Supporting piece, method for manufacturing supporting piece, display module and electronic equipment

Abstract

Embodiments of the present application disclose a support, a preparation method of the support, a display module and an electronic device. The support is used for supporting a display screen. The display screen comprises a first non-bending part, a second non-bending part and a bending part. The support comprises a first support opposite to the first non-bending part, a second support opposite to the second non-bending part, and a bending support opposite to the bending part, the bending support being located between the first support and the second support. The bending support is provided with one or more through holes penetrating through the bending support, one opening of the through hole being located on a surface of the bending support opposite to the bending part. The through hole is filled with a filling material, so that the impact resistance and extrusion resistance of the electronic device can be improved. The elastic modulus of the filling material is less than the elastic modulus of the support, so that the bending performance of the bending area of the support can be further improved.

Description

[0001] This application is a divisional application. The original application has the application number 202210711705.9 and the original application date is June 22, 2022. The entire contents of the original application are incorporated herein by reference. Technical Field

[0002] This application relates to the field of displays, and more particularly to a support member, a method for manufacturing the support member, a display module, and an electronic device. Background Technology

[0003] With the continuous development of display technology, electronic devices are gradually becoming a development trend for future mobile electronic products. When unfolded, electronic devices offer a larger display area, enhancing the viewing experience. When folded, they achieve a smaller size, making them easier for users to carry.

[0004] The electronic device includes at least: a flexible display screen and a support member for supporting the flexible display screen. The flexible display screen includes a bent portion, and the support member has through holes in the area corresponding to the bent portion to improve the bending performance of the support member.

[0005] However, setting through holes in the area corresponding to the bend on the support component will make the flexible display screen's bending area less resistant to compression and impact, resulting in appearance defects such as cracks and creases in the bending area, thus reducing the user experience. Summary of the Invention

[0006] This application provides a support member, a method for preparing the support member, a display module, and an electronic device, which solves the problem of poor compression resistance and impact resistance of existing electronic devices.

[0007] To achieve the above objectives, the embodiments of this application adopt the following technical solutions: A first aspect of this application provides a support member for supporting a display screen, the display screen including: a first non-bending portion, a second non-bending portion, and a bending portion; the support member includes: a first support member opposite to the first non-bending portion, a second support member opposite to the second non-bending portion, and a bending support member opposite to the bending portion, the bending support member being located between the first support member and the second support member; the bending support member includes a first surface opposite to the bending portion and a second surface opposite to the first surface, the bending support member having one or more through holes penetrating the first surface and the second surface of the bending support member; the through holes are filled with a filler material, wherein the thickness of the filler material is less than or equal to the thickness of the support member, and the elastic modulus of the filler material is less than the elastic modulus of the support member. Therefore, by placing filler material in the through hole of the support, the impact and compression resistance of electronic equipment can be improved. Moreover, the elastic modulus of the filler material is less than that of the support. When the filler material is compressed or stretched, the deformation of the filler material is greater than that of the support. Placing the filler material in the through hole of the support is beneficial to further improve the bending performance of the bending area of ​​the support.

[0008] In one alternative implementation, the filling material is filled into the through-hole by inkjet printing. Therefore, inkjet printing allows for patterned coating, offering advantages such as high printing precision and excellent uniformity of the printed filling material.

[0009] In one alternative implementation, the filler material includes at least one of the following: a filler adhesive, a resin, and a polymer material. This allows for a greater variety of filler material options.

[0010] In one alternative implementation, the filler adhesive includes at least one of photosensitive adhesive, thermosetting adhesive, and moisture-curing adhesive. This provides a wider variety of filler adhesive materials.

[0011] In one alternative implementation, the filler material is strip-shaped, and its length direction is parallel to the length direction of the bend. This improves the compressive strength of the support.

[0012] In one optional implementation, the filling material further includes a first limiting portion disposed at at least one end of the filling material along its length, the first limiting portion engaging with the through hole. Thus, the first limiting portion can alter the stress distribution on the support member.

[0013] In one optional implementation, the filler material further includes a second limiting portion disposed at at least one end of the filler material along its thickness direction, the second limiting portion engaging with the through hole. Thus, the second limiting portion can prevent the filler material from being squeezed out during use. In one optional implementation, the filler material satisfies at least one of the following conditions: Young's modulus greater than 1 MPa; glass transition temperature less than 0 °C; stress relaxation recovery rate greater than 90%; and elastic limit greater than 50%. Therefore, placing filler material in the through-holes of the support member is beneficial for improving the support member's resistance to compression and impact.

[0014] In one alternative implementation, the material of the support includes at least one of fiber, elemental metal, and alloy. This improves the support's resistance to compression and impact.

[0015] A second aspect of this application provides a method for manufacturing a support member for supporting a display screen, the display screen including: a first non-bending portion, a second non-bending portion, and a bending portion; the support member including: a first support member opposite to the first non-bending portion, a second support member opposite to the second non-bending portion, and a bending support member opposite to the bending portion, the bending support member being located between the first support member and the second support member; the method includes: filling a filler material into a through-hole of the bending support member by inkjet printing, wherein the bending support member includes a first surface opposite to the bending portion and a second surface opposite to the first surface, the bending support member having one or more through-holes penetrating the first and second surfaces of the bending support member; curing the filler material; wherein the height of the filler material is less than or equal to the height of the through-hole, and the elastic modulus of the filler material is less than the elastic modulus of the support member. Therefore, the inkjet printing filling method can achieve patterned coating, and has the advantages of high printing accuracy and good uniformity of the printed filler material.

[0016] In one optional implementation, the filling material is filled into the through hole of the support member by inkjet printing, which includes: attaching a carrier layer to one surface of the support member; and inkjet printing on the surface of the support member opposite to the carrier layer to fill the through hole of the support member with the filling material.

[0017] It should be noted that the carrier layer can be a release film or a display screen.

[0018] In one alternative implementation, the carrier layer is a release film, and after the filler material is cured, the method further includes removing the carrier layer.

[0019] In one alternative implementation, the support layer is a display screen. After the filler material is cured, the display screen can be connected to the support layer through the filler material without having to be removed.

[0020] A third aspect of this application provides a display module, including a display screen and a support member as described above; the display screen includes a display panel and a cover plate stacked together, the backlight surface of the display panel is close to the support member, and the cover plate is disposed on the light-emitting surface of the display panel. Thus, by using the aforementioned support member, the display module improves its impact and compression resistance.

[0021] In one alternative implementation, a protective film is provided on the side of the cover plate away from the display panel. This protective film thus protects the display screen.

[0022] A fourth aspect of this application provides an electronic device including a housing and a display module as described above, the housing being disposed on the side of the support member away from the display screen. Thus, by employing the aforementioned display module, the electronic device improves its impact and compression resistance.

[0023] This application provides a support member, a method for preparing the support member, a display module, and an electronic device. A filler material is provided in the through hole of the bending area of ​​the support member, which improves the impact and compression resistance of the electronic device. The elastic modulus of the filler material is less than that of the support member. When the filler material is compressed or stretched, the deformation of the filler material is greater than that of the support member. Placing the filler material in the through hole of the support member is beneficial to further improve the bending performance of the bending area of ​​the support member. Attached Figure Description

[0024] Figure 1a A schematic diagram of the disassembly structure of an electronic device provided in an embodiment of this application; Figure 1b This is a schematic diagram of the structure of a display module provided in an embodiment of this application; Figure 2 for Figure 1b The image shows an AA cross-sectional view of the module. Figure 3 This is a schematic diagram of the disassembly structure of a display module provided in an embodiment of this application; Figure 4 This is a schematic diagram of the structure of a support member provided in an embodiment of this application; Figure 5 A flowchart illustrating a method for preparing a support member according to an embodiment of this application; Figure 6 A schematic diagram of an inkjet printing window provided in an embodiment of this application; Figure 7 A flowchart illustrating another method for preparing a support member according to an embodiment of this application; Figure 8 , Figure 9 , Figure 10 , Figure 11 Execution respectively Figure 7 A schematic diagram of the product structure after each step; Figure 12 A flowchart illustrating another method for preparing a support member according to an embodiment of this application; Figure 13 , Figure 14 , Figure 15 Execution respectively Figure 12 A schematic diagram of the product structure after each step; Figure 15a This is a structural schematic diagram of a bending support member provided in an embodiment of this application; Figure 15b for Figure 15a Top view of the bent support component; Figure 16 for Figure 15a BB section view in the middle; Figure 17 for Figure 15a BB section view in the middle; Figure 18 for Figure 15a BB section view in the middle; Figure 19 for Figure 15a BB section view in the middle; Figure 20 for Figure 15a BB section view in the middle; Figure 21 for Figure 15a CC section view in the middle; Figure 22 for Figure 15a CC section view in the middle; Figure 23 for Figure 15a CC section view in the middle; Figure 24 for Figure 15a CC section view in the middle; Figure 25 This is a partial enlarged view of a bent support component; Figure 26 A top view of an electronic device provided in an embodiment of this application; Figure 27 This is a schematic diagram of the internal structure of an electronic device provided in an embodiment of this application; Figure 28 A schematic diagram of impact test results at a weak point in the hinge area of ​​an electronic device; Figure 29 This is a schematic diagram of the compression test results of the electronic device provided in the embodiments of this application; Figure 30 A simulation diagram of the compression test results of the electronic device provided in the embodiments of this application. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of this application clearer, the application will now be described in further detail with reference to the accompanying drawings.

[0026] In the following description, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0027] Furthermore, in this application, directional terms such as "upper" and "lower" are defined relative to the orientation of the components shown in the accompanying drawings. It should be understood that these directional terms are relative concepts, used for relative description and clarification, and can change accordingly depending on the orientation of the components in the accompanying drawings.

[0028] This application provides an electronic device, which can be a mobile phone, monitor, tablet computer, in-vehicle computer, or other product with a display interface. This application does not impose any special limitations on the specific form of the aforementioned electronic device.

[0029] Figure 1a This is a schematic diagram of the disassembly structure of the electronic device provided in the embodiments of this application, such as... Figure 1a As shown, the electronic device includes a display module 1, a mid-frame 2, and a housing 3 (or battery cover, back cover). The mid-frame 2 is located between the display module 1 and the housing 3.

[0030] Display module 1 is used to display images.

[0031] The surface of the middle frame 2 furthest from the display module 1 is used to mount internal components such as batteries, printed circuit boards (PCBs), cameras, and antennas. After the housing 3 is closed with the middle frame 2, the aforementioned internal components are located between the housing 3 and the middle frame 2, thereby preventing external moisture and dust from entering the cavity and affecting the performance of the aforementioned electronic devices.

[0032] Display module 1 can be electrically connected to the PCB mounted on the middle frame 2 via a flexible printed circuit (FPC). This allows the PCB to transmit display data to display module 1 to control display module 1 to display images.

[0033] The display module 1, the middle frame 2, and the housing 3 can be disposed on different layers along the thickness direction of the electronic device. These layers can be parallel to each other, and the plane on which each layer is located can be called the XY plane. The direction perpendicular to the XY plane can be called the Z direction. That is to say, the display module 1, the middle frame 2, and the housing 3 can be distributed in layers along the Z direction.

[0034] Figure 1b This is a schematic diagram of the structure of the display module provided in the embodiments of this application, such as... Figure 1b As shown, the display module includes a display screen 10 and a support member 20 for supporting the display screen 10.

[0035] This application does not limit the structure of the display screen 10 in the embodiments. In some embodiments, such as Figure 2 As shown, the display screen 10 includes a protective film 1003, a cover plate 1002, and a display panel 1001 stacked along the Z direction. A support member 20 is disposed on the side of the display panel 1001 away from the cover plate 1002. The support member 20 can support the display screen 10 and dissipate heat for the display screen 10.

[0036] This application does not impose certain restrictions on the structure of the display panel 1001. For example, the display panel 1001 is an active matrix organic light emitting diode (AMOLED) display.

[0037] As a self-emissive display, AMOLED displays do not require a backlight module (BLM). Therefore, when the substrate of an AMOLED display is made of a flexible resin material, such as polyethylene terephthalate (PET), the AMOLED display can be bent.

[0038] The cover plate 1002 and the protective film 1003 can protect the display panel 1001 and prevent the external environment from interfering with the display panel 1001.

[0039] Figure 2 for Figure 1b AA section view in the image. Figure 3 This is a schematic diagram of the disassembly structure of a display module provided in an embodiment of this application.

[0040] like Figure 2 , Figure 3 As shown, the support member 20 includes at least: a first support member 201, a second support member 202, and a bending support member 203.

[0041] like Figure 3As shown, the display screen 10 is, for example, a flexible display screen. The display screen 10 includes: a first non-bending portion 101, a second non-bending portion 102, and a bending portion 103, wherein the bending portion 103 is located between the first non-bending portion 101 and the second non-bending portion 102.

[0042] The first support member 201 is connected to the first non-bending portion 101 of the display screen 10, the second support member 202 is connected to the second non-bending portion 102 of the display screen 10, and the bending support member 203 is connected to the bending portion 103 of the display screen 10.

[0043] When the included angle α between the first support member 201 and the second support member 202 is less than 180°, the display screen 10 is in a bent state.

[0044] Alternatively, when the included angle α between the first support member 201 and the second support member 202 increases to 180°, the display screen 10 is in the unfolded state.

[0045] The first support member 201 and the second support member 202 are used to support the display screen 10 during the unfolding and folding process, to ensure the flatness of the display screen 10, and to protect the non-display surface of the display screen 10.

[0046] The aforementioned bending support 203 is opposite to the bending portion 103 of the display screen 10. When the display screen 10 is bent or unfolded, the bending support 203 can bend or unfold accordingly.

[0047] To improve the bending performance of the bending support 203, in some embodiments, such as Figure 2 , Figure 3 As shown, the bending support member 203 is provided with one or more through holes 2031, which penetrate the bending support member 203 along the thickness direction of the bending support member 203.

[0048] One of the openings of the through hole is located on the surface of the bent support opposite to the bent portion.

[0049] In some embodiments, the extending direction of the through hole 2031 is perpendicular to the plane of the support member 20.

[0050] However, impact reliability tests on electronic devices revealed that setting through holes in the area corresponding to the bend on the support component makes the flexible display screen's bending area less resistant to compression and impact. This results in appearance defects such as orange peel texture, mold marks, and creases in the bending area, reducing the user experience.

[0051] Therefore, embodiments of this application provide an improved support member. Figure 4 This is a structural schematic diagram of the support member provided in an embodiment of this application. Figure 4As shown, the support member 20 includes: a first support member 201, a second support member 202, a bent support member 203, and a filling material 2032, which fills the through hole 2031 of the bent support member 203.

[0052] The first support member 201 is used to support the first non-bent portion of the display screen, the second support member 202 is used to support the second non-bent portion of the display screen, the bending support member is used to support the bent portion of the display screen, and the bending support member 203 is located between the first support member 201 and the second support member 202.

[0053] This application embodiment does not limit the structure of the filler material 2032. The filler material 2032 should satisfy the following condition: the elastic modulus of the filler material 2032 is less than the elastic modulus of the support member 20. For example, the elastic modulus of the filler material 2032 is greater than 1 MPa.

[0054] It should be noted that the elastic modulus is a physical quantity that describes the ability of a solid material to resist deformation.

[0055] For example, the elastic modulus in this application may be Young's modulus.

[0056] The definition of Young's modulus is explained below: The Young's modulus of filler material 2032 can be represented by Young's modulus E.

[0057] Young's modulus E satisfies: E = σ / ε. Where σ represents stress, which is the force on a unit cross-sectional area of ​​the 2032-cell filler material, and ε represents strain, which is the elongation per unit length of the 2032-cell filler material.

[0058] Assuming the length of the filling material 2032 is L and the cross-sectional area is S, when it elongates by ΔL under the action of force F, the stress σ of the filling material 2032 satisfies: σ=F / S, and the strain ε of the filling material 2032 satisfies: ε=ΔL / L.

[0059] The larger the Young's modulus, the smaller the deformation of filler material 2032 when it is compressed or stretched.

[0060] In this embodiment, the Young's modulus of the filler material 2032 is less than that of the support 20, which means that when the filler material 2032 is compressed or stretched, the deformation of the filler material 2032 is greater than that of the support 20. By placing the filler material 2032 in the through hole of the support 20, the through hole of the support 20 is more likely to deform, which is beneficial to improving the bending performance of the support 20.

[0061] In addition, filling the through holes of the support member 20 with filling material helps to improve the support member 20's resistance to compression and impact.

[0062] In some embodiments of this application, the glass transition temperature (Tg) of the filler material 2032 is, for example, less than 0°C. In other embodiments of this application, the glass transition temperature of the filler material 2032 is, for example, less than -10°C. The glass transition temperature refers to the temperature at which the filler material 2032 transitions from a glassy state to a highly elastic state.

[0063] It should be noted that for polymer materials of the same system, the lower the Tg, the lower the elastic modulus at room temperature, and the corresponding decrease in reliability benefits.

[0064] The ambient temperature of electronic devices is usually greater than or equal to the glass transition temperature of the filler material 2032. That is to say, under normal use conditions, the filler material 2032 is in a highly elastic state, which makes it easier for the through-hole position of the support 20 to deform, thus improving the bending performance of the support 20.

[0065] The stress relaxation recovery of filler material 2032 is, for example, greater than 90%. Stress relaxation recovery refers to the reduction of stress in filler material 2032 under constant temperature and long-term constant strain, while simultaneously producing irreversible plastic deformation.

[0066] The elastic limit of the filler material 2032 is, for example, greater than 50%. The elastic limit refers to the maximum deformation of the filler material 2032 under external force. If the deformation of the filler material 2032 under external force is less than this limit, its deformation will completely disappear and it will return to its original shape when the external force is removed. If the deformation of the filler material 2032 under external force exceeds this limit, the filler material 2032 cannot completely return to its original shape even if the external force is removed.

[0067] It should be noted that the filler material 2032 provided in this application embodiment should meet at least one of the following conditions: Young's modulus greater than 1 MPa, glass transition temperature less than 0°C, stress relaxation recovery rate greater than 90%, and elastic limit greater than 50%.

[0068] This application does not limit the material of the support component. In some embodiments of this application, the material of the support component includes at least one of the following: fiber, elemental metal, and alloy. For example, it can be carbon fiber, stainless steel, aluminum alloy, or titanium alloy.

[0069] The embodiments of this application do not limit the material of the filler 2032. In some embodiments of this application, the filler 2032 includes at least one of the following: filler adhesive, resin, and polymer material.

[0070] The filler adhesive includes at least one of photosensitive adhesive, thermosetting adhesive, and moisture-curing adhesive. In some embodiments, it may also be a mixture of two or more of these adhesives.

[0071] Among them, photosensitive adhesives can be ultraviolet (UV) curing adhesives or optically clear (OCA) adhesives. Both UV adhesives and OCA adhesives have certain light curing properties and will cure under light irradiation.

[0072] Thermosetting adhesives, for example, can be cured by heating.

[0073] Moisture-curing adhesives can react with components such as water vapor and oxygen in the air to complete the curing process.

[0074] This application embodiment does not limit the thickness of the filler material 2032, wherein the thickness of the filler material 2032 is less than or equal to the thickness of the support member. For example, the thickness of the support member is 50um-300um.

[0075] The embodiments of this application do not limit the molding method of the filling material 2032. In some embodiments of this application, the filling material 2032 is filled into the through hole by inkjet printing.

[0076] This application also provides a method for manufacturing a support member, which is used to support a display screen, such as... Figure 5 As shown, the method for manufacturing this support includes: S101. The filling material is filled into the through hole of the bent support by inkjet printing.

[0077] The display screen includes a first non-bending portion, a second non-bending portion, and a bending portion.

[0078] The support member includes: a first support member opposite to the first non-bending portion, a second support member opposite to the second non-bending portion, and a bent support member opposite to the bending portion, the bent support member being located between the first support member and the second support member.

[0079] The bending support includes a first surface opposite to the bending portion and a second surface opposite to the first surface. The bending support has one or more through holes that penetrate the first and second surfaces of the bending support.

[0080] The filler material, also known as printing ink, can be, for example, ultraviolet (UV) curing adhesive. The Young's modulus of UV curing adhesive after curing is less than that of the support component.

[0081] Compared with traditional coating technologies such as spraying, scraping, and screen printing, inkjet printing can achieve patterned coating and has the advantages of high printing accuracy and good uniformity of the printed filling material.

[0082] Inkjet printers typically include an ink cartridge and a printhead that can precisely deposit solution in the designed area, which can precisely spray the filler material (printing ink) into the through-holes of the support.

[0083] The jetting characteristics of printing ink, solution evaporation behavior, ink viscosity, and printhead diameter are all important parameters affecting resolution. In some embodiments of this application, ink viscosity, surface tension, and density need to meet the following requirements: Figure 6 Only the black printing window shown can be used to spray the glue.

[0084] in, Figure 6 The adhesive properties at the black printing window must meet the following requirements: Reynolds number Re: 100 ≤ Re ≤ 1000, Oh: 0.1 ≤ Oh ≤ 1.

[0085] When the Reynolds number of the glue is less than 100, the viscous force has a greater effect on the ink than the inertial force. The ink flow rate is reduced due to the viscous force, resulting in poor ink flow and affecting printhead ejection.

[0086] When the Reynolds number (Re) of the glue is greater than 1000, satellite dots will occur. This is because the ink viscosity is too low, causing ink to leak from the printhead and form satellite dots under high-frequency jetting.

[0087] Glue Reynolds number Re= =Inertial force / Viscous force.

[0088] Where ρ is the ink density, μ is the ink viscosity, d is the printhead diameter, and v is the printhead ink ejection speed.

[0089] When the Oh number of the glue is less than 0.1, the ink viscosity is too low, and the ink leaks out of the printhead, forming satellite dots under high-frequency spraying.

[0090] When the Oh number of the glue is greater than 1, the ink viscosity will be too high, the flow will be poor, and the printhead will be affected.

[0091] Glue Onezoglu number Oh= =Viscous force / .

[0092] S102. Curing filler material.

[0093] The height of the filler material is less than or equal to the height of the through hole, and the Young's modulus of the cured filler material is less than the Young's modulus of the support.

[0094] It should be noted that, in order to prevent the filling material from flowing out of the through hole, a bearing layer needs to be attached to one surface of the bent support before step S101.

[0095] Step S101 includes: inkjet printing on the surface of the bent support member away from the bearing layer, and filling the through hole of the bent support member with the filler material.

[0096] The embodiments of this application do not impose restrictions on the structure of the bearing layer.

[0097] In some embodiments of this application, the carrier layer is a release film.

[0098] like Figure 7 As shown, the filling material is filled into the through-hole of the bent support member by inkjet printing, including: S1011. For example Figure 8 As shown, a release film 30 is attached to one surface of the support member 20.

[0099] The release film 30 includes a first surface and a second surface opposite to each other. For example, an adhesive layer is provided on the first surface of the release film 30, and the release film 30 can be bonded to the surface of the support member 20 through the adhesive layer.

[0100] S1012. For example Figure 9 As shown, inkjet printing is performed on the surface of the bent support 203 that is away from the release film, as follows. Figure 10 As shown, filler material 2032 is filled into the through hole 2031 of the bent support 203.

[0101] The support includes a first support 201, a second support 202, and a bent support 203 located between the first support 201 and the second support 202. The filling material 2032 fills the through hole 2031 of the bent support 203.

[0102] Among them, inkjet printing is a non-contact micron-level printing process that can precisely spray printing ink (the filling material in this application) into the through hole 2031 of the bent support 203 through the inkjet printer 4.

[0103] In addition, refer to Figure 7 After step S102, the method further includes: S1013. For example... Figure 11 As shown, remove Figure 10 Release film 30 shown.

[0104] In some other embodiments of this application, the carrier layer may be a display screen.

[0105] like Figure 12 As shown, the filling material is filled into the through-hole of the support member by inkjet printing, including: S1014. For example Figure 13 As shown, the connecting support 20 and the display screen 10 are connected.

[0106] The display screen 10 is, for example, a flexible display screen, which includes a display surface and a non-display surface. The support member 20 is disposed near the non-display surface of the display screen 10, and the support member 20 can be bonded to the display screen 10 by an adhesive layer.

[0107] The support includes a first support 201, a second support 202, and a bent support 203 located between the first support 201 and the second support 202. The first support 201 supports the first non-bent portion 101 of the display screen 10, the second support 202 supports the second non-bent portion 102 of the display screen, and the bent support 203 supports the bent portion 103 of the display screen.

[0108] S1015. For example... Figure 14 As shown, inkjet printing is performed on the surface of the bent support 203 facing away from the display screen 10, and the filler material 2032 is filled into the through hole 2031 of the bent support 203.

[0109] The filling material 2032 is filled into the through hole 2031 of the bent support 203.

[0110] The ink (filler material 2032 in this application) can be precisely sprayed into the through hole 2031 of the bent support 203 by the inkjet printer 4 to obtain the following result: Figure 15 The display module 1 shown.

[0111] Therefore, compared with traditional coating technologies such as spraying, scraping, and screen printing, inkjet printing can fill the through holes of the support with filler material, achieving patterned coating with advantages such as high printing accuracy and excellent uniformity of the printed filler material.

[0112] Impact tests were performed on the electronic devices provided in the embodiments of this application, and the test results are shown in Table 1.

[0113] Table 1

[0114] Among them, filler material 1 and filler material 2 are acrylic filler adhesives, which are different in material and have different impact resistance.

[0115] It should be noted that the impact reliability of electronic equipment can be represented by the critical failure height of the electronic equipment. The critical failure height of electronic equipment can be obtained by performing a tip impact test on the electronic equipment using an impact tester. The critical failure height of electronic equipment refers to the drop height of the tip. When the drop height is exceeded, the electronic equipment will produce fragmentation points due to the impact.

[0116] As shown in Table 1, the support components made of titanium alloy have better impact resistance than those made of carbon fiber.

[0117] When the support is made of titanium alloy, the impact reliability of the electronic device is improved by 38% after filling the through hole of the support with filler material 1 compared with not filling the through hole of the support.

[0118] When the support is made of titanium alloy, the impact reliability of the electronic device is improved by 61% after filling the through hole of the support with filler material 2 compared with not filling the through hole of the support.

[0119] When the support is made of carbon fiber, the impact reliability of the electronic device is improved by 29% after filling the through hole of the support with filler material 1 compared to not filling the through hole of the support.

[0120] When the support is made of carbon fiber, the impact reliability of the electronic device is improved by 36% after filling the through hole of the support with filler material 2 compared to not filling the through hole of the support.

[0121] In summary, by adding filler material to the through holes of the support components of electronic devices, the impact resistance of the electronic devices can be improved by more than 30%.

[0122] Therefore, by placing filler material in the through hole of the support, the impact and compression resistance of electronic equipment can be improved. Moreover, the Young's modulus of the filler material is less than that of the support. When the filler material is compressed or stretched, the deformation of the filler material is greater than that of the support. Placing the filler material in the through hole of the support is beneficial to further improve the bending performance of the bending zone of the support.

[0123] The shape of the filler material 2032 is not limited in the embodiments of this application. In some embodiments of this application, Figure 15a This is a structural schematic diagram of a bending support member provided in an embodiment of this application. Figure 15b for Figure 15a A top view of the bent support component. (See attached image.) Figure 15a , Figure 15b As shown, the filling material 2032 adopts a strip structure, and the length direction of the filling material 2032 is parallel to the length direction of the bent part.

[0124] For example, the cross-sectional shape of the filler material 2032 includes: such as Figure 16 The line shape shown.

[0125] In some embodiments, such as Figure 15b As shown, the filling material further includes a first limiting part 20321, which is disposed at at least one end of the filling material along its length. The longitudinal cross-sectional dimension of the first limiting part 20321 is larger than that of the filling material, and the first limiting part engages with the through hole. Thus, the first limiting part 20321 can change the stress distribution on the support member.

[0126] For example, such as Figure 17 As shown, the filling material 2032 includes a first limiting part 20321, and the cross-sectional shape of the filling material 2032 includes a T-shape.

[0127] like Figure 18 , Figure 19 , Figure 20 As shown, the filling material 2032 includes two first limiting portions 20321, and the cross-sectional shape of the filling material 2032 includes: as shown in the figure. Figure 18 The I-shaped shape shown, and as shown Figure 19 and Figure 20 The hourglass shape shown.

[0128] In some other embodiments, the filling material 2032 further includes a second limiting portion 20322, which is disposed at at least one end of the filling material 2032 along the thickness direction. The cross-sectional dimension of the second limiting portion 20322 is larger than the cross-sectional dimension of the filling material 2032, and the second limiting portion engages with the through hole.

[0129] Therefore, the second limiting part 20322 can prevent the filling material 2032 from being squeezed out during use.

[0130] For example, such as Figure 21 As shown, the filling material 2032 includes a second limiting part 20322, and the longitudinal cross-sectional shape of the filling material 2032 includes: T-shaped.

[0131] like Figure 22 , Figure 23 , Figure 24 As shown, the filling material 2032 includes two second limiting portions 20322, and the longitudinal cross-sectional shape of the filling material 2032 includes: as shown in the figure. Figure 22 The I-shaped shape shown, and as shown Figure 23 and Figure 24 The hourglass shape shown.

[0132] like Figure 25As shown, the through-hole is filled with filler material 2032, and the impact resistance of the filler material 2032 varies at different locations. Specifically, position a is located at the first limiting part 20321 of the filler material 2032, and position b is located at the middle position of the filler material 2032. Impact tests are performed on different locations of the electronic device. Figure 25 The impact test results for the regions corresponding to positions a and b are shown in Table 2.

[0133] Table 2

[0134] According to Table 2, at position a, when there is no filling material in the through hole of the support, the critical failure height of the electronic device is 108 mm. When there is filling material in the through hole of the support, the critical failure height of the electronic device increases to 119 mm.

[0135] At position b, when there is no filling material in the through hole of the support, the critical failure height of the electronic device is 74.1 mm. When there is filling material in the through hole of the support, the critical failure height of the electronic device increases to 101 mm.

[0136] Therefore, by adding filling material into the through holes of the electronic device's support, the impact resistance of the electronic device at the corresponding position of the through hole can be improved.

[0137] Meanwhile, referring to Table 2, the failure threshold height of the electronic device in the area corresponding to position b is higher than that of the area corresponding to position a.

[0138] Therefore, compared with the areas corresponding to both ends (first limiting part 20321) of the through hole between the electronic device and the support, the area corresponding to the middle position of the electronic device and the support has better impact resistance.

[0139] Figure 26 The image shown is a top view of the electronic device provided in an embodiment of this application. Figure 26 As shown, the electronic device includes: a first flat display area 11, a second flat display area, and a hinge area 13.

[0140] An impact test was performed on the hinge area 13 of the electronic device provided in this application embodiment, and the test results are shown in Table 3.

[0141] Table 3

[0142] Table 3 shows the average test results of impact tests on 6 groups of electronic devices with no filling material in the through holes of the support components, and the average test results of impact tests on 6 groups of electronic devices with filling material in the through holes of the support components.

[0143] As shown in Table 3, compared with not setting filler material in the through hole of the support, after setting filler material in the through hole of the support, the critical failure height of the pivot area 13 of the electronic device after being impacted by the sharp point increased by 40 mm, and the critical failure height benefit increased by 61%.

[0144] Figure 27 This is a schematic diagram of the internal structure of an electronic device provided in an embodiment of this application. Figure 27 As shown, the weak areas of the pivot area 13 of the electronic device include: position A, position B, position C, position D, position E, and position F. Among them, the pivot corresponding to position A and position B is provided with small holes, and positions C, position D, position E, and position F are the gap positions between the pivot and the first planar display area 11.

[0145] Figure 28 This is a schematic diagram showing the impact test results at a weak point in the hinge area of ​​an electronic device. (Example:) Figure 28 As shown, compared with not providing filling material in the through hole of the support, after providing filling material 2032 in the through hole 2031, the impact resistance of the pivot area 13 is improved by 32% at position B, 26% at position C, 43% at position D, 59% at position E, and 44% at position F, except that position A remains flat.

[0146] Filling the through holes in the support components of electronic devices with filler material can improve the impact resistance of the electronic devices at the corresponding weak points of the pivot.

[0147] Figure 29 This is a schematic diagram illustrating the compression test results of the electronic device provided in an embodiment of this application. Figure 29 As shown, when no filler material is placed in the through-hole of the support component, the folding display screen exhibits a deeper crease after a 30-second to 1-minute compression test. After filler material is placed in the through-hole of the support component, the folding display screen exhibits a shallower crease after a 30-second to 1-minute compression test.

[0148] Therefore, by adding filling material into the through holes of the support components of electronic devices, the compressive strength of the electronic devices can be improved.

[0149] Figure 30 This is a simulation diagram of the compression test results of the electronic device provided in the embodiments of this application. The horizontal axis represents the length of each position at the bent end of the display screen from the center point, in μm, and the vertical axis represents the crease depth, in μm. It should be noted that when the horizontal axis is 0, the position is the center position of the bent end of the display screen, and when the vertical axis is 0, it indicates that there is no bend at that position of the display screen.

[0150] Line 1 shows the bending curve of the display screen when there is no filler material in the through hole of the support component. Line 2 shows the bending curve of the display screen when there is filler material in the through hole of the support component.

[0151] like Figure 30 As shown, when the support through-hole was filled with filler material, the crease of the folding display screen decreased from 201.17 micrometers to 96.92 micrometers after the support through-hole was filled with filler material.

[0152] Therefore, by adding filler material to the through holes of the support member, the depth of the display screen crease can be reduced.

[0153] The Young's modulus of the filler material also affects the compression resistance of the electronic device. Further whole-device crease tests were conducted on the electronic device provided in this application embodiment, and the test results are shown in Table 4.

[0154] Table 4

[0155] As shown in Table 4, compared with the absence of filler material in the through holes of the support member, the crease depth becomes shallower after filler material is added to the through holes of the support member. Furthermore, the crease improvement is significant as the Young's modulus of filler material 2032 increases.

[0156] This application provides a support member, a method for preparing the support member, a display module, and an electronic device. A filler material is provided in the through hole of the bending area of ​​the support member, which improves the impact and compression resistance of the electronic device. The elastic modulus of the filler material is less than that of the support member. When the filler material is compressed or stretched, the deformation of the filler material is greater than that of the support member. Placing the filler material in the through hole of the support member is beneficial to further improve the bending performance of the bending area of ​​the support member.

[0157] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any changes or substitutions within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A support member, characterized in that, The support member is used to support the display screen, which includes: a first non-bending portion, a second non-bending portion, and a bending portion; The support member includes: a first support member opposite to the first non-bent portion, a second support member opposite to the second non-bent portion, and a bent support member opposite to the bent portion, wherein the bent support member is located between the first support member and the second support member; The bending support includes a first surface opposite to the bending portion and a second surface opposite to the first surface. The bending support is provided with one or more through holes that penetrate the first surface and the second surface of the bending support. The through hole is filled with a filler material, wherein the thickness of the filler material is less than or equal to the thickness of the support member, and the elastic modulus of the filler material is less than the elastic modulus of the support member; The filling material has a second limiting part at at least one end along the thickness direction. The cross-sectional dimension of the second limiting part is larger than the cross-sectional dimension of the filling material. The second limiting part is engaged with the through hole.

2. The support member according to claim 1, characterized in that, The filling material is filled into the through-hole by inkjet printing.

3. The support member according to claim 1 or 2, characterized in that, The filler material includes at least one of the following: filler adhesive, resin, and polymer material.

4. The support member according to any one of claims 1-3, characterized in that, The filler adhesive includes at least one of photosensitive adhesive, thermosetting adhesive, and moisture-curing adhesive.

5. The support member according to claim 4, characterized in that, The filling material is strip-shaped, and the length direction of the filling material is parallel to the length direction of the bent portion.

6. The support member according to any one of claims 1-5, characterized in that, The filling material further includes a first limiting part, which is disposed at at least one end of the filling material along its length direction, and the first limiting part engages with the through hole.

7. The support member according to claim 6, characterized in that, The longitudinal cross-sectional dimension of the first limiting part is larger than the longitudinal cross-sectional dimension of the filling material.

8. The support member according to claim 6 or 7, characterized in that, The filling material includes two first limiting portions, which are disposed at both ends of the filling material along its length.

9. The support member according to any one of claims 1-8, characterized in that, The filling material includes two second limiting portions, which are disposed at both ends of the filling material along its length.

10. The support member according to any one of claims 1-9, characterized in that, The filler material satisfies at least one of the following conditions: Young's modulus is greater than 1 MPa; The glass transition temperature is less than 0℃; Stress relaxation recovery rate greater than 90%; The elasticity limit is greater than 50%.

11. The support member according to any one of claims 1-10, characterized in that, The material of the support includes at least one of the following: fiber, elemental metal, and alloy.

12. The support member according to any one of claims 1-11, characterized in that, The cross-sectional shapes of the filling material include: T-shaped, I-shaped, and hourglass-shaped.

13. The support member according to any one of claims 1-12, characterized in that, The longitudinal cross-sectional shapes of the filling material include: T-shaped, I-shaped, and hourglass-shaped.

14. The support member according to any one of claims 1-13, characterized in that, The adhesive properties of the filler material during inkjet printing meet the following conditions: Reynolds number Re: 100≤Re≤1000, Oh: 0.1≤Oh≤1.

15. The support member according to any one of claims 1-14, characterized in that, The support member is connected to the display screen via the filling material.

16. A method for preparing a support member, characterized in that, The support member is used to support the display screen, which includes: a first non-bending portion, a second non-bending portion, and a bending portion; The support member includes: a first support member opposite to the first non-bent portion, a second support member opposite to the second non-bent portion, and a bent support member opposite to the bent portion, the bent support member being located between the first support member and the second support member, the method including: The filling material is filled into the through hole of the bending support by inkjet printing. The bending support includes a first surface opposite to the bending portion and a second surface opposite to the first surface. The bending support is provided with one or more through holes that penetrate the first surface and the second surface of the bending support. The filling material is solidified; wherein the height of the filling material is less than or equal to the height of the through hole, the elastic modulus of the filling material is less than the elastic modulus of the support member, and the filling material further includes: a second limiting part, the second limiting part is disposed at at least one end of the filling material along the thickness direction, the cross-sectional dimension of the second limiting part is larger than the cross-sectional dimension of other parts of the filling material, and the second limiting part is engaged with the through hole.

17. The method for preparing the support member according to claim 16, characterized in that, The process of filling the through-hole of the bent support member with filling material by inkjet printing includes: A load-bearing layer is attached to one surface of the bent support member; Inkjet printing is performed on the surface of the bent support member opposite to the bearing layer to fill the through holes of the bent support member with the filler material.

18. The method for preparing the support member according to claim 17, characterized in that, After the filler material is cured, the method further includes: Remove the supporting layer.

19. A display module, characterized in that, The device includes a display screen and a support member as described in any one of claims 1-15; the display screen includes a display panel and a cover plate stacked together, the backlight surface of the display panel being close to the support member, and the cover plate being disposed on the light-emitting surface of the display panel.

20. The display module according to claim 19, characterized in that, The cover plate has a protective film on the side away from the display panel.

21. An electronic device, characterized in that, It includes a housing and a display module as described in claim 19 or 20, wherein the housing is disposed on the side of the support member away from the display screen.

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