Quick-release heat dissipation fin structure for computer power module

Abstract

The application relates to the field of heat dissipation fins, and discloses a computer power module quick-release heat dissipation fin structure which comprises a body and a mounting plate, the inner wall of the body is movably provided with a heat dissipation fin body, the inner wall of the heat dissipation fin body is fixedly provided with a copper pipe, the inner wall of the mounting plate is provided with a plurality of heat dissipation holes, one end of the mounting plate is slidably provided with two mounting racks, the inner wall of the mounting plate is slidably connected with a plurality of limiting racks, the plurality of limiting racks are divided into two groups, one end of the two groups of limiting racks is fixedly provided with a control handle; the mounting plate is connected with the surface of the body, one end of the mounting plate is connected with the heat dissipation fin body through the mounting rack, the limiting racks are slidably arranged in the mounting plate, the inner wall of the limiting racks is clamped with the surface of the body, and the surface of the limiting racks is provided with the control handle, so that the control handle is used to control the separation of the limiting racks and the body, and the heat dissipation fin body at one end of the mounting plate can be disassembled.

Description

Technical Field

[0001] This application relates to the field of heat sinks, and in particular to quick-release heat sink structures for computer power modules. Background Technology

[0002] A power module heatsink is a passive heat dissipation component, primarily used to effectively dissipate the heat generated by the power module into the surrounding environment. Heatsinks are typically made of high thermal conductivity materials such as aluminum or copper, increasing surface area to improve heat dissipation efficiency. The working principle of heatsinks is based on heat conduction and convection. When heat generated by the power module is transferred to the heatsink, air flows over the fin surface, carrying away the heat through convection, thus achieving heat dissipation. The larger the surface area of ​​the fins, the better the heat dissipation effect. Commonly used materials for heatsinks include aluminum and copper. Aluminum is widely used due to its lower cost and good thermal conductivity, while copper is used in more demanding heat dissipation applications due to its higher thermal conductivity. In conventional installation, several heatsink bodies are mounted on the inner wall of the chassis near the cooling fan. Copper pipes are installed on the inner wall of the heatsink body, lifting the heatsink body. Because copper has excellent thermal conductivity, the copper pipes can quickly conduct heat from the heat source to the surface of the heatsink, ensuring that the heat is rapidly dissipated into the air.

[0003] Regarding the aforementioned technologies, the inventors believe that conventional heat sink fins are often installed near the ventilation holes, making it easy for external dust to enter the fins. After prolonged use, dust can clog the fins, affecting airflow and resulting in poor heat dissipation. Therefore, users need to clean the fins regularly. However, since conventional fins are installed inside the chassis, disassembling them is inconvenient.

[0004] The information disclosed in this background section is only intended to enhance the understanding of the background technology of this application, and therefore may include prior art that is not known to those skilled in the art. Utility Model Content

[0005] To address the inconvenience of disassembling fins during cleaning, this application provides a quick-release heatsink fin structure for computer power modules.

[0006] The quick-release heat sink structure for the computer power module provided in this application adopts the following technical solution:

[0007] A quick-release heatsink structure for a computer power module includes a body and a mounting plate. Heatsink fins are movably mounted on the inner wall of the body, and copper pipes are fixedly mounted on the inner wall of the heatsink fins. The inner wall of the mounting plate has several heat dissipation holes. Two mounting brackets are slidably mounted on one end of the mounting plate, and several limiting brackets are slidably connected to the inner wall of the mounting plate. These limiting brackets are divided into two groups, and a control handle is fixedly mounted on one end of each group of limiting brackets. The heat dissipation holes are evenly distributed on the inner wall of the mounting plate. One end of each limiting bracket engages with the inner wall of the body. The two groups of limiting brackets are symmetrically distributed about the mounting plate. The top of each mounting bracket is movably connected to the bottom end of the heatsink fins.

[0008] Preferably, a limiting spring is fixedly installed at one end of the limiting frame, and a connecting block is fixedly connected to one end of the limiting spring. One end of the connecting block is fixedly installed on the surface of the mounting plate, and the center of the connecting block and the center of the limiting spring are on the same straight line.

[0009] Preferably, one end of the mounting plate is fixedly connected to two fixing brackets, the two fixing brackets are symmetrically distributed about the mounting plate as an axis, and the cross-section of the mounting brackets is an "L" shaped structure.

[0010] Preferably, an auxiliary piece is fixedly installed on the inner wall of the limiting frame, the inner wall of the auxiliary piece is movably connected to the surface of the machine body, and the auxiliary piece is a rubber sheet.

[0011] Preferably, a fixing bolt is rotatably mounted on the inner wall of the mounting plate, and the surface of the fixing bolt is threadedly connected to the inner wall of the mounting bracket.

[0012] Preferably, a slide rail is slidably installed on the inner wall of the mounting bracket, the dimensions of the slide rail surface are adapted to the dimensions of the inner wall of the mounting bracket, and the cross-section of the slide rail is a "T" shaped structure, with one end of the slide rail fixedly connected to the surface of the mounting plate.

[0013] Preferably, a push spring is fixedly installed on the surface of the slide rail, and the top of the push spring is fixedly connected to the inner wall of the mounting bracket.

[0014] In summary, this application includes the following beneficial technical effects:

[0015] 1. By connecting the mounting plate to the surface of the chassis, one end of the mounting plate is connected to the heat sink fin body via a mounting bracket. A limit bracket is slidably installed inside the mounting plate, with its inner wall engaging with the chassis surface. A control handle is installed on the surface of the limit bracket for easy separation of the limit bracket from the chassis, allowing for disassembly of the mounting plate. A limit spring is installed at one end of the limit bracket, with the other end connected to the mounting plate surface via a connecting block, ensuring the limit bracket remains engaged with the chassis surface. A rubber auxiliary plate is installed on the inner wall of the limit bracket to prevent noise caused by vibrations from the cooling fan during startup. One end of the mounting plate has a mounting bracket and a fixing bracket to maintain the heat sink fin body connected to the mounting plate. Compared to existing technologies, this significantly improves the ease of cleaning the heat sink fin body.

[0016] 2. A fixing bolt can also be installed at one end of the mounting plate to facilitate the rotation of the fixing bolt and control the mounting bracket to easily remove the heat sink body from between the mounting bracket and the fixing bracket. The inner wall of the mounting bracket is slidably connected with a slide rail to limit the movement of the mounting bracket, thereby improving the stability of the mounting bracket's movement. A push spring is fixedly connected to the bottom of the mounting bracket to prevent the mounting bracket from sliding down, which would affect the fixing effect of the heat sink body; thus effectively improving the performance of the device. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of the quick-release heat sink fin structure of the computer power module in the embodiment of the application.

[0018] Figure 2 This is a schematic diagram of the mounting plate structure in an embodiment of the application;

[0019] Figure 3 This is a side view of the embodiment of the application.

[0020] Figure 4 This is a schematic diagram of the structure at point A in the embodiment of the application.

[0021] Explanation of reference numerals in the attached drawings: 1. Body; 2. Heat dissipation fin body; 3. Copper pipe; 4. Mounting plate; 5. Heat dissipation hole; 6. Limiting bracket; 7. Control handle; 8. Limiting spring; 9. Connecting block; 10. Auxiliary piece; 11. Mounting bracket; 12. Fixing bracket; 13. Fixing bolt; 14. Slide rail; 15. Push spring. Detailed Implementation

[0022] The following is in conjunction with the appendix Figure 1 —4. This application will be described in further detail.

[0023] This application discloses a quick-release heat sink structure for a computer power module, referring to... Figure 1 - Figure 2 The system includes a chassis 1. During installation, several heat sink bodies 2 are mounted on the inner wall of the chassis 1 near the cooling fan. Copper pipes 3 are installed on the inner wall of the heat sink bodies 2, which lift the heat sink bodies 2. Due to the excellent thermal conductivity of copper, the copper pipes 3 can quickly conduct heat from the heat source to the surface of the heat sink, thus ensuring that the heat can be quickly dissipated into the air. A mounting plate 4 is connected to the surface of the chassis 1. One end of the mounting plate 4 is connected to the heat sink body 2 via a mounting bracket 11. The surface of the mounting plate 4... Several heat dissipation holes 5 are provided on the surface to facilitate heat dissipation inside the body 1. A limit bracket 6 is slidably installed inside the mounting plate 4. The inner wall of the limit bracket 6 is engaged with the surface of the body 1. A control handle 7 is installed on the surface of the limit bracket 6. The mounting plate 4 is fixed to the surface of the body 1 by means of the limit bracket 6. The limit bracket 6 can be separated from the body 1 by using the control handle 7, so that the mounting plate 4 can be disassembled. This facilitates the disassembly and cleaning of the heat dissipation fin body 2, effectively improving the convenience of cleaning the heat dissipation fin body 2.

[0024] Reference Figure 2 One end of the limiting bracket 6 is equipped with a limiting spring 8. One end of the limiting spring 8 is connected to the surface of the mounting plate 4 via a connecting block 9. The limiting spring 8 pushes the limiting bracket 6, thereby keeping the limiting bracket 6 locked to the surface of the body 1, effectively improving the fixing effect of the limiting bracket 6. The inner wall of the limiting bracket 6 is equipped with a rubber auxiliary piece 10. The inner wall of the auxiliary piece 10 is connected to the surface of the body 1. The relatively soft nature of the auxiliary piece 10 avoids the problem of noise generated by the vibration of the cooling fan when it starts. One end of the mounting plate 4 is connected to a mounting bracket 11 and a fixing bracket 12. One end of the mounting bracket 11 and the fixing bracket 12 are both connected to the surface of the heat sink body 2. The mounting bracket 11 and the fixing bracket 12 keep the heat sink body 2 connected to the mounting plate 4.

[0025] Reference Figure 3 - Figure 4A fixing bolt 13 is installed at one end of the mounting plate 4. The surface of the fixing bolt 13 is threaded to the inner wall of the mounting bracket 11. Rotating the fixing bolt 13 controls the mounting bracket 11 to move up and down, thereby facilitating the removal of the heat sink body 2 from between the mounting bracket 11 and the fixing bracket 12. A slide rail 14 is slidably connected to the inner wall of the mounting bracket 11. One end of the slide rail 14 is connected to the mounting plate 4. The slide rail 14 restricts the movement of the mounting bracket 11, thereby improving the stability of the movement of the mounting bracket 11. A push spring 15 is fixedly connected to the bottom end of the mounting bracket 11. The bottom end of the push spring 15 is connected to the surface of the slide rail 14. The push spring 15 supports the bottom end of the mounting bracket 11, thereby preventing the mounting bracket 11 from sliding down and affecting the fixing effect of the heat sink body 2.

[0026] The implementation principle of the quick-release heat sink structure for the computer power module in this application embodiment is as follows: A mounting plate 4 is connected to the surface of the chassis 1. One end of the mounting plate 4 is connected to the heat sink body 2 via a mounting bracket 11. Several heat dissipation holes 5 are provided on the surface of the mounting plate 4 to facilitate heat dissipation within the chassis 1. A limit bracket 6 is slidably installed inside the mounting plate 4. The inner wall of the limit bracket 6 engages with the surface of the chassis 1. A control handle 7 is installed on the surface of the limit bracket 6 to fix the mounting plate 4 to the surface of the chassis 1. The control handle 7 is used to separate the limit bracket 6 from the chassis 1, allowing for disassembly of the mounting plate 4 and facilitating cleaning of the heat sink body 2. A limit spring 8 is installed at one end of the limit bracket 6. One end of the limiting spring 8 is connected to the surface of the mounting plate 4 via the connecting block 9, so that the limiting frame 6 can be pushed by the limiting spring 8, thereby keeping the limiting frame 6 locked to the surface of the body 1, effectively improving the fixing effect of the limiting frame 6. The inner wall of the limiting frame 6 is equipped with a rubber auxiliary piece 10, and the inner wall of the auxiliary piece 10 is connected to the surface of the body 1. In order to avoid the problem of noise generated by the vibration of the cooling fan when it starts, the auxiliary piece 10 is relatively soft. One end of the mounting plate 4 is connected to the mounting bracket 11 and the fixing bracket 12. One end of the mounting bracket 11 and the fixing bracket 12 are connected to the surface of the heat sink body 2, so that the heat sink body 2 can be kept connected to the mounting plate 4 by the mounting bracket 11 and the fixing bracket 12.

[0027] A fixing bolt 13 can also be installed at one end of the mounting plate 4. The surface of the fixing bolt 13 is threaded to the inner wall of the mounting bracket 11, so that the mounting bracket 11 can be moved up and down by rotating the fixing bolt 13. This makes it easy to remove the heat sink body 2 from between the mounting bracket 11 and the fixing bracket 12. A slide rail 14 is slidably connected to the inner wall of the mounting bracket 11. One end of the slide rail 14 is connected to the mounting plate 4, so that the movement position of the mounting bracket 11 can be restricted by the slide rail 14, thereby improving the stability of the movement of the mounting bracket 11. A push spring 15 is fixedly connected to the bottom end of the mounting bracket 11. The bottom end of the push spring 15 is connected to the surface of the slide rail 14, so that the bottom end of the mounting bracket 11 can be supported by the push spring 15, thereby preventing the mounting bracket 11 from sliding down and affecting the fixing effect of the heat sink body 2.

[0028] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A quick-release heat sink structure for a computer power module, comprising a body (1) and a mounting plate (4), characterized in that: The inner wall of the body (1) is movably installed with a heat dissipation fin body (2), and a copper pipe (3) is fixedly installed on the inner wall of the heat dissipation fin body (2). The inner wall of the mounting plate (4) is provided with a number of heat dissipation holes (5). Two mounting brackets (11) are slidably installed on one end of the mounting plate (4), and a number of limiting brackets (6) are slidably connected to the inner wall of the mounting plate (4). The number of limiting brackets (6) are divided into two groups, and a control handle (7) is fixedly installed on one end of each group of limiting brackets (6).

2. The quick-release heat sink structure for a computer power module according to claim 1, characterized in that: Several heat dissipation holes (5) are evenly distributed on the inner wall of the mounting plate (4). One end of the limiting bracket (6) is engaged with the inner wall of the body (1). Two sets of limiting brackets (6) are symmetrically distributed about the mounting plate (4). The top of the mounting bracket (11) is movably connected to the bottom of the heat dissipation fin body (2).

3. The quick-release heat sink structure for a computer power module according to claim 1, characterized in that: One end of the limiting frame (6) is fixedly installed with a limiting spring (8), and one end of the limiting spring (8) is fixedly connected with a connecting block (9). One end of the connecting block (9) is fixedly installed on the surface of the mounting plate (4), and the center of the connecting block (9) and the center of the limiting spring (8) are on the same straight line.

4. The quick-release heat sink structure for a computer power module according to claim 1, characterized in that: Two fixing brackets (12) are fixedly connected to one end of the mounting plate (4). The two fixing brackets (12) are symmetrically distributed about the mounting plate (4) and the cross section of the mounting bracket (11) is "L" shaped.

5. The quick-release heat sink structure for a computer power module according to claim 1, characterized in that: An auxiliary piece (10) is fixedly installed on the inner wall of the limiting frame (6). The inner wall of the auxiliary piece (10) is movably connected to the surface of the body (1), and the auxiliary piece (10) is a rubber sheet.

6. The quick-release heat sink structure for a computer power module according to claim 1, characterized in that: The inner wall of the mounting plate (4) is rotatably mounted with fixing bolts (13), and the surface of the fixing bolts (13) is threadedly connected to the inner wall of the mounting bracket (11).

7. The quick-release heat sink structure for a computer power module according to claim 1, characterized in that: The inner wall of the mounting bracket (11) is slidably mounted with a slide rail (14). The dimensions of the slide rail (14) are compatible with the dimensions of the inner wall of the mounting bracket (11), and the cross section of the slide rail (14) is a "T" shaped structure. One end of the slide rail (14) is fixedly connected to the surface of the mounting plate (4).

8. The quick-release heat sink structure for a computer power module according to claim 7, characterized in that: A push spring (15) is fixedly installed on the surface of the slide rail (14), and the top of the push spring (15) is fixedly connected to the inner wall of the mounting bracket (11).

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