In-vehicle controller and vehicle

Abstract

The application discloses a vehicle-mounted controller and a vehicle, the vehicle-mounted controller comprising a shell, a heat dissipation piece, a first circuit board and a second circuit board, the shell having a mounting cavity; the heat dissipation piece is arranged in the shell and divides the mounting cavity into a first cavity and a second cavity, the heat dissipation piece having a first heat dissipation surface in the first cavity and a second heat dissipation surface in the second cavity; the first circuit board is arranged in the first cavity, at least one first chip is arranged on the first circuit board, the first chip is in heat conduction connection with the first heat dissipation surface, the second circuit board is arranged in the second cavity, at least one second chip is arranged on the second circuit board, and the second chip is in heat conduction connection with the second heat dissipation surface. The vehicle-mounted controller of the application realizes higher integration, improves the integration and space utilization of the vehicle controller, and improves the heat dissipation effect.

Description

Technical Field

[0001] This utility model relates to the field of controller heat dissipation technology, specifically to an in-vehicle controller and a vehicle. Background Technology

[0002] With the rapid popularization of electric and intelligent vehicles, the complexity and functional integration of vehicle control systems are constantly increasing. As a core component of the vehicle's electronic system, the vehicle controller integrates multiple functional modules, all of which rely on high-performance controller chips. However, with the increasing demands on chip computing power and power consumption, heat dissipation issues are becoming increasingly significant, placing higher demands on the chip's heat dissipation performance. In related technologies, vehicle controllers suffer from low integration and poor heat dissipation. Utility Model Content

[0003] This utility model aims to at least partially solve one of the technical problems in the related art.

[0004] Therefore, this disclosure proposes an on-board controller and a vehicle.

[0005] The vehicle controller of this embodiment includes a housing, a heat sink, a first circuit board, and a second circuit board. The housing has a mounting cavity. The heat sink is disposed inside the housing and divides the mounting cavity into a first chamber and a second chamber. The heat sink has a first heat dissipation surface located in the first chamber and a second heat dissipation surface located in the second chamber.

[0006] The first circuit board is disposed in the first cavity, and a first chip is disposed on the first circuit board. The first chip is thermally connected to the first heat dissipation surface. The second circuit board is disposed in the second cavity, and a second chip is disposed on the second circuit board. The second chip is thermally connected to the second heat dissipation surface.

[0007] Optionally, the vehicle controller further includes a first heat-conducting sheet, the first heat-conducting sheet having a first heat-conducting surface and a second heat-conducting surface, the first heat-conducting surface being directly or indirectly attached to the first heat dissipation surface, and the second heat-conducting surface being directly or indirectly attached to the first chip; and / or the vehicle controller further includes a second heat-conducting sheet, the second heat-conducting sheet having a third heat-conducting surface and a fourth heat-conducting surface, the third heat-conducting surface being directly or indirectly attached to the second heat dissipation surface, and the fourth heat-conducting surface being directly or indirectly attached to the second chip.

[0008] Optionally, a first graphene layer for heat conduction is provided between the second thermally conductive surface and the first chip; and / or a second graphene layer for heat conduction is provided between the fourth thermally conductive surface and the second chip.

[0009] Optionally, the first graphene layer is bonded to the second thermally conductive surface; and / or the second graphene layer is bonded to the fourth thermally conductive surface.

[0010] Optionally, the second thermally conductive surface is provided with a first insulating member surrounding the first graphene layer, the height of the first insulating member being higher than the first graphene layer; and / or the fourth thermally conductive surface is provided with a second insulating member surrounding the second graphene layer, the height of the second insulating member being higher than the second graphene layer.

[0011] Optionally, the first insulating element, the second thermally conductive surface, and the first graphene layer define a first clearance groove for avoiding electrical components on the first circuit board; and / or the second insulating element, the fourth thermally conductive surface, and the second graphene layer define a second clearance groove for avoiding electrical components on the second circuit board.

[0012] Optionally, the first circuit board is provided with a first heating device other than the first chip, and the first heating device and the first heat dissipation surface are connected by a first heat-conducting component; and / or the second circuit board is provided with a second heating device other than the second chip, and the second heating device and the second heat dissipation surface are connected by a second heat-conducting component.

[0013] Optionally, the housing includes an upper cover plate, a middle frame, and a lower cover plate, at least a portion of the heat sink is disposed within the space of the middle frame, the upper cover plate is detachably disposed on the top surface of the middle frame, and the lower cover plate is detachably disposed on the bottom surface of the middle frame.

[0014] Optionally, a first sealing gasket is provided between the top surface of the middle frame and the upper cover plate, and a second sealing gasket is provided between the bottom surface of the middle frame and the lower cover plate.

[0015] Optionally, the first circuit board has a first connector, the housing has a first interface for the first connector to pass through, and a first seal is provided between the first connector and the first interface; and / or the second circuit board has a second connector, the housing has a second interface for the second connector to pass through, and a second seal is provided between the second connector and the second interface.

[0016] Optionally, the middle frame is provided with a fixing part for connecting to the vehicle.

[0017] Optionally, the heat dissipation component is a liquid cooling plate, which has a coolant flow channel and a coolant inlet and a coolant outlet communicating with the coolant flow channel. Both the coolant inlet and the coolant outlet are located outside the mounting cavity.

[0018] Optionally, the first chip and the second chip are at least one of a driving control chip, a vehicle cockpit control chip, a T-BOX communication chip, and a vehicle control chip.

[0019] The vehicle of this disclosure includes the on-board controller described in any of the above embodiments.

[0020] The vehicle controller of this disclosure divides the mounting cavity of the housing into two chambers, which respectively house a first circuit board and a second circuit board. The two circuit boards share a single heat sink, achieving a higher degree of integration. This allows for the installation of more electronic components within a limited space, improving the integration and space utilization of the vehicle controller. Furthermore, the heat sink divides the interior of the housing into two independent chambers, each containing a chip and a corresponding heat dissipation surface, which helps isolate heat sources and reduce thermal interference. Each chip also has a dedicated heat dissipation surface, which can more effectively conduct and dissipate the heat generated by the chip, improving heat dissipation performance. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the structure of the vehicle controller according to an embodiment of the present utility model.

[0022] Figure 2 This is a partial exploded view of the vehicle controller according to an embodiment of the present invention.

[0023] Figure 3 This is a partial structural diagram of the first chamber of the vehicle controller according to an embodiment of the present invention.

[0024] Figure 4 This is a partial structural diagram of the second chamber of the vehicle controller according to an embodiment of the present invention.

[0025] Figure label:

[0026] 100. Vehicle controller; 1. Housing; 101. Top cover; 102. Middle frame; 1021. Fixing part; 103. Bottom cover; 104. First connector; 105. Second connector; 201. First chamber; 202. Second chamber; 3. Heat sink; 301. First heat dissipation surface; 302. Second heat dissipation surface; 303. Coolant inlet; 304. Coolant outlet; 4. First circuit board; 401. First connector; 5. Second circuit board; 501. Second connector; 6. First heat-conducting sheet; 601. Second heat-conducting surface; 7. Second heat-conducting sheet; 701. Fourth heat-conducting surface; 8. First graphene layer; 9. Second graphene layer; 10. First insulating component; 11. Second insulating component; 12. First clearance groove; 13. Second clearance groove. Detailed Implementation

[0027] The embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0028] like Figures 1 to 4 As shown, the vehicle controller 100 of this embodiment includes a housing 1, a heat sink 3, a first circuit board 4, and a second circuit board 5. The housing 1 has a mounting cavity, and the heat sink 3 is disposed in the housing 1 and divides the mounting cavity into a first chamber 201 and a second chamber 202. The heat sink 3 has a first heat dissipation surface 301 located in the first chamber 201 and a second heat dissipation surface 302 located in the second chamber 202.

[0029] A first circuit board 4 is disposed within a first chamber 201, and at least one first chip is disposed on the first circuit board 4. The first chip is thermally connected to a first heat dissipation surface 301. A second circuit board 5 is disposed within a second chamber 202, and at least one second chip is disposed on the second circuit board 5. The second chip is thermally connected to a second heat dissipation surface 302.

[0030] The vehicle controller 100 of this embodiment divides the mounting cavity of the housing 1 into two chambers, which respectively house the first circuit board 4 and the second circuit board 5. The two circuit boards share a heat sink 3, achieving a higher degree of integration. This allows for the installation of more electronic components within a limited space, improving the integration and space utilization of the vehicle controller 100. Furthermore, the heat sink 3 divides the interior of the housing 1 into two independent chambers, each containing a chip and a corresponding heat dissipation surface, which helps to isolate heat sources and reduce thermal interference. Each chip also has a dedicated heat dissipation surface, which can more effectively conduct and dissipate the heat generated by the chip, improving heat dissipation performance.

[0031] In some embodiments, the vehicle controller 100 further includes a first heat-conducting sheet 6, which has a first heat-conducting surface and a second heat-conducting surface 601 arranged opposite to each other. The first heat-conducting surface is directly or indirectly attached to the first heat dissipation surface 301, and the second heat-conducting surface 601 is directly or indirectly attached to the first chip.

[0032] The first heat-conducting sheet 6 increases the thermal contact area between the first chip and the first heat dissipation surface 301, which helps to conduct heat more efficiently and reduces thermal resistance. The first heat-conducting sheet 6 also helps to disperse heat, making the heat distribution more uniform, preventing local overheating, and helping to improve the overall heat dissipation efficiency. In addition, the heat-conducting sheet can act as a buffer layer, reducing the physical contact between the first chip and the first heat dissipation surface 301, thereby protecting the first chip from direct impact from the external environment.

[0033] In some embodiments, the vehicle controller 100 further includes a second heat-conducting sheet 7, which has a third heat-conducting surface and a fourth heat-conducting surface 701 arranged opposite to each other. The third heat-conducting surface is directly or indirectly attached to the second heat dissipation surface 302, and the fourth heat-conducting surface 701 is directly or indirectly attached to the second chip.

[0034] The second heat-conducting sheet 7 increases the thermal contact area between the second chip and the second heat dissipation surface 302, which helps to conduct heat more efficiently and reduces thermal resistance. The second heat-conducting sheet 7 also helps to disperse heat, making the heat distribution more uniform, preventing local overheating, and helping to improve the overall heat dissipation efficiency. In addition, the heat-conducting sheet can act as a buffer layer, reducing the physical contact between the second chip and the second heat dissipation surface 302, thereby protecting the second chip from direct impact from the external environment.

[0035] Optionally, a first graphene layer 8 for heat conduction is provided between the second thermally conductive surface 601 and the first chip, and a second graphene layer 9 for heat conduction is provided between the fourth thermally conductive surface 701 and the second chip.

[0036] It should be noted that graphene has extremely high thermal conductivity, typically exceeding 4000 W / m·K, far surpassing the thermal conductivity of most traditional metals and heat dissipation materials. This allows heat generated by the chip to be conducted from the chip to the heat dissipation surface more quickly and effectively, further improving heat dissipation efficiency.

[0037] Optionally, the first graphene layer 8 is bonded to the second thermally conductive surface 601, and the second graphene layer 9 is bonded to the fourth thermally conductive surface 701.

[0038] For example, the first graphene layer 8 is bonded to the second thermally conductive surface 601 using a fixative or thermally conductive adhesive, and the second graphene layer 9 is bonded to the fourth thermally conductive surface 701 using the same adhesive. This bonding ensures stable contact between the graphene layer and the thermally conductive surface, preventing displacement of the graphene layer during vibration or movement, thus maintaining continuous thermal conductivity. Bonding eliminates tiny gaps between the graphene layer and the thermally conductive surface, reducing thermal resistance and improving the efficiency of heat transfer from the graphene layer to the thermally conductive surface. Through bonding, the graphene layer can be installed on the thermally conductive surface more easily and quickly, simplifying the production process and installation steps. Bonding provides long-term mechanical stability, preventing the graphene layer from detaching or shifting due to time or environmental factors.

[0039] In some embodiments, a first insulating member 10 is provided on the second thermally conductive surface 601 surrounding the first graphene layer 8, and the height of the first insulating member 10 is higher than that of the first graphene layer 8. A second insulating member 11 is provided on the fourth thermally conductive surface 701 surrounding the second graphene layer 9, and the height of the second insulating member 11 is higher than that of the second graphene layer 9.

[0040] like Figure 2 and Figure 3 As shown, the insulating component serves to provide electrical isolation, preventing the graphene layer from coming into electrical contact with other electrical components during use and causing a short circuit, thus effectively ensuring safety. Additionally, the insulating component protects the graphene layer from mechanical damage during installation or use, such as scratches or cracks.

[0041] Optionally, the first insulating member 10, the second thermally conductive surface 601, and the first graphene layer 8 define a first clearance groove 12 for avoiding electrical components on the first circuit board 4. The second insulating member 11, the fourth thermally conductive surface 701, and the second graphene layer 9 define a second clearance groove 13 for avoiding electrical components on the second circuit board 5.

[0042] The recessed design allows the vehicle controller 100 to accommodate larger or more strategically located electrical components on the circuit board without compromising overall heat dissipation performance, thus optimizing board space utilization. The recessed design reduces interference from electrical components with the heat dissipation path, ensuring heat is conducted more effectively from the chip to the heat dissipation surface, thereby improving heat dissipation efficiency. The recessed design also provides greater design flexibility, allowing the vehicle controller 100 to adapt to different types of circuit board layouts and the installation requirements of electrical components.

[0043] In some embodiments, the first circuit board 4 is provided with a first heat-generating device other than the first chip, and the first heat-generating device and the first heat dissipation surface 301 are connected by a first heat-conducting component. The second circuit board 5 is provided with a second heat-generating device other than the second chip, and the second heat-generating device and the second heat dissipation surface 302 are connected by a second heat-conducting component.

[0044] In other words, through the first heat-conducting component, not only the first chip, but also other heat-generating devices on the first circuit board 4 can effectively conduct heat to the first heat dissipation surface 301, thereby improving the overall heat dissipation efficiency. This helps to balance the heat distribution of different heat-generating components, prevents any component from overheating, and thus improves the stability and reliability of the system.

[0045] Similarly, through the second heat-conducting component, not only the second chip, but also other heat-generating devices on the second circuit board 5 can effectively conduct heat to the second heat dissipation surface 302, thereby improving the overall heat dissipation efficiency. This helps to balance the heat distribution of different heat-generating components, prevents any component from overheating, and thus improves the stability and reliability of the system.

[0046] For example, the first heating device and / or the second heating device are components configured on the circuit board, such as resistors, capacitors and other components.

[0047] In some embodiments, the housing 1 includes an upper cover plate 101, a middle frame 102 and a lower cover plate 103. At least a portion of the heat sink 3 is disposed within the space of the middle frame 102. The upper cover plate 101 is detachably disposed on the top surface of the middle frame 102 and the lower cover plate 103 is detachably disposed on the bottom surface of the middle frame 102.

[0048] The modular design of the housing 1 allows the upper cover 101 and lower cover 103 to be installed and removed independently, facilitating maintenance and replacement and improving product maintainability. The middle frame 102 provides additional structural strength, helping to protect internal components from damage during transportation or use.

[0049] Optionally, a first sealing gasket is provided between the top surface of the middle frame 102 and the upper cover plate 101, and a second sealing gasket is provided between the bottom surface of the middle frame 102 and the lower cover plate 103.

[0050] The sealing gasket effectively prevents dust and moisture from entering the vehicle controller 100, protecting internal electronic components from environmental factors, reducing or even eliminating condensation inside the vehicle controller 100, and improving product reliability and durability. The sealing gasket can absorb and buffer external vibrations to a certain extent, reducing the impact of vibrations on internal components and contributing to improved system stability and safety. The sealing gasket reduces direct heat conduction through the housing 1, concentrating heat on the heat sink 3 and heat dissipation surface, optimizing the heat dissipation path and efficiency. The sealing gasket is made of conductive material, achieving both sealing of the inside of the vehicle controller 100 and conductivity, preventing damage to the circuit boards caused by static electricity in the middle frame 102, upper cover 101, and lower cover 103, thus improving product reliability.

[0051] In some embodiments, the first circuit board 4 has a first connector 401, and the housing 1 has a first interface 104 through which the first connector 401 passes. A first seal (not shown in the figure) is provided between the first connector 401 and the first interface 104. The second circuit board 5 has a second connector 501, and the housing 1 has a second interface 105 through which the second connector 501 passes. A second seal (not shown in the figure) is provided between the second connector 501 and the second interface 105.

[0052] like Figure 1 As shown, the first seal effectively prevents dust and moisture from entering the vehicle controller 100, protecting internal electronic components from environmental factors and improving product reliability and durability. The seal can absorb and buffer external vibrations to a certain extent, reducing the impact of vibrations on internal components and contributing to improved system stability and safety. The seal also provides a certain degree of electromagnetic shielding, reducing the impact of electromagnetic interference on internal components.

[0053] Optionally, the middle frame 102 is provided with a fixing part 1021 for connecting to the vehicle.

[0054] For example, there are multiple fixing parts 1021, the middle frame 102 is generally rectangular, and each corner of the middle frame 102 is provided with a fixing part 1021. The fixing part 1021 is provided with a connection hole to facilitate connection with the vehicle. This can ensure a stable connection between the vehicle controller 100 and the vehicle, prevent the vehicle controller 100 from moving or vibrating during driving, thereby improving the stability and safety of the system.

[0055] Optionally, the heat sink 3 is a liquid cooling plate, which has a coolant flow channel and a coolant inlet 303 and a coolant outlet 304 connected to the coolant flow channel. Both the coolant inlet 303 and the coolant outlet 304 are located outside the mounting cavity.

[0056] Liquid cooling plates remove heat through the circulation of coolant. Compared to traditional air cooling methods, liquid cooling plates have higher heat capacity and heat dissipation efficiency, enabling them to more effectively reduce the temperature of electronic components. The coolant inlet 303 and coolant outlet 304 are located outside the mounting cavity, simplifying the installation of the liquid cooling plate and the connection of the coolant circulation system, reducing the complexity and time cost of the installation process.

[0057] Optionally, the first chip and the second chip are at least one of a driving control chip, a vehicle cockpit control chip, a T-BOX communication chip, and a vehicle control chip.

[0058] For example, the vehicle controllers in this disclosure include, but are not limited to, cockpit domain controllers, cockpit domain controllers, T-BOX communication controllers, and vehicle domain controllers.

[0059] The vehicle of this disclosure includes the vehicle controller 100 in any of the above embodiments.

[0060] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0061] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0062] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0063] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0064] In this utility model, the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of this utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0065] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A vehicle-mounted controller, characterized in that, include: A housing having a mounting cavity; A heat sink is disposed within the housing and divides the mounting cavity into a first chamber and a second chamber. The heat sink has a first heat dissipation surface located in the first chamber and a second heat dissipation surface located in the second chamber. A first circuit board and a second circuit board are disposed in the first cavity. The first circuit board is provided with at least one first chip and is thermally connected to the first heat dissipation surface. The second circuit board is disposed in the second cavity and is provided with at least one second chip and is thermally connected to the second heat dissipation surface.

2. The vehicle controller according to claim 1, characterized in that, The vehicle controller further includes a first heat-conducting sheet, the first heat-conducting sheet having a first heat-conducting surface and a second heat-conducting surface disposed opposite to each other, the first heat-conducting surface being directly or indirectly attached to the first heat dissipation surface, and the second heat-conducting surface being directly or indirectly attached to the first chip; and / or The vehicle controller further includes a second heat-conducting sheet, which has a third heat-conducting surface and a fourth heat-conducting surface arranged opposite to each other. The third heat-conducting surface is directly or indirectly attached to the second heat dissipation surface, and the fourth heat-conducting surface is directly or indirectly attached to the second chip.

3. The vehicle controller according to claim 2, characterized in that, A first graphene layer for heat conduction is provided between the second thermally conductive surface and the first chip; and / or a second graphene layer for heat conduction is provided between the fourth thermally conductive surface and the second chip.

4. The vehicle controller according to claim 3, characterized in that, The first graphene layer is bonded to the second thermally conductive surface; and / or the second graphene layer is bonded to the fourth thermally conductive surface.

5. The vehicle controller according to claim 4, characterized in that, The second thermally conductive surface is provided with a first insulating element surrounding the first graphene layer, the height of the first insulating element being higher than that of the first graphene layer; and / or The fourth thermally conductive surface is provided with a second insulating element surrounding the second graphene layer, and the height of the second insulating element is higher than that of the second graphene layer.

6. The vehicle controller according to claim 5, characterized in that, The first insulating element, the second thermally conductive surface, and the first graphene layer define a first clearance groove for avoiding electrical components on the first circuit board; and / or the second insulating element, the fourth thermally conductive surface, and the second graphene layer define a second clearance groove for avoiding electrical components on the second circuit board.

7. The vehicle controller according to claim 1, characterized in that, The first circuit board is provided with a first heat-generating device other than the first chip, and the first heat-generating device and the first heat dissipation surface are connected by a first thermal conductive element; and / or The second circuit board is provided with a second heat-generating device other than the second chip, and the second heat-generating device and the second heat dissipation surface are connected by a second heat-conducting component.

8. The vehicle controller according to claim 1, characterized in that, The housing includes an upper cover plate, a middle frame, and a lower cover plate. At least a portion of the heat sink is disposed within the space of the middle frame. The upper cover plate is detachably disposed on the top surface of the middle frame, and the lower cover plate is detachably disposed on the bottom surface of the middle frame.

9. The vehicle controller according to claim 8, characterized in that, A first sealing gasket is provided between the top surface of the middle frame and the upper cover plate, and a second sealing gasket is provided between the bottom surface of the middle frame and the lower cover plate.

10. The vehicle controller according to claim 8, characterized in that, The first circuit board has a first connector, and the housing has a first interface for the first connector to pass through. A first seal is provided between the first connector and the first interface; and / or The second circuit board has a second connector, and the housing has a second interface for the second connector to pass through. A second seal is provided between the second connector and the second interface.

11. The vehicle controller according to claim 8, characterized in that, The middle frame is provided with a fixing part for connecting to the vehicle.

12. The vehicle controller according to claim 1, characterized in that, The heat dissipation component is a liquid cooling plate, which has a coolant flow channel and a coolant inlet and a coolant outlet communicating with the coolant flow channel. Both the coolant inlet and the coolant outlet are located outside the mounting cavity.

13. The vehicle controller according to claim 1, characterized in that, The first chip and the second chip are at least one of a driving control chip, a vehicle cockpit control chip, a T-BOX communication chip, and a vehicle control chip.

14. A vehicle, characterized in that, The vehicle controller includes any one of claims 1-13.

Images