Cooling system and data center

Abstract

The application provides a cooling system and a data center. The cooling system comprises a heat exchange device, a cold source device and an adsorption refrigeration device. The heat exchange device comprises a first heat exchange cavity and a second heat exchange cavity. The first outlet of the cold source device is communicated with the inlet of the second heat exchange cavity. The adsorber comprises an adsorption cavity, a first heat exchanger and a second heat exchanger. The condenser comprises a condensation cavity and a third heat exchanger. The evaporator comprises an evaporation cavity and a fourth heat exchanger. The inlet of the condensation cavity is communicated with the outlet of the adsorption cavity. The outlet of the condensation cavity is communicated with the inlet of the evaporation cavity. The outlet of the evaporation cavity is communicated with the inlet of the adsorption cavity. The inlet of the first heat exchanger is communicated with the outlet of the second heat exchange cavity. The inlet of the third heat exchanger is communicated with the third outlet of the cold source device. The inlet of the fourth heat exchanger is communicated with the fourth outlet of the cold source device. The outlet of the fourth heat exchanger is communicated with the inlet of the second heat exchange cavity. The cooling system can improve the heat dissipation effect of the heat exchange device on the liquid cooling device.

Description

Technical Field

[0001] This application relates to the field of data center cooling technology, and more particularly to a cooling system and a data center. Background Technology

[0002] Data centers typically include electronic equipment such as communication devices, storage devices, and power supply equipment. These electronic devices generate a significant amount of heat during operation. As the performance of electronic devices continues to improve, their heat density is increasing, placing ever higher demands on heat dissipation. To improve the heat dissipation efficiency of electronic devices, liquid-cooled servers, liquid-cooled cabinets, and other liquid cooling equipment have emerged.

[0003] In related technologies, liquid cooling equipment employs adsorption refrigeration systems to dissipate heat from internal heat-generating components. In adsorption refrigeration systems, the evaporator performs the cooling, and the heat exchange medium in the cold source equipment exchanges heat with the heat-generating components after passing through the evaporator. However, further improvements in heat exchange efficiency are a direction that requires further development. Utility Model Content

[0004] This application provides a coolant treatment system and a data center to improve the heat dissipation effect of heat exchange equipment on liquid cooling equipment.

[0005] To achieve the above objectives, the embodiments of this application adopt the following technical solutions:

[0006] In a first aspect, embodiments of this application provide a cooling system, comprising: a heat exchange device, the heat exchange device including an independent first heat exchange chamber and a second heat exchange chamber, the inlet of the first heat exchange chamber being used to input a heat exchange medium, and the outlet of the first heat exchange chamber being used to output the cooled heat exchange medium; a cold source device, the first outlet of the cold source device being connected to the inlet of the second heat exchange chamber; and an adsorption refrigeration device, the adsorption refrigeration device including an adsorber, a condenser, and an evaporator, the adsorber including an adsorption chamber and a first heat exchanger and a second heat exchanger disposed within the adsorption chamber, the condenser including a condensation chamber and a third heat exchanger disposed within the condensation chamber, and the evaporator including an evaporation chamber and a fourth heat exchanger disposed within the evaporation chamber. The heat exchangers are configured such that: the inlet of the condensing chamber is connected to the outlet of the adsorption chamber; the outlet of the condensing chamber is connected to the inlet of the evaporating chamber; and the outlet of the evaporating chamber is connected to the inlet of the adsorption chamber. The inlet of the first heat exchanger is connected to the outlet of the second heat exchanger, and the outlet of the first heat exchanger is connected to the first inlet of the cold source equipment. The inlet of the second heat exchanger is connected to the second outlet of the cold source equipment, and the outlet of the second heat exchanger is connected to the second inlet of the cold source equipment. The inlet of the third heat exchanger is connected to the third outlet of the cold source equipment, and the outlet of the third heat exchanger is connected to the third inlet of the cold source equipment. The inlet of the fourth heat exchanger is connected to the fourth outlet of the cold source equipment, and the outlet of the fourth heat exchanger is connected to the inlet of the second heat exchanger.

[0007] As an optional implementation, the adsorption refrigeration device includes two sets of adsorbers, namely a first adsorber and a second adsorber, and the cooling system has a first state and a second state. When the cooling system is in the first state, the inlet of the first heat exchanger in the first adsorber is connected to the outlet of the second heat exchange chamber, and the outlet of the first heat exchanger is connected to the first inlet of the cold source device; the inlet of the second heat exchanger in the second adsorber is connected to the second outlet of the cold source device, and the outlet of the second heat exchanger is connected to the second inlet of the cold source device; the inlet of the condensing chamber is connected to the inlet of the adsorption chamber of the first adsorber. When the cooling system is in the second state, the inlet of the first heat exchanger in the second adsorber is connected to the outlet of the second heat exchange chamber, and the outlet of the first heat exchanger is connected to the first inlet of the cold source device; the inlet of the second heat exchanger in the first adsorber is connected to the second outlet of the cold source device, and the outlet of the second heat exchanger is connected to the second inlet of the cold source device; the inlet of the condensing chamber is connected to the inlet of the adsorption chamber of the second adsorber.

[0008] As an optional implementation, the temperature of the cooled heat exchange medium output from the first, second, third, and fourth outlets of the cold source equipment is the same.

[0009] The cooling system provided in this application embodiment has a conduit at the inlet of the second heat exchange chamber of the heat exchange equipment, and the first outlet of the cold source equipment and the outlet of the fourth heat exchanger are both connected to the inlet of the conduit.

[0010] As an optional implementation, the cooling system includes a coolant distribution device, which includes a heat exchange device, an expansion tank, and a circulation pump, with the expansion tank connected between the heat exchange device and the circulation pump.

[0011] As an alternative implementation, the coolant distribution device includes a housing with an installation space, in which a heat exchanger, an expansion tank, a circulating pump, and an adsorption refrigeration device are assembled.

[0012] As an alternative implementation, the adsorption cooling device is located at the top of the installation space in the height direction of the housing.

[0013] As an alternative implementation, the evaporator, adsorber, and condenser are spaced apart in the installation space along the height direction of the casing.

[0014] As an alternative implementation, in the height direction of the casing, the condenser and evaporator are located at the top of the installation space, and the adsorber is spaced apart from the condenser and evaporator.

[0015] Secondly, this application provides a data center, which includes: a liquid cooling device, the liquid cooling device including a heat dissipation channel; in any of the above embodiments, the cooling system has the inlet of the first heat exchange chamber connected to the outlet of the heat dissipation channel, and the outlet of the first heat exchange chamber connected to the inlet of the heat dissipation channel.

[0016] The cooling system of this application embodiment, by adding a second heat exchange medium that is directly discharged from the first outlet of the cold source device to the second heat exchange chamber, increases the flow rate of the second heat exchange medium on the one hand, and achieves preheating of the second heat exchange chamber on the other hand, thereby improving the heat exchange efficiency between the second heat exchange medium and the first heat exchange medium, and obtaining more heat for the adsorption refrigeration device, effectively improving the preheating recovery efficiency. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 A block diagram illustrating the cooling principle of a data center provided in this application embodiment;

[0019] Figure 2 Structural arrangement of the refrigeration system provided in the embodiments of this application Figure 1 ;

[0020] Figure 3 Structural arrangement of the refrigeration system provided in the embodiments of this application Figure 2 ;

[0021] Figure 4 Structural arrangement of the refrigeration system provided in the embodiments of this application Figure 3 .

[0022] Explanation of reference numerals in the attached figures:

[0023] 10. Heat exchange equipment; 110. First heat exchange chamber; 120. Second heat exchange chamber; 20. Liquid cooling equipment; 210. Heat dissipation channel; 310. First adsorber; 320. Second adsorber; 330. Adsorption chamber; 340. First heat exchanger; 350. Second heat exchanger; 40. Condenser; 410. Condensation chamber; 420. Third heat exchanger; 50. Evaporator; 510. Evaporation chamber; 520. Fourth heat exchanger; 60. Cold source equipment; 70. Expansion tank; 72. Circulation pump; 74. Make-up tank; 76. Make-up pump; 77. Conduit; 80. Shell; 82. Installation space; 90. Coolant distribution device. Detailed Implementation

[0024] In related technologies, after the coolant in the liquid cooling equipment absorbs the heat generated by the heat-generating components in the liquid cooling equipment, it usually releases the heat into the environment outside the data center, resulting in a lack of effective utilization of the waste heat of the data center.

[0025] To overcome the shortcomings of the prior art, this application provides a cooling system. By adding a second heat exchange medium that is directly discharged from the first outlet of the cold source device to the second heat exchange chamber, the flow rate of the second heat exchange medium is increased on the one hand, and the second heat exchange chamber is cooled down in advance on the other hand, thereby improving the heat exchange efficiency between the second heat exchange medium and the first heat exchange medium, and obtaining more heat for the adsorption refrigeration device, effectively improving the preheating recovery efficiency.

[0026] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0027] See Figure 1 This application provides a data center, which may include a server room and at least one liquid cooling device 20 disposed within the server room. For example, the server room may be a closed room or a room open on one or more sides. The server room may be a temporary room (such as a tent, prefabricated house, etc.) or a permanent room.

[0028] The liquid cooling device 20 may also include a heat-generating element that generates heat when powered on. The heat generated by the heat-generating element of the liquid cooling device 20 can be cooled by the cooling system to maintain the operating temperature of the heat-generating element within the design range, ensuring the stability of the heat-generating element during operation. For example, any liquid cooling device 20 may include, but is not limited to, a liquid-cooled server, a liquid-cooled cabinet, etc. The liquid-cooled server may be a blade server, a rack server, etc.

[0029] In some embodiments, the data center may further include a cooling system for cooling heat-generating devices. The cooling system may include a heat exchanger 10, a cold source device 60, and an adsorption refrigeration device.

[0030] The heat exchange device 10 may include independent first heat exchange chamber 110 and second heat exchange chamber 120. The inlet of the first heat exchange chamber 110 is used to input the heat exchange medium, and the outlet of the first heat exchange chamber 110 is used to output the cooled heat exchange medium. The first outlet of the cold source device 60 is connected to the inlet of the second heat exchange chamber 120. The adsorption refrigeration device may include an adsorber, a condenser 40, and an evaporator 50. The adsorber includes an adsorption chamber 330 and a first heat exchanger 340 and a second heat exchanger 350 disposed within the adsorption chamber 330. The condenser 40 includes a condensation chamber 410 and a third heat exchanger 420 disposed within the condensation chamber 410. The evaporator 50 includes an evaporation chamber 510 and a fourth heat exchanger 520 disposed within the evaporation chamber 510. The inlet of the condensation chamber 410 is connected to the outlet of the adsorption chamber 330, the outlet of the condensation chamber 410 is connected to the inlet of the evaporation chamber 510, and the outlet of the evaporation chamber 510 is connected to the inlet of the adsorption chamber 330. The inlet of the first heat exchanger 340 is connected to the outlet of the second heat exchange chamber 120, and the outlet of the first heat exchanger 340 is connected to the first inlet of the cold source device 60. The inlet of the second heat exchanger 350 is connected to the second outlet of the cold source device 60, and the outlet of the second heat exchanger 350 is connected to the second inlet of the cold source device 60. The inlet of the third heat exchanger 420 is connected to the third outlet of the cold source device 60, and the outlet of the third heat exchanger 420 is connected to the third inlet of the cold source device 60. The inlet of the fourth heat exchanger 520 is connected to the fourth outlet of the cold source device 60, and the outlet of the fourth heat exchanger 520 is connected to the inlet of the second heat exchange chamber 120.

[0031] In this embodiment, the heat exchange device 10 has independent first heat exchange chamber 110 and second heat exchange chamber 120. The first heat exchange chamber 110 can be circulated with a first heat exchange medium to exchange heat with the heating element of the liquid cooling device 20, and the second heat exchange chamber 120 can be circulated with a second heat exchange medium. Within the heat exchange device 10, the first heat exchange medium and the second heat exchange medium exchange heat, thereby transferring heat from the heating element to the second heat exchange medium.

[0032] Specifically, the liquid cooling device 20 has a heat dissipation channel 210. The inlet of the first heat exchange chamber 110 is connected to the outlet of the heat dissipation channel 210, and the outlet of the first heat exchange chamber 110 is connected to the inlet of the heat dissipation channel 210. In this way, the first heat exchange medium can flow into the interior of the liquid cooling device 20 from the inlet of the heat dissipation channel 210 to exchange heat with the heat-generating device. After heat exchange, the first heat exchange medium flows into the first heat exchange chamber 110 from the outlet of the heat dissipation channel 210 to exchange heat with the second heat exchange medium in the second heat exchange chamber 120.

[0033] In this embodiment, the adsorber has an adsorption chamber 330, and an adsorbent is provided in the adsorption chamber 330. The adsorbent may include one or more of the following substances: activated carbon, silica gel, metal-organic framework, activated alumina, etc.

[0034] A first heat exchanger 340 is disposed within the adsorption chamber 330. The inlet of the first heat exchanger 340 is connected to the outlet of the second heat exchange chamber 120, and the outlet of the first heat exchanger 340 is connected to the first inlet of the cold source device 60. This allows the high-temperature second heat exchange medium in the second heat exchange chamber 120 to enter the adsorption chamber 330 and heat it. In other words, the first heat exchanger 340 can provide heat to the adsorbate in the adsorption chamber 330, causing the adsorbate to desorb from the adsorbent within the chamber. The outlet of the first heat exchanger 340 is connected to the first inlet of the cold source device 60, allowing the second heat exchange medium, after absorbing heat in the adsorption chamber 330, to return to the cold source device 60 for recooling.

[0035] The second heat exchanger 350 is disposed within the adsorption chamber 330. The inlet of the second heat exchanger 350 is connected to the second outlet of the cold source device 60, and the outlet of the second heat exchanger 350 is connected to the second inlet of the cold source device 60. This allows the low-temperature second heat exchange medium within the cold source device 60 to enter the adsorption chamber 330 and cool it. In other words, the second heat exchanger 350 can provide cooling to the adsorbate within the adsorption chamber 330, enabling the adsorbate to be adsorbed onto the adsorbent within the chamber. The outlet of the second heat exchanger 350 is connected to the second inlet of the cold source device 60, allowing the second heat exchange medium, after absorbing heat in the adsorption chamber 330, to return to the cold source device 60 and be cooled again.

[0036] In other words, in this embodiment, a first heat exchanger 340 and a second heat exchanger 350 are provided in the adsorption chamber 330. The first heat exchanger 340 and the second heat exchanger 350 can respectively serve as heating components and cooling components to provide heat or cold to the adsorption chamber 330, so that the adsorbate in the adsorption chamber 330 is desorbed by heat or adsorbed by cold.

[0037] The condenser 40 has a condensation chamber 410. The inlet of the condensation chamber 410 is connected to the outlet of the adsorption chamber 330, which is used to allow the adsorbate to flow into the condensation chamber 410 so that the adsorbate releases heat and condenses in the condensation chamber 410. The outlet of the condenser 40 is used to allow the adsorbate that has been condensed in the condensation chamber 410 to flow out of the condensation chamber 410.

[0038] A third heat exchanger 420 is installed inside the condensing chamber 410. The inlet of the third heat exchanger 420 is connected to the third outlet of the cold source device 60. This allows the low-temperature second heat exchange medium from the cold source device 60 to be input into the condensing chamber 410 for cooling. Specifically, the third heat exchanger 420 can provide cooling to the adsorbate within the condensing chamber 410, causing it to condense into a liquid state. The outlet of the third heat exchanger 420 is connected to the third inlet of the cold source device 60, allowing the second heat exchange medium, after absorbing heat in the condensing chamber 410, to return to the cold source device 60 and be cooled again.

[0039] The evaporator 50 has an evaporation chamber 510. The inlet of the evaporator 50 is connected to the outlet of the condensation chamber 410, allowing the condensed adsorbate to flow into the evaporation chamber 510 so that the adsorbate can absorb heat and evaporate within the evaporation chamber 510. The outlet of the evaporator 50 is connected to the inlet of the adsorption chamber 330, allowing the adsorbate that has evaporated within the evaporation chamber 510 to flow out of the evaporation chamber 510 and into the adsorption chamber 330.

[0040] A fourth heat exchanger 520 is installed inside the evaporation chamber 510. The inlet of the fourth heat exchanger 520 is connected to the fourth outlet of the cold source device 60, and the outlet of the fourth heat exchanger 520 is connected to the inlet of the second heat exchange chamber 120. Because the adsorbate absorbs heat and evaporates inside the evaporation chamber 510, the second heat exchange medium from the cold source device 60 can be cooled, forming a low-temperature second heat exchange medium. This low-temperature second heat exchange medium, in the endosperm of the second heat exchange chamber 120, reabsorbs heat from the first heat exchange medium in the first heat exchange chamber 110, thereby cooling the heating element.

[0041] In this embodiment, the low-temperature second heat exchange medium entering the second heat exchange chamber 120 has two paths: one is the second heat exchange medium discharged from the cold source device 60 and passing through the evaporator 50, and the other is the second heat exchange medium discharged from the first outlet of the cold source device 60 into the second heat exchange chamber 120. Typically, the temperature of the first heat exchange medium in the first heat exchange chamber 110 is higher than the temperatures of these two paths of the second heat exchange medium. This embodiment adds the second heat exchange medium that is directly discharged from the first outlet of the cold source device 60 into the second heat exchange chamber 120. This increases the flow rate of the second heat exchange medium and allows for pre-cooling of the second heat exchange chamber 120, improving the heat exchange efficiency between the second and first heat exchange media, and enabling the adsorption refrigeration equipment to obtain more heat, effectively improving the preheating recovery efficiency.

[0042] Furthermore, in this embodiment, the inlet of the first heat exchanger 340 is connected to the outlet of the second heat exchange chamber 120, and the outlet of the first heat exchanger 340 is connected to the first inlet of the cold source device 60. Thus, the second heat exchange medium discharged from the second heat exchange chamber 120 exchanges heat with the first heat exchanger 340 and is then discharged into the cold source device 60 for further cooling, resulting in a lower temperature for the second heat exchange medium within the system. Compared to related technologies where the second heat exchange medium in the first heat exchanger 340 is returned to the heat exchange device 10, the method of drawing the second heat exchange medium from the cold source device 60 in this embodiment is more conducive to improving the heat exchange efficiency between the second and first heat exchange media.

[0043] In some embodiments, the adsorption refrigeration device may further include multiple adsors, and the cooling system has a first state and a second state.

[0044] When the cooling system is in the first state, the inlet of the first heat exchanger 340 in the first adsorber 310 is connected to the outlet of the second heat exchange chamber 120, and the outlet of the first heat exchanger 340 is connected to the first inlet of the cold source device 60; the inlet of the second heat exchanger 350 in the second adsorber 320 is connected to the second outlet of the cold source device 60, and the outlet of the second heat exchanger 350 is connected to the second inlet of the cold source device 60. The inlet of the condensation chamber 410 is connected to the inlet of the adsorption chamber 330 of the first adsorber 310.

[0045] When the cooling system is in the second state, the inlet of the first heat exchanger 340 in the second adsorber 320 is connected to the outlet of the second heat exchange chamber 120, and the outlet of the first heat exchanger 340 is connected to the first inlet of the cold source device 60. The inlet of the second heat exchanger 350 in the first adsorber 310 is connected to the second outlet of the cold source device 60, and the outlet of the second heat exchanger 350 is connected to the second inlet of the cold source device 60. The inlet of the condensation chamber 410 is connected to the inlet of the adsorption chamber 330 of the second adsorber 320.

[0046] In some optional embodiments, the first adsorber 310 is configured as one or more, such as one, two, three, or more. The second adsorber 320 is configured as one or more, such as two, three, or more. The following description uses one first adsorber 310 and one second adsorber 320 as an example.

[0047] When the coolant treatment system is in the first state, the inlet of the first heat exchanger 340 of the first adsorber 310 is connected to the outlet of the second heat exchange chamber 120, and the outlet of the first heat exchanger 340 is connected to the first inlet of the cold source device 60. This allows the second heat exchange medium flowing out of the second heat exchange chamber 120 to flow into the first heat exchanger 340 to heat the adsorbate in the adsorption chamber 330 of the first adsorber 310, causing the adsorbate in the adsorption chamber 330 of the first adsorber 310 to desorb upon heating. At this time, since the inlet of the condenser chamber 410 is connected to the inlet of the adsorption chamber 330 of the first adsorber 310, the desorbed adsorbent enters the condenser 40 to condense and flows back to the evaporator 50.

[0048] When the coolant treatment system is in the first state, the inlet of the second heat exchanger 350 in the second adsorber 320 is connected to the second outlet of the cold source device 60, and the outlet of the second heat exchanger 350 is connected to the second inlet of the cold source device 60. This allows the second heat exchange medium flowing out of the cold source device 60 to flow into the second heat exchanger 350 to cool the adsorbate in the adsorption chamber 330 of the first adsorber 310. The adsorbate in the adsorption chamber 330 of the second adsorber 320 is cooled and adsorbed so that it can be desorbed next time.

[0049] In other words, when the cooling system is in the first state, the first adsorber 310 acts as a desorption bed for desorption, and the second adsorber 320 acts as an adsorption bed for adsorption. After desorption and adsorption have occurred for a period of time, the functions of the first adsorber 310 and the second adsorber 320 are switched, that is, from the first state to the second state.

[0050] When the coolant treatment system is in the second state, the inlet of the first heat exchanger 340 of the second adsorber 320 is connected to the outlet of the second heat exchange chamber 120, and the outlet of the first heat exchanger 340 is connected to the first inlet of the cold source device 60. This allows the second heat exchange medium flowing out of the second heat exchange chamber 120 to flow into the first heat exchanger 340 to heat the adsorbate in the adsorption chamber 330 of the first adsorber 310, causing the adsorbate in the adsorption chamber 330 of the first adsorber 310 to desorb upon heating. At this time, since the inlet of the condenser chamber 410 is connected to the inlet of the adsorption chamber 330 of the second adsorber 320, the desorbed adsorbent enters the condenser 40 to condense and flows back to the evaporator 50.

[0051] When the coolant treatment system is in the second state, the inlet of the second heat exchanger 350 in the first adsorber 310 is connected to the second outlet of the cold source device 60, and the outlet of the second heat exchanger 350 is connected to the second inlet of the cold source device 60. This allows the second heat exchange medium flowing out of the cold source device 60 to flow into the second heat exchanger 350 to cool the adsorbate in the adsorption chamber 330 of the second adsorber 320. The adsorbate in the adsorption chamber 330 of the second adsorber 320 is cooled and adsorbed so that it can be desorbed next time.

[0052] In other words, when the cooling system is in the second state, the second adsorber 320 acts as a desorption bed for desorption, and the first adsorber 310 acts as an adsorption bed for adsorption.

[0053] In this embodiment, by alternately supplying high-temperature and low-temperature media to the first adsorber 310 and the second adsorber 320, the adsorbate in the adsorption chamber 330 is alternately heated and cooled, so that the adsorbate in the adsorption chamber 330 can be alternately desorbed and adsorbed. The desorbed adsorbate can flow from the adsorption chamber 330 into the condensing chamber 410. The adsorbate flowing from the adsorption chamber 330 into the condensing chamber 410 is condensed into a liquid state by the condenser 40 in the condensing chamber 410 and can then enter the evaporation chamber 510. The evaporator 50 can evaporate the liquid adsorbate in the evaporation chamber 510, thereby achieving continuous cooling.

[0054] In some embodiments, the temperature of the cooled heat exchange medium output from the first outlet, second outlet, third outlet and fourth outlet of the cold source device 60 is the same.

[0055] In this embodiment, the coolant flowing out of the first outlet, second outlet, third outlet and fourth outlet of the cold source device 60 has the same temperature.

[0056] Since the fourth heat exchanger 520 is located in the evaporation chamber 510, the inlet of the fourth heat exchanger 520 is connected to the fourth outlet of the cold source device 60, and the outlet of the fourth heat exchanger 520 is connected to the inlet of the second heat exchange chamber 120. The adsorbent in the evaporation chamber 510 absorbs heat and evaporates. In other words, the temperature of the second heat exchange medium flowing out of the fourth outlet of the cold source device 60 is lower than that of the other outlets after passing through the fourth heat exchanger 520. Thus, when it is connected to the second heat exchange chamber 120 of the heat exchange device 10, the temperature of the second heat exchange medium can be further reduced.

[0057] In some embodiments, the inlet of the second heat exchange chamber 120 of the heat exchange device 10 is provided with a conduit 77, and the first outlet of the cold source device 60 and the outlet of the fourth heat exchanger 520 are both connected to the inlet of the conduit 77.

[0058] In other words, the second heat exchange medium flowing out from the first outlet of the cold source device 60 and the outlet of the fourth heat exchanger 520 is premixed in the conduit 77 before being passed together into the second heat exchange chamber 120 of the heat exchange device 10 to improve the heat absorption effect.

[0059] In some embodiments, the cooling system includes a coolant distribution device 90, which includes a heat exchange device 10, an expansion tank 70, and a circulation pump 72. The expansion tank 70 is connected between the heat exchange device 10 and the circulation pump 72.

[0060] In this embodiment, after the first heat exchange medium in the first heat exchange chamber 110 exchanges heat with the second heat exchange medium in the second heat exchange chamber 120, the first heat exchange medium returns to the cold source device 60 through the power provided by the circulation pump 72, continues to exchange heat with the heating device in the cold source device 60, removes the heat load on it, and then re-enters the heat exchange device 10 to complete a complete fluid cycle.

[0061] The expansion tank 70 stores the first heat exchange medium. The expansion tank is an important component of the heating, ventilation and air conditioning system. It accommodates the expansion of the system water in the heating system, and also plays a role in pressure stabilization and water replenishment to the system.

[0062] In some optional embodiments, the liquid cooling device 20 has a heat dissipation channel 210. The inlet of the first heat exchange chamber 110 is connected to the outlet of the heat dissipation channel 210, and the outlet of the first heat exchange chamber 110 is connected to the inlet of the circulation pump 72. The outlet of the circulation pump 72 is connected to the inlet of the heat dissipation channel 210. In this way, the first heat exchange medium can flow into the interior of the liquid cooling device 20 from the inlet of the heat dissipation channel 210 to exchange heat with the heat-generating device. After heat exchange, the first heat exchange medium flows into the first heat exchange chamber 110 from the outlet of the heat dissipation channel 210 to exchange heat with the second heat exchange medium in the second heat exchange chamber 120. After exchanging heat with the second heat exchange medium, it flows to the circulation pump 72 and, under the lifting force of the circulation pump 72, returns to the heat dissipation channel 210 to carry away the heat from the heat-generating device.

[0063] In some alternative embodiments, the circulating pump 72 may also be provided in two sets, one for use and one for backup, to improve the reliability of the system.

[0064] In some embodiments, the cooling system may further include a replenishment tank 74 and a replenishment pump 76, with the outlet of the replenishment tank 74 connected to the inlet of the replenishment pump 76 and the outlet of the replenishment pump 76 connected to the outlet of the expansion tank 70, for replenishing the system with a second heat exchange medium through the second heat exchange medium in the replenishment tank 74.

[0065] See Figure 1 In some embodiments, the coolant distribution device 90 may also include a housing 80, which forms an installation space 82. The heat exchange device 10, expansion tank 70, circulation pump 72 and adsorption refrigeration device are assembled in the installation space 82, thereby reducing the deployment cost of different devices in the computer room 10 and simplifying the piping system.

[0066] See Figure 2 In some alternative embodiments, the adsorption refrigeration device is located at the top of the installation space 82 in the height direction of the housing 80. That is, the evaporator 50, the adsorber, and the condenser 40 are located at the top of the installation space 82.

[0067] See Figure 3 In some alternative embodiments, the evaporator 50, the adsorber, and the condenser 40 are spaced apart in the height direction of the housing 80 within the installation space 80.

[0068] See Figure 4 In some alternative embodiments, the condenser 40 and the evaporator 50 are located at the top of the installation space in the height direction of the housing 80, and the adsorber is spaced apart from the condenser 40 and the evaporator 50.

[0069] It should be noted that the terms "one embodiment," "embodiment," "exemplary embodiment," "some embodiments," etc., mentioned in the specification indicate that the described embodiment may include a specific feature, structure, or characteristic, but not every embodiment necessarily includes that specific feature, structure, or characteristic. Furthermore, such phrases do not necessarily refer to the same embodiment. Moreover, when a specific feature, structure, or characteristic is described in connection with an embodiment, implementing such a feature, structure, or characteristic in conjunction with other embodiments, whether explicitly described or not, is within the knowledge scope of those skilled in the art.

[0070] Generally speaking, terms should be understood at least in part by their use in context. For example, at least in part by context, the term "one or more" as used in the text can be used to describe any feature, structure, or characteristic of the singular meaning, or a combination of features, structures, or characteristics of the plural meaning. Similarly, at least in part by context, terms such as "a" or "the" can also be understood to convey either singular or plural usage.

[0071] It should be readily understood that the terms “on,” “above,” and “on top of” in this application should be interpreted in the broadest possible sense, such that “on” means not only “directly on something” but also “on something” with an intermediate feature or layer therebetween, and that “above” or “on top of” means not only “on something” but also “on something” without an intermediate feature or layer therebetween (i.e., directly on something).

[0072] Furthermore, for ease of explanation, spatially relative terms such as "below," "below," "under," "above," and "above" may be used to describe the relationship of one element or feature relative to other elements or features as shown in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation other than those shown in the figures. The device may have other orientations (rotated 90° or in other orientations), and the spatially relative descriptive terms used herein may be interpreted accordingly.

[0073] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A cooling system, characterized in that, include; A heat exchange device, comprising an independent first heat exchange chamber and a second heat exchange chamber, wherein the inlet of the first heat exchange chamber is used to input the heat exchange medium and the outlet of the first heat exchange chamber is used to output the cooled heat exchange medium. A cold source device, wherein the first outlet of the cold source device is connected to the inlet of the second heat exchange chamber; An adsorption refrigeration device, comprising an adsorber, a condenser, and an evaporator, wherein the adsorber includes an adsorption chamber and a first heat exchanger and a second heat exchanger disposed within the adsorption chamber, the condenser includes a condensation chamber and a third heat exchanger disposed within the condensation chamber, and the evaporator includes an evaporation chamber and a fourth heat exchanger disposed within the evaporation chamber. The inlet of the condensation chamber is connected to the outlet of the adsorption chamber, the outlet of the condensation chamber is connected to the inlet of the evaporation chamber, and the outlet of the evaporation chamber is connected to the inlet of the adsorption chamber. The inlet of the first heat exchanger is connected to the outlet of the second heat exchange chamber, and the outlet of the first heat exchanger is connected to the first inlet of the cold source equipment; The inlet of the second heat exchanger is connected to the second outlet of the cold source equipment, and the outlet of the second heat exchanger is connected to the second inlet of the cold source equipment; The inlet of the third heat exchanger is connected to the third outlet of the cold source equipment, and the outlet of the third heat exchanger is connected to the third inlet of the cold source equipment; The inlet of the fourth heat exchanger is connected to the fourth outlet of the cold source equipment, and the outlet of the fourth heat exchanger is connected to the inlet of the second heat exchange chamber.

2. The cooling system according to claim 1, characterized in that, The adsorption refrigeration equipment includes two sets of adsors, namely a first adsorber and a second adsorber, and the cooling system has a first state and a second state. When the cooling system is in the first state, the inlet of the first heat exchanger in the first adsorber is connected to the outlet of the second heat exchange chamber, and the outlet of the first heat exchanger is connected to the first inlet of the cold source device; the inlet of the second heat exchanger in the second adsorber is connected to the second outlet of the cold source device, and the outlet of the second heat exchanger is connected to the second inlet of the cold source device; the inlet of the condensation chamber is connected to the inlet of the adsorption chamber of the first adsorber. When the cooling system is in the second state, the inlet of the first heat exchanger in the second adsorber is connected to the outlet of the second heat exchange chamber, and the outlet of the first heat exchanger is connected to the first inlet of the cold source device; the inlet of the second heat exchanger in the first adsorber is connected to the second outlet of the cold source device, and the outlet of the second heat exchanger is connected to the second inlet of the cold source device; the inlet of the condensation chamber is connected to the inlet of the adsorption chamber of the second adsorber.

3. The cooling system according to claim 1, characterized in that, The first outlet, second outlet, third outlet and fourth outlet of the cold source equipment output the cooled heat exchange medium at the same temperature.

4. The cooling system according to claim 1, characterized in that, The inlet of the second heat exchange chamber of the heat exchange equipment is provided with a conduit, and the first outlet of the cold source equipment and the outlet of the fourth heat exchanger are both connected to the inlet of the conduit.

5. The cooling system according to claim 1, characterized in that, The cooling system includes a coolant distribution device, which includes the heat exchange equipment, an expansion tank, and a circulation pump. The expansion tank is connected between the heat exchange equipment and the circulation pump.

6. The cooling system according to claim 5, characterized in that, The coolant distribution device includes a housing, which forms an installation space, and the heat exchange equipment, the expansion tank, the circulating pump, and the adsorption refrigeration equipment are assembled in the installation space.

7. The cooling system according to claim 6, characterized in that, The adsorption refrigeration device is located at the top of the installation space in the height direction of the housing.

8. The cooling system according to claim 6, characterized in that, The evaporator, the adsorber, and the condenser are spaced apart within the installation space along the height direction of the housing.

9. The cooling system according to claim 6, characterized in that, In the height direction of the housing, the condenser and the evaporator are located at the top of the installation space, and the adsorber is spaced apart from the condenser and the evaporator.

10. A data center, characterized in that, include: Liquid cooling equipment, the liquid cooling equipment including heat dissipation channels; The cooling system according to any one of claims 1 to 9, wherein the inlet of the first heat exchange chamber is connected to the outlet of the heat dissipation channel, and the outlet of the first heat exchange chamber is connected to the inlet of the heat dissipation channel.

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