Semiconductor chip precision testing device

Abstract

This utility model discloses a precision testing device for semiconductor chips, including a test PCB board and a test fixture fixed on the test PCB board. A cover plate is hinged to the top of the test fixture, and a test area is provided inside the test fixture, with a pressure plate inside the test area. A first movable rod is fixed to the top of the pressure plate and slides inside the cover plate. A first inclined block is fixed to the top of the first movable rod. A movable plate slides on the top of the cover plate, and an L-shaped first connecting rod is symmetrically fixed to the top of the movable plate. A roller sliding on the inclined surface of the first inclined block is rotatably connected between the two first connecting rods, on the side closest to the first movable rod. Through this structure, the inclined linkage mechanism achieves automated clamping and rapid release for semiconductor chip testing, ensuring reliable test contact. After testing, pressing the operation plate releases the lock, and the pressure plate automatically resets under spring action, facilitating quick chip replacement. The device is simple to operate, highly efficient, and helps improve the efficiency of semiconductor chip testing.

Description

Technical Field

[0001] This utility model relates to the field of chip testing technology, and in particular to a precision testing device for semiconductor chips. Background Technology

[0002] The significance of semiconductor chip testing lies in ensuring the quality, performance, and reliability of chips, thereby enhancing the market competitiveness and user satisfaction of products.

[0003] In the prior art, a search revealed a Chinese patent entitled "A Precision Testing Device for Semiconductor Chips," application number "202022670942.4." This patent mainly includes a base, with a mounting seat fixedly installed at one bottom side. The mounting seat has mounting holes on its upper surface, and a test groove is formed at the center of the upper surface of the base. A gantry frame is located on the upper part of the base outside the test groove. A lead screw passes through the center of the top of the gantry frame, and a pressure plate is rotatably connected to the bottom end of the lead screw via a bushing. A sliding rod is fixedly installed on the upper part of the pressure plate. While this patent allows the test PCB board and pin holder to apply pressure to the pins of the semiconductor chip, improving the contact effect between the pin holder and the semiconductor chip pins and ensuring the accuracy of the test results, the operator needs to repeatedly rotate the lead screw to achieve the clamping and releasing of the chip. This process is time-consuming and labor-intensive, limiting the improvement of testing efficiency and making it difficult to meet the needs of the modern semiconductor industry for large-scale chip testing. Therefore, this utility model provides a precision testing device for semiconductor chips to solve the problems mentioned in the background art. Utility Model Content

[0004] The purpose of this invention is to provide a precision testing device for semiconductor chips. Through a inclined plane linkage mechanism, it realizes automated clamping and rapid release for semiconductor chip testing, ensuring reliable test contact. After the test is completed, pressing the operation plate can release the lock, and the pressure plate will automatically reset under the action of the spring, which facilitates quick chip replacement. The device is easy to operate, highly efficient, and helps to improve the efficiency of semiconductor chip testing.

[0005] To achieve the above objectives, a precision testing device for semiconductor chips is provided, including a test PCB board and a test fixture fixed on the test PCB board. The test fixture has a cover plate hinged to its top, a test area is provided inside the test fixture, and a pressure plate is provided inside the test area.

[0006] The top of the pressure plate is fixedly provided with a first movable rod that slides inside the cover plate. The top of the first movable rod is fixedly provided with a first inclined block. The top of the cover plate is provided with a movable plate. The top of the movable plate is symmetrically provided with an L-shaped first connecting rod. A roller that slides on the inclined surface of the first inclined block is rotatably connected between the two first connecting rods and on the side closer to the first movable rod.

[0007] The test fixture is fixed with a U-shaped bracket on the top and side near the movable plate. The end of the movable plate is provided with a positioning component that works with the bracket. The positioning component is used to fix the position of the movable plate on the cover plate.

[0008] According to the semiconductor chip precision testing device, the positioning component includes a second movable rod sliding inside the movable plate, an operating plate fixed to the end of the second movable rod, a second spring sleeved on the outside of the second movable rod, a second connecting rod fixed to one side of the second spring, and a second inclined block fixed to one end of the second connecting rod. The inclined surface of the second inclined block can slide in cooperation with the fixed frame.

[0009] According to the semiconductor chip precision testing device, a fixing plate is fixed on the side of the first movable rod near the top, and a first spring is sleeved on the outside of the first movable rod below the fixing plate.

[0010] According to the semiconductor chip precision testing device, the top of the cover plate is symmetrically fixed with fixed columns, and the first connecting rod slides inside the fixed columns.

[0011] According to the semiconductor chip precision testing device, positioning components are provided at both ends of the movable plate.

[0012] According to the semiconductor chip precision testing device, a limiting plate is fixedly provided at one end of each of the two moving rods facing each other, and a sliding groove is provided inside the moving plate to cooperate with the second moving rod and the limiting plate to slide.

[0013] According to the semiconductor chip precision testing device, both the first and second movable rods are square structures, and anti-slip pads are fixed on the opposite sides of the operation plate.

[0014] This utility model has the following beneficial effects:

[0015] 1. Compared with existing technologies, the inclined plane linkage mechanism realizes automated clamping and rapid release of semiconductor chip testing. When the cover is closed, the sliding of the movable plate drives the roller to move down along the first inclined plane block, so that the pressure plate automatically clamps the chip; the second inclined plane block in the positioning component cooperates with the fixed frame to achieve stable locking and ensure the reliability of test contact; after the test is completed, pressing the operation plate can release the lock, and the pressure plate will automatically reset under the action of the spring, which facilitates quick chip replacement, is simple to operate, and has high efficiency, which helps to improve the efficiency of semiconductor chip testing. Attached Figure Description

[0016] The present invention will be further described below with reference to the accompanying drawings and embodiments;

[0017] Figure 1This is a schematic diagram of the test PCB board and test fixture structure of a precision testing device for semiconductor chips according to this utility model;

[0018] Figure 2 This is a schematic diagram of the test fixture structure of a precision testing device for semiconductor chips according to this utility model;

[0019] Figure 3 This utility model relates to a precision testing device for semiconductor chips. Figure 2 Another perspective structural diagram;

[0020] Figure 4 This utility model relates to a precision testing device for semiconductor chips. Figure 2 Enlarged structural diagram at point A;

[0021] Figure 5 This is a schematic cross-sectional view of the internal structure of the test fixture of a precision testing device for semiconductor chips according to this utility model;

[0022] Figure 6 This is a schematic diagram of the second movable rod and limiting plate structure of a precision testing device for semiconductor chips according to this utility model.

[0023] Legend:

[0024] 1. Test PCB board; 2. Test fixture; 3. Cover plate; 4. Test area; 5. Pressure plate; 6. First movable rod; 7. First inclined block; 8. First spring; 9. Roller; 10. Fixed column; 11. First connecting rod; 12. Operation panel; 13. Movable plate; 14. Second connecting rod; 15. Fixed plate; 16. Fixed frame; 17. Second inclined block; 18. Second movable rod; 19. Second spring; 20. Limit plate. Detailed Implementation

[0025] This section will describe in detail the specific embodiments of the present utility model. The preferred embodiments of the present utility model are shown in the accompanying drawings. The purpose of the drawings is to supplement the textual description with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the present utility model, but they should not be construed as limiting the scope of protection of the present utility model.

[0026] Reference Figure 1-6This utility model provides a precision testing device for semiconductor chips, which includes a test PCB board 1 and a test fixture 2 fixed on the test PCB board 1. A cover plate 3 is hinged to the top of the test fixture 2. A test area 4 is provided inside the test fixture 2. A pressure plate 5 is provided inside the test area 4. A first movable rod 6 that slides inside the cover plate 3 is fixed to the top of the pressure plate 5. A first inclined block 7 is fixed to the top of the first movable rod 6. A fixing plate 15 is fixed to the side of the first movable rod 6 near the top. A first spring 8 located below the fixing plate 15 is sleeved on the outside of the first movable rod 6.

[0027] The semiconductor chip to be tested is placed inside the test area 4. The cover plate 3 is flipped to close the chip, at which point the pressure plate 5 is positioned above the chip. When the first movable rod 6 moves downward, it can drive the pressure plate 5 downward and press down on the chip, ensuring contact between the pin socket and the pin.

[0028] A movable plate 13 slides on the top of the cover plate 3. The top of the movable plate 13 is symmetrically fixed with an L-shaped first connecting rod 11. A roller 9 that slides on the inclined surface of the first inclined block 7 is rotatably connected between the two first connecting rods 11 and on the side near the first movable rod 6. A U-shaped fixing frame 16 is fixed on the top of the test fixture 2 and on the side near the movable plate 13. Both ends of the movable plate 13 are provided with positioning components that cooperate with the fixing frame 16.

[0029] While the movable plate 13 moves for positioning, it drives the roller 9 to move horizontally through the first connecting rod 11. The roller 9 contacts the inclined surface of the first inclined block 7, so that the sliding of the movable plate 13 can synchronously drive the first inclined block 7 and the first movable rod 6 to move downward, so that the movement of the first movable rod 6 can push the pressure plate 5 to move downward, thereby realizing the pressing operation of the chip.

[0030] The positioning assembly is used to fix the position of the movable plate 13 on the cover plate 3. The positioning assembly includes a second movable rod 18 that slides inside the movable plate 13, an operating plate 12 fixed to the end of the second movable rod 18, a second spring 19 sleeved on the outside of the second movable rod 18, a second connecting rod 14 fixed to one side of the second spring 19, and a second inclined block 17 fixed to one end of the second connecting rod 14. The inclined surface of the second inclined block 17 can slide in cooperation with the fixing frame 16. Anti-slip pads are fixed on the opposite side of the operating plate 12 so that the user can operate it with his / her fingers.

[0031] The movable plate 13 moves on the cover plate 3, and the second inclined block 17 on the second connecting rod 14 contacts the fixed frame 16. Utilizing the guiding effect of its inclined surface, the second connecting rod 14, the operating plate 12, and the second movable rod 18 can be displaced, causing the second inclined block 17 to engage with the fixed frame 16, thus positioning the movable plate 13. When the operating plate 12 is pressed inward, the second inclined block 17 moves to the inside of the fixed frame 16, allowing the movable plate 13 to move freely, separating the second inclined block 17 from the fixed frame 16, facilitating the opening of the cover plate 3.

[0032] The top of the cover plate 3 is symmetrically fixed with fixed posts 10. The first connecting rod 11 slides inside the fixed posts 10. When the first connecting rod 11 moves with the movable plate 13, it moves inside the fixed posts 10, which helps to ensure the smoothness of its movement. The opposing ends of the second movable rods 18 are fixed with limiting plates 20. The movable plate 13 has a sliding groove inside that cooperates with the second movable rods 18 and the limiting plates 20. The limiting plates 20 play a limiting role to prevent the second movable rods 18 from disengaging from the movable plate 13. The first movable rod 6 and the second movable rod 18 are both square structures to ensure the stability of the operating plate 12 and the pressure plate 5.

[0033] Working principle: The semiconductor chip to be tested is placed inside the test area 4. The cover plate 3 is flipped to close, at which time the pressure plate 5 is located above the chip. The movable plate 13 is moved by the operation plate 12. The movable plate 13 moves on the cover plate 3, and the second inclined block 17 on the second connecting rod 14 contacts the fixed frame 16. The guiding effect of its inclined surface can push the displacement of the second connecting rod 14, the operation plate 12 and the second movable rod 18, so that the second inclined block 17 engages with the fixed frame 16, thereby positioning the movable plate 13.

[0034] While the movable plate 13 moves for positioning, it drives the roller 9 to move horizontally through the first connecting rod 11. The roller 9 contacts the inclined surface of the first inclined block 7, so that the sliding of the movable plate 13 can synchronously drive the first inclined block 7 and the first movable rod 6 to move downward. The movement of the first movable rod 6 pushes the pressure plate 5 downward, realizing the automatic pressing operation of the chip and ensuring the contact between the pin seat and the pin.

[0035] After the test is completed, the operation plate 12 is pressed inward, and the second inclined block 17 moves to the inside of the fixed frame 16. The movable plate 13 can then be moved freely to separate the second inclined block 17 from the fixed frame 16. At the same time, the roller 9 slides on the first inclined block 7, and the pressure plate 5 can be automatically reset by the first spring 8 to facilitate opening the cover plate 3 and taking out the chip that has been tested.

[0036] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present utility model.

Claims

1. A precision testing device for semiconductor chips, characterized in that, The test fixture includes a test PCB board (1) and a test fixture (2) fixed on the test PCB board (1). The test fixture (2) has a cover plate (3) hinged to the top. The test fixture (2) has a test area (4) inside and a pressure plate (5) inside the test area (4). The pressure plate (5) is fixedly provided with a first movable rod (6) that slides inside the cover plate (3). The first movable rod (6) is fixedly provided with a first inclined block (7). The cover plate (3) is slidably provided with a movable plate (13). The movable plate (13) is symmetrically provided with an L-shaped first connecting rod (11). The two first connecting rods (11) are rotatably connected to a roller (9) that slides on the inclined surface of the first inclined block (7) between them and on the side closer to the first movable rod (6). The test fixture (2) has a U-shaped fixing frame (16) fixed on the top and near the movable plate (13). The end of the movable plate (13) is provided with a positioning component that works with the fixing frame (16). The positioning component is used to fix the position of the movable plate (13) on the cover plate (3).

2. The semiconductor chip precision testing device according to claim 1, wherein The positioning assembly includes a second movable rod (18) that slides inside the movable plate (13), an operating plate (12) fixed to the end of the second movable rod (18), a second spring (19) sleeved on the outside of the second movable rod (18), a second connecting rod (14) fixed to one side of the second spring (19), and a second inclined block (17) fixed to one end of the second connecting rod (14). The inclined surface of the second inclined block (17) can slide in cooperation with the fixed frame (16).

3. The semiconductor chip precision testing device according to claim 2, wherein A fixing plate (15) is fixed on the side of the first movable rod (6) near the top, and a first spring (8) is sleeved on the outside of the first movable rod (6) below the fixing plate (15).

4. The precision testing device for semiconductor chips according to claim 3, characterized in that, The top of the cover plate (3) is symmetrically fixed with fixed columns (10), and the first connecting rod (11) slides inside the fixed columns (10).

5. The semiconductor chip precision testing device according to claim 4, wherein Positioning components are provided at both ends of the movable plate (13).

6. The semiconductor chip precision testing device according to claim 5, wherein Each of the two movable rods (18) is fixed with a limiting plate (20) at one end facing each other. The movable plate (13) has a sliding groove inside that cooperates with the second movable rod (18) and the limiting plate (20) to slide.

7. The semiconductor chip precision testing device according to claim 2, wherein Both the first movable rod (6) and the second movable rod (18) are square structures, and anti-slip pads are fixed on the opposite sides of the operating plate (12).

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