A metal product hole processing and polishing device

Abstract

The utility model relates to a kind of metal product hole processing polishing device, including first workstation and second workstation, the first workstation is provided with the polishing mechanism of the inner and outer surface of sleeve is polished simultaneously, and the second workstation is provided with the limiting mechanism of the sleeve during polishing is limited, and the second workstation is also provided with the pusher mechanism of the sleeve is pushed, by above-mentioned mechanism mutual cooperation, the inner and outer surface of sleeve is polished and cleaned simultaneously, effectively solve the technical problem that its operation reliability is influenced by the stain after the mixture of processing residual metal scrap or machine oil and long-term running accumulated dust due to sleeve after hole processing procedure, such as drilling, boring.

Description

Technical Field

[0001] This application relates to the field of surface treatment equipment technology, and more specifically, it relates to a device for machining and grinding holes in metal products. Background Technology

[0002] In the field of metal processing, the internal bushing of a fan is a key transmission component, and the surface finish of its inner and outer surfaces directly affects the fan's assembly accuracy, operational stability, and service life. After drilling, boring, and other hole-making processes, the inner hole and outer surface of the bushing are often contaminated with residual metal shavings or a mixture of machine oil and dust accumulated over long-term operation, affecting its operational reliability. Utility Model Content

[0003] In view of the shortcomings of the prior art, the purpose of this application is to provide a metal product hole processing and grinding device, including a first worktable and a second worktable. The first worktable is provided with a grinding mechanism for grinding the inner and outer surfaces of the bushing simultaneously, and the second worktable is provided with a limiting mechanism for limiting the bushing during grinding. The second worktable is also provided with a pushing mechanism for pushing the bushing.

[0004] Preferably, the polishing mechanism includes a first motor installed at the bottom of the first worktable, and a first brush is driven to one end of the first motor. A bushing is placed on the first brush, and the first motor drives the first brush to polish the lower half of the bushing.

[0005] Preferably, the grinding mechanism further includes a fixed base installed on the top of the first worktable and a lifting plate that moves up and down on the side of the fixed base. A second motor is installed on the top of the lifting plate, and one end of the second motor is connected to a second brush that simultaneously grinds the upper half of the bushing. A mounting plate is provided on the side of the fixed base, and a first cylinder is installed on the mounting plate. The first cylinder is connected to the lifting plate.

[0006] Preferably, the limiting mechanism includes a guide plate installed on the top of the first worktable to guide the bushing and a gantry frame installed on the top of the second worktable. A second cylinder is installed on the gantry frame, and one end of the second cylinder drives a limiting block that is aligned and cooperates with the guide plate to abut and limit the bushing.

[0007] Preferably, the pushing mechanism includes a moving table, and a third cylinder is provided on the top of the moving table. One end of the third cylinder drives a moving beam. Limiting plates that limit the two sides of the top of the moving beam are respectively provided to limit the two sides of the bushing. The third cylinder drives the moving beam together with the limiting plates to move in the Y-axis direction.

[0008] Preferably, the pushing mechanism further includes a first mounting frame disposed at the bottom of the second worktable, and the first mounting frame is provided with a fourth cylinder that is driven and connected to the moving table, and the fourth cylinder drives the moving table together with the limiting plate and the bushing to move simultaneously in the X-axis direction to push the material.

[0009] Preferably, a second mounting bracket is provided on each of the two sides of the top of the second workbench, and a sensor for limiting the movement range of the moving stage and a buffer for buffering the moving stage are respectively installed on the second mounting bracket, and the buffer is located on the side of the sensor.

[0010] In summary, the beneficial effects of this application are as follows:

[0011] The bushing to be ground and cleaned is placed in the grinding mechanism, and then the bushing is limited by the limiting mechanism. After the bushing is in the correct position, the grinding mechanism can grind the inner and outer surfaces of the bushing simultaneously, thereby cleaning the dirt and grime that is a mixture of residual metal shavings, machine oil and dust accumulated over long-term operation. After the bushing is ground and cleaned, the limiting mechanism is driven to reset, at which point the bushing is in an unlimited state. Finally, the cleaning bushing is pushed out by the pushing mechanism. Through the cooperation of the above mechanisms, the inner and outer surfaces of the bushing are ground and cleaned simultaneously, effectively solving the technical problem that the inner and outer surfaces of the bushing are often affected by dirt and grime that is a mixture of residual metal shavings or machine oil and dust accumulated over long-term operation after drilling, boring and other hole processing processes, which affects the reliability of the bushing. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the overall structure of a metal product hole processing and grinding device;

[0013] Figure 2 This is a schematic diagram of the limiting mechanism;

[0014] Figure 3 This is another structural diagram of the limiting mechanism;

[0015] Figure 4 This is another structural schematic diagram of a hole-processing and grinding device for metal products;

[0016] Figure 5 This is another structural schematic diagram of a metal product hole processing and grinding device.

[0017] Reference numerals in the attached drawings: 1. First worktable; 2. Second worktable; 3. Grinding mechanism; 301. First motor; 302. First brush; 303. Fixed seat; 304. Lifting plate; 305. Second motor; 306. Second brush; 307. Mounting plate; 308. First cylinder; 309. First slide rail; 4. Limiting mechanism; 401. Guide plate; 402. Gantry frame; 403. Second cylinder; 404. Limiting block; 5. Pushing mechanism; 501. Moving table; 502. Third cylinder; 503. Moving beam; 504. Limiting plate; 505. First mounting frame; 506. Fourth cylinder; 507. Second slide rail; 508. Third slide rail; 6. Second mounting frame; 7. Sensor; 8. Buffer; 9. Bushing. Detailed Implementation

[0018] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0019] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly or indirectly attached to that other component. When a component is referred to as being "connected to" another component, it can be directly or indirectly connected to that other component.

[0020] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0021] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0022] A device for machining and grinding holes in metal products, see [link / reference] Figures 1 to 5The system includes a first worktable 1 and a second worktable 2. The first worktable 1 is equipped with a grinding mechanism 3 for simultaneously grinding the inner and outer surfaces of the bushing 9, and the second worktable 2 is equipped with a limiting mechanism 4 for limiting the bushing 9 during grinding, and a pushing mechanism 5 for pushing the bushing 9. The bushing 9 to be ground and cleaned is placed at the grinding mechanism 3, and then the bushing 9 is limited by the limiting mechanism 4. After the bushing 9 is in the correct position, the grinding mechanism 3 can simultaneously grind the inner and outer surfaces of the bushing 9, thereby removing the residual metal shavings on the bushing 9. The bushing 9 is cleaned by mixing the oil with the dust accumulated over long-term operation. After the bushing 9 is cleaned, the limiting mechanism 4 is driven to reset. At this time, the bushing 9 is in an unlimited state. Finally, the pushing mechanism 5 pushes the cleaned bushing 9 out of the box. Through the cooperation of the above mechanisms, the inner and outer surfaces of the bushing 9 are cleaned at the same time. This effectively solves the technical problem that the inner hole and outer surface of the bushing 9 are often affected by the metal shavings or oil mixed with the dust accumulated over long-term operation after drilling, boring and other hole processing processes, which affect its operational reliability.

[0023] The polishing mechanism 3 includes a first motor 301 installed at the bottom of the first worktable 1, with one end of the first motor 301 driving a first brush 302. A bushing 9 is placed on the first brush 302, and the first motor 301 drives the first brush 302 to polish the lower half of the bushing 9. The polishing mechanism 3 also includes a fixed base 303 installed on the top of the first worktable 1 and a lifting plate 304 that moves up and down along the side of the fixed base 303. A [missing information - likely a device or structure] is installed on the top of the lifting plate 304. A second motor 305 is connected to a second brush 306 at one end, which simultaneously polishes the upper half of the bushing 9. A mounting plate 307 is provided on the side of the fixed base 303, and a first cylinder 308 is mounted on the mounting plate 307. The first cylinder 308 is driven by a lifting plate 304. When the bushing 9 to be polished is located at the bristles of the first brush 302, the lower half of the bushing 9 is pressed into the first brush 302 due to its own weight. The bristles of brush 302 will contact the outer and inner surfaces of the lower half of bushing 9 respectively. Then, the bushing 9 will be limited by the limiting mechanism 4. After the bushing 9 is in the correct position, the lifting plate 304, together with the second motor 305 and the second brush 306, will be driven by the first cylinder 308 to move towards the bushing 9 until the bristles of the second brush 306 will contact the outer and inner surfaces of the upper half of bushing 9 respectively. Then, the first motor 301 and the second motor 305 will be started at the same time. When the first motor 301 and the second motor 305 are working, they will drive the first brush 302 and the second brush 306 to rotate at the same time. The rotating bristles will polish the outer and inner surfaces of bushing 9 at the same time, thereby cleaning the metal debris and stains on bushing 9. In this embodiment, the fixed base 303 is provided with a plurality of first slide rails 309 to improve the stability of the lifting plate 304, together with the second cylinder 403 and the second brush 306 when they are raised and lowered on its side.

[0024] The limiting mechanism 4 includes a guide plate 401 installed on the top of the first workbench 1 to guide the bushing 9 and a gantry frame 402 installed on the top of the second workbench 2. A second cylinder 403 is installed on the gantry frame 402, and one end of the second cylinder 403 drives a limiting block 404 that aligns with the guide plate 401 to abut and limit the bushing 9. When the lower half of the bushing 9 is pressed into the first brush 302 due to its own weight, the middle part of the bushing 9 is at this time The outer surface will contact the side of the guide plate 401. Then, the second cylinder 403 drives the limiting block 404 to move towards the bushing 9 until the bushing 9 is abutted between the guide plate 401 and the limiting block 404. Through the alignment and cooperation between the guide plate 401 and the limiting block 404, the bushing 9 is limited. After the bushing 9 is in the correct position, the second brush 306 and the first brush 302 can cooperate to polish and clean the bushing 9.

[0025] The pushing mechanism 5 includes a movable stage 501, and a third cylinder 502 is provided on the top of the movable stage 501. One end of the third cylinder 502 is driven and connected to a movable beam 503. Limiting plates 504 are respectively provided on both sides of the top of the movable beam 503 to limit the two sides of the bushing 9. The third cylinder 502 drives the movable beam 503 together with the limiting plates 504 to move in the Y-axis direction. The pushing mechanism 5 also includes a first mounting frame 505 provided at the bottom of the second worktable 2. A fourth cylinder 506 is provided on the first mounting frame 505 and driven and connected to the movable stage 501. The fourth cylinder 506 drives the movable stage 501 together with the limiting plates 504 and the bushing 9 to move simultaneously in the X-axis direction to push the material. After the bushing 9 is polished and cleaned, it is only necessary to first reset the limiting mechanism 4. At this time, the bushing 9 is in an unlimited state. Then, the third cylinder 502 drives the movable beam 503 together with the limiting plates 504 to move in the Y-axis direction to push the material. The moving beam 503, together with the limiting plate 504, moves towards the bushing 9 until the bushing 9 is secured between the limiting plates 504. Then, the fourth cylinder 506 drives the moving table 501, together with the limiting plate 504 and the bushing 9, to move to the side until the bushing 9 is pushed from the first brush 302 onto the first worktable 1, thereby realizing the unloading action of the cleaned bushing 9. In this embodiment, the limiting block 404 is movably placed on the top of the moving beam 503, and the second cylinder 403 drives the limiting block 404 to move on the top of the moving beam 503. The top sides of the moving table 501 are respectively provided with second slide rails 507 to improve the stability of the moving beam 503 and the limiting plate 504 when moving. The top sides of the second worktable 2 are also provided with third slide rails 508 to improve the stability of the moving table 501, the limiting plate 504 and the bushing 9 when moving.

[0026] The second workbench 2 has a second mounting bracket 6 on each of its top two sides. The second mounting bracket 6 is equipped with a sensor 7 for limiting the movement range of the moving stage 501 and a buffer 8 for buffering the moving stage 501. The buffer 8 is located on the side of the sensor 7. The sensor 7 can be a known technology, such as a proximity sensor of model SS12-08NON. The specific selection and configuration of the sensor 7 is not an innovation of this utility model and can be implemented with reference to the prior art, so it will not be described in detail. The buffer 8 can also be a known technology, such as a standard automatic compensation hydraulic buffer 8 of model ACA3650-3F. The specific selection and configuration of the buffer 8 is not an innovation of this utility model and can be implemented with reference to the prior art, so it will not be described in detail.

[0027] The above embodiments are merely explanations of this application and are not intended to limit it. After reading this specification, those skilled in the art can make modifications to these embodiments without contributing any inventive step, but such modifications are protected by patent law as long as they fall within the scope of the claims of this application.

Claims

1. A metal article hole processing polishing apparatus characterized by, It includes a first worktable and a second worktable. The first worktable is provided with a grinding mechanism for simultaneously grinding the inner and outer surfaces of the bushing, and the second worktable is provided with a limiting mechanism for limiting the bushing during grinding. The second worktable is also provided with a pushing mechanism for pushing the bushing.

2. A metal article hole processing and polishing apparatus according to claim 1, wherein The polishing mechanism includes a first motor installed at the bottom of the first worktable, and a first brush is connected to one end of the first motor. A bushing is placed on the first brush, and the first motor drives the first brush to polish the lower half of the bushing.

3. A metal product hole processing polishing apparatus according to claim 1, wherein The grinding mechanism also includes a fixed base installed on the top of the first worktable and a lifting plate that moves up and down on the side of the fixed base. A second motor is installed on the top of the lifting plate, and one end of the second motor is connected to a second brush that simultaneously grinds the upper half of the bushing. A mounting plate is provided on the side of the fixed base, and a first cylinder is installed on the mounting plate. The first cylinder is connected to the lifting plate.

4. The apparatus of claim 1 wherein, The limiting mechanism includes a guide plate installed on the top of the first worktable to guide the bushing and a gantry frame installed on the top of the second worktable. A second cylinder is installed on the gantry frame, and one end of the second cylinder drives a limiting block that is aligned and cooperates with the guide plate to abut and limit the bushing.

5. The apparatus of claim 1 wherein, The pushing mechanism includes a moving table, and a third cylinder is provided on the top of the moving table. One end of the third cylinder drives a moving beam. Limiting plates that limit the two sides of the top of the moving beam are respectively provided to limit the two sides of the bushing. The third cylinder drives the moving beam together with the limiting plates to move in the Y-axis direction.

6. A metal article hole processing and polishing apparatus according to claim 5, wherein The pushing mechanism also includes a first mounting frame disposed at the bottom of the second worktable, and a fourth cylinder connected to the moving table is disposed on the first mounting frame. The fourth cylinder drives the moving table, together with the limiting plate and the bushing, to move simultaneously in the X-axis direction to push the material.

7. A metal product hole processing polishing apparatus according to claim 5, wherein The second workbench is provided with a second mounting bracket on each of its top two sides. The second mounting bracket is provided with a sensor that limits the movement range of the moving platform and a buffer that buffers the moving platform. The buffer is located on the side of the sensor.

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