A structure for improving ESD capability of a module by high-temperature adhesive tape and dispensing

Abstract

A structure for improving the ESD capacity of a module by high-temperature adhesive tape and dispensing mode, comprising: a display module, a bending area, a component area, and an FPC, wherein the lower part of the display module is connected with the FPC, the upper part of the FPC is the bending area, the lower right of the bending area is the component area, the components of the component area are arranged close to the center of the component area, and the copper foil in the bending area is not punched, the high-temperature adhesive tape size of the component area is increased to improve the protection of the components on ESD, the GIP pad protection of the glass can be realized through dispensing treatment, the copper foil in the bending area is not punched, and the inflow of ESD into the component area is prevented, and the components are protected.

Description

Technical Field

[0001] This utility model relates to the field of display module technology, and in particular to a structure that improves the ESD capability of a module by using high-temperature tape and dispensing method. Background Technology

[0002] During whole-machine testing, ESD can easily be introduced into the IC through the component area, glass gip pads, and copper foil openings, damaging the IC.

[0003] Based on this, in order to protect the component area from ESD damage, this design proposes a structure that improves the module's ESD capability by using high-temperature tape and dispensing. Utility Model Content

[0004] The purpose of this invention is to provide a structure that improves the ESD capability of a module by using high-temperature tape and dispensing.

[0005] A structure for improving the ESD capability of a module by using high-temperature tape and dispensing includes: a display module, a bending area, a component area, and an FPC, wherein the lower part of the display module is connected to the FPC, the upper part of the FPC is the bending area, the lower right of the bending area is the component area, the components in the component area are wired close to the center of the component area, and the copper foil in the bending area has no holes.

[0006] Preferably, high-temperature tape is arranged around the component area, and the area of ​​the high-temperature tape is larger than the area of ​​the component area.

[0007] Preferably, the connection between the bending area and the display module is thickened by applying adhesive.

[0008] The beneficial effects of the above scheme are:

[0009] 1. This utility model improves the protection of components against ESD by increasing the size of the high-temperature tape in the component area. At the same time, the dispensing process can achieve GIP pad protection for the glass. Furthermore, the copper foil in the bending area does not use openings to prevent ESD from flowing into the component area, thus protecting the components. Attached Figure Description

[0010] Figure 1 This is a schematic diagram of the structure of this utility model;

[0011] Figure 2 for Figure 1 Enlarged view of the structure at point A in the middle;

[0012] In the diagram: 1. Display module; 2. Bending area; 3. Component area; 4. FPC. Detailed Implementation

[0013] The present invention will be further described clearly and completely below with reference to the accompanying drawings, but the scope of protection of the present invention is not limited thereto.

[0014] according to Figure 1 , Figure 2 As shown, a structure for improving the ESD capability of a module by using high-temperature tape and dispensing includes: a display module 1, a bending area 2, a component area 3, and an FPC 4. The lower part of the display module 1 is connected to the FPC 4, the upper part of the FPC 4 is the bending area 2, and the lower right of the bending area 2 is the component area 3. The components in the component area 3 are wired close to the center of the component area 3. The copper foil in the bending area 2 is not perforated. By designing that the bending area 2 is not perforated at the connection with the display module 1, ESD intrusion into the component area can be prevented.

[0015] Specifically, high-temperature tape is arranged around the component area 3. The area of ​​the high-temperature tape is larger than the area of ​​the component area 3. By concentrating the wiring of the components in the component area 3, the components are concentrated in the center of the component area 3. At the same time, the size of the high-temperature tape is increased. During production, the high-temperature tape around the components is pressed by hand to protect the components. After protection, ESD will not be directly introduced to the components.

[0016] Specifically, the connection between the bending area 2 and the display module 1 is thickened by applying adhesive. This thickening process is to prevent ESD penetration during the ESD test, which could damage the glass. By thickening the glass, ESD intrusion can be effectively prevented, thus protecting the glass in the display module 1.

Claims

1. A structure for improving the ESD capability of a module through high-temperature adhesive tape and dispensing, comprising: The display module (1), bending area (2), component area (3), and FPC (4) are characterized in that the lower part of the display module (1) is connected to the FPC (4), the upper part of the FPC (4) is the bending area (2), the lower right side of the bending area (2) is the component area (3), the components of the component area (3) are wired close to the center of the component area (3), and the copper foil in the bending area (2) is not perforated; high temperature tape is arranged around the component area (3), and the area of ​​the high temperature tape is larger than the area of ​​the component area (3); the connection between the bending area (2) and the display module (1) is thickened by dispensing glue.

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