A server radiator, board card device and server
By introducing a push-pull device into the server heatsink, the problems of difficult heatsink disassembly and easy damage are solved, achieving convenient disassembly and chip protection.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- INSPUR (SHANDONG) COMPUTER TECH CO LTD
- Filing Date
- 2025-04-30
- Publication Date
- 2026-06-16
AI Technical Summary
In existing technologies, server heat sinks are difficult to disassemble and can easily damage the heat sink and chips during disassembly.
A server heat sink with a push-pull device is designed. By generating a push-pull force on the heat sink body and the circuit board during disassembly, the adhesive part is separated from the chip. The push-pull device overcomes the adhesive force, realizes the disassembly of the heat sink, and avoids stress concentration on the chip.
It enables convenient disassembly of the heat sink, reduces the risk of damage to the board chips and heat sink, and ensures the controllability and reliability of the disassembly process.
Smart Images
Figure CN224366388U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of server heat sink structure technology, and more specifically, to a server heat sink, board device and server. Background Technology
[0002] Currently, in the field of server technology, heat sinks are used to dissipate heat from the chips on the board, and the heat sink and the chip are bonded together with a thermally conductive adhesive.
[0003] However, due to the strong adhesion of thermally conductive adhesives, there is a problem of difficulty in disassembling the heat sink. In related technologies, when removing the heat sink from the chip, manual force is used to push the heat sink directly off the board, which can easily cause deformation of the board chip and damage to the appearance of the heat sink.
[0004] Therefore, how to solve the problem of difficult heat sink disassembly and the easy damage to the heat sink and chip during disassembly is a problem that urgently needs to be solved by those skilled in the art. Summary of the Invention
[0005] This application provides a server heat sink, board device, and server to at least solve the problem in the related art that server heat sinks are difficult to disassemble and that disassembly can easily damage the server heat sink and chips.
[0006] This application provides a server heat sink, including:
[0007] The heat sink body has an adhesive part for bonding with the chips of the server's circuit board;
[0008] A pushing device, located on the heat sink body, is used to generate a pushing force on at least one of the heat sink body and the circuit board when disassembling the heat sink body and the circuit board, so as to separate the adhesive part from the chip.
[0009] This application also provides a board device, including:
[0010] The aforementioned server heat sink;
[0011] The board has at least one chip, and the adhesive part of the server heat sink is bonded to the chip by thermally conductive adhesive.
[0012] This application also provides a server, including the aforementioned board device.
[0013] The server heat sink provided in this application is used to install on a board in a server. The adhesive part of the heat sink body is bonded to the chip of the board so as to dissipate heat from the board chip using the server heat sink. Through this application, since the heat sink body is equipped with a pushing device, the pushing device plays a role in disassembling the server heat sink. That is, when disassembling the heat sink body and the circuit board, the pushing device can generate a pushing force on at least one of the heat sink body and the circuit board, causing the adhesive part of the heat sink body to separate from the chip. In other words, by means of the pushing device, a pushing force is generated on the heat sink body and / or the circuit board, and this pushing force is used to overcome the adhesive force between the adhesive part and the chip, thereby separating the adhesive part from the chip, so as to realize the disassembly and maintenance of the server heat sink. Moreover, the pushing force of the pushing device acts on the non-chip position of the circuit board, which is less likely to cause stress concentration on the chip. Using the pushing device to generate a pushing force to disassemble the server heat sink is beneficial to make the position, magnitude and direction of the pushing force controllable. Therefore, it can solve the technical problem that the server heat sink is difficult to disassemble and is easy to damage the server heat sink and the circuit board chip during disassembly, and achieve the technical effect of not easily causing deformation of the circuit board chip and damage to the appearance of the server heat sink itself. Attached Figure Description
[0014] To more clearly illustrate the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0015] Figure 1 This is a schematic diagram of the structure of a server heat sink provided in a specific embodiment of the present utility model;
[0016] Figure 2 for Figure 1 The diagram shows the structure of the server heatsink after it is fixed to the circuit board.
[0017] Figure 3 A partial structural diagram showing the process of removing a server heatsink by unscrewing a threaded component.
[0018] Figure 4 This is a structural diagram of the protrusion and the fastener;
[0019] Figure 5 This is a schematic diagram of the circuit board's structure;
[0020] Figure 6 This is a structural diagram showing the connection between the fixing screw and the fastener.
[0021] The above figures include the following reference numerals:
[0022] 1-Heater body; 11-Protrusion; 111-First protrusion; 112-Second protrusion; 113-Third protrusion; 12-Fixing component; 121-Fixing screw; 13-Heater fins; 14-Thermal grease; 2-Threaded component; 3-Board; 31-Chip; 311-First chip; 312-Second chip; 313-Third chip. Detailed Implementation
[0023] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.
[0024] It should be noted that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. The terms "installed," "connected," and "linked" should be interpreted broadly, for example, they can be fixed connections, detachable connections, or integral connections; they can be mechanical connections or electrical connections; they can be direct connections or indirect connections through an intermediate medium; they can be internal connections between two elements. The terms "parallel," "perpendicular," and "equal" include the described situation and situations similar to the described situation, the range of which is within an acceptable deviation range, wherein the acceptable deviation range is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, where an acceptable deviation range for approximate parallelism can be, for example, within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where an acceptable deviation range for approximate perpendicularity can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, where an acceptable deviation range for approximate equality can be, for example, a difference between the two equal items being less than or equal to 5% of either one. Those skilled in the art will understand the specific meaning of the above terms in this application based on the specific circumstances.
[0025] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.
[0026] Please refer to Figure 1 , Figure 2 and Figure 3 This application provides a server heat sink, including a heat sink body 1 and a pushing device. The heat sink body 1 is provided with an adhesive part for attaching to the chip 31 of the server's board 3 (e.g., ...). Figure 5 (As shown) Adhesive bonding; A pusher device is provided on the heat sink body 1. The pusher device is used to generate a pusher force on at least one of the heat sink body 1 and the board 3 when disassembling the heat sink body 1 and the board 3, so that the adhesive part of the heat sink body 1 is separated from the chip 31.
[0027] In other words, the server heat sink provided in this embodiment of the utility model is used to install on the board 3 of the server. The adhesive part of the heat sink body 1 of the server heat sink is bonded to the chip 31 of the board 3 so as to use the server heat sink to dissipate heat from the chip 31 of the board 3. More importantly, the heat sink body 1 of the server heat sink is equipped with a pushing device, which plays a role in disassembling the server heat sink. That is, when disassembling the heat sink body 1 and the board 3, the pushing device can generate a pushing force on at least one of the heat sink body 1 and the board 3, so that the adhesive part of the heat sink body 1 is separated from the chip 31. In other words, by means of the pushing device, a pushing force is generated on the heat sink body 1 and / or the board 3, and the pushing force is used to overcome the adhesive force between the adhesive part and the chip 31, thereby separating the adhesive part from the chip 31, so as to realize the disassembly and maintenance of the server heat sink. Moreover, the pushing force of the pushing device acts on the non-chip 31 part of the board 3, which is less likely to cause stress concentration on the chip 31. Using the pushing device to generate a pushing force to disassemble the server heat sink is beneficial to make the position, magnitude and direction of the pushing force controllable. Therefore, it is less likely to cause deformation of the chip 31 of the board 3 and damage to the appearance of the server heat sink itself.
[0028] Therefore, it can be seen that this server heat sink can solve the problems of difficult disassembly and easy damage to the server heat sink and board chip 31 during disassembly.
[0029] It is understandable that the structure and location of the push-up device must ensure that the push-up device does not interfere with the assembly of the server heat sink and the board 3 when the server heat sink is installed on the server board 3.
[0030] It should be noted that this embodiment does not limit the specific number and distribution of the adhesive parts of the heat sink body 1. The number and distribution of the adhesive parts correspond to the chips 31 of the board 3. That is, the board 3 has at least one chip 31. For example, for a heterogeneous acceleration server used to complete high-performance clustered training tasks, it includes a heterogeneous acceleration card. A heterogeneous acceleration card integrates multiple chips 31. In this case, the server heat sink provided by this embodiment can centrally dissipate heat from the multi-chip 31 board 3. It is understood that when multiple chips 31 are bonded to multiple adhesive parts, the overall adhesive force between the server heat sink and the board 3 is relatively large. However, the server heat sink provided by this embodiment can be disassembled by using the pushing force of the pushing device. That is, the server heat sink can be compatible with the overall heat dissipation capacity of the server heat sink and the ease of disassembly and maintenance. It is especially suitable for high-performance computing, training servers and other scenarios that require good heat dissipation and frequent maintenance of the server heat sink.
[0031] In addition, this embodiment does not limit the specific structure of the pushing device, as long as the pushing device can generate a pushing force on at least one of the heat sink body 1 and the board 3, so that the adhesive part of the heat sink body 1 is separated from the chip 31.
[0032] like Figure 3 As shown, in some embodiments, the pushing device includes a threaded part 2, which is threadedly connected to the radiator body 1, and is used to push the plate 3 when the threaded part 2 is screwed on.
[0033] Understandably, since the threaded part 2 is threadedly connected to the heatsink body 1, when disassembling the server heatsink, it is only necessary to screw the threaded part 2 so that its end abuts against the board 3. This converts the rotational force of the threaded pair between the threaded part 2 and the heatsink body 1 into an axial pushing force, thereby pushing the heatsink body 1 away from the board 3, separating the bonded part from the chip 31, and thus disassembling the server heatsink. This structure is simple, easy to disassemble, and can reduce maintenance costs.
[0034] It should be noted that, in order to facilitate the application of tightening force to the threaded part 2, in some embodiments, the head of the threaded part 2 is provided with a tool interface, such as a cross groove or a slotted groove, so as to facilitate the application of tightening force to the threaded part 2 by connecting the tool with the tool interface, thereby saving external force, etc.
[0035] Furthermore, this embodiment does not limit the specific number or distribution of the threaded parts 2, as long as the adhesive part and the chip 31 can be separated by screwing on the threaded parts 2. For example, the number of threaded parts 2 can be one or at least two.
[0036] In some embodiments, the number of threaded parts 2 is at least two, and the threaded parts 2 are evenly distributed, symmetrically distributed in pairs, or diagonally distributed in pairs.
[0037] In other words, when disassembling the server heatsink, the evenly distributed threaded parts 2 can be turned in sequence, or two symmetrical threaded parts 2 can be turned alternately, or two diagonally opposite threaded parts 2 can be turned alternately, so that the heatsink body 1 and the board 3 are subjected to uniform force. This avoids the heatsink body 1 tilting or the board 3 chip 31 being subjected to force on one side, which would reduce the local adhesion between the adhesive part and the chip 31, and help the server heatsink to be effectively separated from the board 3, further reducing the damage to the server heatsink and the chip 31.
[0038] In addition, such as Figure 4 and Figure 5 As shown, in order to facilitate the connection between the adhesive portion of the heat sink body 1 and the chip 31, in some embodiments, the heat sink body 1 is provided with at least one protrusion 11, the protrusion 11 is used to correspond one-to-one with the chip 31, and the adhesive portion is the surface of the protrusion 11.
[0039] In other words, by providing a protrusion 11, this embodiment can adapt the protrusion 11 to the chip 31. In this way, when installing the server heat sink, the protrusion 11 is aligned and attached to the corresponding chip 31, which facilitates quick positioning of the heat sink body 1 and helps to achieve effective adhesion between the adhesive part and the chip 31, thereby improving the reliability of the connection between the adhesive part and the chip 31.
[0040] It should be noted that the number of protrusions 11 is the same as the number of chips 31, and the layout of the protrusions 11 is the same as the layout of the chips 31. Furthermore, the protrusions 11 can have different heights to accommodate chips 31 of different thicknesses. For example, as... Figure 4 and Figure 5 As shown, there can be three protrusions 11, namely a first protrusion 111, a second protrusion 112, and a third protrusion 113. Correspondingly, the board 3 is provided with three different chips 31, namely a first chip 311, a second chip 312, and a third chip 313. The first protrusion 111 is bonded to the first chip 311, the second protrusion 112 is bonded to the second chip 312, and the third protrusion 113 is bonded to the third chip 313, so as to achieve better heat dissipation for the first chip 311, the second chip 312, and the third chip 313.
[0041] Furthermore, the above embodiments do not limit the specific method of bonding the adhesive portion to the chip 31. For example, the adhesive portion and the chip 31 can be bonded using a thermally conductive adhesive to achieve better heat dissipation for the chip 31. The thermally conductive adhesive can be thermally conductive silicone grease 14, which has high adhesion and good thermal conductivity. During assembly, the thermally conductive adhesive can be applied to the adhesive portion, such as... Figure 4 As shown, the surfaces of the first protrusion 111, the second protrusion 112 and the third protrusion 113 are all provided with thermal grease 14. During assembly, the adhesive part can be connected to the corresponding chip 31 by aligning the adhesive part with the corresponding chip 31 and making contact.
[0042] In addition, to ensure the reliability of fixing the server heatsink to board 3, such as Figure 4 As shown, in some embodiments, the heat sink body 1 is provided with a fixing member 12, which is used to detachably fix the heat sink body 1 and the board 3.
[0043] In other words, after the adhesive part is bonded to the chip 31, the heat sink body 1 and the board 3 are fixed by the fastener 12, thereby realizing a reliable connection between the server heat sink and the board 3, ensuring the stability of the relative position of the server heat sink and the board 3, and ensuring the effective heat dissipation of the chip 31 by the server heat sink.
[0044] It should be noted that this embodiment does not limit the specific structure of the fastener 12, as long as the fastener 12 can fix the heat sink body 1 and the circuit board 3 and be detachable. Here, detachable means that the fixation between the heat sink body 1 and the circuit board 3 can be released. For example, as Figure 4 and Figure 6 As shown, the fixing member 12 can be a fixing stud with internal threads. The board 3 has a fixing hole corresponding to the fixing stud. When the server heat sink is placed on the board 3, the fixing stud passes through the fixing hole, and the fixing screw 121 is screwed into the fixing stud to fix the heat sink body 1 to the board 3. Of course, the fixing stud can also have external threads. When the server heat sink is placed on the board 3, the fixing stud passes through the fixing hole and one end protrudes from the fixing hole, so that the fixing nut is connected to the fixing stud to fix the heat sink body 1 to the board 3.
[0045] Understandably, when it is necessary to disassemble the server heatsink, the fixing between the heatsink body 1 and the board 3 must first be removed to avoid affecting the separation of the heatsink body 1 and the board 3. For example, before using the push-pull device to disassemble the heatsink body 1 and the board 3, the fixing screws 121 or fixing nuts must first be removed to release the fixing studs from the heatsink body 1 and the board 3.
[0046] In addition, to improve the heat dissipation effect of server heat sinks, such as Figure 1As shown, in some embodiments, the heat sink body 1 has heat dissipation fins 13 on the side away from the adhesive portion.
[0047] In other words, this embodiment uses heat sink 13 to dissipate heat from the chip 31 on the board 3. This structure is simple and easy to implement.
[0048] In addition to using the threaded part 2 to generate a pushing force on the heat sink body 1 and / or the board 3, the pushing device can also be implemented in the following ways.
[0049] For example, in some embodiments, the pushing device includes an elastic element disposed on the heat sink body 1, which is used to provide an elastic force to the heat sink body 1 away from the board 3 when the heat sink body 1 and the board 3 are disassembled.
[0050] Understandably, after the server heatsink and board 3 are assembled, the elastic element can store elastic force. Therefore, when disassembling the heatsink body 1 and board 3, the elastic restoring force of the elastic element can be used to automatically lift the heatsink body 1, thereby separating the adhesive part from the chip 31. This structure is simple and requires no tools.
[0051] It should be noted that this embodiment does not limit the specific number and distribution of elastic elements, as long as the elastic restoring force of the elastic elements can be used to separate the adhesive part from the chip 31.
[0052] In addition, when the pushing device only includes an elastic element, the elastic force of the elastic element must be greater than the adhesive force between the adhesive part and the chip 31 (in this embodiment of the utility model, the elastic force of the elastic element can be the resultant force of multiple elastic elements). In this case, the elastic element needs to be used in conjunction with the fixing member 12. That is, in the non-disassembly state, the server heat sink and the board 3 are fixed by the fixing member 12. At this time, the elastic element stores elastic energy. When the fixing effect of the fixing member 12 is removed, the elastic force of the elastic element can overcome the adhesive force between the adhesive part and the chip 31.
[0053] Of course, the push device can also include a threaded part 2 and an elastic part. The combined action of the threaded part 2 and the elastic part can be used to disassemble the server heat sink and the board 3. At this time, when the server heat sink and the board 3 are assembled, the elastic force of the elastic part is less than the adhesive force between the adhesive part and the chip 31. When disassembling, by twisting the threaded part 2, the elastic restoring force of the elastic part is superimposed to achieve the separation of the adhesive part and the chip 31.
[0054] In other embodiments, the following scheme may also be adopted: the pushing device includes a first magnet, which is disposed on the heat sink body 1. The first magnet is used to generate a repulsive force with the second magnet of the board 3 when the heat sink body 1 and the board 3 are disassembled.
[0055] In other words, this embodiment achieves separation of the adhesive portion from the chip 31 by respectively setting a first magnet and a second magnet on the heat sink body 1 and the board 3, utilizing the repulsive effect of the first and second magnets. It is understood that the first and second magnets have the same magnetism. Moreover, this solution is a non-contact push-type method, avoiding mechanical wear.
[0056] In other embodiments, the pushing device may include a pressure medium expansion member disposed on the radiator body 1, which is used to generate a pushing force on the radiator body 1 and the board 3 by injecting pressure medium when disassembling the radiator body 1 and the board 3.
[0057] For example, the pressure medium expansion component can be an air bladder or a hydraulic bladder. When the server heatsink needs to be disassembled, a pressure medium is injected into the pressure medium expansion component through an external inflation device or hydraulic device, causing the pressure medium expansion component to expand. The pressure of the medium within the expansion component then lifts the heatsink body 1, achieving separation of the adhesive portion from the chip 31. It is understood that this embodiment can precisely control the pushing force by controlling the pressure of the pressure medium, thereby adapting to thermally conductive adhesives of different viscosities between the adhesive portion and the chip 31.
[0058] It should be noted that in the above embodiments, different implementation schemes of the jacking device can exist independently or can be a combination of different implementation schemes.
[0059] In addition to the server heat sink described above, this utility model also provides a board device including the server heat sink disclosed in the above embodiments. The board device includes a board 3, on which at least one chip 31 is provided. The adhesive part of the heat sink body 1 of the server heat sink disclosed in the above embodiments is bonded to the chip 31 by a thermally conductive adhesive. For the structure of other parts of the board 3, please refer to the relevant technology, which will not be repeated here.
[0060] The key point of this embodiment is that the board device uses the server heat sink disclosed in any of the above embodiments to dissipate heat from the board 3, which includes at least the beneficial effects of the server heat sink, making it easy to disassemble the server heat sink and less likely to damage the chip 31 of the board 3 and the server heat sink.
[0061] In addition to the server heat sink and circuit board device mentioned above, this utility model also provides a server that includes the circuit board device disclosed in the above embodiments. For the structure of other parts of the server, please refer to the relevant technology, which will not be repeated here.
[0062] The key point of this embodiment is that the server uses the server heat sink disclosed in any of the above embodiments, and at least includes the beneficial effects of the above server heat sink, which will not be repeated here.
[0063] It should be noted that this embodiment does not limit the specific type of server. For example, the server can be a heterogeneous computing acceleration server or other types of servers.
[0064] The above provides a detailed description of a server heat sink, circuit board device, and server provided in this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make various improvements and modifications to this application without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of this application.
Claims
1. A server heat sink, characterized in that, include: The heat sink body (1) is provided with an adhesive part, which is used to bond to the chip (31) of the server board (3); A pushing device is provided on the heat sink body (1) and is used to generate a pushing force on at least one of the heat sink body (1) and the board (3) when disassembling the heat sink body (1) and the board (3) so as to separate the adhesive part from the chip (31).
2. The server heat sink according to claim 1, characterized in that, The jacking device includes: The threaded part (2) is threadedly connected to the heat sink body (1) and is used to push the plate (3) when the threaded part (2) is screwed.
3. The server heat sink according to claim 2, characterized in that, When the number of threaded parts (2) is at least one, and the number of threaded parts (2) is at least two, the threaded parts (2) are evenly distributed, symmetrically distributed in pairs, or diagonally distributed in pairs.
4. The server heat sink according to claim 1, characterized in that, The heat sink body (1) is provided with at least one protrusion (11), the protrusion (11) is used to correspond one-to-one with the chip (31), and the adhesive part is the surface of the protrusion (11).
5. The server heat sink according to claim 1, characterized in that, The radiator body (1) is provided with a fixing member (12), which is used to detachably fix the radiator body (1) and the board (3).
6. The server heat sink according to claim 1, characterized in that, The heat sink body (1) has heat dissipation fins (13) on the side away from the adhesive part.
7. The server heat sink according to any one of claims 1-6, characterized in that, The jacking device includes: An elastic element is provided on the heat sink body (1) to provide an elastic force away from the board (3) to the heat sink body (1) when the heat sink body (1) and the board (3) are disassembled.
8. The server heat sink according to any one of claims 1-6, characterized in that, The jacking device includes: A first magnet, disposed on the heat sink body (1), is used to generate a repulsive force with a second magnet on the board (3) when the heat sink body (1) and the board (3) are disassembled; or, A pressure medium expansion component is provided on the radiator body (1) and is used to generate a pushing force on the radiator body (1) and the board (3) by injecting pressure medium when disassembling the radiator body (1) and the board (3).
9. A circuit board device, characterized in that, include: The server heat sink according to any one of claims 1-8; The board (3) is provided with at least one chip (31), and the adhesive part of the server heat sink is bonded to the chip (31) by a thermally conductive adhesive.
10. A server, characterized in that, Includes the board device as described in claim 9.