Display screen and electronic device
By using a shielding structure with conductive and ground layers in the display screen, the problems of increased thickness and reduced light transmittance caused by metal mesh are solved, achieving thinner design and efficient electromagnetic shielding, thus improving display effect and signal stability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- 联想长风科技(北京)有限公司
- Filing Date
- 2025-04-09
- Publication Date
- 2026-06-16
AI Technical Summary
In the prior art, display components achieve electromagnetic shielding by setting a metal mesh on the display glass, which increases the thickness and reduces the light transmittance, thus affecting the display effect.
The shielding structure employs a conductive layer and a grounding layer. The conductive layer is an indium tin oxide thin film with a thickness of 50-200 nanometers, while the grounding layer is a ring-shaped layer that avoids the display area and has a thickness of less than 0.4 millimeters, achieving electromagnetic shielding while maintaining good light transmittance.
It reduces the thickness of the display screen, improves the display effect, and enhances the stability of the display signal transmission of electronic devices.
Smart Images

Figure CN224368295U_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to the field of display technology, and more particularly to a display screen and an electronic device. Background Technology
[0002] Display components on electronic devices are capable of outputting images.
[0003] In related technologies, display components achieve electromagnetic shielding by setting a metal mesh on the display glass. However, this method results in a large thickness of the display component and a low light transmittance of the metal mesh, leading to poor display performance. Utility Model Content
[0004] This disclosure provides a display screen and an electronic device, the technical problem of which is to reduce the thickness of the display screen and improve the display effect.
[0005] In a first aspect, this disclosure provides a display screen, which may include: a display substrate and a shielding structure. The display substrate has a display area that satisfies light transmission conditions along a first direction. The shielding structure may include: a conductive layer and a ground layer. The conductive layer is distributed and stacked with the display substrate along the first direction, and the portion of the conductive layer corresponding to the display area satisfies light transmission conditions. The ground layer is annular to avoid the display area. The ground layer is opposite to and electrically connected to a ring edge of the conductive layer, and can be electrically connected to the grounding area of an electronic device. The conductive layer is an indium tin oxide thin film with a thickness greater than 50 nanometers and less than 200 nanometers, and the thickness of the shielding structure along the first direction is less than 0.4 millimeters.
[0006] In some embodiments, the inner space of the ground layer and the side of the conductive layer facing away from the display substrate cooperate to form a target accommodating space.
[0007] In some embodiments, the grounding layer and the conductive layer are distributed and stacked along the first direction; the shielding structure further includes: a first conductive adhesive, which is annular and respectively connects two annular surfaces of the grounding layer and the conductive layer that are opposite to each other.
[0008] In some embodiments, the peripheral surface of the display substrate extending along the first direction, the peripheral surface of the conductive layer extending along the first direction, the outer surface of the first conductive adhesive extending along the first direction, and the outer surface of the ground layer extending along the first direction are flush with each other.
[0009] In some embodiments, the grounding layer is sleeved on the periphery of the conductive layer extending along the first direction, and the thickness of the grounding layer is greater than the thickness of the conductive layer, so as to cooperate with the conductive layer to form the target accommodating space; the shielding structure further includes: a second conductive adhesive, the second conductive adhesive being disposed in the annular space between the conductive layer and the grounding layer, and being connected to the peripheral surface of the conductive layer and an inner surface of the grounding layer.
[0010] In some embodiments, the indium tin oxide film has a plurality of through holes extending along the first direction.
[0011] In some embodiments, the grounding layer is a ring of copper foil, and the thickness of the grounding layer along the first direction is greater than 0.1 mm and less than 0.3 mm.
[0012] In a second aspect, this disclosure provides an electronic device, which may include: a housing and a display screen as described in any embodiment of the first aspect, the display screen being connected to the housing, and the display area of the display screen on the side opposite to the shielding structure being exposed from the outside of the housing.
[0013] In some embodiments, at least a portion of the housing is made of metal to form a grounding area for the electronic device.
[0014] In some embodiments, the electronic device may further include: a display circuit disposed within a target accommodating space formed by the inner space of the ground layer and the side of the conductive layer facing away from the display substrate.
[0015] Through the above technical solutions, the display screen and electronic device provided in this disclosure can block the influence of electromagnetic interference (such as Wi-Fi, Bluetooth signals, etc.) on the display circuit when there is electromagnetic interference outside the electronic device or electromagnetic radiation generated by the circuit inside the electronic device, thereby improving the stability of the display signal transmission of the electronic device. The thickness of the indium tin oxide film is small enough to be controlled between 50-200 nanometers, so that the thickness of the shielding structure can be controlled within 0.4 mm, thereby reducing the thickness of the display screen. In addition, since the indium tin oxide film has good light transmittance, and the grounding layer avoids the display area, the display loss can be reduced to improve the display effect.
[0016] The above description is only an overview of the technical solution of this disclosure. In order to better understand the technical means of this disclosure and to implement it in accordance with the contents of the specification, the preferred embodiments of this disclosure are described in detail below with reference to the accompanying drawings. Attached Figure Description
[0017] To more clearly illustrate the technical solutions in this disclosure or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0018] Figure 1 A schematic diagram of the structure of a display screen provided in an embodiment of this disclosure. Figure 1 ;
[0019] Figure 2 A schematic diagram of the structure of a display screen provided in an embodiment of this disclosure. Figure 2 ;
[0020] Figure 3 Provided for an embodiment of this disclosure Figure 1 A partially enlarged structural diagram;
[0021] Figure 4 A schematic diagram of the structure of a display screen provided in another embodiment of this disclosure. Figure 1 ;
[0022] Figure 5 A schematic diagram of the structure of a display screen provided in another embodiment of this disclosure. Figure 2 ;
[0023] Figure 6 Provided for another embodiment of this disclosure Figure 4 A partially enlarged structural diagram;
[0024] Figure 7 This is a schematic diagram of the structure of the conductive layer of the display screen provided in this disclosure.
[0025] Explanation of reference numerals in the attached figures:
[0026] 10. Display screen; 11. Display substrate; 12. Shielding structure; 121. Conductive layer; 1211. Through hole; 122. Ground layer; 123. Target accommodating space; 124. First conductive adhesive; 125. Second conductive adhesive. Detailed Implementation
[0027] The embodiments of this disclosure will be further described in detail below with reference to the accompanying drawings and examples. The detailed description of the embodiments and the accompanying drawings are used to illustrate the principles of this disclosure by way of example, but should not be used to limit the scope of this disclosure. This disclosure can be implemented in many different forms and is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.
[0028] These embodiments are provided to make the disclosure thorough and complete, and to fully express the scope of the disclosure to those skilled in the art. It should be noted that, unless otherwise specifically stated, the relative arrangement of components and steps, material composition, numerical expressions, and values set forth in these embodiments should be interpreted as exemplary only and not as limiting.
[0029] It should be noted that, in the description of this disclosure, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," and "outer," etc., indicating orientation or positional relationship, are only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this disclosure. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.
[0030] Furthermore, the terms "first," "second," and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different parts. "Vertical" is not strictly vertical, but within the permissible margin of error. "Parallel" is not strictly parallel, but within the permissible margin of error. Terms such as "including" or "contains" mean that the element preceding the word encompasses the element listed after the word, and do not exclude the possibility of encompassing other elements as well.
[0031] It should also be noted that, in the description of this disclosure, unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this disclosure depending on the specific circumstances. When a particular device is described as being located between a first device and a second device, an intermediary device may or may not be present between the particular device and the first or second device.
[0032] All terms used in this disclosure have the same meaning as understood by one of ordinary skill in the art to which this disclosure pertains, unless otherwise specifically defined. It should also be understood that terms defined in general dictionaries should be interpreted as having meanings consistent with their meanings in the context of the relevant art, and not as idealized or highly formalized, unless expressly defined herein.
[0033] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, they should be considered part of the specification.
[0034] Display components on electronic devices are capable of outputting images.
[0035] In related technologies, display components achieve electromagnetic shielding by setting a metal mesh on the display glass. However, this method results in a large thickness of the display component (the metal mesh is thick, and the fixing structure connecting the metal mesh and the display glass also has a thickness, which increases the thickness of the display component by 0.4 mm). Furthermore, the low light transmittance of the metal mesh leads to poor display performance of the display component.
[0036] The inventors of this application have discovered that a display screen capable of being mounted on an electronic device can be designed to enable the electronic device to at least display images. The display screen may include a display substrate and a shielding structure. The display substrate has a display area, and an indium tin oxide (ITO) thin film of the shielding structure is deposited on one side of the substrate (covering the display area). An annular grounding layer of the shielding structure electrically connects one edge of the ITO thin film to the grounding area of the electronic device, thus grounding the shielding structure. In this way, when there is electromagnetic interference (such as Wi-Fi, Bluetooth signals, etc.) outside the electronic device or electromagnetic radiation generated by the internal circuitry of the electronic device, the shielding structure can block the influence of such electromagnetic interference and radiation on the display circuitry, thereby improving the stability of the electronic device's display signal transmission. Here, the thickness of the ITO thin film is small enough to be controlled between 50-200 nanometers, allowing the thickness of the shielding structure to be controlled within 0.4 millimeters, thereby reducing the thickness of the display screen. Furthermore, because the ITO thin film has good light transmittance, and the grounding layer avoids the display area, display loss can be reduced to improve the display effect.
[0037] First aspect
[0038] This disclosure provides a display screen 10, see [link to relevant documentation] Figures 1 to 7 As shown, the display screen 10 may include a display substrate 11 and a shielding structure 12. The display substrate 11 has a display area that satisfies the light transmission condition along a first direction. The shielding structure 12 may include a conductive layer 121 and a ground layer 122. The conductive layer 121 is distributed and stacked with the display substrate 11 along the first direction, and the portion of the conductive layer 121 corresponding to the display area satisfies the light transmission condition. The ground layer 122 is annular to avoid the display area, and the ground layer 122 is opposite to and electrically connected to a ring edge of the conductive layer 121, and can be electrically connected to the grounding area of the electronic device. The conductive layer 121 is an indium tin oxide thin film with a thickness greater than 50 nanometers and less than 200 nanometers, and the thickness of the shielding structure 12 along the first direction is less than 0.4 millimeters.
[0039] The display screen 10 can be a display screen of electronic devices such as smartphones, foldable smartphones, tablets, laptops, automotive displays, military displays, and aviation instruments. When an electronic device is equipped with a display screen 10, the electronic device at least has the function of displaying images. The display screen 10 can be of types such as LCD, AMOLED, Mini LED, and Micro LED.
[0040] The display substrate 11 can be made of glass, flexible polymer, etc.; it can be a touch-enabled display substrate 11 or a non-touch-enabled display substrate 11. The first direction can be the thickness direction of the display substrate 11. For ease of explanation, the first direction will be considered as the top-to-bottom direction in the following text (e.g., Figure 1 and Figure 4 To illustrate (using the X direction shown), in this setting, the display substrate 11 is placed flat, and the display image formed by the display circuitry above the display substrate 11 can be seen through the display area of the display substrate 11 (e.g., the X direction shown). Figure 1 , Figure 2 , Figure 4 and Figure 5 The area on the display substrate 11 corresponding to position AA is displayed on the lower surface of the display substrate 11 at the position corresponding to the display area.
[0041] The shielding structure 12 is used at least to block electromagnetic interference (such as Wi-Fi, Bluetooth signals, etc.) from external sources or electromagnetic radiation generated by internal circuits of the electronic device, thereby improving the stability of the electronic device's display signal transmission. The conductive layer 121 is disposed above and stacked on top of the display substrate 11 (covering the display area), and is an indium tin oxide (ITO) thin film. The ITO thin film can be greater than 50 nanometers and less than 200 nanometers thick. The ITO thin film has the function of absorbing and reflecting electromagnetic waves, thus blocking radiation and reducing signal interference. For example, if the display screen 10 is a touch screen, it may experience signal interference and thus skipping. The ITO thin film can reduce interference and reduce the probability of skipping. The annular grounding layer 122 and the conductive layer 121 can form a low-impedance path, enabling the rapid conduction of electrostatic charges to the grounding area of the electronic device, thereby achieving electromagnetic shielding. The grounding layer 122 can be an annular metal layer, such as an annular copper foil or an annular silver paste, which can be electrically connected to the grounding area of the electronic device through conductive adhesive, soldering, or other methods.
[0042] See one example. Figures 1 to 7As shown, a display screen 10 is provided on the upper part of a horizontally placed smartphone. The display screen 10 may include a display substrate 11 and a shielding structure 12. The display substrate 11 is located in a horizontal space and has a display area that meets the light transmission conditions in the vertical direction. The shielding structure 12 includes a conductive layer 121 and a ground layer 122. The indium tin oxide film of the conductive layer 121 is laid on top of the display substrate 11, and the portion of the conductive layer 121 corresponding to the display area meets the light transmission conditions. The annular ground layer 122 is bonded to the top of the conductive layer 121 and avoids the display area. The ground layer 122 is opposite to and electrically connected to a ring edge of the conductive layer 121 and can be electrically connected to the metal casing of the phone. The thickness of the indium tin oxide film is greater than 50 nanometers and less than 200 nanometers, and the thickness of the shielding structure 12 in the first direction is less than 0.4 millimeters.
[0043] Compared to using a metal mesh for electromagnetic shielding, the shielding structure 12 of the display screen 10 in this embodiment can be compressed to a thickness of 0.4 mm, reducing the thickness and weight of the display screen 10. Furthermore, the conductive layer 121 in the shielding structure 12 is an indium tin oxide (ITO) thin film with a light transmittance of ≥85%. Simultaneously, the grounding layer 122 avoids the display area to improve the display effect of the display screen 10. The ITO thin film also has bending properties to accommodate assembly tolerances between the display substrate 11 and other structures. In addition, the grounding layer 122 can establish a stable potential reference point, achieving electrical connection between the conductive layer 121 and the grounding area of the electronic device, allowing interference currents (such as electromagnetic interference) to be effectively discharged.
[0044] In some embodiments, see Figure 1 and Figure 4 As shown, the inner space of the ground layer 122 and the side of the conductive layer 121 facing away from the display substrate 11 cooperate to form the target accommodating space 123. The target accommodating space 123 can be used to accommodate structures such as display circuits that enable the display screen 10 to display images, so that the display circuits and other structures accommodated in the target accommodating space 123 can be protected against electromagnetic interference and physically by the ground layer 122 and the conductive layer 121.
[0045] In some embodiments, see Figures 1 to 3 As shown, the grounding layer 122 and the conductive layer 121 are distributed and stacked along the first direction; the shielding structure 12 may further include: a first conductive adhesive 124, which is annular and connects the two annular surfaces of the grounding layer 122 and the conductive layer 121 that are opposite to each other.
[0046] In other words, the annular grounding layer 122 can be bonded to the top of the conductive layer 121 by the annular first conductive adhesive 124, and the annular grounding layer 122 can form a groove structure with the conductive layer 121, and the space inside the groove structure forms the target accommodating space 123.
[0047] Here, the orthographic projection of the grounding layer 122 along the first direction can completely coincide with the orthographic projection of the first conductive adhesive 124 along the first direction, so as to reduce the probability of the first conductive adhesive 124 occupying extra space, and at the same time, to make the stress of the conductive layer 121 at different positions corresponding to the grounding layer 122 uniformly distributed. The first conductive adhesive 124 not only realizes the connection and fixation between the grounding layer 122 and the conductive layer 121, but also realizes the electrical connection between the grounding layer 122 and the conductive layer 121; the conductive particles in the first conductive adhesive 124 can be polymer microspheres with gold-plated surfaces and a diameter of 3-10 μm.
[0048] In this embodiment, the ground layer 122 and the conductive layer 121 are stacked, which can reduce the probability of the ground layer 122 occupying the space around the conductive layer 121.
[0049] In some embodiments, see Figure 1 and Figure 3 As shown, the peripheral surface of the display substrate 11 extending along the first direction, the peripheral surface of the conductive layer 121 extending along the first direction, the outer ring of the first conductive adhesive 124 extending along the first direction, and the outer ring of the ground layer 122 extending along the first direction are flush with each other. Alternatively, it can be said that each side of the peripheral surface of the display screen 10 extending along the first direction is coplanar at the top, middle, and bottom to facilitate the structural arrangement of the periphery of the display screen 10.
[0050] In other embodiments, see Figures 4 to 6 As shown, the grounding layer 122 is sleeved on the periphery of the conductive layer 121 extending along the first direction, and the thickness of the grounding layer 122 is greater than the thickness of the conductive layer 121, so as to cooperate with the conductive layer 121 to form a target accommodating space 123; the shielding structure 12 may further include: a second conductive adhesive 125, which is disposed in the annular space between the conductive layer 121 and the grounding layer 122, and is connected to the peripheral surface of the conductive layer 121 and an inner ring surface of the grounding layer 122.
[0051] Alternatively, it can be said that the conductive layer 121 is located in the ring space of the ground layer 122 and occupies a part of the thickness space of the ring space, so that the other part of the thickness space can form the target accommodating space 123, and the peripheral surface of the conductive layer 121 extending along the first direction and the inner surface of the ground layer 122 can be connected by the second conductive adhesive 125.
[0052] Here, the outer surface of the ground layer 122 extending along the first direction can be flush with the peripheral surface of the display substrate 11 extending along the first direction. In other words, each side of the peripheral surface of the display screen 10 extending along the first direction is coplanar, facilitating the structural arrangement of the periphery of the display screen 10. The second conductive adhesive 125 not only achieves the connection and fixation between the ground layer 122 and the conductive layer 121, but also achieves the electrical connection between them. The conductive particles in the second conductive adhesive 125 can be gold-plated polymer microspheres with a diameter of 3-10 μm.
[0053] In this embodiment, the grounding layer 122 can ground the conductive layer 121, and can also provide anti-interference and physical protection for the conductive layer 121 and the display circuit and other structures located therein.
[0054] In some embodiments, see Figure 7 As shown, the indium tin oxide thin film has a plurality of through holes 1211 extending along a first direction. The shapes of the plurality of through holes 1211 may be consistent or inconsistent; the plurality of through holes 1211 may be arranged regularly or irregularly; for example, see Figure 7 As shown, the multiple through holes 1211 have the same shape and are arranged in a regular pattern of 8 rows and 12 columns to make the conductive layer 121 form a grid.
[0055] In this embodiment, the indium tin oxide film has a plurality of through holes 1211 extending along the first direction, which can further reduce display loss, improve display effect, and reduce the amount of indium tin oxide film used.
[0056] In some embodiments, see Figure 1 , Figure 2 , Figure 4 and Figure 5 As shown, the grounding layer 122 is a ring of copper foil, and the thickness of the grounding layer 122 along the first direction is greater than 0.1 mm and less than 0.3 mm.
[0057] The thickness of the grounding layer 122 can be 0.1 mm, 0.2 mm, 0.25 mm, or 0.3 mm. When the grounding layer 122 is made of copper foil, copper foil has excellent conductivity, which can quickly conduct away charge or current, reduce grounding resistance, and improve electromagnetic shielding effect; and copper in the copper foil has good thermal conductivity, which can conduct heat in the target enclosure space 123 to the outer casing of the electronic device through the grounding layer 122, thereby reducing the probability of excessive temperature in the target enclosure space 123.
[0058] Second aspect
[0059] This disclosure provides an electronic device, which may include: a housing and a display screen 10 of any embodiment in the first aspect, the display screen 10 being connected to the housing, and the display area of the display screen 10 on the side facing away from the shielding structure 12 being exposed from the outside of the housing.
[0060] Electronic devices can be smartphones, foldable smartphones, tablets, laptops, automotive displays, military displays, aviation instruments, etc. The outer casing can be recessed to accommodate a battery, circuit board, display circuit, and other structures. The display screen 10 can be located in the opening of the accommodating space to close it, and the display area of the display screen 10 on the side facing away from the shielding structure 12 is exposed from the outside of the outer casing, so that the display image formed by the display circuit can be displayed on the outside of the electronic device through the display area of the display substrate 11.
[0061] In some embodiments, at least a portion of the housing is made of metal to form a grounding area for the electronic device. For example, a ring of the housing near the grounding layer 122 or the entire housing is made of metal. The partial or complete use of metal in the housing to form a grounding area and to be electrically connected to the grounding layer 122 achieves electromagnetic shielding of the shielding structure 12. This arrangement reduces the space occupied by additional grounding areas in the electronic device and the increase in cost.
[0062] In some embodiments, the electronic device may further include a display circuit disposed within a target accommodating space 123 formed by the inner space of the ground layer 122 and the side of the conductive layer 121 facing away from the display substrate 11. The display circuit is implemented by a display chip, or it may be implemented by other means. The display circuit located within the target accommodating space 123 can be physically protected and protected from interference by the ground layer 122 and the conductive layer 121 forming the target accommodating space 123, which can improve the display effect of the display circuit.
[0063] It should be noted that the display screen in the electronic device provided in this disclosure is similar to the display screen embodiments described above, and has similar beneficial effects. For technical details not disclosed in the embodiments of the electronic device in this disclosure, please refer to the description of the display screen embodiments in this disclosure for understanding; they will not be repeated here.
[0064] The embodiments of this disclosure have now been described in detail. To avoid obscuring the concept of this disclosure, some details known in the art have not been described. Those skilled in the art can fully understand how to implement the technical solutions disclosed herein based on the above description.
[0065] While specific embodiments of this disclosure have been described in detail by way of examples, those skilled in the art should understand that the examples are for illustrative purposes only and not intended to limit the scope of this disclosure. Those skilled in the art should understand that modifications can be made to the above embodiments or equivalent substitutions can be made to some technical features without departing from the scope and spirit of this disclosure. In particular, as long as there is no structural conflict, the technical features mentioned in the various embodiments can be combined in any manner.
Claims
1. A display screen, characterized in that, include: The display substrate has a display area that satisfies the light transmission condition along a first direction; The shielding structure includes a conductive layer and a ground layer. The conductive layer and the display substrate are distributed and stacked along the first direction, and the portion of the conductive layer corresponding to the display area satisfies the light transmission condition. The ground layer is annular to avoid the display area. The ground layer is opposite to and electrically connected to a ring edge of the conductive layer, and can be electrically connected to the ground area of the electronic device. The conductive layer is an indium tin oxide thin film with a thickness greater than 50 nanometers and less than 200 nanometers, and the thickness of the shielding structure along the first direction is less than 0.4 millimeters.
2. The display screen according to claim 1, characterized in that, The inner space of the grounding layer and the side of the conductive layer facing away from the display substrate cooperate to form the target accommodating space.
3. The display screen according to claim 2, characterized in that, The grounding layer and the conductive layer are distributed and stacked along the first direction; The shielding structure further includes: a first conductive adhesive, which is annular and connects the two annular surfaces of the grounding layer and the conductive layer that are opposite to each other.
4. The display screen according to claim 3, characterized in that, The peripheral surface of the display substrate extending along the first direction, the peripheral surface of the conductive layer extending along the first direction, the outer surface of the first conductive adhesive extending along the first direction, and the outer surface of the ground layer extending along the first direction are flush with each other.
5. The display screen according to claim 2, characterized in that, The grounding layer is sleeved on the periphery of the conductive layer extending along the first direction, and the thickness of the grounding layer is greater than the thickness of the conductive layer, so as to cooperate with the conductive layer to form the target accommodating space; The shielding structure further includes a second conductive adhesive, which is disposed in the annular space between the conductive layer and the grounding layer, and is connected to the peripheral surface of the conductive layer and an inner surface of the grounding layer.
6. The display screen according to any one of claims 2 to 5, characterized in that, The indium tin oxide thin film has a plurality of through holes extending along the first direction.
7. The display screen according to claim 6, characterized in that, The grounding layer is a ring of copper foil, and the thickness of the grounding layer along the first direction is greater than 0.1 mm and less than 0.3 mm.
8. An electronic device, characterized in that, include: shell; The display screen according to any one of claims 1 to 7, wherein the display screen is connected to the housing, and the display area of the display screen on the side opposite to the shielding structure is exposed from the outside of the housing.
9. The electronic device according to claim 8, characterized in that, At least a portion of the housing is made of metal to form a grounding area for the electronic device.
10. The electronic device according to claim 9, characterized in that, Also includes: The display circuit is disposed within the target accommodating space formed by the inner space of the ground layer and the side of the conductive layer facing away from the display substrate.