Composite shunt and sampling device

Abstract

The invention relates to the technical field of current monitoring, and discloses a composite shunt and a sampling device, and the composite shunt comprises a resistor body which is used as a to-be-measured current main channel; the composite structures are used for being connected with an external circuit, the composite structures are oppositely arranged on the two sides of the resistor body, each composite structure comprises a first metal plate and a second metal plate, and the second metal plates are connected with the resistor body and the first metal plates respectively; one end, facing the first metal plate, of the second metal plate is at least partially intruded into the first metal plate, and the part, intruded into the first metal plate, of the second metal plate comprises at least one composite connecting body so as to construct composite connection of the first metal plate and the second metal plate. The reliability and the cost performance of the shunt are improved.

Description

Technical Field

[0001] The present application relates to the technical field of current monitoring, and in particular to a composite shunt and sampling device. Background Art

[0002] A shunt is a resistor device used for current measurement. When current flows through the shunt resistor, a voltage difference is generated between the sampling points of the resistor. Based on this voltage difference and the resistance of the resistor, the current of the shunt can be calculated. Since the resistance of the resistor and the voltage difference between the sampling points are very small, the indirect measurement of tens or even hundreds of amperes of current by a small current circuit is achieved. Therefore, shunts are widely used in current sampling, measurement and monitoring scenarios of large current and high-power equipment. Shunts in related technologies are mostly in harsh working conditions with harsh conditions, and their own structures are easily deformed or loosened due to thermal expansion and contraction or external stress, affecting the reliability of the shunt. Summary of the Invention

[0003] In view of this, the present application provides a composite diverter and sampling device to solve the above-mentioned technical problems.

[0004] In a first aspect, the present application discloses a composite diverter, comprising:

[0005] The resistor is used as the main channel of the current to be measured;

[0006] A composite structure for connecting to an external circuit, the composite structure being arranged oppositely on both sides of the resistor and each comprising a first metal plate and a second metal plate, wherein the second metal plate is respectively connected to the resistor and the first metal plate;

[0007] The second metal plate faces one end of the first metal plate and at least partially penetrates into the first metal plate. The portion of the second metal plate that penetrates into the first metal plate includes at least one composite connector to construct a composite connection between the first metal plate and the second metal plate.

[0008] In a possible example, the cross-sectional length of the bonding surface between the composite connector and the first metal plate is L1, and the thickness of the first metal plate is L2. The relationship between L1 and L2 satisfies: L1 / L2≥1.

[0009] In a possible example, end surfaces of the facing ends of the first metal plate and the second metal plate of the same composite structure do not overlap in a direction perpendicular to the top surface of the first metal plate or the second metal plate.

[0010] In a possible example, the first metal plate includes an aluminum plate or an aluminum alloy plate.

[0011] In a possible example, the second metal plate includes a metal copper plate or an alloy copper plate.

[0012] In a possible example, a cross-sectional profile of a bonding surface between the composite connector and the first metal plate is in the shape of a broken line, and a bend of the broken line faces the first metal plate or the second metal plate.

[0013] In a possible example, a cross-sectional profile of a bonding surface between the composite connector and the first metal plate is stepped or toothed.

[0014] In a possible example, a bonding surface between the composite connector and the first metal plate maintains a preset inclination angle relative to a top surface or a bottom surface of the first metal plate.

[0015] In a possible example, a cross-sectional profile of a bonding surface between the composite connector and the first metal plate is rectangular, and a ratio of the length to the thickness of the composite connector is ≥0.5.

[0016] In a possible example, the composite connector includes a rectangular bump, a triangular prism bump, or a semi-cylindrical bump.

[0017] In a possible example, the resistance temperature coefficient of the resistor is ±20*10 -5 / ℃.

[0018] In a possible example, a sampling structure is further included for outputting a pressure difference signal. The sampling structure is correspondingly connected to the second metal plate and is close to the resistor.

[0019] In a possible example, the sampling structure includes a first sampling patch, and the first sampling patch is correspondingly attached to the upper surface of the second metal plate.

[0020] In a possible example, the composite structure includes a partition groove, which is opened on the upper surface of the first metal plate and / or the second metal plate and connected to the first sampling patch.

[0021] In a possible example, the sampling structure includes a sampling column, and the sampling column is correspondingly configured on the upper surface of the second metal plate and connected to the second metal plate.

[0022] In a possible example, a current bus connection structure is further included. The current bus connection structure is configured on the first metal plate and is located at an end of the first metal plate away from the resistor.

[0023] In a possible example, the current bus connection structure includes an external through hole, an external threaded hole, or an external stud provided on the first metal plate.

[0024] In a possible example, a first resistance adjustment groove is provided on the resistor body and between the two second metal plates, and a second resistance adjustment groove is provided on a side of the resistor body and corresponding to the first resistance adjustment groove.

[0025] In a second aspect, an embodiment of the present application discloses a sampling device, which includes the composite diverter described in any of the above embodiments.

[0026] In summary, compared with the prior art, the present application discloses a composite shunt and a sampling device, in which the composite structure of the composite shunt for connecting an external circuit is arranged relatively on both sides of the resistor body used as the main channel of the current to be measured, and the second metal plate of the composite structure respectively connects the resistor body and the first metal plate, and its end facing the first metal plate at least partially invades into the first metal plate, and the part of the second metal plate invading into the first metal plate includes at least one composite connector to construct a composite connection between the first metal plate and the second metal plate. Thus, the reliability and cost-effectiveness of the shunt are improved through the composite connection of the first metal plate and the second metal plate and the intrusive design of the second metal plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following is a brief introduction to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0028] Figure 1 This is a schematic diagram of the three-dimensional structure of the first composite diverter according to an embodiment of the present application;

[0029] Figure 2 1 is a side view schematic diagram of the structure of the first composite diverter according to an embodiment of the present application;

[0030] Figure 3 yes Figure 2 A magnified view of the local structure;

[0031] Figure 4 Schematic diagram of the three-dimensional structure of the second composite diverter according to the embodiment of the present application;

[0032] Figure 5 Schematic diagram of the three-dimensional structure of the third composite diverter according to the embodiment of the present application;

[0033] Figure 6 1 is a side view schematic structural diagram of the fourth composite diverter according to an embodiment of the present application;

[0034] Figure 71 is a side view structural diagram of the fifth composite diverter according to an embodiment of the present application;

[0035] Figure 8 1 is a side structural diagram of the sixth composite diverter according to an embodiment of the present application;

[0036] Figure 9 1 is a side structural diagram of the seventh composite diverter according to an embodiment of the present application;

[0037] Figure 10 1 is a side view structural diagram of the eighth composite diverter according to an embodiment of the present application;

[0038] Figure 11 1 is a side structural diagram of a ninth composite diverter according to an embodiment of the present application;

[0039] Figure 12 10 is a schematic diagram of the three-dimensional structure of the composite diverter according to the embodiment of the present application;

[0040] Figure 13 11 is a schematic side view of the structure of the composite diverter according to the embodiment of the present application;

[0041] Figure 14 12 is a schematic side view of the structure of the composite diverter according to the embodiment of the present application;

[0042] Figure 15 This is a side structural schematic diagram of the 13th composite diverter of the embodiment of the present application. DETAILED DESCRIPTION

[0043] Exemplary embodiments will be described in detail herein, with examples illustrated in the accompanying drawings. When the following description refers to the drawings, identical numbers in different figures represent identical or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present application, as detailed in the appended claims.

[0044] It should be noted that, in this document, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprising a ..." does not exclude the presence of other identical elements in the process, method, article or device comprising the element. In addition, components, features, and elements with the same name in different embodiments of the present application may have the same meaning or different meanings, and their specific meanings need to be determined based on their explanation in the specific embodiment or further combined with the context of the specific embodiment.

[0045] It should be understood that the specific embodiments described herein are only used to explain the present application and are not intended to limit the present application.

[0046] In the subsequent description, the use of suffixes such as "module", "component" or "unit" to represent elements is only for the purpose of facilitating the description of the present application and has no specific meaning. Therefore, "module", "component" or "unit" can be used interchangeably.

[0047] In the description of this application, it should be noted that the terms "upper," "lower," "left," "right," "inner," and "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate the description of this application and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0048] The technical solutions shown in this application will be described in detail below through specific embodiments. It should be noted that the description order of the following embodiments does not limit the priority order of the embodiments.

[0049] Please refer to Figure 1 and Figure 2 The composite shunt of the embodiment of the present application includes a resistor 1 and a composite structure 2. The resistor 1 is used as a main channel for the current to be measured, and the composite structure 2 is used to connect to an external circuit.

[0050] In a possible implementation of the present application, the composite structure 2 is arranged relatively on both sides of the resistor body 1, and both include a first metal plate 21 and a second metal plate 22, and the second metal plate 22 is respectively connected to the resistor body 1 and the first metal plate 21, wherein the second metal plate 22 faces one end of the first metal plate 21 and at least partially penetrates into the first metal plate 21, and the part of the second metal plate 22 that penetrates into the first metal plate 21 includes at least one composite connector 20 to construct a composite connection between the first metal plate 21 and the second metal plate 22.

[0051] During the operation of the composite diverter, one end of the second metal plate 22 facing the first metal plate 21 at least partially penetrates into the first metal plate 21, that is, the first metal plate 21 and the second metal plate 22 form a composite connection structure through the composite connector 20, thereby improving the mechanical strength and thermal stability of the diverter, and suppressing the deformation or loosening of the diverter plate due to thermal expansion and contraction or external stress, and through the buffering characteristics of the composite structure, disperse the external stress transmission path and improve the overall anti-deformation ability.

[0052] Among them, if the first metal plate 21 and the connection end of the device under test are made of the same material or the same system as the bus, then the thermal expansion coefficient, hardness, and potential difference between the two are the same or very small, so the connection interface between the two will not produce electrochemical corrosion, and the smaller thermal stress will not easily cause deformation or loosening, which is suitable for high-reliability scenarios such as electric vehicle BMS, industrial power modules, etc.

[0053] In a possible implementation of this application, continue to refer to Figure 12 The surface area of ​​the bonding surface between the composite connector 20 and the first metal plate 21 is S1, and the area of ​​the cross section of the first metal plate 21 parallel to its end face is S2. The relationship between S1 and S2 satisfies: S1 / S2≥1.

[0054] Specifically, when S1 / S2>1, the surface area of ​​the bonding surface between the composite connector 20 and the first metal plate 21 is greater than the area of ​​the cross section of the first metal plate 21 parallel to its end face. Relatively speaking, a larger bonding surface is formed between the composite connector 20 and the first metal plate 21 to enhance the metallurgical bite strength and peeling resistance between the composite connector 20 and the first metal plate 21, thereby improving the fatigue resistance of the second metal plate 22 and the first metal plate 21 under thermal cycling conditions, slowing down the propagation path of interface cracks caused by thermal expansion and contraction, thereby improving the reliability of the shunt, and being suitable for long-term reliable operation of the shunt in harsh working environments such as high current and high temperature changes.

[0055] Also, when S1 / S2=1, the joining surface between the composite connector 20 and the first metal plate 21 can be considered to be perpendicular to the top or bottom surface of the first metal plate 21, that is, the first metal plate 21 and the second metal plate 22 are fixed end to end.

[0056] In a possible implementation of this application, continue to refer to Figure 6 The cross-sectional length of the bonding surface between the composite connector 20 and the first metal plate 21 is L1, and the thickness of the first metal plate 21 is L2. The relationship between L1 and L2 satisfies: L1 / L2≥1.

[0057] Specifically, when L1 / L2>1, the cross-sectional line length of the bonding surface between the composite connector 20 and the first metal plate 21 is greater than the thickness of the first metal plate 21. Correspondingly, a larger bonding surface is formed between the composite connector 20 and the first metal plate 21 to enhance the composite connection strength between the composite connector 20 and the first metal plate 21 and improve the reliability of the diverter.

[0058] Also, when L1=L2, the joining surface between the composite connector 20 and the first metal plate 21 can be considered to be perpendicular to the top or bottom surface of the first metal plate 21, that is, the first metal plate 21 and the second metal plate 22 are fixed end to end.

[0059] In a possible implementation of the present application, in the composite diverter of the present application, the end faces of the first metal plate 21 and the second metal plate 22 facing each other of the same composite structure 2 do not overlap in a direction perpendicular to the top surface of the first metal plate 21 or the second metal plate 22, thereby ensuring a larger contact area between the composite connector 20 and the first metal plate 21, forming a local interlocking structure, and enhancing the metallurgical bite strength between the composite connector 20 and the first metal plate 21 and the overall strength of the composite structure 2.

[0060] In combination with any of the above embodiments, the composite diverter of the present application also includes the following design:

[0061] In one example, the composite interconnect 20 and the second metal plate 22 may be integrally formed of the same metal material to effectively reduce the connection interface of the second metal plate 22 and improve structural stability and conductive continuity.

[0062] In one example, the resistor body 1 includes a manganese copper plate to ensure the sampling accuracy of the shunt based on its material properties, and the manganese copper plate has good metallurgical connection performance, and the connection layer formed is stable, which is conducive to maintaining the stability of the connection layer resistance, so as to be suitable for the micro-voltage difference sampling of the shunt and avoid thermocouple errors.

[0063] It should be noted that the resistance temperature coefficient of resistor 1 is ±20*10 -5 / ℃, so as to ensure that the resistance of the resistor 1 is less affected by the temperature, thereby ensuring high-precision measurement of the shunt.

[0064] In one example, the resistance temperature coefficient of the resistor 1 is ±15*10 -5 / ℃、±10*10 -5 / ℃、±8*10 -5 / ℃、±6*10 -5 / ℃、±4*10 -5 / ℃ or ±2*10 -5 / ℃.

[0065] In one example, a first resistance adjustment slot 11 is provided on the resistor 1 between the two second metal plates 22 , so that the specific resistance of the resistor 1 before operation can be preliminarily adjusted over a large range by adjusting the slot size of the first resistance adjustment slot 11 .

[0066] In addition, a second resistance adjustment slot 12 is provided on the side of the resistor body 1 and corresponding to the first resistance adjustment slot 11, so that the specific resistance of the resistor body 1 before operation can be finely adjusted by adjusting the slot size of the second resistance adjustment slot 12, thereby ensuring high-precision measurement of the shunt.

[0067] In a possible implementation of the present application, the first metal plate 21 includes a metal aluminum plate or an aluminum alloy plate.

[0068] It is understandable that the plates used to connect the external circuits of the shunts in the related art all use copper plates, but copper plates are expensive and are greatly affected by global copper price fluctuations, especially in high-current, large-size shunt applications, which will significantly increase the material cost. In addition, the copper plates have high density and weight, which is not conducive to overall weight reduction design in application scenarios with high lightweight requirements. At the same time, copper plates are prone to generate copper oxide in the air, and their surface becomes black, resulting in a decrease in conductivity. Nickel or tin electroplating is also required, which increases the process complexity and cost. Therefore, the first metal plate 21 of this embodiment includes a metal aluminum plate or an aluminum alloy plate to optimize material costs, especially in high-current, large-volume scenarios, with significant savings, and is more suitable for occasions with high lightweight requirements. At the same time, the natural aluminum oxide film has a self-protection function, which is conducive to improving long-term stability, and the intrusion connection design of the second metal plate 22 ensures the structural strength and reliability of the metal aluminum plate or aluminum alloy plate, while meeting the conductive requirements, achieving the lightweight requirements and cost reduction requirements of the shunt, and improving the reliability and cost-effectiveness of the shunt.

[0069] In a possible implementation of the present application, the second metal plate 22 includes a metal copper plate or an alloy copper plate.

[0070] Among them, based on the second metal plate 22 connecting the resistor body 1 and the first metal plate 21 respectively, the second metal plate 22 including a metal copper plate or an alloy copper plate has excellent electrical properties, can better connect electrically with the resistor body 1, helps to reduce welding stress and contact resistance, and thus improve the reliability and comprehensive performance of the shunt.

[0071] In a possible implementation of the present application, the first metal plate 21 includes a metal aluminum plate or an aluminum alloy plate, and the second metal plate 22 includes a metal copper plate or an alloy copper plate. Then the composite structure 2 of the shunt is a copper-aluminum metal composite connection structure, and one end of the second metal plate 22 of copper material at least partially invades the first metal plate 21 of aluminum material to improve the mechanical strength and thermal stability of the shunt, and optimize the material cost, meet the lightweight requirements, and also ensure the connection strength between the plate body of the shunt connected to the external circuit and the resistor body 1, reduce its welding stress and contact resistance, and thereby improve the reliability and comprehensive performance of the shunt.

[0072] It can be understood that one end of the second metal plate 22 at least partially penetrates into the first metal plate 21 to form a local interlocking structure, which helps to resist tension and shear. A metallurgical diffusion layer is formed between the first metal plate 21 and the second metal plate 22 to construct a stable conductive channel and a firm connection structure, improve the bonding strength of the interface between dissimilar metals, avoid thermal expansion stress causing shedding or cracking, and enhance the working reliability of the shunt in large currents and complex environments.

[0073] In one example, the outer surface of the second metal plate 22 is plated with a metal protective layer 22a, and the forming material of the metal protective layer 22a includes at least one of tin, tin alloy, nickel, nickel alloy, gold, and silver, thereby effectively reducing its oxidation rate in the air, improving its antioxidant ability, and enhancing its affinity with solder, thereby improving the connection stability and conduction reliability of the shunt, and adapting to high current sampling accuracy and harsh environmental requirements.

[0074] The composite shunt of the present application includes a sampling structure 3 , which is correspondingly connected to the second metal plate 22 and close to the resistor 1 , so that the shunt can output a voltage difference signal of the resistor 1 through the sampling structure 3 .

[0075] In a possible implementation of the present application, the sampling structure 3 includes a first sampling patch 31 , which is correspondingly attached to the upper surface of the second metal plate 22 , so that the shunt outputs the voltage difference signal of the resistor 1 through the first sampling patch 31 .

[0076] In one example, a metallurgical diffusion layer is formed between the first sampling patch 31 and the second metal plate 22 to construct a stable conductive channel and a firm connection structure, improve the bonding strength of the interface between dissimilar metals, avoid falling off or cracking caused by thermal expansion stress, and enhance the working reliability of the shunt in high current and complex environment.

[0077] It should be noted that, based on the contents of the above embodiments, the first metal plate 21 and the second metal plate 22 can also be an integrally formed design of the same metal material, and the first metal plate 21 and the second metal plate 22 include metal aluminum plates or aluminum alloy plates to meet lightweight requirements and improve the cost-effectiveness of the diverter.

[0078] In one example, the composite structure 2 includes a partition groove 23, which is opened on the upper surface of the first metal plate 21 and / or the second metal plate 22 and connected to the first sampling patch 31, so as to establish isolation between the first sampling patch 31 and the composite structure 2 through the partition groove 23, while ensuring the soldering effect between the first sampling patch 31 and the external circuit board. For example, when the first sampling patch 31 is soldered to the PCB pad, the solder should be separated from the sampling patch area by the surrounding material under the action of affinity wetting force, thereby improving the connection quality between the sampling patch and the PCB pad, avoiding parasitic current interference with the pressure difference sampling accuracy, and at the same time helping the structural positioning of the first sampling patch 31 and improving measurement accuracy.

[0079] Optionally, the depth of the partition groove 23 is ≥0.1 mm.

[0080] Preferably, the depth of the partition groove 23 includes 0.5 mm, 0.3 mm, and 0.6 mm.

[0081] Furthermore, the metal protective layer 22 a may be plated on the outer surface of the first sampling patch 31 , and the metal protective layer 22 a may be formed of at least one of tin, tin alloy, nickel, nickel alloy, gold, and silver to protect the first sampling patch 31 .

[0082] In one example, the first sampling patch 31 protrudes from the resistor 1 and the composite structure 2. Specifically, the upper surface of the first sampling patch 31 protrudes from the first metal plate 21 or the second metal plate 22 by a height ≥ 0.1 mm, and the length of the first sampling patch 31 is ≥ 0.4 mm, to facilitate electrical connection of the first sampling patch 31 during operation.

[0083] In a possible implementation of this application, reference Figure 4 The sampling structure 3 includes a sampling column 32 , which is correspondingly disposed on the upper surface of the second metal plate 22 and connected to the second metal plate 22 so as to output the voltage difference signal of the resistor 1 through the sampling column 32 .

[0084] Optionally, the sampling column 32 is fixed to the second metal plate 22 by riveting or welding.

[0085] In one example, a first sampling step 32a is provided at the top of the sampling column 32 so that the sampling column 32 can be partially suspended and connected to an external circuit board, thereby partially isolating the external circuit board to prevent it from being subjected to thermal shock during operation of the diverter and reducing the impact of temperature changes on the surface of the diverter on components on the PCB board.

[0086] In one example, reference Figure 14 The sampling structure 3 also includes a heat dissipation groove 35, which is spaced apart from the sampling column 32. The heat dissipation groove 35 is arranged on the composite structure 2 and passes through the first metal plate 21 and the second metal plate 22, so as to provide a heat dissipation channel for the first metal plate 21 and the second metal plate 22 of the composite structure 2, thereby improving the reliability of the diverter.

[0087] The heat dissipation groove 35 is arc-shaped and arranged around the sampling column 32 to optimize the heat dissipation effect at the connection between the sampling column 32 and the second metal plate 22 .

[0088] In a possible implementation of this application, reference Figure 5 The sampling structure 3 includes a sampling threaded hole 33 , which is correspondingly opened on the upper surface of the second metal plate 22 and is used to connect the sampling circuit so that the shunt outputs the pressure difference signal of the resistor 1 through the sampling threaded hole 33 .

[0089] The sampling threaded hole 33 is designed as a blind hole structure to prevent metal chips randomly generated when the adapter is connected to the sampling threaded hole 33 from falling and endangering the safety of the system.

[0090] In one example, the sampling threaded hole 33 is provided with a second sampling step 33a, the height of which is ≤ the thickness of the external circuit board, so as to facilitate electrical connection with the pad of the external circuit board and guide the installation, positioning and support of the external circuit board connected to the sampling structure 3.

[0091] In a possible implementation of this application, reference Figure 13 The sampling structure 3 includes a sampling through hole 34 , which is correspondingly opened on the second metal plate 22 to adapt to the connection column of the external circuit board and output the voltage difference signal of the resistor 1 .

[0092] In a possible implementation of this application, reference Figure 15The sampling structure 3 includes a heat dissipation through-hole 37, which is relatively opened at the end of the second metal plate 22 close to the resistor 1 and connected to the resistor 1. A second sampling patch 36 is exposed in the heat dissipation through-hole 37 and is connected to the side of the resistor 1 in the heat dissipation through-hole 37. Therefore, the shunt outputs the voltage difference signal of the resistor 1 through the second sampling patch 36. In addition, the heat dissipation through-hole 37 provides a heat dissipation channel for the second sampling patch 36 and the second metal plate 22, thereby improving the reliability of the shunt.

[0093] The composite shunt of the present application includes a current bus connection structure 4, which is configured on the first metal plate 21 and located at the end of the first metal plate 21 away from the resistor 1, and is used to connect with the bus or high-power connector of external equipment.

[0094] In a possible implementation of the present application, the current bus connection structure 4 includes an external connection hole 41 provided on the first metal plate 21 .

[0095] The diameter of the external through hole 41 is ≥2 mm.

[0096] refer to Figure 4 and Figure 5 In a possible implementation of the present application, the current bus connection structure 4 may further include an external threaded hole 42, wherein the external threaded hole 42 is used to connect an external adapter so that the shunt can be connected to the bus or high-power connector of the external device through the current bus connection structure 4.

[0097] In a possible implementation of the present application, the current bus connection structure 4 may further include an external stud 43 , and the external stud 43 is fixed to the first metal plate 21 by riveting or welding to ensure the reliability of the external connection of the shunt.

[0098] It should be noted that the upper surface of the first metal plate 21 may also be a smooth, integrated plane, so that the composite structure 2 of the diverter can be connected to external equipment by laser or ultrasonic welding.

[0099] In one example, the first metal plate 21 includes a metal aluminum plate or an aluminum alloy plate, which corresponds to the aluminum or aluminum alloy bus or high-power connector of the external equipment to prevent deformation and loosening due to the different thermal expansion coefficients and hardness of copper and aluminum materials when different metal materials, such as copper and aluminum materials, are electrically connected. At the same time, there is a potential difference between the two materials, and the contact surface of the two metals is exposed to the risk of electrochemical corrosion under the combined action of moisture, carbon dioxide and other impurities in the air, thereby improving the reliability of the shunt.

[0100] In one example, an identification notch 5 is provided at the top corner of any composite structure 2 away from one end of the resistor body 1 to facilitate identification of the specific direction of the shunt during installation. Of course, the embodiments of the present application are not limited to this, and the identification notch 5 can also be other digital identification, graphic identification, scale identification or color identification, etc.

[0101] In a possible implementation of this application, reference Figure 3 The cross-sectional profile of the bonding surface between the composite connector 20 and the first metal plate 21 is marked as J, and J is in the shape of a broken line, and the bending angle of the broken line of J is toward the first metal plate 21 or the second metal plate 22.

[0102] In this way, a strong structure is constructed between the first metal plate 21 and the second metal plate 22, that is, the broken line cross-sectional profile forms an "anchor structure" between the composite connector 20 and the first metal plate 21, which increases the contact area between the two and improves the shear and peeling resistance. The bonding surface between the composite connector 20 and the first metal plate 21 can be multi-point / multi-faceted, thereby enhancing the metallurgical bite strength and peeling resistance between the composite connector 20 and the first metal plate 21, and also improving the fatigue resistance of the second metal plate 22 and the first metal plate 21 under thermal cycling conditions, slowing down the propagation path of interface cracks caused by thermal expansion and contraction, so as to improve the reliability of the shunt, which is suitable for long-term reliable operation of the shunt under harsh working environments such as large current and high temperature changes.

[0103] Among them, the bending angle of the broken line marked J is Q, and the angle range of Q includes 5° to 85°, so as to ensure that the bonding surface between the composite connector 20 and the first metal plate 21 is multi-point / multi-faceted, thereby enhancing the metallurgical bite and anti-peeling ability between the composite connector 20 and the first metal plate 21.

[0104] Preferably, the bending angle of the fold line of J is 15°, 20°, 30°, 45°, or 60°.

[0105] In a possible implementation of this application, reference Figure 6 The bonding surface between the composite connector 20 and the first metal plate 21 maintains a preset inclination angle R relative to the top surface or bottom surface of the first metal plate 21. Specifically, the bonding surface between the composite connector 20 and the first metal plate 21 is an inclined surface relative to the top surface or bottom surface of the first metal plate 21, thereby ensuring a larger contact area between the composite connector 20 and the first metal plate 21, thereby enhancing the metallurgical bite strength and anti-peeling ability between the composite connector 20 and the first metal plate 21.

[0106] The preset inclination angle R ranges from 10° to 90°.

[0107] Preferably, the preset inclination angle R is 15°, 20°, 30°, 45°, or 60°.

[0108] In an optional application scenario, refer to Figure 7 , the preset inclination angle R is 90°, then the bonding surface between the composite connector 20 and the first metal plate 21 remains perpendicular to the top or bottom surface of the first metal plate 21, that is, the first metal plate 21 and the second metal plate 22 are fixed end to end.

[0109] In a possible implementation of this application, reference Figure 8 The cross-sectional profile of the bonding surface between the composite connector 20 and the first metal plate 21 is set to be rectangular, thereby ensuring that there is a large contact area between the composite connector 20 and the first metal plate 21, forming a local interlocking structure, and enhancing the metallurgical bite strength between the composite connector 20 and the first metal plate 21 and the overall strength of the composite structure 2.

[0110] In one example, the ratio of the length to the thickness of the composite connector 20 is ≥0.5, so as to further ensure a larger contact area between the composite connector 20 and the first metal plate 21 .

[0111] It should be noted that the portion of the second metal plate 22 that intrudes into the first metal plate 21 includes at least one composite connector 20, and when the second metal plate 22 intrudes into the first metal plate 21, it can also be regarded as a portion of the first metal plate 21 being connected to the second metal plate 22. Figure 9 The portion of the second metal plate 22 that intrudes into the first metal plate 21 includes two composite connectors 20, and the two composite connectors 20 are relatively close to the upper surface and lower surface of the second metal plate 22. Therefore, on the one hand, it can be regarded as two composite connectors 20 intruding into the first metal plate 21 and clamping part of the first metal plate 21 to construct a composite connection between the first metal plate 21 and the second metal plate 22, thereby ensuring the connection strength between the first metal plate 21 and the second metal plate 22. On the other hand, it can also be regarded as one end of the first metal plate 21 facing the second metal plate 22, at least partially intruding into the second metal plate 22, and the cross-sectional profile of the bonding surface of this part with the second metal plate 22 is rectangular. Of course, the cross-sectional profile of the bonding surface of the composite connector 20 and the first metal plate 21 in the embodiment of the present application also conforms to the above design when it is in other shapes, which will not be repeated here.

[0112] In a possible implementation of this application, reference Figure 10 The cross-sectional profile of the bonding surface between the composite connector 20 and the first metal plate 21 is stepped, thereby ensuring that there is a large contact area between the composite connector 20 and the first metal plate 21, forming a local interlocking structure, and enhancing the metallurgical bite strength between the composite connector 20 and the first metal plate 21 and the overall strength of the composite structure 2.

[0113] In a possible implementation of this application, reference Figure 11 The number of composite connectors 20 is several, and several composite connectors 20 form a continuous band surface at one end of the second metal plate 22 facing the first metal plate 21, so that the cross-sectional profile of the bonding surface between the composite connector 20 and the first metal plate 21 is tooth-shaped, thereby ensuring that there is a large contact area between the composite connector 20 and the first metal plate 21, forming a local interlocking structure, and enhancing the metallurgical bite strength between the composite connector 20 and the first metal plate 21 and the overall strength of the composite structure 2.

[0114] In one example, the cross-sectional profile of the bonding surface between the composite connector 20 and the first metal plate 21 includes rectangular teeth, circular teeth, triangular teeth, wavy teeth, etc.

[0115] Based on the above embodiments, the composite connector 20 may include rectangular bumps, triangular prism bumps, or semi-cylindrical bumps to ensure a larger contact area between the composite connector 20 and the first metal plate 21 to form a partially embedded structure.

[0116] It should be noted that in the composite shunt of the present application, the composite structure 2 is arranged relatively on both sides of the resistor body 1, and the composite structures 2 on both sides of the resistor body 1 are mirror images of each other, that is, the structural connection relationship between the first metal plate 21 and the second metal plate 22 of each composite structure 2 is the same.

[0117] The present application also discloses a sampling device, which includes a composite flow divider as described in any of the above embodiments.

[0118] For other working principles and processes of the sampling device of this embodiment, please refer to the description of the composite diverter in the above embodiment, which will not be repeated here.

[0119] The above is a detailed introduction to the composite flow divider and sampling device provided by the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. It should be noted that in the present application, the descriptions of the various embodiments have their own emphases. For portions not described or recorded in detail in a particular embodiment, reference can be made to the relevant descriptions of other embodiments.

[0120] The above are only preferred embodiments of the present application and do not limit the patent scope of the present application. The various technical features of the technical solution of the present application can be arbitrarily combined. In order to make the description concise, all possible combinations of the various technical features in the above embodiments are not described. Any equivalent structure or equivalent process transformation made using the contents of the description and drawings of this application, or directly or indirectly applied in other related technical fields, as long as there is no contradiction in the combination of these technical features, are also included in the patent protection scope of the present application.

Claims

1. A composite diverter, characterized in that: include: The resistor is used as the main channel of the current to be measured; A composite structure for connecting to an external circuit, the composite structure being arranged oppositely on both sides of the resistor and each comprising a first metal plate and a second metal plate, wherein the second metal plate is respectively connected to the resistor and the first metal plate; The second metal plate faces one end of the first metal plate and at least partially penetrates into the first metal plate. The portion of the second metal plate that penetrates into the first metal plate includes at least one composite connector to construct a composite connection between the first metal plate and the second metal plate.

2. The composite diverter according to claim 1, characterized in that: The cross-sectional length of the bonding surface between the composite connector and the first metal plate is L1, and the thickness of the first metal plate is L2. The relationship between L1 and L2 satisfies: L1 / L2≥1.

3. The composite diverter according to claim 1, characterized in that: The end surfaces of the facing ends of the first metal plate and the second metal plate of the same composite structure do not overlap in a direction perpendicular to the top surface of the first metal plate or the second metal plate.

4. The composite diverter according to claim 1, characterized in that: The first metal plate includes an aluminum plate or an aluminum alloy plate.

5. The composite diverter according to claim 1, characterized in that: The second metal plate includes a metal copper plate or an alloy copper plate.

6. The composite diverter according to any one of claims 1 to 3, characterized in that: The cross-sectional profile of the bonding surface between the composite connector and the first metal plate is in the shape of a broken line, and the bending angle of the broken line faces the first metal plate or the second metal plate.

7. The composite diverter according to any one of claims 1 to 3, characterized in that: The cross-sectional profile of the bonding surface between the composite connector and the first metal plate is stepped or toothed.

8. The composite diverter according to any one of claims 1 to 2, characterized in that: The bonding surface between the composite connector and the first metal plate maintains a preset inclination angle relative to the top surface or the bottom surface of the first metal plate.

9. The composite diverter according to any one of claims 1 to 3, characterized in that: The cross-sectional profile of the bonding surface between the composite connector and the first metal plate is rectangular, and the ratio of the length to the thickness of the composite connector is ≥0.

5.

10. The composite diverter according to any one of claims 1 to 3, characterized in that: The composite connector includes a rectangular bump, a triangular prism bump or a semi-cylindrical bump.

11. The composite diverter according to claim 1, characterized in that: The resistance temperature coefficient of the resistor is ±20*10 -5 / ℃.

12. The composite diverter according to claim 1, characterized in that: It also includes a sampling structure for outputting a pressure difference signal. The sampling structure is correspondingly connected to the second metal plate and is close to the resistor body.

13. The composite diverter according to claim 12, characterized in that: The sampling structure includes a first sampling patch, and the first sampling patch is correspondingly attached to the upper surface of the second metal plate.

14. The composite diverter according to claim 13, characterized in that: The composite structure includes a partition groove, which is opened on the upper surface of the first metal plate and / or the second metal plate and connected to the first sampling patch.

15. The composite diverter according to claim 12, characterized in that: The sampling structure includes a sampling column, which is correspondingly configured on the upper surface of the second metal plate and connected to the second metal plate.

16. The composite diverter according to claim 1, characterized in that: The device further comprises a current bus connection structure, which is configured on the first metal plate and located at an end of the first metal plate away from the resistor.

17. The composite diverter according to claim 16, characterized in that: The current bus connection structure includes an external through hole, an external threaded hole or an external stud arranged on the first metal plate.

18. The composite diverter according to claim 1, characterized in that: A first resistance adjustment groove is provided on the resistor body and between the two second metal plates, and a second resistance adjustment groove is provided on a side of the resistor body and corresponding to the first resistance adjustment groove.

19. A sampling device, characterized in that: The sampling device comprises the composite diverter according to any one of claims 1 to 18.

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