoelectric cooling power by monitoring the temperature of key components within the chassis to dissipate heat from the functional modules. For functional modules with temperature feedback, the power of the thermoelectric cooler can be automatically adjusted based on the module's temperature. However, for modules without temperature feedback, the power needs to be adjusted based on the temperature sensor. Temperature sensors are typically thermocouples, requiring two wires connected at different locations, making installation complex and space-consuming. As functional modules become increasingly integrated, the space available for temperature sensors within these modules is limited, making installation difficult. Furthermore, thermocouple-type temperature sensors are bulky and have relatively poor reliability. Utility Model Content

[0003] To solve the above-mentioned technical problems, this utility model provides a thermoelectric refrigeration temperature control system, which solves the problem of temperature sensor installation and arrangement, and realizes the system's reliability and miniaturization design.

[0004] The purpose of this utility model is achieved through the following technical solution. A thermoelectric cooling temperature control system is proposed according to this utility model for dissipating heat from a heating element. The heating element is thermally connected to a thermoelectric cooler. The system includes a heat transfer structure, which is thermally connected to the heating element. A metal block is disposed on the heat transfer structure and is thermally connected to the heat transfer structure. The metal block is in contact with a piezoelectric ceramic I or a pressure sensor I. The piezoelectric ceramic I or the pressure sensor I is electrically connected to a temperature control module, and the temperature control module is electrically connected to the thermoelectric cooler.

[0005] Compared with the prior art, the advantages of this utility model are:

[0006] This invention proposes a thermoelectric cooling temperature control system. The device heats up, causing a metal block to deform, which in turn causes a piezoelectric ceramic or pressure sensor to generate an electrical signal. The electrical signal can control the power of the thermoelectric cooler through the temperature control module, so that the structure can automatically adjust the power of the thermoelectric cooler according to the temperature of the heating device. It no longer relies on traditional temperature sensors, solving the installation and layout problems of temperature sensors. Furthermore, the structure of the metal block, piezoelectric ceramic or pressure sensor is simple, which can improve reliability and realize miniaturization design.

[0007] Furthermore, the heat transfer structure is also provided with an insulating block, which is thermally connected to the heat transfer structure. The insulating block is in contact with the piezoelectric ceramic II or the pressure sensor II, which is electrically connected to the temperature control module. The metal block and the insulating block are arranged in groups, and the distance between the metal block and the insulating block in the same group on the heat transfer structure is similar so that the metal block, the insulating block and the corresponding piezoelectric ceramic or pressure sensor will have equal or similar deformation under vibration conditions.

[0008] Compared with the prior art, the advantages of this utility model are:

[0009] When the temperature control system operates under vibration conditions, the vibration can cause relative displacement between the metal block and the piezoelectric ceramic I or pressure sensor, thus affecting the contact pressure. This results in inaccurate electrical signals transmitted by the piezoelectric ceramic or pressure sensor corresponding to the metal block. After setting up an insulation block, the insulation block will only deform due to vibration. After the electrical signal of the piezoelectric ceramic or pressure sensor corresponding to the insulation block is transmitted to the temperature control module, the temperature control module processes the electrical signals of the two piezoelectric ceramics or pressure sensors, calculates the electrical signal generated due to temperature deformation, cancels the electrical signal generated under vibration conditions, corrects the erroneous electrical signal generated under vibration conditions, and makes the temperature control more accurate.

[0010] Furthermore, the temperature control module includes a memory, a control logic circuit, an amplifier circuit for amplifying the input signal, and a power supply.

[0011] Furthermore, the system is housed in a chassis, which includes a chassis shell, an inner shell, and an outer shell. A thermoelectric cooler is disposed between the inner shell and the outer shell, and the thermoelectric cooler is thermally connected to the inner shell and the outer shell. A cold plate structure is inserted into the chassis shell, and the module connector on the cold plate structure is inserted into the backplate connector on the backplate assembly inside the chassis. The thermoelectric cooler is electrically connected to the backplate assembly. The cold plate structure includes a cold plate shell, which is thermally connected to the inner shell. A functional PCB board is disposed inside the cold plate shell, and a functional chip and a module connector are disposed on the functional PCB board. The heat-generating device is a functional chip, and the functional chip is thermally connected to the cold plate shell.

[0012] Furthermore, the inner wall of the cold plate housing is provided with a group of metal blocks and heat insulation blocks, and the functional PCB board is provided with piezoelectric ceramic I or pressure sensor I in contact with the metal blocks, piezoelectric ceramic II or pressure sensor II in contact with the heat insulation blocks, and temperature control module.

[0013] Furthermore, the inner wall of the cold plate housing is provided with a heat-conducting boss, and the functional chip is thermally connected to the heat-conducting boss through a heat-conducting pad. The metal block and the heat-insulating block are set on the heat-conducting boss.

[0014] Furthermore, a temperature control device is provided on the inner shell, the temperature control device including a temperature control device housing, the temperature control device housing being thermally connected to the inner shell, a temperature control PCB board being provided inside the temperature control device housing, and a temperature control module, piezoelectric ceramic I or pressure sensor I, and piezoelectric ceramic II or pressure sensor II being integrated on the temperature control PCB board; the inner wall of the temperature control device housing is provided with a metal block in contact with piezoelectric ceramic I or pressure sensor I, and a heat insulation block in contact with piezoelectric ceramic II or pressure sensor II; the temperature control module is electrically connected to the back plate assembly.

[0015] Furthermore, the outer wall of the outer casing is provided with heat dissipation fins, and a fan for dissipating heat from the outer casing is provided on the outside of the chassis. The fan is electrically connected to a corresponding temperature control device on the outer casing.

[0016] Furthermore, a heat insulation plate is provided between the inner shell and the outer shell, and a hole is opened on the heat insulation plate, with a thermoelectric cooler nested in the hole.

[0017] The above description is only an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, and to make the purpose, features and advantages of this utility model more obvious and easy to understand, the following are preferred embodiments, and detailed descriptions are provided in conjunction with the accompanying drawings. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the thermoelectric cooler inside the chassis in an embodiment of the thermoelectric refrigeration temperature control system of this utility model;

[0019] Figure 2 This is a schematic diagram of the chassis in Embodiment 1 of the thermoelectric refrigeration temperature control system of this utility model;

[0020] Figure 3 This is a schematic diagram of the chassis in Embodiment 2 of the thermoelectric refrigeration temperature control system of this utility model;

[0021] Figure 4 This is a cross-sectional view of the temperature control structure in Embodiment 1 or 2 of the thermoelectric refrigeration temperature control system of this utility model, which is a first embodiment.

[0022] Figure 5 This is a cross-sectional view of the second embodiment of the temperature control structure in Embodiment 1 or 2 of the thermoelectric refrigeration temperature control system of this utility model;

[0023] Figure 6 for Figure 2 A sectional perspective view of the cold plate structure in the embodiment shown;

[0024] Figure 7 for Figure 6 A magnified view of a portion of the image;

[0025] Figure 8for Figure 3 A cross-sectional view of the embodiment shown;

[0026] Figure 9 for Figure 8 A partially enlarged schematic diagram of the medium temperature control device;

[0027] Figure 10 This is a schematic diagram of the temperature control structure in Embodiment 1 or 2 of the thermoelectric refrigeration temperature control system of this utility model;

[0028] Figure 11 This is a topology diagram of the temperature control module in Embodiment 1 or 2 of the thermoelectric refrigeration temperature control system of this utility model;

[0029] Figure 12 This is a cross-sectional schematic diagram of the second embodiment of the temperature control structure in Embodiment 1 or 2 of the thermoelectric refrigeration temperature control system of this utility model;

[0030] Figure 13 for Figure 12 The illustrated embodiment is a schematic diagram of vibration.

[0031] Figure label:

[0032] 1-Functional chip, 2-Thermal conductive pad, 3-Heat transfer structure, 4-Metal block, 41-Metal block I, 42-Metal block II, 5-Piezoelectric ceramic, 51-Piezoelectric ceramic I, 52-Piezoelectric ceramic II, 6-Functional PCB board, 7-Cold plate housing, 8-Heat dissipation boss, 9-Module connector, 10-Backplane assembly, 11-Cold plate structure, 12-Thermoelectric cooler, 13-Inner housing, 14-Heat insulation board, 15-Outer housing, 151-Heat dissipation teeth, 16-Temperature control PCB board, 17-Temperature control device, 18-Temperature control device housing, 19-Temperature control module. Detailed Implementation

[0033] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0034] This utility model discloses an embodiment of a thermoelectric refrigeration temperature control system, which is applied in a chassis. The system uses a thermoelectric cooler 12 to dissipate heat from the chassis and its internal cold plate structure 11.

[0035] like Figures 1 to 3As shown, the front of the chassis has an opening for inserting the cold plate structure 11, and the rear has a backplate assembly 10 with a backplate connector. A module connector 9 is located at the rear of the cold plate structure 11. In this embodiment, the module connector 9 can be an LRM connector or a VPX connector. After the cold plate structure 11 is inserted into the chassis, the module connector 9 engages with the backplate connector, enabling signal communication between the cold plate structure 11 and the backplate assembly 10, as well as between the cold plate structures 11 themselves.

[0036] The chassis includes a chassis shell, within which a cold plate structure 11 is inserted. The cold plate shell 7 of the cold plate structure 11 contacts the chassis shell for heat conduction. The chassis shell has double-layered shells on its top, bottom, left, and right sides: an inner shell 13 and an outer shell 15, with the cold plate shell 7 contacting the inner shell 13. A heat insulation plate 14 is installed between the inner shell 13 and the outer shell 15. The heat insulation plate 14 has multiple holes, each containing a thermoelectric cooler 12. The two end faces of the thermoelectric cooler 12 contact the inner shell 13 and the outer shell 15, respectively.

[0037] After the cold plate structure 11 is inserted into the chassis, it contacts the inner shell 13. When the cold plate structure 11 is running, the functional chip inside it generates heat. The heat is first transferred to the cold plate shell 7, and then to the inner shell 13. The thermoelectric cooler 12 operates, transferring the heat from the inner shell 13 to the outer shell 15. The outer shell 15 has heat dissipation fins 151 distributed on it, dissipating the heat to the outside, thus achieving heat dissipation for the cold plate structure 11 and the chassis. By controlling the power of the thermoelectric cooler 12, the rate of heat transfer can be controlled, achieving control of the heat dissipation rate. The power of the thermoelectric cooler 12 is directly proportional to the heat dissipation rate. The thermoelectric cooler 12 is communicatively connected to the backplane 7.

[0038] Thermoelectric cooler 12 removes heat from inner casing 13, and in turn removes heat from cold plate casing 7, thus dissipating heat from the functional chip 1 that is in contact with cold plate casing 7.

[0039] This invention uses a temperature control structure to output current for controlling the power of the thermoelectric cooler 4, thereby controlling the heat dissipation rate. The temperature control structure in this invention has two implementation methods, which are described below.

[0040] The first embodiment of the temperature control structure in this utility model is as follows: Figure 4As shown, this embodiment is illustrated by integrating the piezoelectric ceramic 5 and the functional chip 1 onto a functional PCB board 6. The piezoelectric ceramic 5 and the functional chip 1 are integrated onto the functional PCB board 6. A thermally conductive pad 2 is placed between the functional chip 1 and the heat transfer structure 3 to ensure a stable and reliable thermal connection between them. A metal block 4 is placed at the other end of the heat transfer structure 3, and the metal block 4 is in contact with the piezoelectric ceramic 5. The heat transfer structure 3 is made of a thermally conductive material, capable of transferring heat from the functional chip 1 to the metal block 4.

[0041] The piezoelectric ceramic 5 has the piezoelectric effect, that is, when the piezoelectric ceramic 5 is deformed, it will generate an electrical signal, which can be used to control the power of the thermoelectric cooler 4.

[0042] When the device is working, the heat from the functional chip 1 is transferred to the heat transfer structure 3 through the thermally conductive pad 2. The heat is then transferred from the heat transfer structure 3 to the metal block 4. The metal block 4 has the characteristics of high thermal conductivity and high expansion coefficient. When the metal block 4 is heated, it expands and deforms. The deformation of the metal block 4 acts on the piezoelectric ceramic 5, which generates an electrical signal. The electrical signal is amplified to form a suitable current (voltage) to control the power of the thermoelectric cooler 4, thereby controlling the temperature of the functional chip 1.

[0043] A temperature control module is installed on functional PCB board 6. The temperature control module includes a storage module, control logic circuit, power supply, and amplification circuit, such as... Figure 11 As shown, the piezoelectric ceramic 5 is electrically connected to the temperature control module via the functional PCB board 6, enabling the transmission of the electrical signal generated by the piezoelectric ceramic 5 to the temperature control module.

[0044] The power supply provides appropriate voltage (current) to components such as amplifier circuits, storage modules, and control logic circuits.

[0045] The amplifier circuit amplifies the input piezoelectric ceramic electrical signal appropriately and provides a cutoff upper limit to prevent excessive voltage (current) from damaging the thermoelectric cooler.

[0046] The storage module mainly stores the corresponding relationships and calculation rules of parameters such as the power of the functional chip, the expansion of the metal block, the voltage (current) of the piezoelectric ceramic, and the temperature.

[0047] The control logic circuit mainly controls the amplification factor of the amplifier circuit and outputs signals to control the power of the thermoelectric cooler, as well as the priority of multiple piezoelectric ceramics working simultaneously, based on the data from the storage module.

[0048] If the heat dissipation of functional chip 1 is set to W1, then the temperature corresponding to heat transfer structure 3 is t1.

[0049] The relationship between t1 and W1 can be expressed as follows:

[0050] t1=f(W1) (1)

[0051] The expansion amount Δx of the metal block 4 at a temperature of t1 (the expansion amount, deformation amount, or displacement amount mentioned in this invention refers to the expansion amount, deformation amount, or displacement amount generated by the interaction between the metal block and the piezoelectric ceramic) can be expressed as:

[0052] Δx=f(t1) (2)

[0053] When the expansion of the piezoelectric ceramic 5 into the metal block 4 is Δx, the change in voltage (current) ΔV can be expressed as:

[0054] ΔV=f(Δx) (3)

[0055] When the change in current (voltage) is ΔV, the thermoelectric cooling current A output by the temperature control module is:

[0056] A=f(ΔV) (4)

[0057] The thermoelectric cooling current A output by the temperature control module is expressed as follows:

[0058] W2=f(A) (5)

[0059] The expression for the power W2 of the thermoelectric cooler and the temperature t2 of the functional chip is as follows:

[0060] t2=f(W2) (6)

[0061] Combining equations 1-6, we can obtain the relationship between the temperature t2 of the functional chip, the heat dissipation W1 of functional chip 1, and the power W2 of the thermoelectric cooler. From this, we can derive the control principle of the temperature control structure as follows: Figure 10 As shown.

[0062] The temperature control structure in this embodiment can automatically adjust the power of the thermoelectric cooler according to the device temperature, avoiding the thermoelectric cooler from running at full speed continuously. Furthermore, it eliminates the reliance on traditional temperature sensors, solving the installation and placement challenges of temperature sensors and achieving system reliability and miniaturization.

[0063] The second embodiment of the temperature control structure in this utility model is as follows: Figure 5 As shown. The difference between this embodiment and the first embodiment is that the metal block 4 on the heat transfer structure 3 is replaced with two closely spaced metal blocks I41 and II42. A heat insulation plate is provided between metal block II42 and the heat transfer structure 3 to prevent heat from being transferred from the heat transfer structure 3 to metal block II42. Correspondingly, on the PCB board 6, the piezoelectric ceramic 5 is replaced with piezoelectric ceramic I51 and piezoelectric ceramic II52. Piezoelectric ceramic I51 is in contact with metal block I41, and piezoelectric ceramic II52 is in contact with metal block II42.

[0064] When the temperature control structure is used under vibration conditions, the structure and components inside the temperature control structure will deform. The deformation caused by vibration and temperature may cause the electrical signal generated by the piezoelectric ceramic to be distorted.

[0065] Ideally, the electrical signal output by the piezoelectric ceramic I 51 is positively correlated with temperature; that is, the higher the temperature, the greater the expansion of the metal block I 41, and the greater the electrical signal (voltage or current) generated by the piezoelectric ceramic I 51. For example... Figure 12 , Figure 13 As shown, under vibration conditions, the expansion of metal block I 41 due to temperature is Δx1, and the deformation (i.e., displacement) of the functional PCB board 6 at the corresponding positions of metal block I 41 and metal block II 42, as well as the piezoelectric ceramics I 51 and II 52 on the functional PCB board 6 due to vibration is Δx2. When the deformation directions of Δx1 and Δx2 are the same and Δx2>Δx1, the piezoelectric ceramic I 51 loosens its contact with metal block I 41, and the pressure on piezoelectric ceramic I 51 decreases or even disappears; when the deformation directions of Δx1 and Δx2 are the same and Δx2<Δx1, although piezoelectric ceramic I 51 does not detach from the contact, the deformation of Δx2 will offset part of the deformation of Δx1, resulting in a decrease in the pressure on piezoelectric ceramic I 51; when the deformation directions of Δx1 and Δx2 are opposite, the contact pressure between piezoelectric ceramic I 51 and metal block I 41 increases, and the pressure on piezoelectric ceramic I 51 increases. All of the above situations can lead to inaccurate electrical signals generated by the piezoelectric ceramic I51 (the electrical signal may be larger or smaller under different vibration conditions under the same temperature conditions).

[0066] In this embodiment, two piezoelectric ceramics and two metal blocks are provided. Metal block I 41 is in thermally conductive contact with heat transfer structure 3, and the heat from heat transfer structure 3 can be transferred to metal block I 41. Metal block I 41 can automatically deform and expand with temperature changes, and the output electrical signal of piezoelectric ceramic I 51 can change with temperature. A heat insulation plate is provided between metal block II 42 and heat transfer structure 3 to achieve heat insulation connection, prevent heat from being transferred to metal block II 42, and thus prevent metal block II 42 from expanding and deforming due to temperature changes.

[0067] The initial contact deformation Δx0 is set between metal block I41 and piezoelectric ceramic I51, and between metal block II42 and piezoelectric ceramic II52, under static and initial temperature conditions. This deformation causes the corresponding piezoelectric ceramic to generate a voltage V0. When functional chip 1 starts working and generating heat, the deformation of metal block I41 is Δx1. Metal block II42 is thermally insulated from the heat transfer structure 3 and does not deform due to temperature; its deformation remains Δx0. The actual deformation of metal block I41 due to temperature is Δx1 - Δx0. The voltage generated by the piezoelectric ceramic when deformation is Δx0 is V0, and the voltage generated when deformation is Δx1 is V1. There is a corresponding relationship between the deformation and the voltage generated by the piezoelectric ceramic. This relationship can be pre-stored in the storage module. The temperature control module receives the voltages generated by the two piezoelectric ceramics and calculates the difference. This difference is the voltage value corresponding to the deformation caused by temperature. Then, the calculated voltage is converted into the current required by the thermoelectric cooler and transmitted to the thermoelectric cooler to dissipate heat from functional chip 1.

[0068] When the temperature control structure vibrates under the above temperature conditions (i.e., when metal block I 41 expands by Δx1), and the positions of metal block I 41 and metal block II 42 are close, the vibration deformation of the piezoelectric ceramics on the PCB board at the corresponding positions is consistent or has a very small difference, and can be set to Δx2. At this time, the total deformation of metal block I 41 and piezoelectric ceramic I 51 is Δx1±Δx2 (the sum of the deformation caused by temperature and the deformation caused by vibration), and the voltage generated by piezoelectric ceramic I 51 is V3. The total deformation of metal block II 42 and piezoelectric ceramic II 52 is Δx0±Δx2 (the deformation caused by vibration), and the voltage generated by piezoelectric ceramic II 52 is V4. Since the difference in deformation between metal block I 41 and metal block II 42 is (Δx1±Δx2)-(Δx0±Δx2)=Δx1-Δx0 (removing the deformation caused by vibration), the temperature control module receives the voltage generated by the two piezoelectric ceramics and calculates the difference. The difference between voltage V3 and voltage V4 remains unchanged compared with the difference when there is no vibration. This can keep the voltage (current) output by the temperature control module constant and unaffected by vibration. It can improve the erroneous signal output caused by structural deformation factors. Then, the voltage (current) is converted into the current required by the thermoelectric cooler and transmitted to the thermoelectric cooler to dissipate heat from the functional chip 1, thereby realizing the dynamic compensation function.

[0069] When the temperature control structure is working, the heat from the functional chip 1 is transferred to the heat transfer structure 3 through the thermally conductive pad 2. The metal block I 41 deforms due to the increased temperature. This deformation acts on the piezoelectric ceramic I 51, and the piezoelectric effect of I 51 generates an electrical signal (voltage or current). This signal is processed and amplified by the temperature control module to form a suitable current (voltage), which is then transmitted to the thermoelectric cooler. This control of the thermoelectric cooler's power further alters the temperature of the functional chip 1. The temperature control module also receives the electrical signal generated by the piezoelectric ceramic II 52 and corrects the electrical signal emitted by the piezoelectric ceramic I 51 under vibration conditions, preventing vibration from affecting the accuracy of the electrical signal.

[0070] In other embodiments of the temperature control structure in this utility model, improvements are made based on the first or second embodiment. The functional chip 1 can be replaced with other heat-generating devices that generate heat and require cooling during operation, such as the entire functional module or chassis.

[0071] In other embodiments of the temperature control structure in this utility model, improvements are made based on the first or second embodiment. The thermally conductive pad 2 may not be provided between the functional chip 1 or other heating device and the heat transfer structure 3, that is, the functional chip 1 or other heating device and the heat transfer structure 3 are in direct contact.

[0072] In other embodiments of the temperature control structure in this utility model, improvements are made based on the first or second embodiment. The heat transfer structure 3 can be a whole or multiple structures in contact with each other or heat-conducting connectors forming a heat transfer link.

[0073] In other embodiments of the temperature control structure in this utility model, improvements are made based on the first or second embodiment. The metal block can be integrally set with the heat transfer structure 3, or the metal block and the heat transfer structure 3 can be thermally connected through other heat-conducting components.

[0074] In other embodiments of the temperature control structure in this utility model, improvements are made based on the first or second embodiment. The piezoelectric ceramic can be replaced with a pressure sensor, so that metal block I is in contact with pressure sensor I and metal block II is in contact with pressure sensor II.

[0075] In other embodiments of the temperature control structure in this utility model, improvements are made based on the first or second embodiment. Besides being integrated onto the PCB board 6, the functional chip 1 or other heating devices, piezoelectric ceramics or pressure sensors, and temperature control module can be adjusted according to the application scenario. The functional chip 1 or other heating devices, piezoelectric ceramics or pressure sensors, and temperature control module can be electrically connected via wires. Alternatively, the functional chip 1 or other heating devices can be set up separately, while the piezoelectric ceramics or pressure sensors and temperature control modules can be integrated onto the PCB board 6.

[0076] In other embodiments of the temperature control structure in this utility model, improvements are made based on the second embodiment. The metal block II 42 can be replaced with other forms of non-thermal insulating blocks, such as plastic blocks, and the insulating blocks are placed near the metal block I 41.

[0077] In other embodiments of the temperature control structure in this utility model, improvements are made based on the first or second embodiment. Multiple metal blocks or multiple groups of metal blocks (including metal block I and metal block II) can be set according to the number and distribution of the heating devices to accurately monitor the temperature of the heating devices and feed it back to the temperature control module.

[0078] In the prior art, multiple cold plate structures 11 are installed inside the chassis. A functional PCB board 6 is set within each cold plate structure 11, and a functional chip 1 is mounted on the PCB board 6. A thermoelectric cooler 12 is installed inside the chassis to dissipate heat when the cold plate structures 11 are in operation. Currently, the control method of the thermoelectric cooler is determined by the type of functional chip and the communication link, as follows:

[0079] a) Regarding functional chip 1, in the field of heat dissipation technology, the type of functional chip 1 depends on whether it has a temperature control module designed inside. For example, some functional chip 1 has some pins for temperature control, which are electrically connected to a thermoelectric cooler. The thermoelectric cooler can change its power according to the power of functional chip 1.

[0080] (b) Regarding the communication link, the complete communication link of the chassis consists of the following electrical structures in sequence: cold plate structure (board), LRM / VPX connector, backplane assembly, thermoelectric cooler, etc. Within these electrical structures, it is necessary to check whether the cold plate structure contains traces connecting to the temperature control pins of functional chip 1, whether the LRM / VPX connector has pins connecting to the traces on the cold plate structure, and whether the backplane assembly has traces controlling the thermoelectric cooler. A communication link exists only if the cold plate structure, LRM / VPX connector, backplane assembly, and thermoelectric cooler all have connectivity functions; otherwise, there is no communication link.

[0081] This results in the following thermoelectric cooler control modes, as shown in Table 1.

[0082]

[0083]

[0084] Table 1 Control Modes of Thermoelectric Coolers

[0085] According to the speed regulation mode in Table 1 and Figure 4 , Figure 5 The structural diagram shows that, for existing control modes that rely on external sensors, the temperature control structure of this invention can be used for improvement, thereby deriving two control systems for thermoelectric coolers:

[0086] 1) Integrated temperature control system: When the communication link is complete, the temperature control structure is integrated on the functional PCB board 6 in the cold plate structure 11, and the control signal is transmitted to the thermoelectric cooler 12 through the functional PCB board 6.

[0087] 2) For external temperature control systems, when the communication link is incomplete or nonexistent, the temperature control structure is designed independently and externally connected to the back panel or housing of the equipment (e.g., chassis) to transmit the control limit signal to the thermoelectric cooler 12.

[0088] When an integrated temperature control system is used within the chassis to control the power of the thermoelectric cooler 12, such as Figure 2 , Figure 6 , Figure 7 The image shows Embodiment 1 of a thermoelectric refrigeration temperature control system using the above-described temperature control structure according to this utility model. In this embodiment, a second implementation of the temperature control structure is selected for more accurate temperature measurement. The cold plate structure 11 inside the chassis includes a cold plate shell 7. A functional PCB board 6 is disposed in the cavity inside the cold plate shell 7. A module connector 9 is disposed at the rear end of the functional PCB board 6. The module connector 9 extends out of the cold plate shell 7 and is used to mate with the backplane connector on the backplane assembly 10 inside the chassis. In this embodiment, the module connector 9 is an LRM connector or a VPX connector. Multiple heat dissipation teeth are distributed on the outer side wall of the cold plate shell 7 to increase the heat dissipation area.

[0089] Multiple functional chips 1 are distributed on the side of the functional PCB board 6. These functional chips 1, as devices requiring heat dissipation, generate heat during the operation of the cold plate structure. Thermally conductive pads 2 are adhered to the functional chips 1. Heat dissipation protrusions 8, corresponding to the positions of the functional chips 1, are distributed on the inner wall of the cold plate housing 7. The thermally conductive pads 2 are tightly attached to the heat dissipation protrusions 8. The heat generated by the functional chips 1 is transferred to the cold plate housing 7 through the thermally conductive pads 2 and the heat dissipation protrusions 8, achieving a thermally conductive connection between the functional chips 1 and the cold plate housing 7. In this embodiment, the heat dissipation protrusions 8 and the cold plate housing 7 are integrally formed.

[0090] Metal blocks I 41 and II 42 are disposed on the inner wall of the cold plate shell 7. The distance between metal blocks I 41 and II 42 is small, such as... Figure 5 As shown. Piezoelectric ceramics I 51 and II 52, corresponding to the positions of metal block I 41 and metal block II 42, are disposed on the functional PCB board 6. Metal block I 41 is in contact with piezoelectric ceramic I 51, and metal block II 42 is in contact with piezoelectric ceramic II 52. A heat insulation plate is disposed between metal block II 42 and the cold plate housing 7.

[0091] In this embodiment, in order to reduce the volume of metal block I 41 and metal block II 42, metal block I 41 and metal block II 42 are provided on one of the heat dissipation protrusions 8, such as... Figure 6 , Figure 7 As shown.

[0092] Heat from the cold plate housing 7 is conducted to the metal block I 41. The heated metal block I 41 expands and compresses the corresponding piezoelectric ceramic I 51, causing the piezoelectric ceramic I 51 to generate an electrical signal. A temperature control module is integrated on the functional PCB board 6.

[0093] A backplate assembly 10 is installed at the rear of the chassis. After the cold plate structure 11 is inserted into the chassis, the module connector 6 on the cold plate structure 11 is engaged with the backplate connector on the backplate 10. Thermoelectric cooler 12 is electrically connected to backplate assembly 10.

[0094] The electrical signal generated by the piezoelectric ceramic (including piezoelectric ceramic I and piezoelectric ceramic II) is input to the temperature control module. After processing by the temperature control module, a suitable thermoelectric cooling current (voltage) is output. The thermoelectric cooling current (voltage) is transmitted to the thermoelectric cooler 12 through the PCB board 6, module connector 9, backplane connector, and backplane assembly 10, controlling the power of the thermoelectric cooler 12 so that the power of the thermoelectric cooler 12 follows the power of the functional chip 1, thereby regulating the thermoelectric cooling power and thus regulating the temperature of the functional chip 1.

[0095] The thermoelectric cooler 12 is connected to the backplane inside the chassis via wires, including power supply lines, control lines, and signal feedback lines. A power supply board is installed inside the chassis, supplying power to the thermoelectric cooler 12 via the power supply lines. The electrical signals from the temperature control module are transmitted to the thermoelectric cooler through the backplane assembly and control lines to control the power of the thermoelectric cooler. The status of the thermoelectric cooler is transmitted to the backplane assembly and temperature control module through the signal feedback lines to monitor the status of the thermoelectric cooler.

[0096] Multiple cold plate structures 11 can be installed inside the chassis. A heat dissipation control module is set on the back panel assembly. The heat dissipation control module receives the electrical signals output by the temperature control modules in the multiple cold plate structures and selects the largest electrical signal (corresponding to the highest temperature) to control the power of the thermoelectric cooler, ensuring that the power of the thermoelectric cooler can meet the cooling requirements.

[0097] This invention proposes a thermoelectric cooling temperature control system. This system can automatically adjust the power of the thermoelectric cooler 12 according to the temperature of the functional chip 1, no longer relying on traditional temperature sensors. It solves the problem of temperature sensor installation and layout, realizes system reliability and miniaturization design, can effectively control the temperature rise of the cold plate structure (board), and effectively improve the reliability of heat dissipation of electronic equipment.

[0098] In another embodiment of a thermoelectric cooling temperature control system, to accurately measure the temperature of each functional chip 1, metal blocks I 41 and II 42 (close to the corresponding functional chip 1) can be provided on each heat dissipation protrusion 8, and a piezoelectric ceramic is attached to each metal block. The heat emitted by the functional chip 1 is absorbed by the nearest metal block, and the expansion of the metal block causes the corresponding piezoelectric ceramic to generate an electrical signal. Due to the short heat transfer path, the metal block can be precisely deformed according to the heat generated by the functional chip 1, so that the piezoelectric ceramic can accurately generate an electrical signal according to the heat generated by the functional chip 1. The electrical signal generated by the piezoelectric ceramic on the same functional PCB board 6 is transmitted to the temperature control module on the same functional PCB board 6. The temperature control module selects the highest value for processing and sends it to the backplane assembly 10.

[0099] In another embodiment of Example 1 of a thermoelectric refrigeration temperature control system, the cold plate structure 11 is provided with two or more sets of metal blocks (including metal block I 41 and metal block II 42) and piezoelectric ceramics (including piezoelectric ceramic I 51 and piezoelectric ceramic II 52), not limited to the number and position of the functional chip 1, for monitoring the temperature at multiple locations in the cold plate structure. The temperature control module on the PCB board 6 outputs an electrical signal to drive the thermoelectric cooler according to the electrical signal corresponding to the maximum deformation (i.e., the highest temperature).

[0100] In another embodiment of Example 1 of a thermoelectric refrigeration temperature control system, the heat dissipation teeth on the cold plate housing 7 can be removed.

[0101] In another embodiment of Embodiment 1 of a thermoelectric refrigeration temperature control system, a fan can be installed on the outside of the chassis to accelerate the heat dissipation of the outer casing 15. The fan is electrically connected to the backplate assembly 10, and the fan speed can be controlled by a heat dissipation control module. The heat dissipation control module controls the fan speed according to the received electrical signal.

[0102] When an external temperature control structure is used to control the thermoelectric cooler inside the chassis, such as Figure 3 , Figure 8 , Figure 9 The image shows a second embodiment of a thermoelectric refrigeration temperature control system using the above-mentioned temperature control structure. In this embodiment, a second implementation of the temperature control structure is selected for more accurate temperature measurement.

[0103] After the cold plate structure 11 is inserted into the chassis, it comes into contact with the inner shell 13. When the cold plate structure 11 is running, the functional chip 1 inside it generates heat. The heat is first transferred to the cold plate shell 7 of the cold plate structure 11, and then transferred to the inner shell 13.

[0104] A temperature control device 17 is installed on the inner housing 1. The housing 18 of the temperature control device is thermally connected to the inner housing 1, and the temperature control device 17 is communicatively connected to the backplate assembly 10. In order to better measure the temperature, the temperature control device 17 is located near the temperature-sensitive chip inside the cold plate structure 11, so as to ensure more accurate monitoring of the temperature of the temperature-sensitive chip, and control the operation of the thermoelectric cooler according to the monitored temperature to ensure that the temperature of the temperature-sensitive chip is within the normal range.

[0105] In this embodiment, the temperature control device 17 is installed at the rear end of the inner casing 1 of the chassis, such as... Figure 8 As shown, a cavity is provided at the rear of the chassis, exposing the inner housing 1 within the cavity. The temperature control device 17 is installed on the inner wall of the inner housing 13. In this embodiment, the temperature control device 17 is located on the inner housing 13 at the top of the chassis.

[0106] The temperature control device 17 is integrated and enclosed by a temperature control device housing 18. In this embodiment, the top outer wall of the temperature control device housing 18 contacts the inner housing 13. Metal blocks I 41 and II 42 are disposed on the inner wall of the temperature control device housing 18. The distance between metal blocks I 41 and II 42 is small. Figure 9 As shown. A temperature control PCB board 16 is disposed in the inner cavity of the temperature control device housing 18. The temperature control PCB board 16 is disposed in the inner cavity of the temperature control device housing 18 via a bracket (not shown in the figure). The temperature control PCB board 16 is electrically connected to the back panel assembly 10.

[0107] The temperature control PCB board 20 has piezoelectric ceramics I 51 and II 52 corresponding to the positions of metal block I 41 and metal block II 42. Metal block I 41 is in contact with piezoelectric ceramic I 51, and metal block II 42 is in contact with piezoelectric ceramic II 52. An insulation plate is provided between metal block II 42 and the temperature control device housing 18 to prevent heat from the temperature control device housing 18 from being transferred to metal block II 42. The temperature control module 19 is integrated on the temperature control PCB board 16.

[0108] The heat from the inner shell 13 is transferred to the temperature control device shell 18, and the heat from the temperature control device shell 18 is conducted to the metal block I 41. After the metal block I 41 is heated and expands, it can compress the corresponding piezoelectric ceramic I 51. The piezoelectric ceramic has a piezoelectric effect, which generates an electrical signal when the piezoelectric ceramic is deformed. The temperature control module 19 can use the electrical signal to control the power of the thermoelectric cooler.

[0109] When the cold plate structure 11 is working, heat is transferred to the temperature control device housing 18 through the inner shell 13. The temperature of the metal block I 41 rises and deforms. The deformation of the metal block I 41 acts on the piezoelectric ceramic I 51. The piezoelectric effect of the piezoelectric ceramic I 51 generates an electrical signal (voltage or current). The electrical signal is processed and amplified by the temperature control module 19 to form a suitable current (voltage), which is transmitted to the thermoelectric cooler 12 through the back plate assembly 10, thereby controlling the power of the thermoelectric cooler and further changing the temperature of the cold plate structure 11. The temperature control module 19 corrects the electrical signal emitted by the piezoelectric ceramic I 51 under vibration conditions by receiving the electrical signal generated by the piezoelectric ceramic II 52, so as to avoid the vibration affecting the accuracy of the electrical signal.

[0110] In this embodiment, metal block I 41 and metal block II 42 are disposed on the top inner wall of the temperature control device housing 18 to shorten the distance with the inner housing 13.

[0111] External thermoelectric cooling and temperature control systems can be directly installed and used on traditional chassis. At the same time, the thermoelectric cooler can be installed on the chassis, which facilitates the improvement of existing chassis technology. Especially for sealed chassis, thermoelectric coolers and temperature control devices can be directly installed on the outside of the chassis.

[0112] In another embodiment of a thermoelectric refrigeration temperature control system, the temperature control device 17 can be directly electrically connected to the thermoelectric cooler 12.

[0113] In another embodiment of a thermoelectric refrigeration temperature control system, the heat dissipation teeth on the cold plate housing 7 can be removed.

[0114] In another embodiment of Embodiment 2 of a thermoelectric refrigeration temperature control system, multiple temperature control devices 17 can be installed inside the chassis. Each temperature control device 17 controls the operation of several thermoelectric coolers 12. For example, temperature control devices 17 can be installed on all four inner shells 13 (top, bottom, left, and right), and each temperature control device 17 controls the operation of the corresponding thermoelectric cooler 12 on the inner shell 13. When the temperature of an inner shell 1 at a certain location is too high, the power of the thermoelectric cooler 12 at that location can be controlled individually to accelerate cooling.

[0115] In another embodiment of a thermoelectric refrigeration temperature control system, a fan can be installed on the outside of the chassis to accelerate the heat dissipation of the outer casing 15. The fan speed can be controlled by a temperature control device 17. The temperature control device 17 is distributed on the outer casing 15 and controls the fan speed according to the temperature of the outer casing 15.

[0116] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A thermoelectric refrigeration temperature control system, comprising a heating element, wherein the heating element is thermally connected to a thermoelectric cooler (12), characterized in that: The system includes a heat transfer structure (3), which is thermally connected to a heating device. A metal block is provided on the heat transfer structure (3), which is thermally connected to the heat transfer structure (3). The metal block is in contact with a piezoelectric ceramic I (51) or a pressure sensor I. The piezoelectric ceramic I (51) or the pressure sensor I is electrically connected to a temperature control module. The temperature control module is electrically connected to a thermoelectric cooler (12).

2. The thermoelectric refrigeration temperature control system according to claim 1, characterized in that: The heat transfer structure (3) is also provided with an insulating block, which is thermally connected to the heat transfer structure (3). The insulating block is in contact with the piezoelectric ceramic II (52) or the pressure sensor II. The piezoelectric ceramic II (52) or the pressure sensor II is electrically connected to the temperature control module. The metal block and the insulating block are arranged in groups. The distance between the metal block and the insulating block in the same group on the heat transfer structure (3) is close so that the metal block, the insulating block and the corresponding piezoelectric ceramic or pressure sensor will have equal or similar deformation under vibration conditions.

3. The thermoelectric refrigeration temperature control system according to claim 2, characterized in that: The temperature control module includes a memory, a control logic circuit, an amplifier circuit for amplifying the input signal, and a power supply.

4. A thermoelectric refrigeration temperature control system according to claim 2 or 3, characterized in that: The system is installed in a chassis, which includes a chassis shell, an inner shell (13) and an outer shell (15). A thermoelectric cooler (12) is installed between the inner shell (13) and the outer shell (15). The thermoelectric cooler (12) is thermally connected to the inner shell (13) and the outer shell (15). A cold plate structure (11) is inserted into the chassis shell. The module connector (9) on the cold plate structure (11) is inserted into the backplate connector on the backplate assembly (10) inside the chassis. The thermoelectric cooler (12) is electrically connected to the backplate assembly (10). The cold plate structure (11) includes a cold plate shell (7). The cold plate shell (7) is thermally connected to the inner shell (13). A functional PCB board (6) is installed inside the cold plate shell (7). A functional chip (1) and a module connector (9) are installed on the functional PCB board (6). The heating device is the functional chip (1). The functional chip (1) is thermally connected to the cold plate shell (7).

5. The thermoelectric refrigeration temperature control system according to claim 4, characterized in that: The inner wall of the cold plate housing (7) is provided with a group of metal blocks and heat insulation blocks. The functional PCB board (6) is provided with a piezoelectric ceramic I (51) or pressure sensor I that contacts the metal blocks, a piezoelectric ceramic II (52) or pressure sensor II that contacts the heat insulation blocks, and a temperature control module.

6. The thermoelectric refrigeration temperature control system according to claim 5, characterized in that: The inner wall of the cold plate housing (7) is provided with a heat-conducting boss (8). The functional chip (1) is heat-conductingly connected to the heat-conducting boss (8) through a heat-conducting pad (2). The metal block and the heat-insulating block are set on the heat-conducting boss (8).

7. The thermoelectric refrigeration temperature control system according to claim 4, characterized in that: A temperature control device (17) is provided on the inner shell (13). The temperature control device (17) includes a temperature control device housing (18). The temperature control device housing (18) is thermally connected to the inner shell (13). A temperature control PCB board (16) is provided inside the temperature control device housing (18). A temperature control module, a piezoelectric ceramic I (51) or a pressure sensor I, and a piezoelectric ceramic II (52) or a pressure sensor II are integrated on the temperature control PCB board (16). The inner wall of the temperature control device housing (18) is provided with a metal block that contacts the piezoelectric ceramic I (51) or the pressure sensor I, and a heat insulation block that contacts the piezoelectric ceramic II (52) or the pressure sensor II. The temperature control module is electrically connected to the back plate assembly (10).

8. The thermoelectric refrigeration temperature control system according to claim 7, characterized in that: The outer wall of the outer casing (15) is provided with heat dissipation teeth (151), and a fan for heat dissipation of the outer casing (15) is provided on the outside of the chassis. The fan is electrically connected to the corresponding temperature control device on the outer casing (15).

9. The thermoelectric refrigeration temperature control system according to claim 4, characterized in that: A heat insulation plate (14) is provided between the inner shell (13) and the outer shell (15). A hole is opened on the heat insulation plate (14), and a thermoelectric cooler (12) is nested in the hole.

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