A computer internal chip temperature controller

Abstract

The utility model discloses a kind of for computer internal chip temperature controller, including main radiator and several split radiators, the main radiator and split radiator between, between adjacent two split radiators are connected by plug-in structure, the main radiator is fixedly provided with reference frame, quick release assembly is provided on the reference frame, the quick release assembly is used to quickly fixed installation split radiator, the utility model is used for computer internal chip temperature controller, user can flexibly increase or decrease the quantity of split radiator according to chip power and heat dissipation demand, without separately configuring radiator for different power chips, reduce use cost.

Description

Technical Field

[0001] This utility model relates to the field of computer technology, specifically a temperature controller for internal computer chips. Background Technology

[0002] With the rapid development of computer technology, the computing performance of chips is constantly improving, but their power consumption and heat generation are also increasing significantly. Excessive chip temperature not only leads to decreased computing efficiency and reduced system stability, but prolonged exposure to high temperatures can also shorten chip lifespan and even cause hardware failures. Therefore, efficient temperature control technology has become a crucial aspect of computer hardware design.

[0003] Currently, most heat dissipation devices for computer chips are fixed-specification, monolithic structures whose heat dissipation capacity and applicable range are determined during the design phase. This structure has significant limitations: when selecting a heat dissipation device, users need to configure it in advance based on the maximum heat dissipation requirements of their own chips. If the chip is upgraded or the usage scenario is changed later, the original heatsink may become unusable due to insufficient heat dissipation capacity, resulting in wasted resources. Utility Model Content

[0004] To address the shortcomings mentioned in the background art, the purpose of this utility model is to provide a temperature controller for internal computer chips, which aims to achieve flexible adjustment of heat dissipation capacity through modular design to adapt to the heat dissipation requirements of chips with different power ratings.

[0005] The objective of this utility model can be achieved through the following technical solutions:

[0006] A temperature controller for a computer internal chip includes a main heat sink and several separate heat sinks. The main heat sink and the separate heat sinks are connected by a plug-in structure, and two adjacent separate heat sinks are connected by a plug-in structure. A reference frame is fixedly installed on the main heat sink, and a quick-release component is provided on the reference frame for quickly fixing and installing the separate heat sinks.

[0007] More preferably, both the main heat sink and the split heat sink include a heat-conducting base, heat pipes, fins and a cooling fan. The heat pipes are fixedly installed on the heat-conducting base, the fins are fixedly installed on the end of the heat pipe away from the heat-conducting base, and the cooling fan is fixedly installed on the fins.

[0008] More preferably, a mounting bracket is fixedly connected to the heat-conducting base of the main heat sink, and the mounting bracket is used to mount the main heat sink onto the computer motherboard.

[0009] More preferably, the plug-in structure includes a heat-conducting plug and a heat-conducting socket that are fixedly installed on the heat-conducting base. One end of the heat-conducting plug is fixedly connected to a T-shaped block, and the heat-conducting socket has a slot that slides with the T-shaped block.

[0010] More preferably, a fixing ring is symmetrically arranged on the reference frame, and a connecting pin is rotatably provided inside the fixing ring. A fixing sleeve is symmetrically arranged on the heat-conducting base of the split heat sink, and the connecting pin and the fixing sleeve are in sliding fit.

[0011] More preferably, the quick-release assembly includes a U-shaped frame, with grooves at both the upper and lower ends of the outer wall of the reference frame. The horizontal part of the U-shaped frame is slidably disposed inside the groove. A toothed rod is provided on the U-shaped frame at the position corresponding to the connecting pile, and a gear that meshes with the toothed rod is fixedly connected to the connecting pile.

[0012] More preferably, a fixing pile is provided on the connecting pile, and an L-shaped groove is provided on the fixing sleeve. When the split radiator is in a fixed installation state, the fixing pile is located in the vertical groove of the L-shaped groove.

[0013] More preferably, a locking spring is provided between the U-shaped frame and the reference frame, the locking spring being used to apply a preload force to the U-shaped frame away from the reference frame.

[0014] The beneficial effects of this utility model are:

[0015] 1. With this utility model, users can flexibly increase or decrease the number of separate heat sinks according to the chip power and heat dissipation requirements, without having to configure heat sinks separately for chips with different power, thus reducing the cost of use;

[0016] 2. This utility model, through a standardized plug-in structure, enables the rapid combination of the main heat sink and multiple separate heat sinks, which can meet the strong heat dissipation requirements of high-power chips and adapt to the energy-saving heat dissipation scenarios of low-power chips. Attached Figure Description

[0017] The present invention will be further described below with reference to the accompanying drawings.

[0018] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0019] Figure 2 This is a schematic diagram of the main heat sink structure in this utility model;

[0020] Figure 3 This is a schematic diagram of the plug-in structure in this utility model;

[0021] Figure 4 This is a schematic diagram of the quick-release component structure in this utility model;

[0022] Figure 5 This is a partial structural diagram of the quick-release component in this utility model.

[0023] In the picture:

[0024] Figure Descriptions: 1. Main radiator; 2. Split radiator; 3. Plug-in structure; 301. Thermal plug; 302. Thermal socket; 303. T-block; 304. Slot; 4. Base frame; 5. Quick-release assembly; 501. U-shaped bracket; 502. Slide groove; 503. Gear rack; 504. Gear; 505. Locking spring; 6. Thermal base; 7. Heat pipe; 8. Fins; 9. Cooling fan; 10. Mounting base; 11. Retaining ring; 12. Connecting post; 13. Retaining sleeve; 14. Retaining post; 15. L-shaped groove. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0026] In the description of this utility model, it should be understood that the terms "opening", "upper", "lower", "thickness", "top", "middle", "length", "inner", "around" and other terms indicating orientation or positional relationship are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the components or elements referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0027] like Figure 1-5 As shown, a temperature controller for internal computer chips includes a main heat sink 1 and several separate heat sinks 2. The main heat sink 1 serves as a basic module for dissipating heat from the main heat-generating chip (such as the CPU). The separate heat sinks 2 can be selectively added according to actual needs to expand the heat dissipation area and heat dissipation capacity.

[0028] The main radiator 1 and the split radiators 2 are connected, as are adjacent split radiators 2, via plug-in structures 3. By increasing or decreasing the number of split radiators 2, the heat dissipation capacity can be flexibly adjusted. A reference frame 4 is fixedly installed on the main radiator 1. This reference frame 4 not only provides an installation reference for the split radiators 2, but also supports the quick-release assembly 5, which enables the quick fixing and installation of the split radiators 2.

[0029] Both the main heatsink 1 and the separate heatsink 2 adopt a standardized structural design, including a thermally conductive base 6, a heat pipe 7, fins 8, and a cooling fan 9. The thermally conductive base 6 is in direct contact with the chip surface to absorb the heat generated by the chip. The heat pipe 7 is fixedly installed on the thermally conductive base 6 and serves as a heat transfer channel, which can efficiently conduct the heat absorbed by the thermally conductive base 6 to the fins 8. The fins 8 are fixedly installed at the end of the heat pipe 7 away from the thermally conductive base 6, which accelerates heat dissipation by increasing the heat dissipation area. The cooling fan 9 is fixedly installed on the fins 8 and improves the heat dissipation efficiency of the fins 8 by forcing airflow.

[0030] A mounting base 10 is fixedly connected to the heat-conducting base 6 of the main heat sink 1. The mounting base 10 is adapted to the mounting holes on the computer motherboard to stably install the main heat sink 1 on the computer motherboard and ensure that the heat-conducting base 6 is in close contact with the surface of the main chip.

[0031] The plug-in structure 3 is a key component for achieving modular connection, including a heat-conducting plug 301 and a heat-conducting socket 302 fixedly mounted on the heat-conducting base 6. One end of the heat-conducting plug 301 is fixedly connected to a T-shaped block 303, and the heat-conducting socket 302 has a slot 304 that slides with the T-shaped block 303. When it is necessary to expand the heat dissipation module, the T-shaped block 303 of the split heat sink 2 is inserted into the heat-conducting socket 302 of the main heat sink 1 or the previous split heat sink 2 along the slot 304, which realizes the mechanical connection and heat conduction between adjacent heat sinks, ensuring the integrity of the heat dissipation system.

[0032] A fixing ring 11 is symmetrically arranged on the reference frame 4. A connecting pin 12 is rotatably provided inside the fixing ring 11. A fixing sleeve 13 is symmetrically arranged on the heat-conducting base 6 of the split heat sink 2. The connecting pin 12 and the fixing sleeve 13 are slidably engaged. This structure provides auxiliary support and positioning for the split heat sink 2, ensuring the connection accuracy between the split heat sink 2 and the main heat sink 1.

[0033] The quick-release assembly 5 includes a U-shaped frame 501. Slide grooves 502 are provided at both the upper and lower ends of the outer wall of the reference frame 4. The horizontal portion of the U-shaped frame 501 is slidably disposed inside the slide grooves 502 and can reciprocate along the slide grooves 502. A toothed rod 503 is provided on the U-shaped frame 501 at a position corresponding to the connecting post 12. A gear 504 that meshes with the toothed rod 503 is fixedly connected to the connecting post 12. When the U-shaped frame 501 moves, the toothed rod 503 drives the gear 504 to rotate, thereby driving the connecting post 12 to rotate synchronously.

[0034] A fixing post 14 is provided on the connecting post 12, and an L-shaped groove 15 is provided on the fixing sleeve 13. The L-shaped groove 15 consists of a horizontal groove and a vertical groove. When installing the split radiator 2, the fixing sleeve 13 is first put into the connecting post 12, so that the fixing post 14 slides along the horizontal groove of the L-shaped groove 15 to the end. Then, the connecting post 12 is rotated by the quick-release assembly 5, so that the fixing post 14 enters the vertical groove of the L-shaped groove 15. When the split radiator 2 is in the fixed installation state, the fixing post 14 is located in the vertical groove of the L-shaped groove 15, realizing the axial fixation of the split radiator 2.

[0035] A locking spring 505 is provided between the U-shaped frame 501 and the reference frame 4. The locking spring 505 is used to apply a preload force to the U-shaped frame 501 away from the reference frame 4, so that the rack 503 and the gear 504 are kept in meshing state, ensuring that the connecting pile 12 will not rotate unexpectedly due to vibration or other factors, thereby ensuring the fixed reliability of the split radiator 2.

[0036] Working principle:

[0037] Basic installation: Fix the main heat sink 1 to the target chip position on the computer motherboard using the mounting bracket 10, ensuring that the heat-conducting base 6 of the main heat sink 1 is in close contact with the chip surface.

[0038] Installation of Split Radiator 2:

[0039] a. Select an appropriate number of split heat sinks 2 according to the heat dissipation requirements, align the heat-conducting plug 301 of the first split heat sink 2 with the heat-conducting socket 302 of the main heat sink 1, and let the T-shaped block 303 slide into the slot 304 to complete the initial connection.

[0040] b. At the same time, align the fixing sleeve 13 on the split radiator 2 with the connecting post 12 on the reference frame 4 and put it in, so that the fixing post 14 on the connecting post 12 slides along the L-shaped groove 15 of the fixing sleeve 13 to the end.

[0041] c. Press the U-shaped frame 501 towards the reference frame 4 to compress the locking spring 505, so that the U-shaped frame 501 moves along the slide groove 502, and drives the gear 504 to rotate through the toothed rod 503, thereby causing the connecting pile 12 to rotate 90 degrees synchronously. At this time, the fixed pile 14 moves from the horizontal groove of the L-shaped groove 15 into the vertical groove.

[0042] d. Loosen the U-shaped frame 501. Under the pre-tightening force of the locking spring 505, the U-shaped frame 501 returns to its original position. The gear 504 and the rack 503 remain engaged. The connecting pile 12 cannot rotate in the opposite direction. The fixing pile 14 is restricted in the vertical groove of the L-shaped groove 15, thus completing the fixing of the first split radiator 2.

[0043] e. If more split-type heatsinks 2 need to be installed, repeat steps a and b, connecting the subsequent split-type heatsinks 2 to the previous split-type heatsink 2 in sequence.

[0044] Heat dissipation: The heat generated by the chip is absorbed by the heat-conducting base 6 of the main heat sink 1. Part of the heat is transferred to the fins 8 through the heat pipe 7 of the main heat sink 1 and carried away by the cooling fan 9 of the main heat sink 1. The other part of the heat is transferred to each of the separate heat sinks 2 through the plug-in structure 3 and dissipated through the heat pipe 7, fins 8 and cooling fan 9 of the separate heat sink 2, so as to achieve multi-module collaborative heat dissipation.

[0045] In the description of this specification, references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0046] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model.

Claims

1. A temperature controller for a computer internal chip, characterized in that, It includes a main radiator (1) and several split radiators (2). The main radiator (1) and the split radiators (2) are connected by a plug-in structure (3) and two adjacent split radiators (2). A reference frame (4) is fixedly installed on the main radiator (1). A quick-release assembly (5) is installed on the reference frame (4). The quick-release assembly (5) is used to quickly fix and install the split radiators (2).

2. The temperature controller for a computer internal chip according to claim 1, characterized in that, Both the main heat sink (1) and the split heat sink (2) include a heat-conducting base (6), a heat pipe (7), fins (8) and a cooling fan (9). The heat pipe (7) is fixedly installed on the heat-conducting base (6), the fins (8) are fixedly installed at the end of the heat pipe (7) away from the heat-conducting base (6), and the cooling fan (9) is fixedly installed on the fins (8).

3. The temperature controller for a computer internal chip according to claim 2, characterized in that, The heat-conducting base (6) of the main heat sink (1) is fixedly connected to a mounting base (10), which is used to install the main heat sink (1) on the computer motherboard.

4. The temperature controller for a computer internal chip according to claim 3, characterized in that, The plug-in structure (3) includes a heat-conducting plug (301) and a heat-conducting socket (302) fixedly installed on the heat-conducting base (6). One end of the heat-conducting plug (301) is fixedly connected to a T-shaped block (303), and the heat-conducting socket (302) is provided with a slot (304) that slides with the T-shaped block (303).

5. The temperature controller for a computer internal chip according to claim 4, characterized in that, A fixing ring (11) is symmetrically arranged on the reference frame (4). A connecting pin (12) is rotatably arranged inside the fixing ring (11). A fixing sleeve (13) is symmetrically arranged on the heat-conducting base (6) of the split heat sink (2). The connecting pin (12) and the fixing sleeve (13) slide together.

6. The temperature controller for a computer internal chip according to claim 5, characterized in that, The quick-release assembly (5) includes a U-shaped frame (501). The upper and lower ends of the outer side wall of the reference frame (4) are provided with sliding grooves (502). The horizontal part of the U-shaped frame (501) is slidably disposed inside the sliding groove (502). A toothed rod (503) is provided on the U-shaped frame (501) at the position corresponding to the connecting post (12). A gear (504) that meshes with the toothed rod (503) is fixedly connected to the connecting post (12).

7. The temperature controller for a computer internal chip according to claim 6, characterized in that, A fixing pile (14) is provided on the connecting pile (12), and an L-shaped groove (15) is provided on the fixing sleeve (13). When the split radiator (2) is in a fixed installation state, the fixing pile (14) is located in the vertical groove of the L-shaped groove (15).

8. The temperature controller for a computer internal chip according to claim 6, characterized in that, A locking spring (505) is provided between the U-shaped frame (501) and the reference frame (4), and the locking spring (505) is used to apply a preload force to the U-shaped frame (501) away from the reference frame (4).

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