Miniaturized navigation antenna
By employing lightweight high-frequency substrates and an L-shaped coupling structure in the navigation antenna, combined with optimized tuning elements, the problems of large size and heavy weight of traditional navigation antennas have been solved, achieving miniaturized and highly efficient navigation and positioning effects.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN ZHAOXUN TECH CO LTD
- Filing Date
- 2025-07-01
- Publication Date
- 2026-06-16
AI Technical Summary
Traditional navigation antennas are large and heavy, and the use of materials with high relative permittivity results in low gain, narrow bandwidth, and low radiation efficiency, making it difficult to meet the high-precision and high-reliability navigation and positioning requirements of miniaturized devices.
A high-frequency dielectric substrate made of a high-frequency substrate that is lighter than ceramic materials and has a lower relative permittivity is used as the antenna dielectric. A symmetrical L-shaped coupling structure is formed by the first L-shaped stub and the second L-shaped stub. Miniaturization is achieved by utilizing the coupling bandgap. At the same time, metal conductive stubs and soldered parts are used to connect the antenna to the circuit board. The antenna performance is optimized by combining the tuning element.
This technology enables antenna miniaturization and high consistency, reduces weight, and improves antenna gain, bandwidth, and radiation efficiency, thus meeting the high-precision navigation and positioning requirements of miniaturized devices.
Smart Images

Figure CN224367119U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of antenna technology, and in particular to a miniaturized navigation antenna. Background Technology
[0002] With the widespread application of satellite navigation technology, miniaturized devices such as wearable devices and handheld navigation terminals have placed stringent requirements on the size and weight of navigation antennas. However, traditional navigation antennas are mostly externally mounted, typically tens of centimeters in size and weighing hundreds of grams or more, causing numerous inconveniences in installation and use, and making them difficult to adapt to space- and load-sensitive devices.
[0003] In existing technologies, navigation antennas often use ceramic materials as the dielectric. Although their high relative permittivity allows for a certain degree of miniaturization, ceramic materials are heavy and the manufacturing process is often rough, making it difficult to guarantee processing precision and resulting in poor product consistency. Furthermore, using materials with high relative permittivity leads to problems such as low antenna gain, narrow bandwidth, and low radiation efficiency, limiting the performance improvement after miniaturization and failing to meet the requirements of high-precision, high-reliability navigation and positioning. Therefore, there is an urgent need for a navigation antenna design that balances miniaturization and high performance. Utility Model Content
[0004] The purpose of this invention is to solve the problems of low antenna gain and low radiation efficiency in the existing technology, and to provide a miniaturized navigation antenna. By utilizing the coupling band gap formed between two L-shaped branches, the antenna is miniaturized. By using a high-frequency dielectric substrate made of a high-frequency material that is lighter than ceramic material and has a lower relative permittivity as the antenna dielectric, the antenna is lighter and has higher consistency in mass production.
[0005] To achieve the above objectives, this utility model provides a miniaturized navigation antenna, including a high-frequency dielectric substrate. The top of the high-frequency dielectric substrate is provided with a first L-shaped stub and a second L-shaped stub, which are spaced a certain distance apart to form a coupling band gap. A conductive element is provided on the side of the high-frequency dielectric substrate. The top of the conductive element is connected to the first L-shaped stub and the second L-shaped stub, and the bottom of the conductive element is connected to a solder joint. The high-frequency dielectric substrate is connected to a circuit board through the solder joint.
[0006] As a further description of the above technical solution: the conductive component includes a first metal conductive branch and a second metal conductive branch, the top of the first metal conductive branch is connected to a first L-shaped branch, and the top of the second metal conductive branch is connected to a second L-shaped branch.
[0007] As a further description of the above technical solution: the welded component includes a first pad and a second pad, both of which are connected to the bottom of the high-frequency dielectric substrate. The first pad is connected to the bottom of the first metal conductive stub, and the second pad is connected to the second metal conductive stub.
[0008] As a further description of the above technical solution: the high-frequency dielectric board has a first tuning element, a second tuning element and a fourth tuning element connected in parallel on the side of the circuit board, and a third tuning element connected in series on the side of the high-frequency dielectric board. The circuit board is provided with a power supply port and a circuit board clearance area.
[0009] As a further description of the above technical solution: the first metal conductive stub and the second metal conductive stub are connected on both sides of the high-frequency dielectric substrate.
[0010] As a further description of the above technical solution: both the first metal conductive stub and the second metal conductive stub are arc-shaped.
[0011] As a further description of the above technical solution: the top of the high-frequency dielectric plate is provided with a first mounting groove, which is used to install a first L-shaped branch and a second L-shaped branch.
[0012] As a further description of the above technical solution: the high-frequency dielectric substrate has a second mounting groove on both sides, and the second mounting groove is used to install conductive components.
[0013] As a further description of the above technical solution: the high-frequency dielectric substrate has a third mounting groove on both sides, and the third mounting groove is used to install the welded parts.
[0014] The above technical solution has the following advantages or beneficial effects:
[0015] This invention forms a symmetrical L-shaped coupling structure by using a first L-shaped stub and a second L-shaped stub. The coupling band gap formed between the two L-shaped stubs enables the miniaturization of the antenna. By using a high-frequency dielectric substrate made of a high-frequency material that is lighter than ceramic material and has a lower relative permittivity as the antenna dielectric, the antenna is lighter and has higher consistency during mass production. Attached Figure Description
[0016] Figure 1 This is a schematic diagram of the structure of a miniaturized navigation antenna in one embodiment of the present invention;
[0017] Figure 2 This is a top view of a miniaturized navigation antenna in one embodiment of the present invention;
[0018] Figure 3 This is a bottom view of a miniaturized navigation antenna in one embodiment of the present invention;
[0019] Figure 4 This is a schematic diagram of the miniaturized navigation antenna mounted on a circuit board in one embodiment of the present invention.
[0020] Legend:
[0021] 1. High-frequency dielectric substrate; 2. First L-shaped stub; 3. Second L-shaped stub; 4. Coupling bandgap; 5. Conductor; 6. Solder component; 7. Circuit board; 8. First tuning element; 9. Second tuning element; 10. Third tuning element; 11. Fourth tuning element; 12. Power supply port; 13. Circuit board clearance area; 14. First mounting slot; 15. Second mounting slot; 16. Third mounting slot; 51. First metal conductive stub; 52. Second metal conductive stub; 61. First pad; 62. Second pad. Detailed Implementation
[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0023] In the description of this utility model, it should be noted that the terms "vertical", "up", "down", "horizontal", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0024] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0025] like Figure 1-4As shown, a miniaturized navigation antenna of this utility model includes a high-frequency dielectric substrate 1. The top of the high-frequency dielectric substrate 1 is provided with a first L-shaped stub 2 and a second L-shaped stub 3. The first L-shaped stub 2 and the second L-shaped stub 3 are separated by a certain distance to form a coupling band gap 4. A conductive element 5 is provided on the side of the high-frequency dielectric substrate 1. The top of the conductive element 5 is connected to the first L-shaped stub 2 and the second L-shaped stub 3, and the bottom of the conductive element 5 is connected to a welding element 6. The high-frequency dielectric substrate 1 is connected to a circuit board 7 through the welding element 6.
[0026] In the technical solution of this utility model, a symmetrical L-shaped coupling structure is formed by the first L-shaped stub 2 and the second L-shaped stub 3. The coupling band gap 4 formed between the two L-shaped stubs is used to realize the miniaturization of the antenna. The high-frequency dielectric board 1, which is lighter than ceramic materials and has a lower relative permittivity, is used as the antenna dielectric, making the antenna lighter and more consistent during mass production. The high-frequency dielectric board 1, the first L-shaped stub 2 and the second L-shaped stub 3 can be connected to the circuit board 7 through the conductive part 5 and the welding part 6.
[0027] Among them, the first L-shaped stub 2, the second L-shaped stub 3, the conductive element 5, and the welded element 6 are all made of metal. By designing the antenna unit as a symmetrical L-shaped coupling structure, and the longer the coupling path, the more obvious the miniaturization effect, the antenna size is greatly reduced. By extending the coupling bandgap or shortening the distance between the two L-shaped stubs, the operating frequency of the antenna can be reduced to achieve the purpose of miniaturization. At the same time, a high-frequency plate material that is lighter than ceramic materials and has a lower relative permittivity is used as the antenna medium, achieving a small size, thereby greatly reducing the overall weight of the antenna. Furthermore, the use of a high-frequency plate material with a lower relative permittivity allows the designed antenna to have higher consistency and wider bandwidth during mass production.
[0028] Specifically, in the field of navigation and positioning, existing technical implementations typically use ceramic materials as the medium, resulting in significant weight. While using ceramic materials with high relative permittivity can reduce antenna size to some extent, it also places higher demands on the manufacturing process. The manufacturing process for ceramic antennas is relatively rough, making it difficult to guarantee processing precision and leading to poor consistency. This invention, however, uses a high-frequency dielectric substrate 1 made of a high-frequency plate material that is lighter and has a lower relative permittivity than ceramic materials as the antenna medium. Furthermore, the antenna is designed with a symmetrical L-shaped coupling structure, utilizing the coupling bandgap 4 formed by the first L-shaped stub 2 and the second L-shaped stub 3 to achieve antenna miniaturization. Compared to navigation antennas of the same size designed using ceramic materials, the antenna designed in this invention is lighter and more consistent.
[0029] like Figure 1 and Figure 2As shown, the conductive component 5 includes a first metal conductive branch 51 and a second metal conductive branch 52. The top of the first metal conductive branch 51 is connected to the first L-shaped branch 2, and the top of the second metal conductive branch 52 is connected to the second L-shaped branch 3. The first L-shaped branch 2 and the second L-shaped branch 3 are connected to the welding component 6 through the first metal conductive branch 51 and the second metal conductive branch 52.
[0030] The first metal conducting stub 51 and the second metal conducting stub 52 are connected to both sides of the high-frequency dielectric substrate 1.
[0031] like Figure 1 and Figure 3 As shown, the soldering component 6 includes a first solder pad 61 and a second solder pad 62. Both the first solder pad 61 and the second solder pad 62 are connected to the bottom of the high-frequency dielectric substrate 1. The first solder pad 61 is connected to the bottom of the first metal conductive branch 51, and the second solder pad 62 is connected to the second metal conductive branch 52. The first solder pad 61 and the second solder pad 62 are fixed to the bottom of the high-frequency dielectric substrate 1 and are used to connect the conductive component 5 and the circuit board 7.
[0032] like Figure 1 and Figure 4 As shown, a first tuning element 8, a second tuning element 9, and a fourth tuning element 11 are connected in parallel on the side of the high-frequency dielectric substrate 1 and connected to the circuit board 7. A third tuning element 10 is connected in series on the side of the high-frequency dielectric substrate 1 and connected to the circuit board 7. The circuit board 7 is provided with a feed port 12 and a clear area 13. By adjusting the parameters of the tuning elements (capacitors or inductors), the resonant frequency of the antenna is changed, enabling multi-band operation (such as compatibility with GPS L1 / L2 / L5 bands), improving the antenna's versatility. The series and parallel tuning elements form an LC matching network, matching the antenna's input impedance to the 50Ω standard value, reducing signal reflection, and improving the antenna's radiation efficiency and receiving sensitivity.
[0033] Specifically, the tuning element 8 is located at the end of the antenna through parallel connection. One end is connected to the bottom solder part 6 of the antenna, and the other end is connected to the GND of the PCB circuit board 7. By changing the capacitance or inductance value, the frequency can be adjusted within a certain frequency range.
[0034] The functions of tuning elements 9, 10, and 11 in the antenna feed matching network are twofold: first, to adjust the antenna impedance to the optimal matching state, thereby giving the antenna the best radiation characteristics; and second, to enable the antenna to be frequency-adjustable within a small frequency range.
[0035] The power supply port 12 is located at the end of the antenna feed line, with one end connected to the antenna feed line and the other end connected to the GND of the PCB board 7.
[0036] The clearance area 13 of the PCB circuit board is located at the bottom of the antenna. The size of the clearance area not only affects the operating frequency of the antenna, but also the radiation efficiency of the antenna. Choosing an appropriate clearance area can enable the antenna to have higher radiation efficiency.
[0037] like Figure 1 and Figure 2 As shown, both the first metal conductive branch 51 and the second metal conductive branch 52 are arc-shaped. By adopting the arc-shaped structure of the first metal conductive branch 51 and the second metal conductive branch 52, the contact area between the first metal conductive branch 51 and the second metal conductive branch 52 and the first L-shaped branch 2, the second L-shaped branch 3, and the welded part 6 can be increased, thereby enhancing the conductivity.
[0038] like Figure 2 and Figure 3 As shown, a first mounting groove 14 is provided on the top of the high-frequency dielectric board 1 for installing a first L-shaped branch 2 and a second L-shaped branch 3. Second mounting grooves 15 are provided on both sides of the high-frequency dielectric board 1 for installing conductive components 5. A third mounting groove 16 is provided at the bottom of the high-frequency dielectric board 1 for installing welded components 6. The first mounting groove 14 on the top of the high-frequency dielectric board 1 allows for precise positioning and installation of the first L-shaped branch 2 and the second L-shaped branch 3. The second mounting grooves 15 on both sides allow for precise positioning and installation of conductive components 5. The third mounting groove 16 at the bottom allows for precise positioning and installation of welded components 6. The modular mounting groove design simplifies the assembly process and improves production consistency. At the same time, by installing the first L-shaped branch 2, the second L-shaped branch 3, the conductive components 5, and the welded components 6 in the mounting grooves on the high-frequency dielectric board 1, the high-frequency dielectric board 1 can protect the first L-shaped branch 2, the second L-shaped branch 3, the conductive components 5, and the welded components 6.
[0039] Working principle: A symmetrical L-shaped coupling structure is formed by the first L-shaped stub 2 and the second L-shaped stub 3. The coupling band gap 4 formed between the two L-shaped stubs is used to realize the miniaturization of the antenna. The high-frequency dielectric board 1, which is lighter and has a lower relative permittivity than ceramic materials, is used as the antenna dielectric, making the antenna lighter and more consistent during mass production. The high-frequency dielectric board 1, the first L-shaped stub 2 and the second L-shaped stub 3 can be connected to the circuit board 7 through the conductive part 5 and the welding part 6.
[0040] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.
[0041] The preferred embodiments of this utility model disclosed above are merely illustrative of the present utility model. These preferred embodiments do not exhaustively describe all details, nor do they limit the utility model to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of this utility model, thereby enabling those skilled in the art to better understand and utilize it. This utility model is limited only by the claims and their full scope and equivalents.
Claims
1. A miniaturized navigation antenna, characterized in that, The high-frequency dielectric substrate (1) includes a first L-shaped branch (2) and a second L-shaped branch (3) on its top. The first L-shaped branch (2) and the second L-shaped branch (3) are separated by a certain distance to form a coupling band gap (4). A conductive element (5) is provided on the side of the high-frequency dielectric substrate (1). The top of the conductive element (5) is connected to the first L-shaped branch (2) and the second L-shaped branch (3). The bottom of the conductive element (5) is connected to a welding element (6). The high-frequency dielectric substrate (1) is connected to a circuit board (7) through the welding element (6).
2. The miniaturized navigation antenna according to claim 1, characterized in that: The conductive component (5) includes a first metal conductive branch (51) and a second metal conductive branch (52). The top of the first metal conductive branch (51) is connected to the first L-shaped branch (2), and the top of the second metal conductive branch (52) is connected to the second L-shaped branch (3).
3. The miniaturized navigation antenna according to claim 1, characterized in that: The welded component (6) includes a first pad (61) and a second pad (62). The first pad (61) and the second pad (62) are both connected to the bottom of the high-frequency dielectric substrate (1). The first pad (61) is connected to the bottom of the first metal conductive stub (51), and the second pad (62) is connected to the second metal conductive stub (52).
4. The miniaturized navigation antenna according to claim 1, characterized in that: The high-frequency dielectric substrate (1) has a first tuning element (8), a second tuning element (9) and a fourth tuning element (11) connected in parallel on the side of the circuit board (7). The high-frequency dielectric substrate (1) has a third tuning element (10) connected in series on the side of the circuit board (7). The circuit board (7) has a power supply port (12) and a circuit board clearance area (13).
5. The miniaturized navigation antenna according to claim 2, characterized in that: The first metal conducting stub (51) and the second metal conducting stub (52) are connected to both sides of the high-frequency dielectric plate (1).
6. The miniaturized navigation antenna according to claim 2, characterized in that: Both the first metal conductive stub (51) and the second metal conductive stub (52) are arc-shaped.
7. The miniaturized navigation antenna according to claim 1, characterized in that: The high-frequency dielectric substrate (1) has a first mounting groove (14) on its top, which is used to install the first L-shaped branch (2) and the second L-shaped branch (3).
8. The miniaturized navigation antenna according to claim 1, characterized in that: The high-frequency dielectric substrate (1) has a second mounting groove (15) on both sides, and the second mounting groove (15) is used to install the conductive component (5).
9. The miniaturized navigation antenna according to claim 1, characterized in that: The high-frequency dielectric substrate (1) has a third mounting groove (16) on both sides, and the third mounting groove (16) is used to install the welded parts (6).