Computing device

By combining reinforcing components and mounting brackets in the computing device, the interference problem between the heat sink and the function card module is solved, achieving good heat dissipation and structural stability, and enhancing the fixing reliability of the function card module.

CN224366398UActive Publication Date: 2026-06-16XFUSION DIGITAL TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
XFUSION DIGITAL TECH CO LTD
Filing Date
2025-07-30
Publication Date
2026-06-16

AI Technical Summary

⚠Technical Problem

Computing devices struggle to achieve both good heat dissipation and structural stability, especially when the function card mounting bracket interferes with the heat sink fins, resulting in poor heat dissipation and insufficient structural stability.

⚗Method used

By incorporating a reinforcing member in the computing device, the function card module is connected to a mounting bracket, which includes a first mounting plate. The reinforcing member extends along the height direction to fit the function card module and connects to the first mounting plate, thus avoiding interference with the heat sink. Simultaneously, the reinforcing member extends along the length direction to connect to the mounting plate, providing additional support and fixation.

🎯Benefits of technology

It achieves better heat dissipation and structural stability, avoids interference between the mounting bracket and the heat sink, and enhances the fixation reliability of the function card module and the overall structural stability of the equipment.

✦ Generated by Eureka AI based on patent content.

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  • Figure CN224366398U_ABST
    Figure CN224366398U_ABST
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Abstract

The embodiment of the application provides a kind of computing device, computing device includes processor, radiator, function card module, mounting bracket and reinforcing piece, radiator is located above processor along the height direction of computing device;Function card module and radiator are spaced apart along the length direction of computing device;Function card module is connected with mounting bracket, and mounting bracket includes first mounting plate, and first mounting plate is located above function card module along the height direction;Reinforcing piece at least partially extends along the height direction, and the part of reinforcing piece extending along the height direction is attached to the side of function card module towards radiator and is connected with function card module;Reinforcing piece at least partially extends along the length direction, and the part of reinforcing piece extending along the length direction is connected with first mounting plate.The computing device provided by the embodiment of the application can have better heat dissipation effect and better structural stability.
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