Combined flow divider and sampling device

Abstract

The invention relates to the technical field of current monitoring, and discloses a combined shunt and a sampling device, and the combined shunt comprises a resistance plate which is used as a to-be-measured current main channel; the sampling structure is used for collecting a differential pressure signal, and the sampling structure is at least oppositely connected to the resistance plate; the connecting structure is used for connecting an external circuit, the connecting structure comprises aluminum plates, the aluminum plates are oppositely arranged on the two sides of the resistance plate, and at least part of the side, connected with the sampling structure, of the resistance plate is connected to the outer surface of the end, close to the sampling structure, of the aluminum plate. The cost performance of the shunt is improved.

Description

Technical Field

[0001] The present application relates to the technical field of current monitoring, and in particular to a combined shunt and sampling device. Background Art

[0002] A shunt is a resistor device used for current measurement. When current flows through the shunt resistor plate, a voltage difference is generated between the sampling points of the resistor plate. Based on this voltage difference and the resistance of the resistor plate, the current of the shunt can be calculated. Since the resistance of the resistor plate and the voltage difference between the sampling points are very small, the indirect measurement of tens or even hundreds of amperes of current by a small current circuit is achieved. Therefore, shunts are widely used in current sampling, measurement and monitoring scenarios of large current and high-power equipment. The connection lead ends of the shunt in related technologies are mostly made of copper plates, which have high production costs, affecting the cost-effectiveness of the shunt. In addition, the overall structure of the shunt is rigid and has poor environmental adaptability. Summary of the Invention

[0003] In view of this, the present application provides a combined flow divider and sampling device to solve the above-mentioned technical problems.

[0004] In a first aspect, an embodiment of the present application discloses a combined flow divider, comprising:

[0005] The resistor board is used as the main channel of the current to be measured;

[0006] A sampling structure for collecting a pressure difference signal, wherein the sampling structure is at least relatively connected to the resistor plate;

[0007] A connection structure for connecting an external circuit, the connection structure comprising aluminum plates, the aluminum plates being arranged relative to each other on both sides of the resistor plate, and the side of the resistor plate connected to the sampling structure being at least partially connected to the outer surface of the aluminum plate at one end close to the sampling structure.

[0008] In a possible example, the overlapping length of the side of the resistor plate connected to the sampling structure on the end of the aluminum plate close to the sampling structure is N, and N>0.

[0009] In a possible example, the overlapping area between the side of the resistor plate connected to the sampling structure and the aluminum plate is M2, and the area of ​​the lower surface of the resistor plate is M3. The relationship between M2 and M3 satisfies: M2 / M3≥1 / 20.

[0010] In one possible example, one side of the resistor plate connected to the sampling structure is metallurgically bonded to the aluminum plate, and a metallurgical diffusion layer is provided between the resistor plate and the aluminum plate. The area of ​​the metallurgical diffusion layer is M4, and the cross-sectional area of ​​the aluminum plate parallel to its end face is M5. Then, the relationship between M4 and M5 satisfies: M4 / M5 ≥ 0.6.

[0011] In one possible example, the resistance temperature coefficient of the resistor plate is ±20*10 -5 / ℃.

[0012] In a possible example, the resistor plate includes a first resistance adjustment slot and a second resistance adjustment slot, the first resistance adjustment slot is located between the sampling structures, and the second resistance adjustment slot is connected to a side of the first resistance adjustment slot.

[0013] In a possible example, the connection structure includes at least one pair of busbar pins, which are integrally connected to the side of the aluminum plate and are bent and protruded from the aluminum plate in a direction perpendicular to the lower surface of the aluminum plate.

[0014] In a possible example, the sampling structure includes a first sampling patch, and the first sampling patch is relatively attached to the upper surface of the resistor plate.

[0015] In a possible example, the connection structure includes a partition groove, which is opened on the upper surface of the aluminum plate and / or the resistor plate and connected to the first sampling patch.

[0016] In a possible example, the sampling structure includes a first sampling column, and the first sampling column is relatively connected to the upper surface of the resistor plate.

[0017] In a possible example, the connection structure includes a current bus connector, which is configured on the aluminum plate and located at an end of the aluminum plate away from the resistor plate.

[0018] In a possible example, the current bus connector includes an external through hole, an external threaded hole, or an external stud provided on the aluminum plate.

[0019] In a second aspect, an embodiment of the present application discloses a sampling device, which includes the combined diverter described in any of the above embodiments.

[0020] In summary, compared with the prior art, the present application discloses a combined shunt and sampling device. The combined shunt includes a resistor plate, a sampling structure, and a connecting structure. The sampling structure is at least relatively connected to the resistor plate. The connecting structure includes an aluminum plate. The aluminum plates are relatively arranged on both sides of the resistor plate, and one side of the resistor plate connected to the sampling structure is at least partially connected to the outer surface of the aluminum plate near one end of the sampling structure. That is, through the above-mentioned arrangement, the structure of the shunt is flexible and the application environment is wide, and the application of the aluminum plate improves the cost-effectiveness of the shunt. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following is a brief introduction to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0022] Figure 1 This is a schematic diagram of the three-dimensional structure of the first combined diverter according to an embodiment of the present application;

[0023] Figure 2 This is a schematic diagram of the three-dimensional structure of the second combined diverter of the embodiment of the present application;

[0024] Figure 3 yes Figure 1 A schematic diagram of a first top view structure;

[0025] Figure 4 yes Figure 1 A second schematic diagram of a top view structure;

[0026] Figure 5 1 is a schematic diagram of the three-dimensional structure of the third combined type diverter according to the embodiment of the present application;

[0027] Figure 6 1 is a schematic diagram of the three-dimensional structure of the fourth combined diverter according to an embodiment of the present application;

[0028] Figure 7 This is a schematic diagram of the three-dimensional structure of the fifth combined diverter according to the embodiment of the present application;

[0029] Figure 8 This is a schematic diagram of the three-dimensional structure of the sixth combined type diverter according to the embodiment of the present application;

[0030] Figure 9 It is a schematic diagram of the three-dimensional structure of the seventh combined diverter of the embodiment of the present application. DETAILED DESCRIPTION

[0031] Exemplary embodiments will be described in detail herein, with examples illustrated in the accompanying drawings. When the following description refers to the drawings, identical numbers in different figures represent identical or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present application, as detailed in the appended claims.

[0032] It should be noted that, in this document, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprising a ..." does not exclude the presence of other identical elements in the process, method, article or device comprising the element. In addition, components, features, and elements with the same name in different embodiments of the present application may have the same meaning or different meanings, and their specific meanings need to be determined based on their explanation in the specific embodiment or further combined with the context of the specific embodiment.

[0033] It should be understood that the specific embodiments described herein are only used to explain the present application and are not intended to limit the present application.

[0034] In the subsequent description, the use of suffixes such as "module", "component" or "unit" to represent elements is only for the purpose of facilitating the description of the present application and has no specific meaning. Therefore, "module", "component" or "unit" can be used interchangeably.

[0035] In the description of this application, it should be noted that the terms "upper," "lower," "left," "right," "inner," and "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate the description of this application and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0036] The technical solutions shown in this application will be described in detail below through specific embodiments. It should be noted that the description order of the following embodiments does not limit the priority order of the embodiments.

[0037] Please refer to Figure 1 and Figure 2The combined shunt of the embodiment of the present application includes a resistor plate 1, a connecting structure 2, and a sampling structure 3. The resistor plate 1 is used as the main channel of the current to be measured, the connecting structure 2 is used to connect to an external circuit, and the sampling structure 3 is used to output a pressure difference signal.

[0038] In one possible implementation of the present application, the sampling structure 3 is at least relatively connected to the resistor plate 1, and the connecting structure 2 includes an aluminum plate 21, which is relatively arranged on both sides of the resistor plate 1, and the side of the resistor plate 1 connected to the sampling structure 3 is at least partially connected to the outer surface of the aluminum plate 21 at one end close to the sampling structure 3.

[0039] During the operation of the combined shunt, based on the structural design that the side of the resistor plate 1 connected to the sampling structure 3 is at least partially connected to the outer surface of the aluminum plate 21 near the sampling structure 3, the side of the resistor plate 1 connected to the sampling structure 3 can be configured to be at least partially connected to the upper surface of the outer surface of the aluminum plate 21 near the sampling structure 3 according to the actual working conditions of the shunt. Then, the resistor plate 1 can establish an overlapping connection relationship with the aluminum plates 21 on both sides, that is, Figure 1 As shown, the combined shunt is easy to integrate in a relatively compact space, and this design has more heat dissipation channel action points, which helps to achieve better heat dissipation distribution and can better ensure the overall thermal stability of the shunt. It is especially suitable for applications with medium and low currents or high requirements for wiring freedom (such as distributed power supplies, industrial control, smart grid measurement and control equipment, etc.).

[0040] In addition, the effective conductive cross-section of the resistor plate 1 and the aluminum plate 21 can be adjusted accordingly by adjusting the overlapping area of ​​the resistor plate 1 on the upper surface of the aluminum plate 21, thereby improving the overall structural flexibility of the shunt to adapt to different current levels and connection structure designs, and enhancing the adaptability of the shunt to different installation spaces and assembly methods.

[0041] On the other hand, according to the actual working condition of the diverter, the side of the resistor plate 1 connected to the sampling structure 3 can be configured to be at least partially connected to the end surface portion of the outer surface of the aluminum plate 21 near the end of the sampling structure 3, so that the resistor plate 1 can establish a docking connection relationship with the aluminum plates 21 on both sides thereof, that is, Figure 2As shown, one end of the aluminum plate 21 in the thickness direction is aligned with the resistor plate 1 in front contact. Therefore, the resistor plate 1 and the aluminum plate 21 construct a continuous metal contact surface at their end faces, forming a stable plate heat conduction path, which is beneficial to reducing the temperature rise of the connection between the resistor plate 1 and the aluminum plate 21, suppressing the thermal stress caused by the thermal gradient, and the current distribution between the resistor plate 1 and the aluminum plate 21 is uniform, and the effective flow cross-section is larger, which can ensure a greater working strength of the shunt and is suitable for high current and high flow density occasions, especially for application scenarios with extremely high requirements on electrical performance and stability, such as electric vehicle main power monitoring system, battery management system (BMS), rail transit power supply module, etc.

[0042] In a possible implementation of this application, combined with Figure 1 and Figure 3 , the vertical projection area of ​​the side of the resistor plate 1 connected to the sampling structure 3 on the end of the aluminum plate 21 close to the sampling structure 3 is M1, then M1>0, then the side of the resistor plate 1 connected to the sampling structure 3 is at least partially connected to the upper surface or lower surface of the end of the aluminum plate 21 close to the sampling structure 3, and forms an effective coverage area between the aluminum plate 21 in the vertical projection direction to ensure that there is an actual structural connection relationship and an electrical conduction path there, that is, the resistor plate 1 and the aluminum plates 21 on both sides thereof establish an overlapping connection relationship, so that the combined shunt is easy to integrate in a relatively compact space application, and this design has more heat dissipation channel action points, which helps to achieve better heat dissipation distribution and can better ensure the overall thermal stability of the shunt.

[0043] It should be noted that the vertical projection area of ​​the side of the resistor plate 1 connected to the sampling structure 3 on the end of the aluminum plate 21 close to the sampling structure 3 is M1, then M1=0 can also be selected, then the side of the resistor plate 1 connected to the sampling structure 3 will not be connected to the upper surface or lower surface of the end of the aluminum plate 21 close to the sampling structure 3, but is connected to the end surface part of the outer surface of the end of the aluminum plate 21 close to the sampling structure 3, then the resistor plate 1 and the aluminum plates 21 on both sides thereof establish a docking connection relationship, and the resistor plate 1 and one end of the aluminum plate 21 in the thickness direction are in front-aligned contact. Therefore, the resistor plate 1 and the aluminum plate 21 construct a continuous metal contact surface at their end surfaces, forming a stable plate heat conduction path, which is beneficial to reducing the temperature rise of the connection part between the resistor plate 1 and the aluminum plate 21, suppressing the thermal stress caused by the thermal gradient, and the current distribution between the resistor plate 1 and the aluminum plate 21 is uniform, the effective flow cross-section is larger, and the greater working strength of the shunt can be ensured.

[0044] It is understandable that the plates used to connect the shunts to the external circuit in the related art all use copper plates. However, copper plates are expensive and are greatly affected by global copper price fluctuations. This can significantly increase material costs, especially in high-current, large-size shunt applications. Copper plates have high density and weight, which is not conducive to overall weight reduction in applications with high lightweight requirements. At the same time, copper plates easily generate copper oxide in the air, causing their surfaces to blacken, resulting in reduced conductivity. Electroplating with nickel or tin is also required, increasing process complexity and cost. Therefore, the connection structure 2 of this embodiment includes an aluminum plate 21, wherein the aluminum plate 21 can include a metal aluminum plate or an aluminum alloy plate to optimize material costs. This saves significantly, especially in high-current, large-volume scenarios, and is more suitable for applications with high lightweight requirements. At the same time, the natural aluminum oxide film has a self-protection function, which is conducive to improving long-term stability. The structural design in which one side of the resistor plate 1 connected to the sampling structure 3 is at least partially connected to the outer surface of the aluminum plate 21 near the sampling structure 3 improves the overall structural flexibility of the shunt and its adaptability to multiple application environments.

[0045] In a possible implementation of the present application, the overlapping length of one side of the resistor plate 1 connected to the sampling structure 3 on the end of the aluminum plate 21 close to the sampling structure 3 is N, then N>0. Therefore, in one example, the side of the resistor plate 1 connected to the sampling structure 3 is at least partially connected to the upper surface or lower surface of the end of the aluminum plate 21 close to the sampling structure 3, that is, the resistor plate 1 and the aluminum plates 21 on both sides thereof establish an overlapping connection relationship, so that the combined shunt is easy to integrate in a relatively compact space application, and this design has more heat dissipation channel action points, which helps to achieve better heat dissipation distribution and can better ensure the overall thermal stability of the shunt.

[0046] By the same token, if the overlapping length of the side of the resistor plate 1 connected to the sampling structure 3 on the end of the aluminum plate 21 close to the sampling structure 3 is N, then N=0 can also be selected. In an example, the side of the resistor plate 1 connected to the sampling structure 3 will not be connected to the upper surface or lower surface of the end of the aluminum plate 21 close to the sampling structure 3, but is connected to the end surface portion of the outer surface of the end of the aluminum plate 21 close to the sampling structure 3. The resistor plate 1 and the aluminum plates 21 on both sides of it establish a docking connection relationship. Therefore, the resistor plate 1 and the aluminum plate 21 construct a continuous metal contact surface at their end surfaces, forming a stable plate heat conduction path, which is beneficial to reducing the temperature rise of the connection between the resistor plate 1 and the aluminum plate 21, suppressing the thermal stress caused by the thermal gradient, and the current distribution between the resistor plate 1 and the aluminum plate 21 is uniform, and the effective flow cross-section is larger, which can ensure a greater working strength of the shunt.

[0047] In a possible implementation of this application, combined with Figure 1 and Figure 4The overlapping area between the side of the resistor plate 1 connected to the sampling structure 3 and the aluminum plate 21 is M2, and the area of ​​the lower surface of the resistor plate 1 is M3. The relationship between M2 and M3 satisfies: M2 / M3 ≥ 1 / 20. Therefore, the effective conductive cross-section of the resistor plate 1 and the aluminum plate 21 can be adjusted accordingly by adjusting the overlapping area M2, thereby improving the overall structural flexibility of the shunt to adapt to different current levels and connection structure designs, thereby enhancing the adaptability of the shunt to different installation spaces and assembly methods.

[0048] In one example, M2 / M3 includes 1 / 15, 1 / 10, 1 / 8, 1 / 6, and 1 / 4.

[0049] In a possible implementation of this application, reference Figure 2 and 5 The side of the resistor plate 1 connected to the sampling structure 3 is metallurgically bonded to the aluminum plate 21, and a metallurgical diffusion layer 1a is provided between the resistor plate 1 and the aluminum plate 21 to construct a stable conductive channel and a firm connection structure, thereby improving the bonding strength of the interface between dissimilar metals, avoiding shedding or cracking caused by thermal expansion stress, and enhancing the working reliability of the shunt under high current and complex environment.

[0050] In one example, the area of ​​the metallurgical diffusion layer 1 a is M4, and the cross-sectional area of ​​the aluminum plate 21 parallel to its end surface is M5. Then, the relationship between M4 and M5 satisfies: M4 / M5≥0.6.

[0051] In this way, the effective coverage area of ​​the metallurgical diffusion layer 1a between the resistor plate 1 and the aluminum plate 21 is guaranteed, thereby ensuring that under extreme working conditions such as high current, high heat load or long-term operation, the bonding interface between the resistor plate 1 and the aluminum plate 21 will not suffer from structural detachment or electrical performance degradation due to local stress concentration or thermal cycle fatigue, thereby improving the reliability of the shunt.

[0052] Optionally, M4 / M5 includes 0.6, 1, 1.2, 3, and 5.

[0053] In a possible implementation of the present application, the resistor plate 1 includes a manganese copper plate to ensure the sampling accuracy of the shunt based on its material properties, and the manganese copper plate has good metallurgical connection performance, and the formed connection layer is stable, which is conducive to maintaining the stability of the connection layer resistance, so as to be suitable for the micro-voltage difference sampling of the shunt and avoid thermocouple errors.

[0054] It should be noted that the resistance temperature coefficient of the resistor plate 1 is ±20*10 -5 / ℃, so as to ensure that the resistance of the resistor plate 1 is less affected by the temperature, thereby ensuring high-precision measurement of the shunt.

[0055] In one example, the resistance temperature coefficient of the resistor plate 1 is ±15*10 -5 / ℃、±10*10 -5 / ℃、±8*10 -5 / ℃、±6*10 -5 / ℃、±4*10 -5 / ℃ or ±2*10 -5 / ℃.

[0056] In one example, the resistor plate 1 includes a first resistance adjustment slot 11, which is located between the sampling structures 3, so that the specific resistance of the resistor plate 1 before operation can be preliminarily adjusted in a large range by adjusting the slot size of the first resistance adjustment slot 11.

[0057] In addition, a second resistance adjustment slot 12 is connected to the side of the resistor plate 1 and corresponding to the first resistance adjustment slot 11, so that the specific resistance of the resistor plate 1 before operation can be finely adjusted by adjusting the slot size of the second resistance adjustment slot 12, thereby ensuring high-precision measurement of the shunt.

[0058] In a possible implementation of this application, reference Figure 2 The connection structure 2 includes at least one pair of busbar pins 22 , which are integrally connected to the side of the aluminum plate 21 and are bent and protruded from the aluminum plate 21 in a direction perpendicular to the lower surface of the aluminum plate 21 .

[0059] Therefore, through the structural design of the busbar clamp 22, a quick and firm installation alignment port can be provided for the diverter, preventing the diverter from sliding due to the torque generated by the threaded locking during installation, thereby improving the installation efficiency, that is, improving the mechanical fixing ability of the diverter during system integration, preventing loosening or offset, and the bent protruding structural design of the busbar clamp 22 helps to cooperate with pressure plates, bolts or snap mechanisms, thereby improving the adaptability and vibration resistance of the diverter, and is especially suitable for occasions such as automotive, power, and industrial control that have high requirements for electrical connection stability.

[0060] In one example, a plurality of pairs of busbar clips 22 are evenly arranged on both sides of the aluminum plate 21 .

[0061] Furthermore, the cross-sectional profile of the busbar clamping pin 22 along the direction parallel to the end surface of the aluminum plate 21 is designed to be an inverted J-shape or an inverted L-shape to improve the stability of the diverter during installation.

[0062] In a possible implementation of the present application, the sampling structure 3 includes a first sampling patch 31 , which is relatively attached to the upper surface of the resistor plate 1 so that the shunt outputs the voltage difference signal of the resistor plate 1 through the first sampling patch 31 .

[0063] In one example, a metallurgical diffusion layer is also formed between the first sampling patch 31 and the resistor plate 1 to construct a stable conductive channel and a firm connection structure, improve the bonding strength of the interface between dissimilar metals, avoid falling off or cracking caused by thermal expansion stress, and enhance the working reliability of the shunt in high current and complex environment.

[0064] In one example, the connection structure 2 includes a partition groove 23, which is opened on the upper surface of the aluminum plate 21 and / or the resistor plate 1 and connected to the first sampling patch 31, so as to establish isolation between the first sampling patch 31 and the connection structure 2 through the partition groove 23, while ensuring the soldering effect between the first sampling patch 31 and the external circuit board. For example, when the first sampling patch 31 is soldered to the PCB pad, the solder should be separated from the first sampling patch area by the surrounding material under the action of affinity wetting force, thereby improving the connection quality between the first sampling patch 31 and the PCB pad, avoiding parasitic current interference with the pressure difference sampling accuracy, and at the same time facilitating the structural positioning of the first sampling patch 31 and improving measurement accuracy.

[0065] Optionally, the depth of the partition groove 23 is ≥0.1 mm.

[0066] Preferably, the depth of the partition groove 23 includes 0.5 mm, 0.3 mm, and 0.6 mm.

[0067] In one example, the first sampling patch 31 is provided with a metal protective layer. Specifically, the metal protective layer is plated on the outer surface of the first sampling patch 31 , and the material forming the metal protective layer includes at least one of tin, tin alloy, nickel, nickel alloy, gold, and silver to protect the first sampling patch 31 .

[0068] In one example, the first sampling patch 31 protrudes from the resistor plate 1 and the connection structure 2. Specifically, the upper surface of the first sampling patch 31 protrudes from the aluminum plate 21 by a height of ≥0.1 mm, and the length of the first sampling patch 31 is ≥0.4 mm, to facilitate electrical connection of the first sampling patch 31 during operation.

[0069] In a possible implementation of this application, reference Figure 5 The sampling structure 3 includes a first sampling column 32 , which is relatively connected to the upper surface of the resistor plate 1 so as to output the voltage difference signal of the resistor plate 1 through the first sampling column 32 .

[0070] Optionally, the first sampling column 32 is fixed to the resistor plate 1 by riveting or welding.

[0071] In one example, a first sampling step 32a is provided at the top of the first sampling column 32 so that the first sampling column 32 can be partially suspended and connected to an external circuit board, thereby partially isolating the external circuit board to prevent it from being subjected to thermal shock during operation of the diverter, thereby reducing the impact of temperature changes on the surface of the diverter on components on the PCB board.

[0072] In one example, reference Figure 8 The sampling structure 3 also includes a heat dissipation groove 35, which is spaced apart from the first sampling column 32 and passes through part of the aluminum plate 21 and the resistor plate 1 to provide a heat dissipation channel for the aluminum plate 21 and the resistor plate 1, thereby improving the reliability of the shunt.

[0073] The heat dissipation groove 35 is arc-shaped and arranged around the sampling column 32 to optimize the heat dissipation effect at the connection between the sampling column 32 and the second metal plate 22 .

[0074] In a possible implementation of this application, reference Figure 6 The sampling structure 3 includes a second sampling column 33, which is integrally connected to the resistor plate 1 and protrudes from the resistor plate 1 by being bent in a direction perpendicular to the upper surface of the resistor plate 1, so as to output the voltage difference signal of the resistor plate 1 through the second sampling column 33. In addition, through the integral connection with the resistor plate 1, the second sampling column 33 can provide an efficient current sampling path, reduce contact resistance, and help achieve accurate current monitoring. In addition, the structural design of the second sampling column 33 enhances the mechanical shock and vibration resistance of the sampling structure 3, making it suitable for high-power, high-current application scenarios such as industrial control systems and distributed power supplies.

[0075] In a possible implementation of this application, reference Figure 7 The sampling structure 3 includes a sampling threaded hole 34 , which is correspondingly opened on the upper surface of the resistor plate 1 and is used to connect the sampling circuit so that the shunt outputs the pressure difference signal of the resistor plate 1 through the sampling threaded hole 34 .

[0076] The sampling threaded hole 34 is designed as a blind hole structure to prevent metal chips randomly generated when the adapter is connected to the sampling threaded hole 34 from falling and endangering the safety of the system.

[0077] In one example, the sampling threaded hole 34 is provided with a second sampling step 34a, the height of which is ≤ the thickness of the external circuit board, so as to facilitate electrical connection with the pad of the external circuit board and guide the installation, positioning and support of the external circuit board connected to the sampling structure 3.

[0078] It is understandable that the sampling structure 3 may further include a sampling through hole, which is correspondingly opened on the upper surface of the resistor plate 1 to facilitate adapting to the connection column of the external circuit board and outputting the voltage difference signal of the resistor plate 1.

[0079] In a possible implementation of this application, reference Figure 9 The sampling structure 3 includes a heat dissipation through-hole 37, which is provided on the resistor plate 1. A second sampling patch 36 is exposed in the heat dissipation through-hole 37. The second sampling patch 36 is in the heat dissipation through-hole 37 and connected to the side of the resistor plate 1. Thus, the shunt outputs the voltage difference signal of the resistor plate 1 through the second sampling patch 36. In addition, the heat dissipation through-hole 37 provides a heat dissipation channel for the second sampling patch 36 and the resistor plate 1, thereby improving the reliability of the shunt.

[0080] In one possible implementation of the present application, the connection structure 2 includes a current bus connector 4, which is disposed on the aluminum plate 21 and is located at an end of the aluminum plate 21 away from the resistor plate 1 for docking with a busbar or high-power connector of an external device.

[0081] In one example, reference Figure 1 The current bus connection structure 4 includes an external through hole 41 provided on the aluminum plate 21 .

[0082] The diameter of the external through hole 41 is ≥2 mm.

[0083] In one example, reference Figure 2 and Figure 7 The current bus connection structure 4 may further include an external threaded hole 42, which is connected to the aluminum plate 21, wherein the external threaded hole 42 is used to connect an external adapter to facilitate the connection of the shunt with the bus or high-power connector of the external equipment through the current bus connection structure 4.

[0084] Furthermore, the current bar connection structure 4 may further include an external stud 43 , and the external stud 43 is fixed to the aluminum plate 21 by riveting or welding to ensure the reliability of the external connection of the shunt.

[0085] It should be noted that the upper surface of the aluminum plate 21 can also be a smooth, integrated plane, so that the aluminum plate 21 of the diverter can be connected to external equipment by laser or ultrasonic welding.

[0086] In one example, the aluminum plate 21 is docked with the aluminum or aluminum alloy bus or high-power connector of the external equipment to prevent deformation and loosening due to the different thermal expansion coefficients and hardness of copper and aluminum materials when different metal materials, such as copper and aluminum materials, are electrically connected. At the same time, there is a potential difference between the two materials, and the contact surface of the two metals is exposed to the risk of electrochemical corrosion under the combined action of moisture, carbon dioxide and other impurities in the air, thereby improving the reliability of the shunt.

[0087] In a possible implementation of the present application, an identification notch 5 is provided at the top corner of any connecting structure 2 away from one end of the resistor plate 1 to facilitate identification of the specific direction of the shunt during installation. Of course, the embodiments of the present application are not limited to this, and the identification notch 5 can also be other digital identification, graphic identification, scale identification or color identification, etc.

[0088] It should be noted that in the combined shunt of the present application, the connection structures 2 are arranged on both sides of the resistor plate 1, and the connection structures 2 on both sides of the resistor plate 1 are mirror images of each other, that is, the structural connection relationship of each connection structure 2 is the same.

[0089] The present application also discloses a sampling device, which includes a combined flow divider as described in any of the above embodiments.

[0090] For other working principles and processes of the sampling device of this embodiment, please refer to the description of the combined diverter of the above embodiment, which will not be repeated here.

[0091] The combined flow divider and sampling device provided by the present application are described in detail above. Specific examples are used herein to illustrate the principles and implementation methods of the present application. It should be noted that in the present application, the descriptions of the various embodiments have their own emphases. For portions not described or recorded in detail in a particular embodiment, reference can be made to the relevant descriptions of other embodiments.

[0092] The above are only preferred embodiments of the present application and do not limit the patent scope of the present application. The various technical features of the technical solution of the present application can be arbitrarily combined. In order to make the description concise, all possible combinations of the various technical features in the above embodiments are not described. Any equivalent structure or equivalent process transformation made using the contents of the description and drawings of this application, or directly or indirectly applied in other related technical fields, as long as there is no contradiction in the combination of these technical features, are also included in the patent protection scope of the present application.

Claims

1. A combined flow divider, characterized in that: include: The resistor board is used as the main channel of the current to be measured; A sampling structure for collecting a pressure difference signal, wherein the sampling structure is at least relatively connected to the resistor plate; A connection structure for connecting an external circuit, the connection structure comprising aluminum plates, the aluminum plates being arranged relative to each other on both sides of the resistor plate, and the side of the resistor plate connected to the sampling structure being at least partially connected to the outer surface of the aluminum plate at one end close to the sampling structure.

2. The combined diverter according to claim 1, characterized in that: The overlapping length of the side of the resistor plate connected to the sampling structure on the end of the aluminum plate close to the sampling structure is N, and N>0.

3. The combined diverter according to claim 1, wherein: The overlapping area between the side of the resistor plate connected to the sampling structure and the aluminum plate is M2, and the area of ​​the lower surface of the resistor plate is M3. The relationship between M2 and M3 satisfies: M2 / M3≥1 / 20.

4. The combined diverter according to claim 1, wherein: One side of the resistor plate connected to the sampling structure is metallurgically bonded to the aluminum plate, and a metallurgical diffusion layer is provided between the resistor plate and the aluminum plate. The area of ​​the metallurgical diffusion layer is M4, and the cross-sectional area of ​​the aluminum plate parallel to its end face is M5. The relationship between M4 and M5 satisfies: M4 / M5 ≥ 0.

6.

5. The combined diverter according to claim 1, wherein: The resistance temperature coefficient of the resistor plate is ±20*10 -5 / ℃.

6. The combined diverter according to claim 1, characterized in that: The resistor plate includes a first resistance adjustment slot and a second resistance adjustment slot, the first resistance adjustment slot is located between the sampling structures, and the second resistance adjustment slot is connected to a side of the first resistance adjustment slot.

7. The combined flow divider according to claim 1, wherein: The connection structure includes at least one pair of busbar clamping pins, which are integrally connected to the side of the aluminum plate and are bent in a direction perpendicular to the lower surface of the aluminum plate to protrude from the aluminum plate.

8. The combined diverter according to claim 1, wherein: The sampling structure includes a first sampling patch, and the first sampling patch is relatively attached to the upper surface of the resistor plate.

9. The combined diverter according to claim 8, characterized in that: The connection structure includes a partition groove, which is opened on the upper surface of the aluminum plate and / or the resistor plate and is connected to the first sampling patch.

10. The combined diverter according to claim 1, wherein: The sampling structure includes a first sampling column, which is relatively connected to the upper surface of the resistor plate.

11. The combined diverter according to claim 1, characterized in that: The connection structure includes a current bus connector, which is disposed on the aluminum plate and located at one end of the aluminum plate away from the resistor plate.

12. The combined diverter according to claim 11, characterized in that: The current bus connector includes an external through hole, an external threaded hole or an external stud arranged on the aluminum plate.

13. A sampling device, characterized in that: The sampling device comprises the combined flow splitter according to any one of claims 1 to 12.

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