Combined shunt and sampling device

Abstract

The application relates to the technical field of current monitoring, and discloses a combined shunt and a sampling device, the combined shunt comprising: a resistance plate used as a main passage of a current to be measured; a sampling structure used for collecting a differential pressure signal, the sampling structure being connected to the resistance plate at least in a relative mode; and a connecting structure used for connecting an external circuit, the connecting structure comprising an aluminum plate, the aluminum plate being arranged on two sides of the resistance plate in a relative mode, and the vertical projection area of one side of the resistance plate connecting the sampling structure on one end of the aluminum plate close to the sampling structure being M1, and M1 >= 0. The application improves the performance-price ratio of the shunt.

Description

Technical Field

[0001] This application relates to the field of current monitoring technology, specifically to a combined shunt and sampling device. Background Technology

[0002] A shunt is a resistive device used for current measurement. When current flows through the resistor plates of the shunt, a voltage difference is generated between the sampling points of the resistor plates. Based on this voltage difference and the resistance of the resistor plates, the current of the shunt can be calculated. Because the resistance of the resistor plates and the voltage difference between the sampling points are very small, indirect measurement of currents of tens or even hundreds of amperes can be achieved in small current circuits. Therefore, shunts are widely used in current sampling measurement and monitoring scenarios of high current and high power equipment. The connection leads of shunts in related technologies are mostly made of copper plates, which has a high production cost and affects the cost performance of shunts. In addition, the overall structure of the shunt is rigid and has poor environmental adaptability. Utility Model Content

[0003] In view of this, this application provides a combined shunt and sampling device to solve the aforementioned technical problems.

[0004] In a first aspect, embodiments of this application disclose a combined shunt, comprising:

[0005] The resistor plate is used as the main channel for the current to be measured.

[0006] A sampling structure for acquiring differential pressure signals, wherein the sampling structure is at least connected relative to the resistor plate;

[0007] A connection structure for connecting an external circuit includes an aluminum plate arranged opposite each other on both sides of a resistor plate. The vertical projection area of ​​the side of the resistor plate connected to the sampling structure on the end of the aluminum plate near the sampling structure is M1, where M1≥0.

[0008] In one possible example, if the overlap length of the side of the resistor plate connected to the sampling structure on the end of the aluminum plate near the sampling structure is N, then N > 0.

[0009] In one possible example, the overlapping area between the side of the resistor plate connected to the sampling structure and the aluminum plate is M2, and the area of ​​the lower surface of the resistor plate is M3. Then the relationship between M2 and M3 satisfies: M2 / M3≥1 / 20.

[0010] In one possible example, the resistor plate is metallurgically bonded to one side of the sampling structure and to the aluminum plate, and there is a metallurgical diffusion layer between the resistor plate and the aluminum plate. The area of ​​the metallurgical diffusion layer is M4, and the cross-sectional area of ​​the aluminum plate parallel to its end face is M5. Then the relationship between M4 and M5 satisfies: M4 / M5≥0.6.

[0011] In one possible example, the temperature coefficient of resistance of the resistive plate is ±20*10. -5 / ℃.

[0012] In one possible example, the resistor plate includes a first resistance adjustment slot and a second resistance adjustment slot, the first resistance adjustment slot being located between the sampling structures, and the second resistance adjustment slot being connected to the side of the first resistance adjustment slot.

[0013] In one possible example, the connection structure includes at least one pair of busbar clips integrally connected to the side of the aluminum plate and protruding from the aluminum plate in a direction perpendicular to the lower surface of the aluminum plate.

[0014] In one possible example, the sampling structure includes a first sampling patch that is attached to the upper surface of the resistive plate.

[0015] In one possible example, the connection structure includes a partition groove formed on the upper surface of the aluminum plate and / or the resistor plate and connected to the first sampling patch.

[0016] In one possible example, the sampling structure includes a first sampling post that is connected to the upper surface of the resistor plate.

[0017] In one possible example, the connection structure includes a current bus connector disposed on the aluminum plate and located at the end of the aluminum plate away from the resistor plate.

[0018] In one possible example, the current bus connector includes an external through hole, an external threaded hole, or an external stud disposed on the aluminum plate.

[0019] Secondly, embodiments of this application disclose a sampling device, which includes the combined splitter described in any of the above embodiments.

[0020] In summary, compared with the prior art, this application discloses a combined shunt and sampling device. The combined shunt includes a resistor plate, a sampling structure, and a connection structure. The sampling structure is at least relatively connected to the resistor plate. The connection structure includes an aluminum plate, which is arranged opposite to each other on both sides of the resistor plate. The vertical projection area of ​​the side of the resistor plate connected to the sampling structure on the end of the aluminum plate near the sampling structure is M1, where M1≥0. That is, through the above settings, the shunt structure can be flexibly matched, and the application environment is wide. Moreover, the use of aluminum plates improves the cost performance of the shunt. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a three-dimensional structural diagram of the first type of combined shunt according to an embodiment of this application;

[0023] Figure 2 This is a three-dimensional structural diagram of the second type of combined shunt according to an embodiment of this application;

[0024] Figure 3 yes Figure 1 The first top-view structural diagram;

[0025] Figure 4 yes Figure 1 The second top-view structural diagram;

[0026] Figure 5 This is a three-dimensional structural diagram of the third type of combined shunt according to an embodiment of this application;

[0027] Figure 6 This is a three-dimensional structural diagram of the fourth type of combined shunt according to an embodiment of this application;

[0028] Figure 7 This is a three-dimensional structural diagram of the fifth type of combined shunt according to an embodiment of this application;

[0029] Figure 8 This is a three-dimensional structural diagram of the sixth type of combined shunt according to an embodiment of this application;

[0030] Figure 9 This is a three-dimensional structural diagram of the seventh type of combined shunt in this application. Detailed Implementation

[0031] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0032] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Furthermore, components, features, and elements with the same names in different embodiments of this application may have the same meaning or different meanings, the specific meaning of which must be determined by its interpretation in that specific embodiment or further in conjunction with the context of that specific embodiment.

[0033] It should be understood that the specific embodiments described herein are merely illustrative of this application and are not intended to limit this application.

[0034] In the following description, the use of suffixes such as "module," "part," or "unit" to denote elements is solely for the purpose of illustrative purposes and has no specific meaning in itself. Therefore, "module," "part," or "unit" may be used interchangeably.

[0035] In the description of this application, it should be noted that the terms "upper," "lower," "left," "right," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0036] The technical solutions shown in this application will be described in detail below through specific embodiments. It should be noted that the order of description of the following embodiments is not intended to limit the priority of the embodiments.

[0037] Please refer to Figure 1 and Figure 2The combined shunt in this application embodiment includes a resistor plate 1, a connection structure 2, and a sampling structure 3. The resistor plate 1 is used as the main channel for the current to be measured, the connection structure 2 is used to connect to an external circuit, and the sampling structure 3 is used to output a differential pressure signal.

[0038] In one possible implementation of this application, the sampling structure 3 is at least connected to the resistor plate 1, and the connection structure 2 includes an aluminum plate 21, which is arranged opposite to both sides of the resistor plate 1. The side of the resistor plate 1 connected to the sampling structure 3 is at least partially connected to the outer surface of the aluminum plate 21 near the sampling structure 3.

[0039] During the operation of the combined shunt, based on the structural design that at least part of the side of the resistor plate 1 connected to the sampling structure 3 is connected to the outer surface of the aluminum plate 21 near the sampling structure 3, the resistor plate 1 can be configured to be connected to the upper surface of the outer surface of the aluminum plate 21 near the sampling structure 3, according to the actual operating requirements of the shunt. This allows the resistor plate 1 to form an overlapping connection with the aluminum plates 21 on both sides, i.e., as shown... Figure 1 As shown, the combined shunt is easy to integrate into a relatively compact space. Moreover, this design has more heat dissipation channels, which helps to achieve better heat dissipation distribution and can better ensure the overall thermal stability of the shunt. It is especially suitable for applications with low to medium current or high requirements for wiring freedom (such as distributed power supply, industrial control, smart grid measurement and control equipment, etc.).

[0040] Furthermore, the effective conductive cross-section of the resistor plate 1 and the aluminum plate 21 can be adjusted by adjusting the overlapping area of ​​the resistor plate 1 on the upper surface of the aluminum plate 21, thereby improving the overall structural flexibility of the shunt to adapt to different current levels and connection structure designs, and enhancing the adaptability of the shunt to different installation spaces and assembly methods.

[0041] On the other hand, according to the actual operating requirements of the shunt, the resistor plate 1 can be configured to connect at least partly to the end face of the aluminum plate 21 near the sampling structure 3 on one side, so that the resistor plate 1 can form a mating connection with the aluminum plates 21 on both sides, i.e. Figure 2As shown, one end of the aluminum plate 21 in the thickness direction is aligned and in contact with the resistor plate 1. Therefore, the resistor plate 1 and the aluminum plate 21 form a continuous metal contact surface at their end faces, forming a stable heat conduction path. This helps to reduce the temperature rise at the connection between the resistor plate 1 and the aluminum plate 21, suppress the thermal stress caused by the thermal gradient, and ensure uniform current distribution between the resistor plate 1 and the aluminum plate 21. The effective current-carrying cross section is larger, which can ensure a larger working strength of the shunt. It is suitable for high current and high current density applications, especially for applications with extremely high requirements for electrical performance and stability, such as electric vehicle main power monitoring systems, battery management systems (BMS), and rail transit power supply modules.

[0042] In one possible implementation of this application, combined with Figure 1 and Figure 3 If the vertical projection area of ​​the side of the resistor plate 1 connected to the sampling structure 3 on the aluminum plate 21 near the sampling structure 3 is M1, then M1≥0.

[0043] Specifically, when M1 > 0, the resistor plate 1 is connected to the sampling structure 3 on at least part of the upper or lower surface of the aluminum plate 21 near the sampling structure 3, forming an effective coverage area between it and the aluminum plate 21 in the vertical projection direction. This ensures that there is an actual structural connection and electrical conduction path at this location. That is, the resistor plate 1 and the aluminum plates 21 on both sides form an overlapping connection, making it easy to integrate the combined shunt into a relatively compact space. Moreover, this design has more heat dissipation channel action points, which helps to achieve better heat dissipation distribution and can better ensure the overall thermal stability of the shunt.

[0044] It should be noted that the vertical projection area of ​​the side of the resistor plate 1 connected to the sampling structure 3 on the end of the aluminum plate 21 near the sampling structure 3 is M1. Alternatively, M1 can be chosen to be 0. In this case, the side of the resistor plate 1 connected to the sampling structure 3 will not be connected to the upper or lower surface of the end of the aluminum plate 21 near the sampling structure 3, but rather to the end face portion of the outer surface of the end of the aluminum plate 21 near the sampling structure 3. Thus, the resistor plate 1 and the aluminum plates 21 on both sides form a butt joint connection. The ends of the resistor plate 1 and the aluminum plate 21 in the thickness direction are aligned face-to-face. Therefore, the resistor plate 1 and the aluminum plate 21 form a continuous metal contact surface at their end faces, forming a stable heat conduction path. This helps to reduce the temperature rise at the connection point between the resistor plate 1 and the aluminum plate 21, suppress the thermal stress caused by the thermal gradient, and ensure a uniform current distribution between the resistor plate 1 and the aluminum plate 21. The effective current-carrying cross section is larger, which can guarantee a larger working strength of the shunt.

[0045] Understandably, the shunts in related technologies use copper plates for connecting external circuits. However, copper plates are expensive and highly susceptible to fluctuations in global copper prices, especially in high-current, large-size shunt applications, which significantly increases material costs. Furthermore, copper plates are dense and heavy, which is detrimental to overall weight reduction design in applications requiring lightweight construction. Additionally, copper plates readily form copper oxide in the air, causing their surface to blacken and reducing conductivity. Electroplating with nickel or tin further complicates the process and increases costs. Therefore, the connection structure 2 in this embodiment includes an aluminum plate 21, which can be a metallic aluminum plate or an aluminum alloy plate, to optimize material costs. This is particularly beneficial in high-current, high-volume applications, resulting in significant cost savings and making it more suitable for applications with high lightweight requirements. The natural aluminum oxide film provides self-protection, enhancing long-term stability. The structural design, where at least part of the connection between the resistor plate 1 and the sampling structure 3 is on the outer surface of the aluminum plate 21 near the sampling structure 3, improves the overall structural flexibility and adaptability of the shunt to various application environments.

[0046] In one possible implementation of this application, the overlap length of the side of the resistor plate 1 connected to the sampling structure 3 on the aluminum plate 21 near the sampling structure 3 is N, where N > 0. In one example, the side of the resistor plate 1 connected to the sampling structure 3 is at least partially connected to the upper or lower surface of the aluminum plate 21 near the sampling structure 3, that is, the resistor plate 1 and the aluminum plates 21 on both sides form an overlapping connection. Thus, the combined shunt is easy to integrate into a relatively compact space. Moreover, this design has more heat dissipation channel action points, which helps to achieve better heat dissipation distribution and can better ensure the overall thermal stability of the shunt.

[0047] Similarly, if the overlap length of the side of the resistor plate 1 connected to the sampling structure 3 on the end of the aluminum plate 21 near the sampling structure 3 is N, then N = 0 can also be chosen. In one example, the side of the resistor plate 1 connected to the sampling structure 3 will not be connected to the upper or lower surface of the end of the aluminum plate 21 near the sampling structure 3, but to the end face portion of the outer surface of the end of the aluminum plate 21 near the sampling structure 3. Thus, the resistor plate 1 and the aluminum plates 21 on both sides form a butt connection. Therefore, the resistor plate 1 and the aluminum plate 21 form a continuous metal contact surface at their end faces, forming a stable heat conduction path of the plate. This is beneficial to reduce the temperature rise at the connection point between the resistor plate 1 and the aluminum plate 21, suppress the thermal stress caused by the thermal gradient, and ensure a uniform current distribution between the resistor plate 1 and the aluminum plate 21. The effective current-carrying cross section is larger, which can ensure a larger working strength of the shunt.

[0048] In one possible implementation of this application, combined with Figure 1 and Figure 4The overlapping area of ​​the side of the resistor plate 1 connected to the sampling structure 3 and the aluminum plate 21 is M2, and the area of ​​the lower surface of the resistor plate 1 is M3. The relationship between M2 and M3 satisfies: M2 / M3≥1 / 20. Therefore, the effective conductive cross-section of the resistor plate 1 and the aluminum plate 21 can be adjusted by adjusting the overlapping area M2, thereby improving the overall structural flexibility of the shunt to adapt to different current levels and connection structure designs, and enhancing the adaptability of the shunt to different installation spaces and assembly methods.

[0049] In one example, M2 / M3 includes 1 / 15, 1 / 10, 1 / 8, 1 / 6, and 1 / 4.

[0050] In one possible implementation of this application, reference is made to... Figure 2 and 5 The resistor plate 1 is metallurgically bonded to the aluminum plate 21 on one side of the sampling structure 3, and there is a metallurgical diffusion layer 1a between the resistor plate 1 and the aluminum plate 21 to build a stable conductive channel and a strong connection structure, improve the bonding strength of the dissimilar metal interface, avoid thermal expansion stress causing detachment or cracking, and enhance the working reliability of the shunt in high current and complex environments.

[0051] In one example, the area of ​​the metallurgical diffusion layer 1a is M4, and the cross-sectional area of ​​the aluminum plate 21 parallel to its end face is M5. Then the relationship between M4 and M5 satisfies: M4 / M5≥0.6.

[0052] This ensures the effective coverage area of ​​the metallurgical diffusion layer 1a between the resistance plate 1 and the aluminum plate 21, thereby ensuring that the interface between the resistance plate 1 and the aluminum plate 21 will not experience structural detachment or electrical performance degradation due to local stress concentration or thermal cycling fatigue under extreme operating conditions such as high current, high heat load, or long-term operation, thus improving the reliability of the shunt.

[0053] Optionally, M4 / M5 includes 0.6, 1, 1.2, 3, and 5.

[0054] In one possible implementation of this application, the resistance plate 1 includes a manganese copper plate to ensure the sampling accuracy of the shunt based on its material properties. The manganese copper plate has good metallurgical connection performance, and the resulting connection layer is stable, which helps to maintain the stability of the connection layer resistance, so as to be suitable for the micro voltage difference sampling of the shunt and avoid thermocouple errors.

[0055] It should be noted that the temperature coefficient of resistance of resistor 1 is ±20*10. -5 / ℃, to ensure that the resistance value of resistor plate 1 is less affected by temperature, thereby ensuring high-precision measurement of the shunt.

[0056] In one example, the temperature coefficient of resistance of resistor 1 is ±15*10. -5 / ℃, ±10*10 -5 / ℃, ±8*10 -5 / ℃, ±6*10 -5 / ℃, ±4*10 -5 / ℃ or ±2*10 -5 / ℃.

[0057] In one example, the resistor plate 1 includes a first resistance adjustment slot 11 located between the sampling structures 3, so as to initially adjust the specific resistance value of the resistor plate 1 before operation by adjusting the size of the first resistance adjustment slot 11.

[0058] Furthermore, a second resistance adjustment groove 12 is connected to the side of the resistor plate 1 and corresponding to the first resistance adjustment groove 11, so as to adjust the specific resistance value of the resistor plate 1 before operation by adjusting the groove size of the second resistance adjustment groove 12, thereby ensuring the high-precision measurement of the shunt.

[0059] In one possible implementation of this application, reference is made to... Figure 2 The connecting structure 2 includes at least one pair of busbar clips 22, which are integrally connected to the side of the aluminum plate 21 and protrude from the aluminum plate 21 in a direction perpendicular to the lower surface of the aluminum plate 21.

[0060] Therefore, the structural design of the busbar clamp 22 provides a quick and secure mounting port for the splitter, preventing it from slipping due to the torque generated by the threaded locking during installation, thus improving installation efficiency. This enhances the mechanical fixing capability of the splitter during system integration, preventing loosening or displacement. Furthermore, the bent and protruding structural design of the busbar clamp 22 facilitates cooperation with mechanisms such as pressure plates, bolts, or clips, improving the splitter's adaptability and vibration resistance. It is particularly suitable for applications with high requirements for electrical connection stability, such as automotive, power, and industrial control systems.

[0061] In one example, several pairs of busbar clips 22 are evenly arranged on both sides of the aluminum plate 21.

[0062] In addition, the cross-sectional profile of the busbar clamp 22 along the direction parallel to the end face of the aluminum plate 21 is designed in an inverted J-shape or an inverted L-shape to improve the stability of the splitter during installation.

[0063] In one possible implementation of this application, the sampling structure 3 includes a first sampling patch 31, which is attached to the upper surface of the resistor plate 1 so that the shunt can output the differential voltage signal of the resistor plate 1 through the first sampling patch 31.

[0064] In one example, a metallurgical diffusion layer is also formed between the first sampling patch 31 and the resistor plate 1 to build a stable conductive channel and a strong connection structure, improve the bonding strength of the dissimilar metal interface, avoid thermal expansion stress causing detachment or cracking, and enhance the reliability of the shunt in high current and complex environments.

[0065] In one example, the connection structure 2 includes an isolation groove 23, which is formed on the upper surface of the aluminum plate 21 and / or the resistor plate 1 and connected to the first sampling patch 31. The isolation groove 23 is used to create isolation between the first sampling patch 31 and the connection structure 2, while ensuring the soldering effect between the first sampling patch 31 and the external circuit board. For example, when the first sampling patch 31 is soldered to the PCB pad, the solder should be separated from the first sampling patch area by the surrounding material under the action of affinity wetting force, thereby improving the connection quality between the first sampling patch 31 and the PCB pad, avoiding parasitic current interference with the differential voltage sampling accuracy, and also helping the structural positioning of the first sampling patch 31 to improve the measurement accuracy.

[0066] Optionally, the depth of the partition groove 23 is ≥0.1mm.

[0067] Preferably, the depth of the partition groove 23 includes 0.5mm, 0.3mm, and 0.6mm.

[0068] In one example, the first sampling patch 31 is provided with a metal protective layer. Specifically, the metal protective layer is plated on the outer surface of the first sampling patch 31, and the forming material of the metal protective layer includes at least one of tin, tin alloy, nickel, nickel alloy, gold, and silver to protect the first sampling patch 31.

[0069] In one example, the first sampling patch 31 protrudes from the resistor plate 1 and the connection structure 2. Specifically, the upper surface of the first sampling patch 31 protrudes from the aluminum plate 21 by a height ≥ 0.1 mm, and the length of the first sampling patch 31 is ≥ 0.4 mm, so as to facilitate the electrical connection of the first sampling patch 31 during operation.

[0070] In one possible implementation of this application, reference is made to... Figure 5 The sampling structure 3 includes a first sampling post 32, which is connected to the upper surface of the resistor plate 1 so as to output the differential pressure signal of the resistor plate 1 through the first sampling post 32.

[0071] Optionally, the first sampling column 32 is fixed to the resistor plate 1 by riveting or welding.

[0072] In one example, the top of the first sampling post 32 is provided with a first sampling step 32a so that the first sampling post 32 can be partially suspended and connected to the external circuit board, thereby partially isolating the external circuit board, avoiding it from being subjected to thermal shock during the operation of the shunt, and reducing the impact of temperature changes on the surface of the shunt on the components on the PCB board.

[0073] In one example, refer to Figure 8 The sampling structure 3 also includes a heat dissipation groove 35, which is spaced from the first sampling column 32 and passes through the aluminum plate 21 and the resistor plate 1 to provide a heat dissipation channel for the aluminum plate 21 and the resistor plate 1, thereby improving the reliability of the shunt.

[0074] The heat dissipation groove 35 is arc-shaped and wrapped around the sampling column 32 to optimize the heat dissipation effect at the connection between the sampling column 32 and the second metal plate 22.

[0075] In one possible implementation of this application, reference is made to... Figure 6 The sampling structure 3 includes a second sampling post 33, which is integrally connected to the resistor plate 1 and protrudes from the resistor plate 1 by bending along a direction perpendicular to the upper surface of the resistor plate 1. This facilitates the output of the differential voltage signal of the resistor plate 1 through the second sampling post 33. Through its integral connection with the resistor plate 1, the second sampling post 33 provides an efficient current sampling path, reduces contact resistance, and helps to achieve accurate current monitoring. Furthermore, the structural design of the second sampling post 33 enhances the sampling structure 3's resistance to mechanical shock and vibration, making it suitable for high-power, high-current applications such as industrial control systems and distributed power supplies.

[0076] In one possible implementation of this application, reference is made to... Figure 7 The sampling structure 3 includes a sampling threaded hole 34, which is opened on the upper surface of the resistor plate 1 to connect the sampling circuit so that the shunt can output the differential pressure signal of the resistor plate 1 through the sampling threaded hole 34.

[0077] The sampling threaded hole 34 is designed as a blind hole to prevent metal shavings from falling out when the adapter is connected to the sampling threaded hole 34, which could endanger the system safety.

[0078] In one example, the sampling threaded hole 34 is provided with a second sampling step 34a, the height of which is less than or equal to the thickness of the external circuit board, so as to facilitate electrical connection with the pads of the external circuit board and to guide the external circuit board to the installation, positioning and support of the sampling structure 3.

[0079] It is understood that the sampling structure 3 may also include a sampling through hole, which is opened on the upper surface of the resistor plate 1 to facilitate the connection post of the external circuit board and output the differential pressure signal of the resistor plate 1.

[0080] In one possible implementation of this application, reference is made to... Figure 9 The sampling structure 3 includes a heat dissipation through hole 37, which is opened on the resistor plate 1. A second sampling patch 36 is exposed in the heat dissipation through hole 37. The second sampling patch 36 is in the heat dissipation through hole 37 and connected to the side of the resistor plate 1. Thus, the shunt outputs the differential voltage signal of the resistor plate 1 through the second sampling patch 36, and provides a heat dissipation channel for the second sampling patch 36 and the resistor plate 1 through the heat dissipation through hole 37, thereby improving the reliability of the shunt.

[0081] In one possible implementation of this application, the connection structure 2 includes a current bus connector 4, which is disposed on the aluminum plate 21 and located at the end of the aluminum plate 21 away from the resistor plate 1 for docking with the busbar or high-power connector of an external device.

[0082] In one example, refer to Figure 1 The current busbar connection structure 4 includes an external through hole 41 disposed on the aluminum plate 21.

[0083] Among them, the diameter of the external through hole 41 is ≥2mm.

[0084] In one example, refer to Figure 2 and Figure 7 The current busbar connection structure 4 may also include an external threaded hole 42, which is connected to the aluminum plate 21. The external threaded hole 42 is used to connect external adapters so that the shunt can be connected to the busbar or high-power connector of external equipment through the current busbar connection structure 4.

[0085] Furthermore, the current busbar connection structure 4 may also include an external stud 43, which is fixed to the aluminum plate 21 by riveting or welding to ensure the reliability of the shunt's external connection.

[0086] It should be noted that the upper surface of the aluminum plate 21 can also be a smooth, one-piece flat surface, so that the aluminum plate 21 of the distributor can be connected to external equipment by laser or ultrasonic welding.

[0087] In one example, the aluminum plate 21 is connected to the aluminum or aluminum alloy busbar or high-power connector of the external equipment to prevent deformation and loosening when different metal materials, such as copper and aluminum, are electrically connected. The different coefficients of thermal expansion and hardness of copper and aluminum can cause this. At the same time, there is a potential difference between the two materials, and the contact surface of the two metals may be subject to electrochemical corrosion under the combined action of moisture, carbon dioxide and other impurities in the air, thereby improving the reliability of the shunt.

[0088] In one possible implementation of this application, a notch 5 is provided at the top corner of any connection structure 2 away from the resistor plate 1 to indicate the specific direction of the shunt during installation. Of course, the embodiments of this application are not limited to this, and the notch 5 can also be other numerical markings, sticker markings, scale markings or color markings, etc.

[0089] It should be noted that in the combined shunt of this application, the connection structures 2 are arranged opposite to each other on both sides of the resistor plate 1, and the connection structures 2 on both sides of the resistor plate 1 are mirror images of each other, that is, the structural connection relationship of each connection structure 2 is the same.

[0090] This application also discloses a sampling device, which includes a combined shunt as described in any of the above embodiments.

[0091] For other working principles and processes of the sampling device in this embodiment, please refer to the description of the combined shunt in the aforementioned embodiment, which will not be repeated here.

[0092] The combined shunt and sampling device provided in this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. It should be noted that the descriptions of each embodiment in this application have different focuses, and parts not described in detail or in a certain embodiment can be referred to the relevant descriptions of other embodiments.

[0093] The above are merely preferred embodiments of this application and do not limit the patent scope of this application. The technical features of the technical solution of this application can be combined arbitrarily. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are also included within the patent protection scope of this application, as long as the combination of these technical features does not contradict each other.

Claims

1. A combined shunt, characterized in that, include: The resistor plate is used as the main channel for the current to be measured. A sampling structure for acquiring differential pressure signals, wherein the sampling structure is at least connected relative to the resistor plate; A connection structure for connecting an external circuit includes an aluminum plate arranged opposite each other on both sides of a resistor plate. The vertical projection area of ​​the side of the resistor plate connected to the sampling structure on the end of the aluminum plate near the sampling structure is M1, where M1≥0.

2. The combined shunt as described in claim 1, characterized in that, If the overlap length of the side of the resistor plate connected to the sampling structure on the end of the aluminum plate near the sampling structure is N, then N > 0.

3. The combined shunt as described in claim 1, characterized in that, The overlapping area between the side of the resistor plate connected to the sampling structure and the aluminum plate is M2, and the area of ​​the lower surface of the resistor plate is M3. Then the relationship between M2 and M3 satisfies: M2 / M3≥1 / 20.

4. The combined shunt as described in claim 1, characterized in that, The resistor plate is metallurgically bonded to the aluminum plate on one side of the sampling structure, and there is a metallurgical diffusion layer between it and the aluminum plate. The area of ​​the metallurgical diffusion layer is M4, and the cross-sectional area of ​​the aluminum plate parallel to its end face is M5. Then the relationship between M4 and M5 satisfies: M4 / M5≥0.

6.

5. The combined shunt as described in claim 1, characterized in that, The temperature coefficient of resistance of the resistance plate is ±20*10. -5 / ℃.

6. The combined shunt as described in claim 1, characterized in that, The resistor plate includes a first resistance adjustment slot and a second resistance adjustment slot, the first resistance adjustment slot being located between the sampling structures, and the second resistance adjustment slot being connected to the side of the first resistance adjustment slot.

7. The combined shunt as described in claim 1, characterized in that, The connection structure includes at least one pair of busbar clips, which are integrally connected to the side of the aluminum plate and protrude from the aluminum plate in a direction perpendicular to the lower surface of the aluminum plate.

8. The combined shunt as described in claim 1, characterized in that, The sampling structure includes a first sampling patch, which is attached to the upper surface of the resistor plate.

9. The combined shunt as described in claim 8, characterized in that, The connection structure includes a partition groove, which is formed on the upper surface of the aluminum plate and / or the resistor plate and connected to the first sampling patch.

10. The combined shunt as described in claim 1, characterized in that, The sampling structure includes a first sampling post, which is connected to the upper surface of the resistor plate.

11. The combined shunt as described in claim 1, characterized in that, The connection structure includes a current bus connector disposed on the aluminum plate and located at the end of the aluminum plate away from the resistor plate.

12. The combined shunt as described in claim 11, characterized in that, The current bus connector includes an external through hole, an external threaded hole, or an external stud disposed on the aluminum plate.

13. A sampling device, characterized in that, The sampling device includes the combined splitter as described in any one of claims 1 to 12.

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