IGBT module reflow soldering tooling
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- NINGBO JISAI SEMICON CO LTD
- Filing Date
- 2025-06-16
- Publication Date
- 2026-06-19
Smart Images
Figure CN224373002U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of electronic component manufacturing technology, and in particular to an IGBT module reflow soldering fixture. Background Technology
[0002] In the field of electronic component manufacturing, especially in the production of IGBT modules, reflow soldering technology is widely used. Reflow soldering melts solder paste by heating, firmly welding electronic components to the substrate, and has advantages such as high welding quality and good production efficiency. This technology has effectively promoted the automation and large-scale production of electronic components, and improved the reliability and consistency of products. In the existing IGBT module reflow soldering process, specifically, the existing process in the workshop is to place multiple assembled IGBT semi-finished modules on a reflow tray and then send them into the ETC reflow oven for soldering. The IGBT semi-finished modules include a copper base plate brushed with solder paste, a DBC, and a DBC positioning plate.
[0003] However, during the soldering process, due to incomplete evaporation of the flux in the solder paste, large areas of difficult-to-remove stains can easily form on the bottom of the copper base plate. These stains not only affect the heat dissipation performance of the copper base plate and reduce the overall performance of the product, but also affect the aesthetics of the product. In addition, cleaning these stains requires extra time and manpower, leading to reduced production efficiency. At the same time, if the ETC reflow oven malfunctions during the soldering process, the IGBT semi-finished modules in the reflow tray may collide, causing DBC misalignment or scratches, which in turn leads to product scrapping or rework, increasing production costs. Utility Model Content
[0004] The purpose of this invention is to provide an IGBT module reflow soldering fixture, which aims to solve the technical problem that in the existing soldering process, due to incomplete evaporation of flux in the solder paste, large areas of difficult-to-remove stains are easily formed on the bottom of the copper base plate. These stains not only affect the heat dissipation performance of the copper base plate and reduce the overall performance of the product, but also affect the aesthetics of the product. In addition, cleaning these stains requires extra time and manpower, resulting in reduced production efficiency. At the same time, if the ETC reflow oven malfunctions during the soldering process, the IGBT semi-finished modules in the reflow tray may collide, causing DBC misalignment or scratches, which in turn leads to product scrapping or rework, increasing production costs.
[0005] To achieve the above objectives, this utility model employs an IGBT module reflow soldering fixture, comprising a positioning pin, a screw body, and a base. Each positioning pin has a screw hole below it, and the base has a through hole. The positioning pin is fixedly connected to the base via the screw body and is located on the upper surface of the base, with the screw body located in the corresponding screw hole and through hole.
[0006] Each of the positioning pins has a positioning end on its upper part, and the positioning end is adapted to the positioning holes at both ends of the DBC positioning plate and the copper base plate.
[0007] The upper surface of the base has multiple placement through holes, and the IGBT semi-finished module is located directly above the placement through holes.
[0008] The number of the positioning pins and the screw body is four sets, and the four sets of positioning pins are arranged horizontally on the upper surface of the base.
[0009] Each group of four positioning pins is arranged longitudinally on the upper surface of the base.
[0010] This utility model discloses an IGBT module reflow soldering fixture, comprising locating pins, screw bodies, and a base. Each locating pin has a screw hole at its bottom, and the base has a through hole. By setting the locating pins on the base, flux residue is allowed to flow out through the reflow tray hole along the locating pins during the soldering process, thereby preventing large-area stains from forming on the bottom of the copper base plate. This improves the heat dissipation performance of the copper base plate and the overall performance of the product, while maintaining the product's aesthetics. It also saves time and manpower for cleaning stains, increasing production efficiency. In addition, the design of the locating pins can effectively prevent collisions between IGBT semi-finished modules during soldering, avoiding DBC misalignment or scratches, reducing the risk of product scrap or rework, and lowering production costs. Attached Figure Description
[0011] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0012] Figure 1 This is a three-dimensional perspective view of the IGBT module reflow soldering fixture of this utility model.
[0013] Figure 2 This is a disassembled schematic diagram of the IGBT module reflow soldering fixture of this utility model.
[0014] Figure 3 This is a schematic diagram of the combination of the IGBT module reflow soldering fixture and the IGBT module of this utility model.
[0015] 1-Positioning pin, 2-Screw body, 3-Base, 4-Through hole, 5-Positioning end, 6-Placement through hole, 7-DBC positioning plate, 8-Copper base plate, 9-DBC, 10-Return carrier plate. Detailed Implementation
[0016] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.
[0017] Please see Figures 1 to 3 This utility model provides an IGBT module reflow soldering fixture, including a positioning pin 1, a screw body 2 and a base 3. Each positioning pin 1 has a screw hole below it, and the base 3 has a through hole 4. The positioning pin 1 is fixedly connected to the base 3 through the screw body 2 and is located on the upper end face of the base 3. The screw body 2 is located in the corresponding screw hole and through hole 4.
[0018] In this embodiment, the combination design of the positioning pin 1, the screw body 2 and the base 3 achieves a stable connection between the positioning pin 1 and the base 3. This structure not only ensures the overall stability of the tooling, but also enables the positioning pin 1 to accurately guide the placement of the IGBT semi-finished module, thereby improving the accuracy and consistency of welding and effectively avoiding welding defects caused by module position displacement during the welding process.
[0019] Furthermore, each of the positioning pins 1 is provided with a positioning end 5 above it, and the positioning end 5 is adapted to the positioning holes at both ends of the DBC positioning plate 7 and the copper base plate 8.
[0020] In this embodiment, precise positioning ensures that the copper base plate 8 and the DBC positioning plate 7 maintain the correct relative position during the welding process, thereby avoiding poor welding or product performance degradation caused by positional deviation.
[0021] Furthermore, the upper surface of the base 3 has multiple placement through holes 6, and the IGBT semi-finished module is located directly above the placement through holes 6.
[0022] In this embodiment, this design not only improves the utilization rate of tooling, but also facilitates independent operation and monitoring of each module during the welding process, thereby improving production efficiency and product quality.
[0023] Furthermore, there are four sets of the positioning pins 1 and the screw bodies 2, wherein the four sets of positioning pins 1 are arranged horizontally on the upper surface of the base 3.
[0024] In this embodiment, this layout design enables the tooling to process multiple IGBT semi-finished modules simultaneously, improving welding efficiency. At the same time, the even distribution of the four sets of positioning pins 1 ensures that the tooling has better stability and durability when subjected to thermal and mechanical stress during the welding process.
[0025] Furthermore, each group of positioning pins 1 consists of four pins, and the four positioning pins 1 are arranged longitudinally on the upper surface of the base 3.
[0026] In this invention, when soldering IGBT modules, the reflow tray 10 is first placed flat on a table. Then, the reflow soldering fixture is placed into the reflow tray 10. Next, the operator picks up the copper base plate 8 with solder paste on its surface and precisely places it onto the reflow soldering fixture along the positioning pins 1, ensuring that the copper base plate 8 is aligned with the placement through-holes 6 on the fixture. Then, the DBC positioning plate 7 is picked up and similarly placed onto the copper base plate 8 along the positioning pins 1. The slots on the DBC positioning plate 7 are used to position the DBC9, ensuring that the DBC9 is aligned with the copper base plate 8. After precise alignment between the base plates 8, the reflow tray 10 containing the IGBT semi-finished modules is placed into the ETC reflow oven for soldering. During the soldering process, flux residue will flow out from the holes of the reflow tray 10 through the positioning pins 1 of the reflow soldering fixture, thereby avoiding the formation of large areas of stains on the bottom of the copper base plates 8. At the same time, the design of the positioning pins 1 also effectively prevents collisions between the IGBT semi-finished modules during the soldering process, protecting the DBC9 from displacement or scratches, and improving the product yield and production efficiency.
[0027] The above-disclosed embodiments are merely preferred embodiments of the present utility model and should not be construed as limiting the scope of the present utility model. Those skilled in the art can understand that implementing all or part of the above-described embodiments and making equivalent changes in accordance with the claims of the present utility model are still within the scope of the utility model.
Claims
1. A reflow soldering fixture for IGBT modules, characterized in that, The device includes a locating pin, a screw body, and a base. Each locating pin has a screw hole at its bottom, and the base has a through hole. The locating pin is fixedly connected to the base via the screw body and is located on the upper surface of the base. The screw body is located in the corresponding screw hole and through hole.
2. The IGBT module reflow soldering fixture as described in claim 1, characterized in that, Each of the positioning pins has a positioning end on its upper part, and the positioning end is adapted to the positioning holes at both ends of the DBC positioning plate and the copper base plate.
3. The IGBT module reflow soldering fixture as described in claim 2, characterized in that, The upper surface of the base has multiple placement through holes, and the IGBT semi-finished module is located directly above the placement through holes.
4. The IGBT module reflow soldering fixture as described in claim 3, characterized in that, The number of the locating pins and the screw bodies is four sets, wherein the four sets of locating pins are arranged horizontally and sequentially on the upper surface of the base.
5. The IGBT module reflow soldering fixture as described in claim 4, characterized in that, Each group consists of four positioning pins, which are arranged longitudinally on the upper surface of the base.