A vibration shock test tool for packaging a power semiconductor module
By designing a split-type vibration and shock testing fixture, the problem of not being able to replace modules of different sizes in the existing technology is solved, realizing detachable installation and fixation, reducing costs and improving applicability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- JIANGSU ELECTRONIC INFORMATION PROD QUALITY SUPERVISION & INSPECTION INST (JIANGSU INFORMATION SECURITY EVALUATION CENT)
- Filing Date
- 2025-07-03
- Publication Date
- 2026-06-19
AI Technical Summary
Existing vibration and shock testing fixtures are monolithic structures that cannot be replaced according to different sizes of packaged power semiconductor modules, resulting in high user costs and limited applicability.
A split-type vibration and shock testing fixture was designed, including a vibration and shock testing fixture plate and a semiconductor mounting module. By using a combination of limiting plates, locking screws and clamping parts, modules of different sizes can be detached, installed and fixed.
It enables replacement according to the needs of semiconductor modules of different sizes, reduces the user's operating costs, improves the applicability and stability of the test fixture, and avoids the phenomenon of wire stripping.
Smart Images
Figure CN224382766U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of vibration and shock testing fixture technology, specifically relating to a vibration and shock testing fixture for packaged power semiconductor modules. Background Technology
[0002] During the production and processing of packaged power semiconductor modules, vibration and shock performance testing is required. Generally, the packaged power semiconductor module workpiece is fixed to the vibration and shock testing fixture with screws, and the vibration and shock testing fixture is fixed to the table of the vibration table or the impact machine with bolts. The vibration and shock energy of the vibration table (or impact machine) is transmitted to the test sample without distortion or amplification through mechanical connection, ensuring that the test sample is subjected to the specified test stress and avoiding damage to the semiconductor module when the packaged power semiconductor module workpiece is directly connected to the vibration table for vibration or shock testing.
[0003] Vibration and shock testing fixtures are generally square, three-dimensional plates with grooves. Encapsulated power semiconductor modules are fixed inside the grooves with screws. However, the grooves on the vibration and shock testing fixtures can only be used for semiconductor modules of specific sizes. This means that users need to purchase corresponding models of testing fixtures when testing modules of different sizes, resulting in high operating costs. There is an urgent need for improvement as the fixtures cannot be changed according to the needs of different sized semiconductor modules, which is a shortcoming.
[0004] Existing vibration and shock testing fixtures have the problem that, being an integral structure, they cannot be replaced according to the needs of semiconductor modules of different sizes. To address this, this application proposes a vibration and shock testing fixture for packaged power semiconductor modules. Utility Model Content
[0005] The purpose of this invention is to provide a vibration and shock testing fixture for packaged power semiconductor modules, in order to solve the problem that the vibration and shock testing fixture mentioned in the background art is an integral structure and cannot be replaced according to the needs of semiconductor modules of different sizes.
[0006] To achieve the above objectives, this utility model provides the following technical solution: a vibration and shock testing fixture for packaged power semiconductor modules, comprising...
[0007] A vibration and shock test fixture assembly for fixing packaged power semiconductor modules includes a split vibration and shock test fixture plate and a semiconductor mounting module, fixture plate fixing bolts that penetrate the vibration and shock test fixture plate, a semiconductor mounting slot is formed on the surface of the semiconductor mounting module, a semiconductor mounting screw penetrates the semiconductor mounting module, and protrusions are welded on both ends of the semiconductor mounting module.
[0008] The clamping component includes a welded clamping block and protrusions, and fixing blocks symmetrically distributed on both sides of the clamping block, with a locking block fixed to the bottom surface of the fixing block;
[0009] The locking assembly includes a limiting plate, a first locking screw penetrating the end of the limiting plate, a vertically connected limiting rod and mounting plate, and a second locking screw penetrating the mounting plate.
[0010] Preferably, the two ends of the limiting plate are right-angled structures, and a limiting groove b is formed on the surface of the limiting plate for the protrusion to pass through.
[0011] Preferably, the surface of the vibration and shock test fixture plate is provided with a module slot for mounting a semiconductor mounting module, and the side surface of the vibration and shock test fixture plate is provided with a square slot for embedding a protrusion. The module slot is connected to the square slot, and the surfaces of the vibration and shock test fixture plate and the semiconductor mounting module are flush.
[0012] Preferably, the surface of the fixing block is provided with a first circular hole a, the surface of the limiting plate is provided with a second circular hole c, and the limiting rod passes through the first circular hole a and the second circular hole c.
[0013] Preferably, the surface of the semiconductor mounting module has a recessed slot that mates with the card block.
[0014] Preferably, the fixing block is a right-angled triangular three-dimensional structure, and the protruding bottom surface has a concave screw groove d, and the semiconductor module fixing screw cooperates with the screw groove d.
[0015] Preferably, the second locking screw passes through one end of the mounting plate and is fixed to the limiting plate by threaded engagement. The horizontal plane at the top edge of the fixing block is the S-plane, and the top surface of the limiting plate is flush with the S-plane.
[0016] Compared with the prior art, the beneficial effects of this utility model are:
[0017] 1. In this utility model, the designed split vibration and impact test fixture plate and semiconductor mounting module can be used to replace the semiconductor mounting module according to the requirements of semiconductor modules of different sizes, so that different semiconductor module mounting slots can be used for semiconductor modules of different sizes.
[0018] 2. In this utility model, the vibration and impact test fixture plate and the semiconductor mounting module are fixed together by means of the designed limiting plate and the first locking screw, under the synergistic action of the limiting plate and the first locking screw.
[0019] 3. In this utility model, the design of the pressure block and the protrusions is used to press the semiconductor module fixing screws tightly, thereby preventing the screws from slipping during the vibration test and causing the semiconductor module fixing screws to move upwards. Attached Figure Description
[0020] Figure 1 This is a top view of the structure of this utility model;
[0021] Figure 2 For the present utility model Figure 1 Enlarged structural diagram of section B in the middle;
[0022] Figure 3 This is a three-dimensional structural diagram of the pressing block and fixing block of this utility model;
[0023] Figure 4 This is a three-dimensional structural diagram of the limiting plate of this utility model;
[0024] Figure 5 This is a bottom view of the pressing block and fixing block of this utility model.
[0025] Figure 6 This is a three-dimensional structural diagram of the mounting plate of this utility model;
[0026] Figure 7 This is a top view of the semiconductor mounting module of this utility model.
[0027] In the diagram: 1. Vibration and impact test fixture plate; 2. Fixture plate fixing bolts; 3. Semiconductor mounting module; 4. Limiting plate; 31. Protrusion; 32. Semiconductor module fixing screw; 33. Slot; 34. Semiconductor module mounting slot; 41. First locking screw; 51. Limiting rod; 52. Mounting plate; 53. Second locking screw; 61. Pressure block; 62. Fixing block; 63. Locking block; 611. Protrusion. Detailed Implementation
[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0029] Please see Figures 1 to 7 This utility model provides a technical solution: a vibration and shock testing fixture for packaged power semiconductor modules, including a vibration and shock testing fixture assembly for fixing the packaged power semiconductor modules, comprising a split vibration and shock testing fixture plate 1 and a semiconductor mounting module 3, and fixture plate fixing bolts 2 penetrating the vibration and shock testing fixture plate 1. Figure 1In this designation, A represents a packaged power semiconductor module workpiece, denoted as module workpiece A. The vibration and shock test fixture plate 1 is fixed to an external experimental vibration table device using fixture plate fixing bolts 2. A semiconductor module mounting slot 34 is formed on the surface of the semiconductor mounting module 3, and a semiconductor module fixing screw 32 passes through it. Module workpiece A is installed in the semiconductor module mounting slot 34 and fixed by the semiconductor module fixing screw 32. The semiconductor module mounting slot 34 has the same geometry as the corresponding module workpiece A. The vibration and shock test fixture plate 1 and the semiconductor mounting module 3 are separate structures. The vibration and shock test in this application is a detachable fixture. Different semiconductor mounting modules 3 have different sizes and shapes of semiconductor module mounting slots 34. Different semiconductor mounting modules 3 can be replaced as needed, or multiple semiconductor mounting modules 3 can be combined to test module workpieces A of different sizes and models. Both ends of the semiconductor mounting module 3 are welded with protrusions 31, which engage with the side of the vibration and shock test fixture plate 1. A clamping component, including a welded clamping block 61, is also included. The pressure block 61 and the protrusion 611 are symmetrically distributed on both sides of the pressure block 61. A locking block 63 is fixed to the bottom surface of the locking block 62. The pressure block 61 and the protrusion 611 press the semiconductor module fixing screw 32 of the workpiece A, preventing the semiconductor module fixing screw 32 from slipping and moving upwards under vibration. The locking block 63 is embedded inside the semiconductor mounting module 3 and is constrained by the semiconductor mounting module 3, preventing the locking block 63 from shaking on the surface of the semiconductor mounting module 3. The locking assembly includes a limiting plate 4, a first locking screw 41 penetrating the end of the limiting plate 4, and a vertical... The limiting rod 51 and the mounting plate 52 are connected, and the second locking screw 53 passes through the mounting plate 52. The limiting plate 4 is installed on the outer side of the vibration and impact test fixture plate 1. The protrusion 31 passes through the limiting plate 4 and is limited and fixed by the limiting plate 4. Under the locking action of the first locking screw 41, the limiting plate 4 is fixed to the vibration and impact test fixture plate 1, thereby fixing the protrusion 31. The limiting rod 51 passes through the fixing block 62. The mounting plate 52 is fixed to the limiting plate 4 by the second locking screw 53, thereby keeping the limiting rod 51 in a fixed state and limiting the fixing block 62.
[0030] In this embodiment, the limiting plate 4 has right-angled structures at both ends. A limiting groove b is provided on the surface of the limiting plate 4 for the protrusion 31 to pass through. A module groove for mounting the semiconductor mounting module 3 is provided on the surface of the vibration and impact test fixture plate 1. A square groove for the protrusion 31 to be embedded is provided on the side surface of the vibration and impact test fixture plate 1. The module groove is connected to the square groove. The surfaces of the vibration and impact test fixture plate 1 and the semiconductor mounting module 3 are flush. The protrusion 31 is engaged with the side position of the vibration and impact test fixture plate 1 to achieve the function of limiting the protrusion 31 and the semiconductor mounting module 3.
[0031] In this embodiment, a first circular hole a is provided on the surface of the fixing block 62, a second circular hole c is provided on the surface of the limiting plate 4, and a limiting rod 51 passes through the first circular hole a and the second circular hole c. The limiting rod 51 passes through the limiting plate 4 and the fixing block 62 to achieve positioning of the fixing block 62.
[0032] In this embodiment, a recessed slot 33 is formed on the surface of the semiconductor mounting module 3 to cooperate with the card block 63. The card block 63 is embedded inside the semiconductor mounting module 3 and is constrained by the semiconductor mounting module 3 to prevent the card block 63 from shaking on the surface of the semiconductor mounting module 3.
[0033] In this embodiment, the fixing block 62 is a right-angled triangular three-dimensional structure. The bottom surface of the protrusion 611 is provided with a concave screw groove d. The semiconductor module fixing screw 32 cooperates with the screw groove d. The protrusion 611 is a cuboid structure. The protrusion 611 presses the semiconductor module fixing screw 32 to avoid stripping. The semiconductor module fixing screw 32 moves upward.
[0034] In this embodiment, the second locking screw 53 passes through one end of the mounting plate 52 and is fixed to the limiting plate 4 by screwing. The horizontal plane where the top edge of the fixing block 62 is located is the S-plane. The top surface of the limiting plate 4 is flush with the S-plane. The limiting plate 4 and the fixing block 62 are in a corresponding state so that the limiting rod 51 can pass through the fixing block 62.
[0035] Working principle and usage process of this utility model:
[0036] The vibration and shock test fixture plate 1 and the semiconductor mounting module 3 are separate structures. The vibration and shock test of this application is a detachable fixture. The semiconductor module mounting slots 34 opened on different semiconductor mounting modules 3 are different in size and shape. The semiconductor module mounting slots 34 are the same as the geometry of the corresponding module workpiece A. When using, different semiconductor mounting modules 3 can be replaced according to the requirements. Alternatively, multiple semiconductor mounting modules 3 can be used in combination to test module workpieces A of different sizes and models.
[0037] When the vibration and shock test fixture plate 1 and the semiconductor mounting module 3 are combined, the semiconductor mounting module 3 and the protrusion 31 are embedded inside the vibration and shock test fixture plate 1. The limiting plate 4 is installed on the outer side of the vibration and shock test fixture plate 1. The protrusion 31 passes through the limiting plate 4 and is limited and fixed by the limiting plate 4. Under the locking action of the first locking screw 41, the limiting plate 4 is fixed to the vibration and shock test fixture plate 1.
[0038] The limiting rod 51 passes through the fixing block 62, and the mounting plate 52 is fixed to the limiting plate 4 by the second locking screw 53, thereby keeping the limiting rod 51 in a fixed state and limiting the fixing block 62.
[0039] The protrusion 611 on the pressure block 61 presses the semiconductor module fixing screw 32 to prevent stripping, and the semiconductor module fixing screw 32 moves upward.
[0040] In summary, the vibration and shock testing fixture of this application is designed as a split structure, which can replace the semiconductor mounting module 3 according to the requirements of semiconductor modules of different sizes, so that different semiconductor module mounting slots 34 are suitable for semiconductor modules of different sizes. The vibration and shock testing fixture plate 1 and the semiconductor mounting module 3 are combined and fixed under the synergistic action of the limiting plate 4 and the first locking screw 41.
[0041] Although embodiments of the present invention have been shown and described (see the detailed description above), it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A vibration shock test fixture for encapsulating a power semiconductor module, characterized by: include The vibration and shock test fixture assembly for fixing packaged power semiconductor modules includes a split vibration and shock test fixture plate (1) and a semiconductor mounting module (3), a fixture plate fixing bolt (2) that passes through the vibration and shock test fixture plate (1), a semiconductor module mounting groove (34) is provided on the surface of the semiconductor mounting module (3), a semiconductor module fixing screw (32) passes through the semiconductor mounting module (3), and protrusions (31) are welded on both ends of the semiconductor mounting module (3). The clamping component includes a welded clamping block (61) and a protrusion (611), and a fixing block (62) symmetrically distributed on both sides of the clamping block (61), with a locking block (63) fixed to the bottom surface of the fixing block (62); The locking assembly includes a limiting plate (4), a first locking screw (41) penetrating the end of the limiting plate (4), a vertically connected limiting rod (51) and mounting plate (52), and a second locking screw (53) penetrating the mounting plate (52).
2. The vibration and shock testing fixture for a packaged power semiconductor module according to claim 1, characterized in that: The limiting plate (4) has right-angled structures at both ends, and a limiting groove b is provided on the surface of the limiting plate (4) for the protrusion (31) to pass through.
3. The vibration shock test fixture for packaging a power semiconductor module according to claim 1, characterized by: The vibration and shock test fixture plate (1) has a module slot for mounting a semiconductor mounting module (3) on its surface. The side surface of the vibration and shock test fixture plate (1) has a square slot for embedding a protrusion (31). The module slot is connected to the square slot. The surfaces of the vibration and shock test fixture plate (1) and the semiconductor mounting module (3) are flush.
4. The vibration shock test fixture for packaging a power semiconductor module according to claim 1, characterized by: The surface of the fixing block (62) is provided with a first circular hole a, the surface of the limiting plate (4) is provided with a second circular hole c, and the limiting rod (51) passes through the first circular hole a and the second circular hole c.
5. The vibration shock test fixture for packaging a power semiconductor module according to claim 1, characterized by: The semiconductor mounting module (3) has a recessed slot (33) on its surface that mates with the card block (63).
6. The vibration shock test fixture for packaging a power semiconductor module according to claim 1, characterized by: The fixing block (62) is a right-angled triangular three-dimensional structure. The bottom surface of the protrusion (611) is provided with a concave screw groove d, and the semiconductor module fixing screw (32) cooperates with the screw groove d.
7. The vibration shock test fixture for packaging a power semiconductor module according to claim 1, characterized by: The second locking screw (53) passes through one end of the mounting plate (52) and is fixed to the limiting plate (4) by screwing. The horizontal plane at the top edge of the fixing block (62) is the S-plane, and the top surface of the limiting plate (4) is flush with the S-plane.