Composite shunt and sampling device

Abstract

The application relates to the current monitoring technical field, discloses a composite shunt and a sampling device, the composite shunt comprises: a resistor body; a composite structure, the composite structure is oppositely arranged on the two sides of the resistor body, and both comprise a first metal plate and a second metal plate; the second metal plate is connected with the resistor body and the first metal plate respectively; a sampling structure is correspondingly connected on the second metal plate and is close to the resistor body; at least part of the end of the second metal plate facing the first metal plate comprises at least one composite connector, the surface area of the combined surface of the composite connector and the first metal plate is S1, the area of the cross section of the first metal plate parallel to the end surface is S2, and the relationship between S1 and S2 satisfies S1 / S2>=1.The application improves the reliability and cost performance of the shunt.

Description

Technical Field

[0001] This application relates to the field of current monitoring technology, specifically to a composite shunt and sampling device. Background Technology

[0002] A shunt is a resistive device used for current measurement. When current flows through the shunt's resistor, a voltage difference is generated between the sampling points of the resistor. Based on this voltage difference and the resistance of the resistor, the current of the shunt can be calculated. Because the resistance of the resistor and the voltage difference between the sampling points are very small, indirect measurement of currents of tens or even hundreds of amperes can be achieved in small current circuits. Therefore, shunts are widely used in current sampling measurement and monitoring scenarios of high-current and high-power equipment. However, shunts in related technologies are often used under harsh operating conditions, and their structure is prone to deformation or loosening due to thermal expansion and contraction or external stress, which affects the reliability of the shunt. Utility Model Content

[0003] In view of this, this application provides a composite shunt and sampling device to solve the aforementioned technical problems.

[0004] In a first aspect, embodiments of this application disclose a composite shunt, comprising:

[0005] The resistive element is used as the main channel for the current to be measured.

[0006] A composite structure for connecting an external circuit, the composite structure being arranged opposite to each other on both sides of the resistor, and each including a first metal plate and a second metal plate, wherein the second metal plate is connected to the resistor and the first metal plate respectively.

[0007] A sampling structure for outputting a differential pressure signal is provided, wherein the sampling structure is connected to the second metal plate and is close to the resistive element.

[0008] Wherein, the end of the second metal plate facing the first metal plate includes at least one composite connector, the surface area of ​​the joint surface between the composite connector and the first metal plate is S1, and the area of ​​the cross section of the first metal plate parallel to its end face is S2. Then the relationship between S1 and S2 satisfies: S1 / S2≥1.

[0009] In one possible example, the cross-sectional length of the interface between the composite connector and the first metal plate is L1, and the thickness of the first metal plate is L2. Then, the relationship between L1 and L2 satisfies: L1 / L2 > 1.

[0010] In one possible example, the face-to-face end faces of the first and second metal plates of the same composite structure do not coincide in a direction perpendicular to the top surface of the first or second metal plate.

[0011] In one possible example, the first metal plate comprises an aluminum plate or an aluminum alloy plate.

[0012] In one possible example, the second metal plate comprises a copper plate or an alloy copper plate.

[0013] In one possible example, the cross-sectional profile of the interface between the composite connector and the first metal plate is a polygonal line, and the bend of the polygonal line faces the first metal plate or the second metal plate.

[0014] In one possible example, the cross-sectional profile of the interface between the composite connector and the first metal plate is stepped or serrated.

[0015] In one possible example, the bonding surface between the composite connector and the first metal plate maintains a preset angle relative to the top or bottom surface of the first metal plate.

[0016] In one possible example, the cross-sectional profile of the interface between the composite connector and the first metal plate is rectangular, and the ratio of the length to the thickness of the composite connector is ≥0.5.

[0017] In one possible example, the composite connector includes a rectangular bump, a triangular prism bump, or a semi-cylindrical bump.

[0018] In one possible example, the temperature coefficient of resistance of the resistive element is ±20*10. -5 / ℃.

[0019] In one possible example, a sampling structure for outputting a differential pressure signal is also included, the sampling structure being connected to the second metal plate and close to the resistive element.

[0020] In one possible example, the sampling structure includes a first sampling patch that is correspondingly attached to the upper surface of the second metal plate.

[0021] In one possible example, the composite structure includes a partition groove formed on the upper surface of the first metal plate and / or the second metal plate and connected to the first sampling patch.

[0022] In one possible example, the sampling structure includes sampling columns that are correspondingly disposed on the upper surface of the second metal plate and connected to the second metal plate.

[0023] In one possible example, a current bus connection structure is also included, which is disposed on the first metal plate and located at the end of the first metal plate away from the resistor.

[0024] In one possible example, the current bus connection structure includes an external through hole, an external threaded hole, or an external stud disposed on the first metal plate.

[0025] In one possible example, a first resistance adjustment slot is provided on the resistor and located between the two second metal plates, and a second resistance adjustment slot is provided on the side of the resistor and corresponding to the first resistance adjustment slot.

[0026] Secondly, embodiments of this application disclose a sampling device, which includes the composite splitter described in any of the above embodiments.

[0027] In summary, compared with the prior art, this application discloses a composite shunt and a sampling device. The composite structure of the composite shunt for connecting external circuits is arranged opposite to the resistor body that serves as the main channel for the current to be measured on both sides. The sampling structure is connected to a second metal plate of the composite structure that connects the resistor body and the first metal plate respectively. The end of the second metal plate facing the first metal plate includes at least one composite connector. The surface area of ​​the joint surface between the composite connector and the first metal plate is S1, and the area of ​​the cross section of the first metal plate parallel to its end face is S2. The relationship between S1 and S2 satisfies: S1 / S2≥1. Thus, the reliability and cost-effectiveness of the shunt are improved by the composite connection of the first metal plate and the second metal plate. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 This is a three-dimensional structural schematic diagram of the first type of composite shunt according to an embodiment of this application;

[0030] Figure 2 This is a side view of the structure of the first type of composite splitter according to an embodiment of this application;

[0031] Figure 3 yes Figure 2 A magnified view of the local structure;

[0032] Figure 4 This is a three-dimensional structural diagram of the second type of composite shunt according to an embodiment of this application;

[0033] Figure 5 This is a three-dimensional structural diagram of the third type of composite shunt according to an embodiment of this application;

[0034] Figure 6 This is a side view of the fourth type of composite splitter according to an embodiment of this application;

[0035] Figure 7 This is a side view of the fifth type of composite shunt according to an embodiment of this application;

[0036] Figure 8 This is a side view of the sixth type of composite splitter according to an embodiment of this application;

[0037] Figure 9 This is a side view of the seventh type of composite shunt according to an embodiment of this application;

[0038] Figure 10 This is a side view of the eighth type of composite shunt according to an embodiment of this application;

[0039] Figure 11 This is a side view of the ninth type of composite shunt according to an embodiment of this application;

[0040] Figure 12 This is a three-dimensional structural schematic diagram of the tenth type of composite shunt according to an embodiment of this application;

[0041] Figure 13 This is a side view of the 11th type of composite shunt according to an embodiment of this application;

[0042] Figure 14 This is a side view of the 12th type of composite shunt according to an embodiment of this application;

[0043] Figure 15 This is a side view of the 13th type of composite shunt according to an embodiment of this application. Detailed Implementation

[0044] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0045] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Furthermore, components, features, and elements with the same names in different embodiments of this application may have the same meaning or different meanings, the specific meaning of which must be determined by its interpretation in that specific embodiment or further in conjunction with the context of that specific embodiment.

[0046] It should be understood that the specific embodiments described herein are merely illustrative of this application and are not intended to limit this application.

[0047] In the following description, the use of suffixes such as "module," "part," or "unit" to denote elements is solely for the purpose of illustrative purposes and has no specific meaning in itself. Therefore, "module," "part," or "unit" may be used interchangeably.

[0048] In the description of this application, it should be noted that the terms "upper," "lower," "left," "right," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0049] The technical solutions shown in this application will be described in detail below through specific embodiments. It should be noted that the order of description of the following embodiments is not intended to limit the priority of the embodiments.

[0050] Please refer to Figure 1 and Figure 2 The composite shunt in this application includes a resistor 1 and a composite structure 2. The resistor 1 is used as the main channel for the current to be measured, and the composite structure 2 is used to connect to an external circuit.

[0051] In one possible implementation of this application, the composite structure 2 is arranged opposite to each other on both sides of the resistor 1, and each includes a first metal plate 21 and a second metal plate 22. The second metal plate 22 is connected to the resistor 1 and the first metal plate 21 respectively. The end of the second metal plate 22 facing the first metal plate 21 includes at least one composite connector 20 to construct a composite connection between the first metal plate 21 and the second metal plate 22 through the composite connector 20.

[0052] During the operation of the composite splitter, the first metal plate 21 and the second metal plate 22 form a composite connection structure through the composite connector 20, thereby improving the mechanical strength and thermal stability of the splitter, suppressing the deformation or loosening of the splitter plate due to thermal expansion and contraction or external stress, and dispersing the external stress transmission path through the buffering characteristics of the composite structure, thereby improving the overall resistance to deformation.

[0053] In one example, the second metal plate 22 can be considered as one end of the first metal plate 21 facing the first metal plate 21, at least partially penetrating into the first metal plate 21. That is, the portion of the second metal plate 22 penetrating into the first metal plate 21 includes at least one composite connector 20 to construct a composite connection between the first metal plate 21 and the second metal plate 22.

[0054] If the first metal plate 21 and the connection end of the device under test are made of the same material or the same system as the busbar, then the thermal expansion coefficient, hardness and potential difference of the two are the same or very small. Therefore, the connection interface between the two will not produce electrochemical corrosion, and the small thermal stress is not easy to cause deformation or loosening. It is suitable for high reliability scenarios such as electric vehicle BMS, industrial power modules and so on.

[0055] In one possible implementation of this application, see below. Figure 12 The end of the second metal plate 22 facing the first metal plate 21 includes at least one composite connector 20. The surface area of ​​the joint surface between the composite connector 20 and the first metal plate 21 is S1, and the area of ​​the cross section of the first metal plate 21 parallel to its end face is S2. The relationship between S1 and S2 satisfies: S1 / S2≥1.

[0056] Specifically, when S1 / S2 > 1, the surface area of ​​the mating surface between the composite connector 20 and the first metal plate 21 is greater than the area of ​​the cross section of the first metal plate 21 parallel to its end face. Correspondingly, a larger mating surface is formed between the composite connector 20 and the first metal plate 21 to enhance the metallurgical interlocking strength and anti-peeling ability between the composite connector 20 and the first metal plate 21. This improves the fatigue resistance of the second metal plate 22 and the first metal plate 21 under thermal cycling conditions, slows down the propagation path of interface cracks caused by thermal expansion and contraction, and improves the reliability of the shunt. It is suitable for long-term reliable operation of the shunt under harsh working environments such as high current and high temperature changes.

[0057] Furthermore, when S1 / S2 = 1, it can be considered that the joint surface of the composite connector 20 and the first metal plate 21 is perpendicular to the top or bottom surface of the first metal plate 21, that is, the first metal plate 21 and the second metal plate 22 are fixed end to end.

[0058] In one possible implementation of this application, see below. Figure 6 The end of the second metal plate 22 facing the first metal plate 21 includes at least one composite connector 20. The cross-sectional length of the joint surface between the composite connector 20 and the first metal plate 21 is L1, and the thickness of the first metal plate 21 is L2. The relationship between L1 and L2 satisfies: L1 / L2 > 1.

[0059] Specifically, when L1 / L2>1, the cross-sectional length of the joint surface between the composite connector 20 and the first metal plate 21 is greater than the thickness of the first metal plate 21. Consequently, a larger joint surface is formed between the composite connector 20 and the first metal plate 21 to enhance the composite connection strength between the composite connector 20 and the first metal plate 21 and improve the reliability of the shunt.

[0060] On the other hand, L1 = L2, which can be regarded as the joint surface of the composite connector 20 and the first metal plate 21 being perpendicular to the top or bottom surface of the first metal plate 21, that is, the first metal plate 21 and the second metal plate 22 are fixed end to end.

[0061] In one possible implementation of this application, in the composite shunt of this application, the end faces of the first metal plate 21 and the second metal plate 22 of the same composite structure 2 do not overlap in the direction perpendicular to the top surface of the first metal plate 21 or the second metal plate 22. This ensures that the composite connector 20 and the first metal plate 21 have a large contact area, forming a partially interlocked structure, which enhances the metallurgical interlocking strength between the composite connector 20 and the first metal plate 21 and the overall strength of the composite structure 2.

[0062] In conjunction with any of the foregoing embodiments, the composite shunt of this application further includes the following design:

[0063] In one example, the composite connector 20 and the second metal plate 22 can be integrally formed from the same metal material to effectively reduce the connection interface of the second metal plate 22 and improve structural stability and electrical continuity.

[0064] In one example, resistor 1 includes a manganese copper plate to ensure the sampling accuracy of the shunt based on its material properties. The manganese copper plate has good metallurgical connection properties, and the resulting connection layer is stable, which helps to maintain the stability of the connection layer resistance to suit the micro voltage difference sampling of the shunt and avoid thermocouple errors.

[0065] It should be noted that the temperature coefficient of resistance of resistor 1 is ±20*10. -5 / ℃, to ensure that the resistance value of resistor 1 is less affected by temperature, thereby ensuring high-precision measurement of the shunt.

[0066] In one example, the temperature coefficient of resistance of resistor 1 is ±15*10. -5 / ℃, ±10*10 -5 / ℃, ±8*10 -5 / ℃, ±6*10 -5 / ℃, ±4*10 -5 / ℃ or ±2*10 -5 / ℃.

[0067] In one example, a first resistance adjustment groove 11 is provided on the resistor 1 and located between the two second metal plates 22, so as to adjust the specific resistance value of the resistor 1 before operation by adjusting the groove size of the first resistance adjustment groove 11.

[0068] Furthermore, a second resistance adjustment groove 12 is provided on the side of the resistor 1 and corresponding to the first resistance adjustment groove 11, so as to adjust the specific resistance value of the resistor 1 before operation by adjusting the groove size of the second resistance adjustment groove 12, thereby ensuring the high-precision measurement of the shunt.

[0069] In one possible implementation of this application, the first metal plate 21 includes an aluminum plate or an aluminum alloy plate.

[0070] Understandably, the shunt plates used to connect external circuits in related technologies are all made of copper. However, copper is expensive and highly susceptible to fluctuations in global copper prices, especially in high-current, large-size shunt applications, which significantly increases material costs. Furthermore, copper has high density and weight, which is detrimental to overall weight reduction design in applications with high lightweight requirements. Additionally, copper readily forms copper oxide in the air, causing its surface to blacken and reducing conductivity. Electroplating with nickel or tin is also necessary, increasing process complexity and cost. Therefore, in this embodiment, the first metal plate 21 includes an aluminum plate or an aluminum alloy plate to optimize material costs, especially in high-current, high-volume applications, resulting in significant savings. It is also more suitable for applications with high lightweight requirements. Simultaneously, the natural oxide film of aluminum has a self-protective function, which helps improve long-term stability. The intrusive connection design of the second metal plate 22 ensures the structural strength and reliability of the aluminum plate or aluminum alloy plate. This achieves both conductivity requirements and lightweight and cost-effectiveness for the shunt, improving its reliability and cost-effectiveness.

[0071] In one possible implementation of this application, the second metal plate 22 includes a copper plate or an alloy copper plate.

[0072] The second metal plate 22, which is based on the resistor 1 and the first metal plate 21 respectively, is connected to the resistor 1. The second metal plate 22, which is a copper plate or an alloy copper plate, has excellent electrical performance and can better connect with the resistor 1. It helps to reduce welding stress and contact resistance, thereby improving the reliability and overall performance of the shunt.

[0073] In one possible implementation of this application, the first metal plate 21 includes an aluminum plate or an aluminum alloy plate, and the second metal plate 22 includes a copper plate or an alloy copper plate. In this case, the composite structure 2 of the shunt is a copper-aluminum composite connection structure. At least one end of the copper material of the second metal plate 22 penetrates into the aluminum material of the first metal plate 21 to improve the mechanical strength and thermal stability of the shunt, optimize material costs, meet the requirements of lightweighting, and also ensure the connection strength between the plate body of the shunt connecting to the external circuit and the resistor 1, reduce its welding stress and contact resistance, thereby improving the reliability and overall performance of the shunt.

[0074] It is understood that at least one end of the second metal plate 22 penetrates into the first metal plate 21 to form a partially interlocked structure, which helps to resist tension and shear. A metallurgical diffusion layer is formed between the first metal plate 21 and the second metal plate 22 to build a stable conductive channel and a strong connection structure, improve the bonding strength of the dissimilar metal interface, avoid thermal expansion stress leading to detachment or cracking, and enhance the working reliability of the shunt in high current and complex environments.

[0075] In one example, the outer surface of the second metal plate 22 is plated with a metal protective layer 22a, and the metal protective layer 22a is formed by at least one of tin, tin alloy, nickel, nickel alloy, gold, and silver. This can effectively reduce its oxidation rate in the air, improve its oxidation resistance, and enhance its affinity with solder, thereby improving the connection stability and conduction reliability of the shunt and adapting to high current sampling accuracy and harsh environmental requirements.

[0076] The composite shunt of this application includes a sampling structure 3, which is connected to the second metal plate 22 and is close to the resistor 1, so that the shunt can output the differential voltage signal of the resistor 1 through the sampling structure 3.

[0077] In one possible implementation of this application, the sampling structure 3 includes a first sampling patch 31, which is attached to the upper surface of the second metal plate 22 so that the shunt can output the differential voltage signal of the resistor 1 through the first sampling patch 31.

[0078] In one example, a metallurgical diffusion layer is formed between the first sampling patch 31 and the second metal plate 22 to construct a stable conductive channel and a robust connection structure, improve the bonding strength of the dissimilar metal interface, avoid thermal expansion stress leading to detachment or cracking, and enhance the reliability of the shunt in high current and complex environments.

[0079] It should be noted that, based on the above embodiments, the first metal plate 21 and the second metal plate 22 can also be integrally formed from the same metal material, and the first metal plate 21 and the second metal plate 22 can include aluminum plates or aluminum alloy plates to meet the requirements of lightweighting and improve the cost performance of the shunt.

[0080] In one example, the composite structure 2 includes an isolation groove 23, which is formed on the upper surface of the first metal plate 21 and / or the second metal plate 22 and connected to the first sampling patch 31. The isolation groove 23 forms an isolation between the first sampling patch 31 and the composite structure 2, while ensuring the soldering effect between the first sampling patch 31 and the external circuit board. For example, when the first sampling patch 31 is soldered to the PCB pad, the solder should be separated from the sampling patch area by the surrounding material under the action of affinity wetting force, thereby improving the connection quality between the sampling patch and the PCB pad, avoiding parasitic current interference with the differential voltage sampling accuracy, and also helping the structural positioning of the first sampling patch 31 to improve the measurement accuracy.

[0081] Optionally, the depth of the partition groove 23 is ≥0.1mm.

[0082] Preferably, the depth of the partition groove 23 includes 0.5mm, 0.3mm, and 0.6mm.

[0083] Furthermore, the metal protective layer 22a may also be plated on the outer surface of the first sampling patch 31, and the metal protective layer 22a may be formed by at least one of tin, tin alloy, nickel, nickel alloy, gold, and silver to protect the first sampling patch 31.

[0084] In one example, the first sampling patch 31 protrudes from the resistor 1 and the composite structure 2. Specifically, the upper surface of the first sampling patch 31 protrudes from the first metal plate 21 or the second metal plate 22 by a height ≥ 0.1 mm, and the length of the first sampling patch 31 is ≥ 0.4 mm, so as to facilitate the electrical connection of the first sampling patch 31 during operation.

[0085] In one possible implementation of this application, reference is made to... Figure 4 The sampling structure 3 includes a sampling column 32, which is disposed on the upper surface of the second metal plate 22 and connected to the second metal plate 22 so as to output the differential pressure signal of the resistor 1 through the sampling column 32.

[0086] Optionally, the sampling column 32 is fixed to the second metal plate 22 by riveting or welding.

[0087] In one example, the top of the sampling column 32 is provided with a first sampling step 32a so that the sampling column 32 can be partially suspended and connected to an external circuit board, thereby partially isolating the external circuit board, avoiding it from being subjected to thermal shock during the operation of the shunt, and reducing the impact of temperature changes on the surface of the shunt on the components on the PCB board.

[0088] In one example, reference Figure 14 The sampling structure 3 also includes a heat dissipation groove 35, which is spaced from the sampling column 32. It is disposed on the composite structure 2 and penetrates the first metal plate 21 and the second metal plate 22 to provide a heat dissipation channel for the first metal plate 21 and the second metal plate 22 of the composite structure 2, thereby improving the reliability of the shunt.

[0089] The heat dissipation groove 35 is arc-shaped and wrapped around the sampling column 32 to optimize the heat dissipation effect at the connection between the sampling column 32 and the second metal plate 22.

[0090] In one possible implementation of this application, reference is made to... Figure 5 The sampling structure 3 includes a sampling threaded hole 33, which is opened on the upper surface of the second metal plate 22 for connecting the sampling circuit so that the shunt can output the differential pressure signal of the resistor 1 through the sampling threaded hole 33.

[0091] The sampling threaded hole 33 is designed as a blind hole to prevent metal shavings from falling out when the adapter is connected to the sampling threaded hole 33, which could endanger the system safety.

[0092] In one example, the sampling threaded hole 33 is provided with a second sampling step 33a, the height of which is less than or equal to the thickness of the external circuit board, so as to facilitate electrical connection with the pads of the external circuit board and to guide the installation, positioning and support of the external circuit board for connecting the sampling structure 3.

[0093] In one possible implementation of this application, reference is made to... Figure 13 The sampling structure 3 includes a sampling through hole 34, which is opened on the second metal plate 22 to facilitate the connection post of the external circuit board and output the differential pressure signal of the resistor 1.

[0094] In one possible implementation of this application, reference is made to... Figure 15The sampling structure 3 includes a heat dissipation through hole 37, which is opened at one end of the second metal plate 22 near the resistor 1 and connected to the resistor 1. A second sampling patch 36 is exposed in the heat dissipation through hole 37 and is connected to the side of the resistor 1. Thus, the shunt outputs the differential voltage signal of the resistor 1 through the second sampling patch 36, and provides a heat dissipation channel for the second sampling patch 36 and the second metal plate 22 through the heat dissipation through hole 37, thereby improving the reliability of the shunt.

[0095] The composite shunt of this application includes a current bus connection structure 4, which is disposed on the first metal plate 21 and located at the end of the first metal plate 21 away from the resistor 1, for docking with the busbar or high-power connector of external equipment.

[0096] In one possible implementation of this application, the current busbar connection structure 4 includes an external through hole 41 disposed on the first metal plate 21.

[0097] Among them, the diameter of the external through hole 41 is ≥2mm.

[0098] refer to Figure 4 and Figure 5 In one possible implementation of this application, the current bus connection structure 4 may further include an external threaded hole 42, wherein the external threaded hole 42 is used to connect an external adapter so that the shunt can be connected to the busbar or high-power connector of an external device through the current bus connection structure 4.

[0099] In one possible implementation of this application, the current busbar connection structure 4 may further include an external stud 43, and the external stud 43 is fixed on the first metal plate 21 by riveting or welding to ensure the reliability of the shunt's external connection.

[0100] It should be noted that the upper surface of the first metal plate 21 can also be a smooth, one-piece flat surface, so that the composite structure 2 of the shunt can be connected to external equipment by laser or ultrasonic welding.

[0101] In one example, the first metal plate 21 includes an aluminum plate or an aluminum alloy plate, which is connected to the aluminum or aluminum alloy busbar or high-power connector of the external equipment. This is to prevent deformation and loosening when different metal materials, such as copper and aluminum, are electrically connected. The different coefficients of thermal expansion and hardness of copper and aluminum can cause this. At the same time, there is a potential difference between the two materials, and the contact surface of the two metals may be subject to electrochemical corrosion under the combined action of moisture, carbon dioxide and other impurities in the air. This improves the reliability of the shunt.

[0102] In one example, a notch 5 is provided at the top corner of any composite structure 2 away from the resistor 1 to indicate the specific direction of the shunt during installation. Of course, the embodiments of this application are not limited to this, and the notch 5 can also be other numerical markings, sticker markings, scale markings or color markings, etc.

[0103] In one possible implementation of this application, reference is made to... Figure 3 The cross-sectional profile of the joint surface between the composite connector 20 and the first metal plate 21 is marked as J. J is in the shape of a broken line, and the bend of the broken line of J is directed toward the first metal plate 21 or the second metal plate 22.

[0104] This constructs a robust composite structure between the first metal plate 21 and the second metal plate 22. The polygonal cross-sectional profile forms an "anchoring structure" between the composite connector 20 and the first metal plate 21, increasing the contact area between them and improving their shear and peel resistance. This allows the joint surface between the composite connector 20 and the first metal plate 21 to be multi-point / multi-faceted, enhancing the metallurgical bonding strength and peel resistance between them. It also improves the fatigue resistance of the second metal plate 22 and the first metal plate 21 under thermal cycling conditions, slows down the propagation path of interface cracks caused by thermal expansion and contraction, and improves the reliability of the shunt. This makes it suitable for long-term reliable operation of the shunt under harsh working environments such as high current and high temperature changes.

[0105] Wherein, the bend angle of the broken line marked J is Q, and the angle range of Q includes 5° to 85°, so as to ensure that the bonding surface between the composite connector 20 and the first metal plate 21 is multi-point / multi-faceted, thereby enhancing the metallurgical bonding and anti-peeling ability between the composite connector 20 and the first metal plate 21.

[0106] Preferably, the angle of the bend in the line J is 15°, 20°, 30°, 45°, or 60°.

[0107] In one possible implementation of this application, reference is made to... Figure 6 The bonding surface between the composite connector 20 and the first metal plate 21 maintains a preset inclination angle R relative to the top or bottom surface of the first metal plate 21. Specifically, the bonding surface between the composite connector 20 and the first metal plate 21 is an inclined surface relative to the top or bottom surface of the first metal plate 21. This ensures that there is a large contact area between the composite connector 20 and the first metal plate 21, thereby enhancing the metallurgical bonding strength and anti-peeling ability between the composite connector 20 and the first metal plate 21.

[0108] The preset tilt angle R ranges from 10° to 90°.

[0109] Preferably, the preset tilt angle R is 15°, 20°, 30°, 45°, or 60°.

[0110] In one optional application scenario, refer to Figure 7 If the preset tilt angle R is 90°, then the mating surface of the composite connector 20 and the first metal plate 21 is perpendicular to the top or bottom surface of the first metal plate 21, that is, the first metal plate 21 and the second metal plate 22 are fixed end to end.

[0111] In one possible implementation of this application, reference is made to... Figure 8 The cross-sectional profile of the joint surface between the composite connector 20 and the first metal plate 21 is rectangular, thereby ensuring a large contact area between the composite connector 20 and the first metal plate 21, forming a local interlocking structure, and enhancing the metallurgical interlocking strength between the composite connector 20 and the first metal plate 21 and the overall strength of the composite structure 2.

[0112] In one example, the length-to-thickness ratio of the composite connector 20 is ≥0.5, in order to further ensure that the composite connector 20 and the first metal plate 21 have a large contact area.

[0113] It should be noted that the portion of the second metal plate 22 that penetrates into the first metal plate 21 includes at least one composite connector 20, and that when the second metal plate 22 penetrates into the first metal plate 21, it can also be considered that a portion of the first metal plate 21 is connected to the second metal plate 22. Therefore, referring to... Figure 9 The portion of the second metal plate 22 that penetrates into the first metal plate 21 includes two composite connectors 20. The two composite connectors 20 are relatively close to the upper and lower surfaces of the second metal plate 22. Thus, on the one hand, it can be regarded as the two composite connectors 20 penetrating into the first metal plate 21 and clamping a portion of the first metal plate 21 to construct a composite connection between the first metal plate 21 and the second metal plate 22, ensuring the connection strength between the first metal plate 21 and the second metal plate 22. On the other hand, it can also be regarded as the end of the first metal plate 21 facing the second metal plate 22, at least partially penetrating into the second metal plate 22, and the cross-sectional profile of the joint surface of this portion with the second metal plate 22 is rectangular. Of course, the cross-sectional profile of the joint surface of the composite connector 20 with the first metal plate 21 in other shapes in this embodiment of the application also conforms to the above design, which will not be repeated here.

[0114] In one possible implementation of this application, reference is made to... Figure 10 The cross-sectional profile of the joint surface between the composite connector 20 and the first metal plate 21 is stepped, thereby ensuring a large contact area between the composite connector 20 and the first metal plate 21, forming a local interlocking structure, and enhancing the metallurgical interlocking strength between the composite connector 20 and the first metal plate 21 and the overall strength of the composite structure 2.

[0115] In one possible implementation of this application, reference is made to... Figure 11 The number of composite connectors 20 is several. The several composite connectors 20 form a continuous wave pattern at the end of the second metal plate 22 facing the first metal plate 21. As a result, the cross-sectional profile of the joint surface between the composite connector 20 and the first metal plate 21 is toothed. This ensures that there is a large contact area between the composite connector 20 and the first metal plate 21, forming a local interlocking structure, which enhances the metallurgical interlocking strength between the composite connector 20 and the first metal plate 21 and the overall strength of the composite structure 2.

[0116] In one example, the cross-sectional profile of the mating surface between the composite connector 20 and the first metal plate 21 includes rectangular teeth, circular teeth, triangular teeth, wavy teeth, etc.

[0117] Based on the above embodiments, the composite connector 20 may include a rectangular protrusion, a triangular prism protrusion, or a semi-cylindrical protrusion to ensure that the composite connector 20 and the first metal plate 21 have a large contact area and form a partially interlocked structure.

[0118] It should be noted that in the composite shunt of this application, the composite structure 2 is arranged opposite to each other on both sides of the resistor 1, and the composite structures 2 on both sides of the resistor 1 are mirror images of each other, that is, the structural connection relationship of the first metal plate 21 and the second metal plate 22 of each composite structure 2 is the same.

[0119] This application also discloses a sampling device, which includes a composite shunt as described in any of the above embodiments.

[0120] For other working principles and processes of the sampling device in this embodiment, please refer to the description of the composite shunt in the aforementioned embodiment, which will not be repeated here.

[0121] The composite shunt and sampling device provided in this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. It should be noted that the descriptions of each embodiment in this application have different focuses, and parts not described in detail or in a certain embodiment can be referred to the relevant descriptions of other embodiments.

[0122] The above are merely preferred embodiments of this application and do not limit the patent scope of this application. The technical features of the technical solution of this application can be combined arbitrarily. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are also included within the patent protection scope of this application, as long as the combination of these technical features does not contradict each other.

Claims

1. A composite shunt, characterized in that, include: The resistive element is used as the main channel for the current to be measured. A composite structure for connecting an external circuit, the composite structure being arranged opposite to each other on both sides of the resistor, and each including a first metal plate and a second metal plate, wherein the second metal plate is connected to the resistor and the first metal plate respectively. A sampling structure for outputting a differential pressure signal is provided, wherein the sampling structure is connected to the second metal plate and is close to the resistive element. Wherein, the end of the second metal plate facing the first metal plate includes at least one composite connector, the surface area of ​​the joint surface between the composite connector and the first metal plate is S1, and the area of ​​the cross section of the first metal plate parallel to its end face is S2. Then the relationship between S1 and S2 satisfies: S1 / S2≥1.

2. The composite shunt as described in claim 1, characterized in that, The length of the cross-sectional line of the joint surface between the composite connector and the first metal plate is L1, and the thickness of the first metal plate is L2. The relationship between L1 and L2 satisfies: L1 / L2 > 1.

3. The composite shunt as described in claim 1, characterized in that, The face-to-face ends of the first and second metal plates of the same composite structure do not coincide in the direction perpendicular to the top surface of the first or second metal plate.

4. The composite shunt as described in claim 1, characterized in that, The first metal plate includes an aluminum plate or an aluminum alloy plate.

5. The composite shunt as described in claim 1, characterized in that, The second metal plate includes a copper plate or an alloy copper plate.

6. The composite shunt as described in any one of claims 1 to 3, characterized in that, The cross-sectional profile of the interface between the composite connector and the first metal plate is a polygonal line, and the bend of the polygonal line faces the first metal plate or the second metal plate.

7. The composite shunt as described in any one of claims 1 to 3, characterized in that, The cross-sectional profile of the interface between the composite connector and the first metal plate is stepped or toothed.

8. The composite shunt as described in any one of claims 1 to 2, characterized in that, The bonding surface between the composite connector and the first metal plate maintains a preset angle relative to the top or bottom surface of the first metal plate.

9. The composite shunt as described in any one of claims 1 to 3, characterized in that, The cross-sectional profile of the interface between the composite connector and the first metal plate is rectangular, and the ratio of the length to the thickness of the composite connector is ≥0.

5.

10. The composite shunt as described in any one of claims 1 to 4, characterized in that, The composite connector includes a rectangular bump, a triangular prism bump, or a semi-cylindrical bump.

11. The composite shunt as described in claim 1, characterized in that, The temperature coefficient of resistance of the resistive element is ±20*10. -5 / ℃.

12. The composite shunt as described in claim 1, characterized in that, The sampling structure includes a first sampling patch, which is attached to the upper surface of the second metal plate.

13. The composite shunt as described in claim 12, characterized in that, The composite structure includes a partition groove formed on the upper surface of the first metal plate and / or the second metal plate and connected to the first sampling patch.

14. The composite shunt as described in claim 1, characterized in that, The sampling structure includes a sampling column, which is disposed on the upper surface of the second metal plate and connected to the second metal plate.

15. The composite shunt as described in claim 1, characterized in that, It also includes a current bus connection structure, which is disposed on the first metal plate and located at the end of the first metal plate away from the resistor.

16. The composite shunt as described in claim 15, characterized in that, The current busbar connection structure includes an external through hole, an external threaded hole, or an external stud disposed on the first metal plate.

17. The composite shunt as described in claim 1, characterized in that, A first resistance adjustment groove is provided on the resistor body and located between the two second metal plates, and a second resistance adjustment groove is provided on the side of the resistor body and corresponding to the first resistance adjustment groove.

18. A sampling device, characterized in that, The sampling device includes the composite splitter as described in any one of claims 1 to 17.

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