Display apparatus

Abstract

The present application provides a display apparatus, comprising: a substrate; a drive device layer disposed on the substrate; a planarization layer disposed on the drive device layer and comprising a plurality of trenches; a plurality of light-emitting devices, wherein a first portion of an anode of a first light-emitting device is disposed on a planar section, a second portion thereof is disposed on a first sidewall and the bottom of a first trench, and a third portion of an anode of a second light-emitting device is disposed on a second sidewall of the first trench; and a plurality of first banks, the first banks being disposed in the trenches and covering edge portions of adjacent anodes. The present application can prevent damage to surfaces of the anodes.

Description

Display device Technical Field

[0001] This application relates to the field of display technology, and more specifically to a display device. Background Technology

[0002] In the manufacturing technology of organic light-emitting diode (OLED) display panels, inkjet printing (IJP) technology is an important manufacturing process. As shown in Figures 1, 2, and 3, in existing IJP-OLED display panels, the printing substrate typically consists of a planarization layer PLN, an anode AND, a first partition wall BNK1, and a second partition wall BNK2. The first partition wall BNK1 is located between two adjacent anode ANDs and has two main functions: first, it covers the edges of the two adjacent anode ANDs, preventing the light-emitting layer EL at the edges of the anode ANDs from thinning and causing a short circuit between the anode AND and the cathode CTD; second, it fills the vias VH used for the electrical connection between the source / drain contact pads SD-PAD of the anode AND and the driving device layer, reducing the amount of light-emitting material used and improving the flatness of the light-emitting layer EL around the vias VH.

[0003] However, in the prior art, the thickness of the portion of the first partition wall BNK1 located inside the through-hole VH is much greater than the thickness of the portion of the first partition wall BNK1 located on the flat portion outside the through-hole VH. During the sintering process of the first partition wall BNK1, the portion of the first partition wall BNK1 located inside the through-hole VH will experience a large amount of shrinkage, resulting in shear stress between the portion of the first partition wall BNK1 located on the flat portion outside the through-hole VH and the anode AND surface. This shear stress will cause micro-damage to the anode AND surface, which includes the silver (Ag) electrode and the indium tin oxide (ITO) film covering the surface of the silver electrode. That is, at the edge of the first partition wall BNK1, the indium tin oxide film will experience micro-damage due to stress, leading to silver precipitation, as shown in Figures 4 and 5. The precipitated silver will pierce the light-emitting layer EL, ultimately causing a short circuit between the anode AND and the cathode CTD. Invention Overview

[0004] The purpose of embodiments of this application is to provide a display device that prevents damage to the surface of the anode.

[0005] An embodiment of this application provides a display device, comprising: a substrate; a driving device layer disposed on the substrate; a planarization layer disposed on the driving device layer, the planarization layer including a plurality of trenches, the plurality of trenches including adjacent first trenches and second trenches; a plurality of light-emitting devices, each light-emitting device including an anode, a light-emitting layer, and a cathode, the anode including a first portion, a second portion, and a third portion, the plurality of light-emitting devices including adjacent first light-emitting devices and second light-emitting devices, the first portion of the anode of the first light-emitting device being disposed on a flat portion of the planarization layer and located between the first trench and the second trench, the second portion of the anode of the first light-emitting device being disposed on a first sidewall and a bottom of the first trench, and the third portion of the anode of the second light-emitting device being disposed on a second sidewall of the first trench; and a plurality of first partitions, the first partitions being disposed within the trenches, the first partitions covering the second portion of the anode of the first light-emitting device and covering the third portion of the anode of the second light-emitting device. Beneficial effects

[0006] In the display device provided by the embodiments of this application, a first portion of the anode of the first light-emitting device is disposed on the flat portion of the planarization layer, a second portion is disposed on the first sidewall and bottom of the first trench, and a third portion of the anode of the second light-emitting device is disposed on the second sidewall of the first trench. A first partition wall is disposed within the trench and covers these anode portions. This structural design ensures that the first partition wall is disposed only within the trench and does not extend to the flat portion of the planarization layer, thereby significantly reducing the shear stress between the first partition wall and the anode surface. This effectively prevents micro-damage to the indium tin oxide film on the anode surface, thus avoiding the problem of silver deposition and piercing of the light-emitting layer, leading to a short circuit between the anode and cathode. Simultaneously, since the second portion of the anode of the first light-emitting device is disposed on the first sidewall and bottom of the first trench, the effective contact area between the anode and the source / drain contact pads is increased, significantly reducing contact resistance and improving the conductivity of the display device. Furthermore, by disposing the anodes of the first and second light-emitting devices on the two sidewalls of the first trench respectively and covering these portions with the first partition wall, it ensures that the light-emitting layer does not thin at the anode edge and achieves reliable insulation between adjacent anodes, improving the reliability of the display device. Attached Figure Description

[0007] Figure 1 is a schematic diagram of a traditional IJP-OLED display panel.

[0008] Figure 2 is a cross-sectional view of section A-A' in the display panel shown in Figure 1.

[0009] Figure 3 is an enlarged view of region Q in Figure 2.

[0010] Figure 4 is a scanning electron microscope image of the portion of a conventional IJP-OLED display panel corresponding to region Q in Figure 2 when no silver deposition has occurred.

[0011] Figure 5 is a scanning electron microscope image of the portion of a conventional IJP-OLED display panel corresponding to region Q in Figure 2 during silver deposition.

[0012] Figure 6 is a block diagram of a display device provided in an embodiment of this application.

[0013] Figure 7 is a schematic diagram of a display device provided in an embodiment of this application.

[0014] Figure 8 is a cross-sectional view at point B-B' in the display device shown in Figure 7. Embodiments of the present invention

[0015] The specific embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0016] The terms “first,” “second,” and similar words do not indicate any order, quantity, or importance, but are merely used to distinguish different technical features. The terms “multiple,” and similar words mean two or more, unless otherwise expressly specified.

[0017] The embodiments of this application can be combined with each other.

[0018] As shown in Figure 6, the display device provided in the embodiments of this application may be, for example, an OLED display device.

[0019] The display device includes a display panel, a source drive circuit, a timing controller, a light-emitting controller, and a power management chip. The display panel includes a substrate S, a gate drive circuit, data lines DATA, scan lines SCAN, power lines (VDD, VSS), light-emitting control signal lines EM, a pixel array, a packaging layer, a polarizer, and a color filter.

[0020] The substrate S can be, for example, a glass substrate, a flexible substrate (e.g., a polyimide substrate), etc. The pixel array is composed of multiple pixel units PX arranged in rows and columns. Each pixel unit PX includes a light-emitting device and a pixel driving circuit. The pixel driving circuit is electrically connected to the light-emitting device and is used to control the brightness of each light-emitting device. The light-emitting device includes a light-emitting layer (EL), an electron transport layer, a hole transport layer, a cathode (CTD), and an anode (AND), etc. The encapsulation layer includes a multilayer structure of alternating organic and inorganic materials. Each gate driving unit in the gate driving circuit controls a corresponding row of pixel units PX. The source driving circuit provides data signals to the pixel units PX. The timing controller receives externally input image data and synchronization signals, and generates the signals required by the gate driving circuit and the source driving circuit. The power management chip provides the necessary operating voltage to various parts of the display device.

[0021] In addition, the display device of this application may also integrate an embedded touch circuit to realize touch function.

[0022] Embodiments of this application provide a display device, including a substrate S, a driving device layer ARRAY disposed on the substrate S, a planarization layer PLN disposed on the driving device layer ARRAY, a plurality of light-emitting devices, a plurality of first partition walls BNK1, a plurality of second partition walls BNK2, and an encapsulation layer (not shown in the figure).

[0023] The planarization layer PLN includes multiple trenches G. These trenches D not only provide electrical connection between the anode AND and the source / drain contact pads SD-PAD of the drive device layer, but also increase the contact area with the anode AND and optimize the stress distribution between the anode AND and the partitions (first partition BNK1, second partition BNK2). The trench G can be a regular rectangle, ellipse, etc., or an irregular rectangular or elliptical shape, or other regular or irregular shapes (e.g., wavy). The length direction of the trench G is parallel to a first direction (e.g., horizontal direction), and this length direction represents the maximum dimension of the trench G in the top view of the display device. Multiple trenches G include adjacent first and second trenches. The distance between the first and second sidewalls of the first trench gradually decreases from the opening of the trench G to the bottom of the trench G, which facilitates reliable deposition (formation) of the anode material and prevents excessively thin local areas of the anode. The depth of the trench G is greater than 20% of the width W2 at the opening of the trench G and less than the width W2 at the opening of the trench G.

[0024] Because the length direction of the trench G is parallel to the first direction (e.g., the horizontal direction), the contact area between the anode AND and the sidewall of the trench G changes from point contact in a conventional through-hole VH to line contact. Specifically, in a conventional through-hole VH, the coverage area of ​​the anode AND on the sidewall of the through-hole VH is only annular, and its contact length with the sidewall is limited by the circumference of the through-hole VH. However, in the embodiments of this application, due to the use of a trench G extending along the first direction, the coverage area of ​​the anode AND on the sidewall of the trench G is strip-shaped, and its contact length with the sidewall can reach the length of the trench G, significantly increasing the contact length.

[0025] The length of the groove G is greater than 5 times its width; specifically, the length of the groove G is 5 to 20 times its width. This elongated groove G provides a larger stress release space for the anode AND, which helps to disperse the stress on the anode AND, avoids stress concentration at a certain point on the anode AND, and reduces the risk of micro-damage to the anode AND surface.

[0026] In addition, this slender groove G facilitates the uniform filling of the first partition wall BNK1, avoids the stress concentration problem caused by uneven local filling in the traditional through hole VH, changes the stress distribution mode, and improves the reliability of the display device.

[0027] The light-emitting device includes an anode AND, a light-emitting layer EL, and a cathode CTD. The anode AND includes a first part AND1, a second part AND2, and a third part AND3. The multiple light-emitting devices include adjacent first light-emitting devices and second light-emitting devices. The first part AND1 of the anode AND of the first light-emitting device is disposed on the flat portion of the planarization layer PLN and is located between the first trench and the second trench. The second part AND2 of the anode AND of the first light-emitting device is disposed on the first sidewall and the bottom of the first trench. The third part AND3 of the anode AND of the second light-emitting device is disposed on the second sidewall of the first trench. The second sidewall is opposite to the first sidewall (facing each other). The first sidewall is the first slope portion of the planarization layer PLN, and the second sidewall is the second slope portion of the planarization layer PLN.

[0028] A first partition wall BNK1 is disposed within the trench G, covering the second portion AND2 of the anode AND of the first light-emitting device and the third portion AND3 of the anode AND of the second light-emitting device. The first partition wall BNK1 is elongated, with its length parallel to a first direction. The width of the bottom of the first partition wall BNK1 is less than the width W1 of its top. The ratio of the width W1 of the top to the width of the bottom of the first partition wall BNK1 is 1.2 to 2. The thickness H2 of the first partition wall BNK1 varies at a rate of less than 30% in its height direction. The height difference between the top surface of the first partition wall BNK1 and the surface of the flat portion of the planarization layer PLN is less than 2 micrometers; the height difference should not be too large to avoid discontinuities or uneven thickness during subsequent EL deposition.

[0029] The second partition wall BNK2 is disposed on the flat layer PLN and covers a portion of the anode AND. The length direction of the second partition wall BNK2 is parallel to the second direction, and the second direction is perpendicular to the first direction.

[0030] The anode AND includes a silver electrode and an indium tin oxide thin film disposed on the surface of the silver electrode.

[0031] The contact area between the second portion AND2 of the anode AND of the first light-emitting device and the bottom of the first trench is less than 30% of the area of ​​the first portion AND1 of the anode AND of the first light-emitting device. A light-emitting layer EL is disposed on the first portion AND1 of the anode AND and on the first partition wall BNK1, and a portion of the light-emitting layer EL is disposed between two adjacent second partition walls BNK2. The ratio of the thickness of the second portion AND2 of the anode AND of the first light-emitting device to the thickness of the first portion AND1 is in the range of 0.8 to 1.2 to ensure that the anode AND has a similar thickness in the flat portion and the trench G portion, reducing stress concentration.

[0032] The cathode CTD is disposed on the light-emitting layer EL, and the cathode CTD is also disposed on at least a portion of the first partition wall BNK1 and the second partition wall BNK2.

[0033] The encapsulation layer is disposed on the cathode CTD.

[0034] In this embodiment, the substrate S of the display device can be a glass substrate, a quartz substrate, a flexible substrate, etc. A driving device layer ARRAY is disposed on the substrate S and is used to control the light emission of the light-emitting device. A planarization layer PLN is disposed on the driving device layer ARRAY and is used to planarize the surface of the driving device layer ARRAY. The planarization layer PLN can be made of organic materials, such as polyimide, acrylic resin, etc., or inorganic materials, such as silicon oxide, silicon nitride, etc. The planarization layer PLN includes multiple trenches G, the length direction of which is parallel to a first direction (e.g., the pixel row direction). The angle between the sidewall and the bottom of the trench G can be in the range of 30 degrees to 60 degrees, that is, the tilt angle between the first sidewall and the second sidewall is in the range of 30 degrees to 60 degrees. The angle between the sidewall and the bottom of the trench G refers to the angle between the tangent at the midpoint of the sidewall of the trench G and the surface of the bottom, which facilitates the reliable deposition of the anode AND in the trench G and prevents the anode AND from breaking within the trench G. The anode AND of the light-emitting device comprises a first portion AND1, a second portion AND2, and a third portion AND3, which allows the anode AND to be electrically connected to the contact pad SD-PAD and covered by a first partition wall BNK1 in an adjacent trench G. The first portion AND1 is disposed on the flat portion of the planarization layer PLN and, together with the light-emitting layer EL and the cathode CTD, constitutes the light-emitting portion of the light-emitting device. The second portion AND2 extends to the first sidewall and bottom of the first trench for electrical connection with the contact pad SD-PAD. The third portion AND3 extends to the sidewall of the second trench but does not contact the contact pad SD-PAD at the bottom of the trench G. The first partition wall BNK1 is disposed within the trench G and its material can be an organic material such as polyimide or acrylic resin.

[0035] The driving device layer ARRAY includes multiple thin-film transistors and multiple contact pads SD-PAD, which are electrically connected to the drain of the corresponding thin-film transistor. A trench G exposes the corresponding contact pads SD-PAD. The multiple contact pads SD-PAD include a first contact pad and a second contact pad. A second portion AND2 of a first light-emitting device is electrically connected to the first contact pad located at the bottom of the first trench. A third portion AND3 of the anode AND of a second light-emitting device is not electrically connected to the first contact pad located at the bottom of the first trench.

[0036] In this embodiment, the driving device layer ARRAY includes multiple thin-film transistors arranged in an array and multiple corresponding contact pads SD-PADs. Each thin-film transistor includes a gate, a source, and a drain, wherein the gate is connected to a gate driving circuit via a gate line, the source is connected to a data driving circuit via a data line, and the drain is electrically connected to the corresponding contact pad SD-PAD via a metal wiring. The contact pads SD-PADs can be made of materials with good conductivity, such as molybdenum, tungsten, aluminum, copper, or their alloys. The trench G exposes the upper surface of the contact pads SD-PADs. The second part AND2 of the anode AND of the first light-emitting device forms an electrical connection with the first contact pad at the bottom of the trench G, which effectively reduces the contact resistance. Although the third part AND3 of the anode AND of the second light-emitting device also extends to the second sidewall of the first trench, its edge maintains a certain distance from the bottom of the trench G and does not form an electrical connection with the first contact pad, thereby ensuring electrical isolation between adjacent light-emitting devices.

[0037] The third part AND3 of the anode AND of the first light-emitting device is disposed on the sidewall (second sidewall) of the second trench, and the third part AND3 of the anode AND of the first light-emitting device is not electrically connected to the second contact pad located at the bottom of the second trench.

[0038] Similarly, the third portion AND3 of the anode AND of the first light-emitting device extends onto the sidewall of the second trench, but is not electrically connected to the second contact pad at the bottom of the second trench. The first partition wall BNK1 covers the edge of the third portion AND3 of the anode AND of the second light-emitting device. The thickness of the third portion AND3 can be the same as the thickness of the first portion AND1 and the second portion AND2.

[0039] In this embodiment, the third portion AND3 of the anode AND of the first light-emitting device can have a rectangular, trapezoidal, or arc-shaped covering shape on the sidewall of the second trench. The covering size of the third portion AND3 on the sidewall of the second trench gradually increases from the top edge to the bottom edge of the second sidewall. This gradual covering size helps to reduce stress concentration. The contact interface between the third portion AND3 and the sidewall is chamfered, which avoids excessive stress on the edges of the third portion AND3 and helps to improve structural stability.

[0040] The first partition wall BNK1 is set in the trench G, and the width W1 of the top surface of the first partition wall BNK1 is smaller than the width W2 of the opening of the trench G.

[0041] The cross-sectional shape of the first partition wall BNK1 is similar to or close to an inverted trapezoid, and the width W1 of its top surface is smaller than the width W2 of the opening of the trench G. Specifically, the ratio of the width of the top surface of the first partition wall BNK1 to the width of the opening of the trench G is in the range of 0.4 to 0.9. The material of the first partition wall BNK1 is a material with a coefficient of thermal expansion in the range of 20ppm / ℃ to 40ppm / ℃, which makes the thermal expansion characteristics of the first partition wall BNK1 similar to those of the anode AND material, thereby effectively reducing thermal stress.

[0042] In this embodiment, steps are provided on the sidewall of the first trench. Correspondingly, the sidewall of the first partition wall BNK1 is stepped, and the number of steps can be 2 to 4. These steps can provide better support for the second part AND2 and the third part AND3 of the anode AND. In addition, the steps can also act as a blocking part of the third part AND3 of the anode AND, preventing the third part AND3 of the anode AND from contacting the contact pad SD-PAD.

[0043] The edge of the second part AND2 of the anode AND of the first light-emitting device has a first predetermined distance D1 between it and the bottom edge of the second sidewall of the first trench, and the edge of the third part AND3 of the anode AND of the second light-emitting device has a second predetermined distance D2 between it and the bottom edge of the second sidewall of the first trench. The first predetermined distance D1 is greater than or equal to zero, and the second predetermined distance D2 is greater than zero.

[0044] In this embodiment, when the first predetermined distance D1 is 0, the edge of the second portion AND2 of the anode AND of the first light-emitting device reaches the bottom edge of the second sidewall of the first trench, thus maximizing the utilization of the area at the bottom of the trench G to reduce contact resistance. The second predetermined distance D2 is greater than zero, which ensures reliable insulation between the third portion AND3 of the anode AND of the second light-emitting device and the first contact pad.

[0045] In this embodiment, a mesh portion is provided at the bottom of the first trench, which can increase the contact area between the second part AND2 of the anode AND and the contact pad SD-PAD.

[0046] The first predetermined distance D1 is less than or equal to 50% of the width of the first trench. This ensures that the second part AND2 of the anode AND of the first light-emitting device can fully utilize the area at the bottom of the trench G to form good electrical contact with the first contact pad. The first predetermined distance D1 can also be further optimized to a range of 20% to 40% of the width of the trench G. This range ensures sufficient contact area while preventing the second part AND2 of the anode AND of the first light-emitting device from contacting the third part AND3 of the anode AND of the second light-emitting device.

[0047] The contact area between the second part AND2 of the anode AND of the first light-emitting device and the first sidewall is greater than the contact area between the third part AND3 of the anode AND of the second light-emitting device and the second sidewall.

[0048] In this embodiment, the contact area between the second portion AND2 of the anode AND of the first light-emitting device and the first sidewall is greater than the contact area between the third portion AND3 of the anode AND of the second light-emitting device and the second sidewall. This is to ensure that the third portion AND3 is reliably covered by the first partition wall BNK1 and avoids contact with the first contact pad. The ratio of the contact areas is preferably set in the range of 1.5 to 3.

[0049] The height of the first partition wall BNK1 is greater than or equal to 80% of the depth of the first trench and less than or equal to 120% of the depth of the first trench.

[0050] The height range is set primarily based on the following considerations: the height of the first partition wall BNK1 is not less than 80% and not more than 120% of the trench G depth. This ensures that the first partition wall BNK1 can completely cover the edge of the anode AND, avoiding an excessive drop between the flat portion of the flattening layer PLN and the first partition wall BNK1, thus preventing the light-emitting layer EL from thinning at the edge of the trench G. The height of the first partition wall BNK1 can also be adjusted according to its material properties. For example, when the material of the first partition wall BNK1 is a material with a low coefficient of thermal expansion, the height of the first partition wall BNK1 is less than the trench G depth and the difference between the height of the first partition wall BNK1 and the trench G depth is small; when the material of the first partition wall BNK1 is a material with a high coefficient of thermal expansion, the height of the first partition wall BNK1 is less than the trench G depth and the difference between the height of the first partition wall BNK1 and the trench G depth is large.

[0051] Multiple grooves G are arranged in a direction parallel to the second direction, which is perpendicular to the first direction.

[0052] In this embodiment, multiple trenches G are arranged along a direction parallel to a second direction (e.g., the pixel column direction), which is perpendicular to the first direction. The spacing between any two trenches G is equal (the distance between the center lines of adjacent trenches G remains constant), or the spacing between the trenches G is unequal depending on the pixel layout (the distance between the center lines of adjacent trenches G is unequal depending on the area requirements of different color sub-pixels). Along the length of the trenches G, each trench G covers a portion of the anode AND of each pixel unit in the entire pixel row.

[0053] The distance H1 between the edge of the third part AND3 of the anode AND of the second light-emitting device and the top surface of the first partition wall BNK1 is greater than or equal to 10% of the thickness H2 of the first partition wall BNK1. This can prevent the first partition wall BNK1 from generating excessive stress on the edge of the anode AND during the sintering process.

[0054] The Young's modulus of the material of the first partition wall BNK1 is less than that of the Young's modulus of the material of the anode AND.

[0055] The surface roughness of the first and second sidewalls of the first trench is less than that of the bottom.

[0056] In the display device provided by the embodiments of this application, a first portion AND1 of the anode AND of the first light-emitting device is disposed on the flat portion of the planarization layer PLN, a second portion AND2 is disposed on the first sidewall and bottom of the first trench, a third portion AND3 of the anode AND of the second light-emitting device is disposed on the second sidewall of the first trench, and a first partition wall BNK1 is disposed within the trench G and covers these anode AND portions. This structural design ensures that the first partition wall BNK1 is disposed only within the trench G and does not extend to the flat portion of the planarization layer PLN, thereby significantly reducing the shear stress between the first partition wall BNK1 and the anode AND surface, effectively preventing micro-damage to the indium tin oxide film on the anode AND surface, and thus avoiding the problem of silver deposition and piercing of the light-emitting layer EL, leading to a short circuit between the anode AND and the cathode CTD. At the same time, since the second portion AND2 of the anode AND of the first light-emitting device is disposed on the first sidewall and bottom of the first trench, the effective contact area between the anode AND and the contact pad SD-PAD is increased, significantly reducing the contact resistance and improving the conductivity of the display device. Furthermore, by setting the anode AND of the first light-emitting device and the second light-emitting device on the two sidewalls of the first trench respectively, and covering these parts with the first partition wall BNK1 respectively, it is ensured that the light-emitting layer EL will not become thin at the edge of the anode AND, and reliable insulation between adjacent anode ANDs is achieved, thereby improving the reliability of the display device.

[0057] In existing technologies, the surface of the anode AND is prone to damage. Particularly when the anode AND comprises a silver electrode and an indium tin oxide (ITO) film covering the silver electrode surface, the ITO film is susceptible to micro-damage due to thermal stress during the manufacturing process. This micro-damage leads to silver deposition, which can puncture the light-emitting layer (EL), ultimately causing a short circuit between the anode AND and the cathode CTD, affecting the display quality and lifespan of the display panel.

[0058] To solve the above-mentioned technical problems, this application provides a display device, which includes a display panel. The display panel includes a substrate S, a driving device layer ARRAY disposed on the substrate S, a planarization layer PLN disposed on the driving device layer ARRAY, a light-emitting device layer disposed on the planarization layer PLN, and an encapsulation layer disposed on the light-emitting device layer.

[0059] The driving device layer ARRAY includes multiple thin-film transistors and multiple contact pads SD-PAD, which are electrically connected to the drains of the corresponding thin-film transistors. Multiple trenches G are formed on the planarization layer PLN, with the length direction of the trenches G parallel to a first direction. The trenches G expose the contact pads SD-PAD of the driving device layer ARRAY. The light-emitting device includes an anode AND, a light-emitting layer EL, and a cathode CTD. The anode AND of the first light-emitting device includes a first portion AND1, a second portion AND2, and a third portion AND3. The first portion AND1 is disposed on the surface of the planar portion of the planarization layer PLN. The second portion AND2 is disposed on the first sidewall and bottom of the first trench and is electrically connected to the first contact pad. The third portion AND3 is disposed on the sidewall of the second trench and is not electrically connected to the second contact pad. The third portion AND3 of the anode AND of the second light-emitting device is disposed on the second sidewall of the first trench and is not electrically connected to the first contact pad.

[0060] The display panel also includes multiple first partitions BNK1 and multiple second partitions BNK2. The first partitions BNK1 are elongated strips, with their length parallel to the first direction. The first partitions BNK1 are disposed within the trench G, and their width is less than the width of the opening of the trench G. The first partitions BNK1 cover the second portion AND2 of the anode AND of the first light-emitting device and the third portion AND3 of the anode AND of the second light-emitting device. The second portion AND2 of the anode AND of the first light-emitting device is insulated from the third portion AND3 of the anode AND of the second light-emitting device.

[0061] Preferably, the edge of the second portion AND2 of the anode AND of the first light-emitting device has a first predetermined distance D1 between it and the bottom edge of the second sidewall of the first trench, and the edge of the third portion AND3 of the anode AND of the second light-emitting device has a second predetermined distance D2 between it and the bottom edge of the second sidewall of the first trench. The first predetermined distance D1 is greater than or equal to zero, and the second predetermined distance D2 is greater than zero. A second partition wall BNK2 is disposed on the planarization layer PLN and covers a portion of the anode AND. The second partition wall BNK2 is elongated, with its length direction parallel to a second direction and perpendicular to the first direction. The light-emitting layer EL is formed by inkjet printing. The light-emitting layer EL is disposed on the first portion AND1 of the anode AND and on the first partition wall BNK1, and a portion of the light-emitting layer EL is disposed in the space between two adjacent second partition walls BNK2. A cathode CTD is disposed on the light-emitting layer EL, and an encapsulation layer is disposed on the cathode CTD.

[0062] In this application, the edges of two adjacent anodes AND are arranged within the trench G. The second portion AND2 of the anode AND of the first light-emitting device is electrically connected to the first contact pad, while the third portion AND3 of the anode AND of the second light-emitting device is disposed on the second sidewall of the first trench and is not electrically connected to the first contact pad. This avoids stress unevenness caused by the difference in thermal expansion coefficients between the first partition wall BNK1 and the surrounding structure. The width of the first partition wall BNK1 is smaller than the width of the opening of the trench G, preventing the first partition wall BNK1 from extending to the surface of the flat portion of the planarization layer PLN, thereby reducing the stress between the first partition wall BNK1 and the surface of the anode AND and preventing damage to the film layer on the anode AND surface. Simultaneously, the first partition wall BNK1 covers the edges of adjacent anodes AND, preventing the light-emitting layer EL from thinning and causing a short circuit. The second portion AND2 of the anode AND of the first light-emitting device is disposed on the first sidewall and bottom of the first trench and is electrically connected to the first contact pad, increasing the contact area between the anode AND and the contact pad SD-PAD and reducing the contact resistance.

[0063] In the display panel provided by this invention, a first portion AND1 of the anode AND of the first light-emitting device is disposed on the surface of the flat portion of the planarization layer PLN, a second portion AND2 is disposed on the first sidewall and bottom of the first trench, a third portion AND3 of the anode AND of the second light-emitting device is disposed on the second sidewall of the first trench, and a first partition wall BNK1 is disposed within the trench G and covers these anode AND portions. This structural design ensures that the first partition wall BNK1 is disposed only within the trench G and does not extend to the flat portion of the planarization layer PLN, thereby significantly reducing the shear stress between the first partition wall BNK1 and the anode AND surface, effectively preventing micro-damage to the indium tin oxide film on the anode AND surface, and thus avoiding the problem of silver deposition and piercing of the light-emitting layer EL, leading to a short circuit between the anode AND and the cathode CTD. Simultaneously, since the second portion AND2 of the anode AND of the first light-emitting device is disposed on the first sidewall and bottom of the first trench, the effective contact area between the anode AND and the contact pad SD-PAD is increased, significantly reducing the contact resistance and improving the conductivity of the display panel.

[0064] The embodiments of this application have been described in detail above. The content of this specification should not be construed as limiting the scope of protection of this application.

Claims

1. A display device, comprising: substrate; A driving device layer disposed on the substrate; A planarization layer disposed on the driving device layer, the planarization layer including a plurality of trenches, the plurality of trenches including adjacent first trenches and second trenches; A plurality of light-emitting devices, each light-emitting device including an anode, a light-emitting layer, and a cathode, wherein the anode includes a first portion, a second portion, and a third portion, and the plurality of light-emitting devices include adjacent first light-emitting devices and second light-emitting devices, wherein the first portion of the anode of the first light-emitting device is disposed on the flat portion of the flattening layer and located between the first trench and the second trench, the second portion of the anode of the first light-emitting device is disposed on the first sidewall and the bottom of the first trench, and the third portion of the anode of the second light-emitting device is disposed on the second sidewall of the first trench; as well as A plurality of first partition walls are disposed within the trench, the first partition walls covering the second portion of the anode of the first light-emitting device and the third portion of the anode of the second light-emitting device.

2. The display device as claimed in claim 1, wherein, The driving device layer includes a plurality of thin-film transistors and a plurality of contact pads, wherein the contact pads are electrically connected to the drain of the corresponding thin-film transistors; The groove exposes the corresponding contact pad; The plurality of contact pads include a first contact pad and a second contact pad; The second part of the first light-emitting device is electrically connected to the first contact pad located at the bottom of the first trench; The third portion of the anode of the second light-emitting device is not electrically connected to the first contact pad located at the bottom of the first trench.

3. The display device as claimed in claim 1, wherein, The third portion of the anode of the first light-emitting device is disposed on the sidewall of the second trench, and the third portion of the anode of the first light-emitting device is not electrically connected to the second contact pad located at the bottom of the second trench.

4. The display device as claimed in claim 1, wherein, The first partition wall is disposed within the trench, and the width of the top surface of the first partition wall is smaller than the width of the opening of the trench.

5. The display device as claimed in claim 1, wherein, The edge of the second portion of the anode of the first light-emitting device has a first predetermined distance from the bottom edge of the second sidewall of the first trench, and the edge of the third portion of the anode of the second light-emitting device has a second predetermined distance from the bottom edge of the second sidewall of the first trench. The first predetermined distance is greater than or equal to zero, and the second predetermined distance is greater than zero.

6. The display device as claimed in claim 5, wherein, The first predetermined distance is less than or equal to 50% of the width of the first trench.

7. The display device as claimed in claim 1, wherein, The contact area between the second portion of the anode of the first light-emitting device and the first sidewall is greater than the contact area between the third portion of the anode of the second light-emitting device and the second sidewall.

8. The display device as claimed in claim 1, wherein, The height of the first partition wall is greater than or equal to 80% of the depth of the first trench and less than or equal to 120% of the depth of the first trench.

9. The display device as claimed in claim 1, wherein, The length direction of the groove is parallel to the first direction, and the plurality of grooves are arranged along a direction parallel to the second direction, which is perpendicular to the first direction.

10. The display device as claimed in claim 1, wherein, The distance between the edge of the third portion of the anode of the second light-emitting device and the top surface of the first partition wall is greater than or equal to 10% of the thickness of the first partition wall.

11. The display device as claimed in claim 1, wherein, The height difference between the top surface of the first partition wall and the surface of the flat portion of the flat layer is less than 2 micrometers.

12. The display device as claimed in claim 1, wherein, The ratio of the width of the top of the first partition wall to the width of the bottom of the first partition wall is 1.2 to 2.

13. The display device as claimed in claim 1, wherein, The depth of the first groove is greater than 20% of the width of the first groove at the opening and less than the width of the first groove at the opening.

14. The display device as claimed in claim 1, wherein, The length of the first groove is greater than 5 times the width of the first groove.

15. The display device as claimed in claim 1, wherein, The Young's modulus of the material of the first partition wall is less than that of the Young's modulus of the material of the anode.

16. The display device as claimed in claim 1, wherein, The angle between the sidewall and the bottom of the first trench is in the range of 30 degrees to 60 degrees.

17. The display device as claimed in claim 1, wherein, The ratio of the top width of the first partition wall to the width of the opening of the trench is in the range of 0.4 to 0.

9.

18. The display device as claimed in claim 1, wherein, The ratio of the contact area between the second portion of the anode of the first light-emitting device and the first sidewall to the contact area between the third portion of the anode of the second light-emitting device and the second sidewall is in the range of 1.5 to 3.

19. The display device as claimed in claim 1, wherein, The first trench has steps on its sidewalls, and the sidewalls of the first partition wall are stepped.

20. The display device as claimed in claim 19, wherein, The number of steps is 2 to 4.

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